CN106925896B - Fin surface flash processing method - Google Patents
Fin surface flash processing method Download PDFInfo
- Publication number
- CN106925896B CN106925896B CN201511026154.9A CN201511026154A CN106925896B CN 106925896 B CN106925896 B CN 106925896B CN 201511026154 A CN201511026154 A CN 201511026154A CN 106925896 B CN106925896 B CN 106925896B
- Authority
- CN
- China
- Prior art keywords
- flash
- print area
- cooling fin
- region
- laser printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000003672 processing method Methods 0.000 title claims abstract description 14
- 238000001816 cooling Methods 0.000 claims abstract description 32
- 238000007648 laser printing Methods 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 13
- 238000007639 printing Methods 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/02—Deburring or deflashing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- Laser Beam Processing (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention discloses a kind of fin surface flash processing method comprising: print area is set on the periphery of the cooling fin；Laser printing is carried out to remove the flash in the print area in the print area using laser printing apparatus；It is further removed after laser printing by softening deflashing technique in the remaining flash of the print area.In this way, laser printing is carried out to remove the flash in the print area in the print area using laser printing apparatus, it is time saving and energy saving that it than manually strikes off flash with blade, improves efficiency, equipment positioning, which has been greatly reduced in artificial process of rework, to be scratched to plastic-sealed body possibility.
Description
[technical field]
The present invention relates to a kind of chip manufacturing field more particularly to a kind of fin surface flash processing methods.
[background technique]
Existing chip manufacturing proces generally include: chip is placed in the island area of lead frame；Pass through wire bonding work
Bonding line is connected between the pressure welding area of chip and the pin terminals of lead frame by skill；By plastic package die carry out plastic packaging with incite somebody to action
The chip, bonding line and part lead frame plastic packaging are in plastic-sealed body.The back side in the island area of the lead frame leaks outside in institute
It states outside plastic-sealed body, to radiate, therefore the island area can also be referred to as radiating area.
For some lead frame structure, during plastic packaging, it might have a large amount of flash and spill into the cooling fin
On.As shown in Figure 1, the cooling fin 120 exposes to outside the plastic-sealed body 110, due to the leakage of injection molding, there is part flash
130 are formed in the cooling fin 120, and the flash on cooling fin 120 is serious compared with conventional lead frame, soften deflashing work
Skill can not remove the serious black flash in 120 surface of cooling fin clean.In Fig. 1, flash alreadys exceed specification: internal control:
5mil (0.127mm), external control 10mil (0.254mm).It, at present can only be by manually using knife for the flash on such cooling fin
Piece strikes off flash.Concrete operation method includes: whether the cooling fin for manually checking chip product has flash, there is flash, leads to
Blade is crossed to scrape off the flash on this cooling fin.However, efficiency is very low, and is easy by manually striking off flash time-consuming with blade
Scratching surrounding plastic-sealed body influences product appearance.
It is necessary to propose the new scheme of one kind to solve the above problems.
[summary of the invention]
One of the objects of the present invention is to provide a kind of fin surface flash processing methods, can efficiently remove scattered
Flash on backing.
To achieve the above object, according to an aspect of the present invention, the present invention proposes a kind of fin surface flash processing
Method comprising: print area is set on the periphery of the cooling fin；It is carried out using laser printing apparatus in the print area
Laser printing is to remove the flash in the print area；It is further removed after laser printing by softening deflashing technique in institute
State the remaining flash of print area.
Further, the print area is the annular around the edge of the cooling fin.
Further, it includes: the cooling fin for shooting non-flash that the periphery in the cooling fin, which sets print area,
First image；Shoot the second image of the cooling fin of flash；First image and the second image are compared, to identify flash
Region；The flash region is set as the print area.
Further, each section region in the flash region is determined by identifying the color in the flash region
Flash number, and then control the parameter of the printing laser in each section region in the flash region.
Further, the fin surface flash processing method further include: plating step with lead frame and dissipate
One layer of metal is electroplated on backing.
Compared with prior art, in the present invention, by setting print area on the periphery of the cooling fin, laser is utilized
Printing device carries out laser printing to remove the flash in the print area, than manually being scraped with blade in the print area
Except flash is time saving and energy saving, efficiency is improved, equipment positioning has been greatly reduced scuffing in artificial process of rework may to plastic-sealed body
Property.
[Detailed description of the invention]
In order to illustrate the technical solution of the embodiments of the present invention more clearly, required use in being described below to embodiment
Attached drawing be briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for this
For the those of ordinary skill of field, without any creative labor, it can also be obtained according to these attached drawings other
Attached drawing.Wherein:
Fig. 1 is the product schematic diagram on cooling fin with flash；
Fig. 2 is the flow diagram of fin surface flash processing method in one embodiment in the present invention；
Fig. 3 is the print area set on the periphery of the cooling fin.
[specific embodiment]
Detailed description of the invention is mainly by program, step, logical block, process or other symbolistic descriptions come directly
Or the running of simulation technical solution of the present invention indirectly.For the thorough explanation present invention, set forth in following description very
More specific details.And in these no specific details, the present invention then can may be realized still.Technical staff in fields makes
With these descriptions herein and state that the others skilled in the art into fields effectively introduce their work essence.Change sentence
It talks about, for the purpose of the present invention of avoiding confusion, since well known methods and procedures has been readily appreciated that they are not detailed
Thin description.
" one embodiment " or " embodiment " referred to herein, which refers to, may be included at least one implementation of the invention
A particular feature, structure, or characteristic." in one embodiment " that different places occur in the present specification not refers both to same
A embodiment, nor the individual or selective embodiment mutually exclusive with other embodiments.
Fig. 2 is the flow diagram of fin surface flash processing method 200 in one embodiment in the present invention.Such as
Shown in Fig. 2, the fin surface flash processing method 200 includes the following steps.
Step 210, print area is set on the periphery of cooling fin.
In one embodiment, can according to the distribution situation in the region of flash on the cooling fin of multiple chip products, if
It sets the periphery in cooling fin and sets print area.The print area is the annular around the edge of the cooling fin, such as
Shown in Fig. 3, the print area is the region between two rectangles J1, J2, and the flash almost all is located at this region.
As shown in figure 3, there are many regions there is no flash in the print area, but still need to carry out laser printing,
Certain efficiency is consumed in this way, increases cost.In another embodiment, the setting on the periphery of the cooling fin is beaten
Printing region includes: step A, shoots the first image of the cooling fin of non-flash；Step B shoots the of the cooling fin with flash
Two images；Step C compares the first image and the second image, to identify flash region；Step D, by the flash area
Domain is set as the print area.In this way, the different flash situations of different products can be directed to, and different printings is set
Region improves efficiency.
In another embodiment, it can be determined in the flash region by identifying the color in the flash region
Each section region flash number, and then control the ginseng of the printing laser in each section region in the flash region
Number.For example, indicating that flash is thicker if color is deeper, needing to improve the relevant parameter of laser, reinforce sintering effect, if face
Color is more shallow, indicates that flash is thinner, it is desirable to reduce and the relevant parameter of laser reduces sintering effect,
Step 220, laser printing is carried out to remove the print area in the print area using laser printing apparatus
Interior flash.
Step 230, it is further removed by softening deflashing technique and is overflow the print area is remaining after laser printing
Material.
It is clean that this mode in the present invention goes flash that can remove the flash that not can be removed on cooling fin, and uses than artificial
It is time saving and energy saving that blade strikes off flash, improves efficiency, and equipment positioning, which has been greatly reduced in artificial process of rework, to be scratched to plastic packaging
Body possibility.
Subsequent, progress plating step on lead frame and cooling fin to be electroplated one layer of metal, since flash is removed,
Therefore it can be electroplated to form one layer of complete metal on a heat sink.
Above description sufficiently discloses a specific embodiment of the invention.It should be pointed out that being familiar with the field
Range of any change that technical staff does a specific embodiment of the invention all without departing from claims of the present invention.
Correspondingly, the scope of the claims of the invention is also not limited only to previous embodiment.
Claims (3)
1. a kind of fin surface flash processing method, characterized in that it comprises:
Print area is set on the periphery of the cooling fin；
Laser printing is carried out to remove the flash in the print area in the print area using laser printing apparatus；
It is further removed after laser printing by softening deflashing technique in the remaining flash of the print area,
It is described to include: in the periphery of cooling fin setting print area
Shoot the first image of the cooling fin of non-flash；
Shoot the second image of the cooling fin of flash；
First image and the second image are compared, to identify flash region；
The flash region is set as the print area,
Determined by identifying the color in the flash region flash in each section region in the flash region number,
And then control the parameter for printing laser in each section region in the flash region.
2. fin surface flash processing method according to claim 1, it is characterised in that:
The print area is the annular around the edge of the cooling fin.
3. fin surface flash processing method according to claim 1, it is characterised in that:
It is described to dissipate after further removing laser printing by softening deflashing technique after the remaining flash of the print area
Heat sink surface flash processing method further include:
Plating step on lead frame and cooling fin to be electroplated one layer of metal.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511026154.9A CN106925896B (en) | 2015-12-31 | 2015-12-31 | Fin surface flash processing method |
| PCT/CN2016/112608 WO2017114409A1 (en) | 2015-12-31 | 2016-12-28 | Method of removing flashing on heatsink plate surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511026154.9A CN106925896B (en) | 2015-12-31 | 2015-12-31 | Fin surface flash processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106925896A CN106925896A (en) | 2017-07-07 |
| CN106925896B true CN106925896B (en) | 2019-03-19 |
Family
ID=59224537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511026154.9A Active CN106925896B (en) | 2015-12-31 | 2015-12-31 | Fin surface flash processing method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106925896B (en) |
| WO (1) | WO2017114409A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110154289B (en) * | 2018-04-16 | 2021-08-31 | 东莞市博铨橡塑有限公司 | Rubber part freezing trimming device based on 3D imaging and working method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0225374B1 (en) * | 1985-06-11 | 1990-08-29 | AT&T Corp. | Lead frame deflashing |
| CN1335798A (en) * | 1998-12-07 | 2002-02-13 | 卓越自动系统有限公司 | Method and apparatus for removal of mold flash |
| CN1770412A (en) * | 2005-09-20 | 2006-05-10 | 南通富士通微电子股份有限公司 | Integrated circuit assembling method |
| CN202318690U (en) * | 2011-11-21 | 2012-07-11 | 无锡罗姆半导体科技有限公司 | Overflowing material removing device for semiconductor packaging |
| CN104517805A (en) * | 2013-09-26 | 2015-04-15 | 蔡宜兴 | Glue removing method for quad flat non-leaded package chip |
| CN204621368U (en) * | 2015-03-17 | 2015-09-09 | 长电科技（滁州）有限公司 | A kind of laser removes flash device |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1565787A (en) * | 2003-06-17 | 2005-01-19 | 创宇科技工业股份有限公司 | Surface treating method |
| JP4829748B2 (en) * | 2006-11-02 | 2011-12-07 | 浜松ホトニクス株式会社 | Deburring apparatus, deburring method, and resin product manufacturing method |
| JP2008252005A (en) * | 2007-03-30 | 2008-10-16 | Sanyo Electric Co Ltd | Deburring method, and manufacturing method of semiconductor device |
| CN102299114A (en) * | 2010-06-23 | 2011-12-28 | 郁丽华 | Integrated circuit assembly method |
| US20120247504A1 (en) * | 2010-10-01 | 2012-10-04 | Waleed Nasr | System and Method for Sub-micron Level Cleaning of Surfaces |
| JP5970680B2 (en) * | 2012-11-19 | 2016-08-17 | アピックヤマダ株式会社 | Resin molded product manufacturing method and resin removing device |
| US9054092B2 (en) * | 2013-10-28 | 2015-06-09 | Texas Instruments Incorporated | Method and apparatus for stopping resin bleed and mold flash on integrated circuit lead finishes |
| CN104646326A (en) * | 2013-11-21 | 2015-05-27 | 修建东 | Cleaning machine for surface softening overflowing material of transistor |
| CN203674200U (en) * | 2013-12-25 | 2014-06-25 | 天水华天科技股份有限公司 | ESOP8L leading wire framework capable of preventing material overflowing of exposed radiation fin |
| CN104960123B (en) * | 2015-07-03 | 2018-01-12 | 日月光半导体（昆山）有限公司 | Integrated circuit packaging glue overflow removing equipment and method |
-
2015
- 2015-12-31 CN CN201511026154.9A patent/CN106925896B/en active Active
-
2016
- 2016-12-28 WO PCT/CN2016/112608 patent/WO2017114409A1/en active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0225374B1 (en) * | 1985-06-11 | 1990-08-29 | AT&T Corp. | Lead frame deflashing |
| CN1335798A (en) * | 1998-12-07 | 2002-02-13 | 卓越自动系统有限公司 | Method and apparatus for removal of mold flash |
| CN1770412A (en) * | 2005-09-20 | 2006-05-10 | 南通富士通微电子股份有限公司 | Integrated circuit assembling method |
| CN202318690U (en) * | 2011-11-21 | 2012-07-11 | 无锡罗姆半导体科技有限公司 | Overflowing material removing device for semiconductor packaging |
| CN104517805A (en) * | 2013-09-26 | 2015-04-15 | 蔡宜兴 | Glue removing method for quad flat non-leaded package chip |
| CN204621368U (en) * | 2015-03-17 | 2015-09-09 | 长电科技（滁州）有限公司 | A kind of laser removes flash device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017114409A1 (en) | 2017-07-06 |
| CN106925896A (en) | 2017-07-07 |
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