CN106953234B - 硅基单片集成激光器及其制作方法 - Google Patents
硅基单片集成激光器及其制作方法 Download PDFInfo
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- CN106953234B CN106953234B CN201710078430.9A CN201710078430A CN106953234B CN 106953234 B CN106953234 B CN 106953234B CN 201710078430 A CN201710078430 A CN 201710078430A CN 106953234 B CN106953234 B CN 106953234B
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- silicon
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- soi substrate
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 156
- 239000010703 silicon Substances 0.000 title claims abstract description 154
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 154
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 81
- 239000000758 substrate Substances 0.000 claims abstract description 72
- 238000000034 method Methods 0.000 claims abstract description 45
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 39
- 230000008569 process Effects 0.000 claims abstract description 21
- 229910052814 silicon oxide Inorganic materials 0.000 claims abstract description 21
- 238000005530 etching Methods 0.000 claims abstract description 18
- 238000001259 photo etching Methods 0.000 claims abstract description 14
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 claims description 76
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 49
- 230000003287 optical effect Effects 0.000 claims description 34
- 239000002096 quantum dot Substances 0.000 claims description 17
- 239000000377 silicon dioxide Substances 0.000 claims description 9
- 235000012239 silicon dioxide Nutrition 0.000 claims description 9
- 238000000407 epitaxy Methods 0.000 claims description 4
- 238000005137 deposition process Methods 0.000 claims 1
- 230000007704 transition Effects 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 183
- 239000002210 silicon-based material Substances 0.000 description 7
- 230000010354 integration Effects 0.000 description 6
- 238000000151 deposition Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- 238000005411 Van der Waals force Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- -1 divinylsiloxane Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000001534 heteroepitaxy Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/3211—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures characterised by special cladding layers, e.g. details on band-discontinuities
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
Description
Claims (13)
Priority Applications (1)
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CN201710078430.9A CN106953234B (zh) | 2017-02-14 | 2017-02-14 | 硅基单片集成激光器及其制作方法 |
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CN201710078430.9A CN106953234B (zh) | 2017-02-14 | 2017-02-14 | 硅基单片集成激光器及其制作方法 |
Publications (2)
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CN106953234A CN106953234A (zh) | 2017-07-14 |
CN106953234B true CN106953234B (zh) | 2024-01-09 |
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CN201710078430.9A Active CN106953234B (zh) | 2017-02-14 | 2017-02-14 | 硅基单片集成激光器及其制作方法 |
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Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109560462B (zh) * | 2017-09-27 | 2020-06-19 | 中国科学院半导体研究所 | 硅基混合集成激光器阵列及其制备方法 |
WO2019219703A1 (en) * | 2018-05-15 | 2019-11-21 | Rockley Photonics Limited | Integration of photonic components on soi platform |
CN108565209A (zh) * | 2018-05-22 | 2018-09-21 | 北京工业大学 | 一种基于SOI衬底的GaAs外延薄膜及其制备方法和应用 |
CN108521073B (zh) * | 2018-06-07 | 2023-11-24 | 江苏华兴激光科技有限公司 | 一种基于直波导全反射耦合连接的微结构片上光源装置及其制作方法 |
CN209044108U (zh) * | 2018-09-27 | 2019-06-28 | 上海新微科技服务有限公司 | 激光器与硅光芯片集成结构 |
CN110994355B (zh) * | 2019-11-07 | 2021-02-26 | 复旦大学 | 单片集成硅光芯片的分布式反馈激光器及其制备方法 |
CN111262125B (zh) * | 2020-01-19 | 2021-05-11 | 中国科学院上海微系统与信息技术研究所 | 一种硅基激光器及其制备、解理方法 |
CN111600195B (zh) * | 2020-05-08 | 2022-03-25 | 中国科学院上海微系统与信息技术研究所 | 一种硅基单片集成激光器及其制备方法 |
CN115016059B (zh) * | 2022-08-09 | 2022-11-08 | 上海羲禾科技有限公司 | 波分复用装置、波分解复用装置及其制备方法 |
CN116111456B (zh) * | 2022-12-28 | 2024-03-19 | 上海铭锟半导体有限公司 | 集成ⅲ-ⅴ族激光器的硅光器件及制造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101383356A (zh) * | 2007-09-07 | 2009-03-11 | 国际商业机器公司 | 半导体结构及其形成方法 |
CN102243994A (zh) * | 2011-07-22 | 2011-11-16 | 中国科学院半导体研究所 | 倒v型二氧化硅沟槽结构生长硅基砷化镓材料的方法 |
CN102545054A (zh) * | 2012-02-14 | 2012-07-04 | 中国科学院半导体研究所 | 制备硅基InGaAsP为有源区的1550nm激光器的方法 |
CN206931836U (zh) * | 2017-02-14 | 2018-01-26 | 上海新微科技服务有限公司 | 硅基单片集成激光器 |
-
2017
- 2017-02-14 CN CN201710078430.9A patent/CN106953234B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101383356A (zh) * | 2007-09-07 | 2009-03-11 | 国际商业机器公司 | 半导体结构及其形成方法 |
CN102243994A (zh) * | 2011-07-22 | 2011-11-16 | 中国科学院半导体研究所 | 倒v型二氧化硅沟槽结构生长硅基砷化镓材料的方法 |
CN102545054A (zh) * | 2012-02-14 | 2012-07-04 | 中国科学院半导体研究所 | 制备硅基InGaAsP为有源区的1550nm激光器的方法 |
CN206931836U (zh) * | 2017-02-14 | 2018-01-26 | 上海新微科技服务有限公司 | 硅基单片集成激光器 |
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Address after: 201800 room 1048, building 1, 2222 Huancheng Road, Juyuan New District, Jiading District, Shanghai Applicant after: SHANGHAI INTERNATIONAL MICRO-TECH AFFILIATION CENTER Applicant after: SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY, CHINESE ACADEMY OF SCIENCES Applicant after: Shanghai Institute of Microsystems, Chinese Academy of Sciences, Nantong new Micro Research Institute Address before: 201800 room 1048, building 1, 2222 Huancheng Road, Juyuan New District, Jiading District, Shanghai Applicant before: SHANGHAI INTERNATIONAL MICRO-TECH AFFILIATION CENTER Applicant before: SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY, CHINESE ACADEMY OF SCIENCES Applicant before: NANTONG OPTO-ELECTRONICS ENGINEERING CENTER, CHINESE ACADEMY OF SCIENCES Address after: 201800 room 1048, building 1, 2222 Huancheng Road, Juyuan New District, Jiading District, Shanghai Applicant after: SHANGHAI INTERNATIONAL MICRO-TECH AFFILIATION CENTER Applicant after: SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY, CHINESE ACADEMY OF SCIENCES Applicant after: Nantong Xinwei Research Institute Address before: 201800 room 1048, building 1, 2222 Huancheng Road, Juyuan New District, Jiading District, Shanghai Applicant before: SHANGHAI INTERNATIONAL MICRO-TECH AFFILIATION CENTER Applicant before: SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY, CHINESE ACADEMY OF SCIENCES Applicant before: Shanghai Institute of Microsystems, Chinese Academy of Sciences, Nantong new Micro Research Institute |
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Effective date of registration: 20221021 Address after: 201808 Room 930, 9/F, Building 2, No. 1399, Shengzhu Road, Juyuan New District, Jiading District, Shanghai Applicant after: Shanghai Industrial UTechnology Research Institute Applicant after: SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY, CHINESE ACADEMY OF SCIENCES Applicant after: Nantong Xinwei Research Institute Address before: 201800 room 1048, building 1, 2222 Huancheng Road, Juyuan New District, Jiading District, Shanghai Applicant before: SHANGHAI INTERNATIONAL MICRO-TECH AFFILIATION CENTER Applicant before: SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY, CHINESE ACADEMY OF SCIENCES Applicant before: Nantong Xinwei Research Institute |
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Effective date of registration: 20240523 Address after: 201800 Building 1, No. 235, Chengbei Road, Jiading District, Shanghai Patentee after: Shanghai Industrial UTechnology Research Institute Country or region after: China Patentee after: SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY, CHINESE ACADEMY OF SCIENCES Address before: 201808 Room 930, 9/F, Building 2, No. 1399, Shengzhu Road, Juyuan New District, Jiading District, Shanghai Patentee before: Shanghai Industrial UTechnology Research Institute Country or region before: China Patentee before: SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY, CHINESE ACADEMY OF SCIENCES Patentee before: Nantong Xinwei Research Institute |