WO2017114409A1 - Method of removing flashing on heatsink plate surface - Google Patents

Method of removing flashing on heatsink plate surface Download PDF

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Publication number
WO2017114409A1
WO2017114409A1 PCT/CN2016/112608 CN2016112608W WO2017114409A1 WO 2017114409 A1 WO2017114409 A1 WO 2017114409A1 CN 2016112608 W CN2016112608 W CN 2016112608W WO 2017114409 A1 WO2017114409 A1 WO 2017114409A1
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flash
heat sink
printing
laser
area
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PCT/CN2016/112608
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French (fr)
Chinese (zh)
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陆鸿
林连连
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无锡华润安盛科技有限公司
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Publication of WO2017114409A1 publication Critical patent/WO2017114409A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/02—Deburring or deflashing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326

Definitions

  • the present invention relates to the field of chip manufacturing, and in particular to a method for processing a surface of a heat sink.
  • the existing chip manufacturing process generally includes: placing a wafer on an island area of the lead frame; connecting the bonding wire between the bonding pad of the wafer and the pin terminal of the lead frame by a wire bonding process; and molding by a plastic mold
  • the wafer, the bonding wires, and a portion of the lead frame are molded into the molded body.
  • the back side of the island area of the lead frame is exposed outside the plastic body for heat dissipation, so the island area may also be referred to as a heat sink or heat sink.
  • the heat sink 120 is exposed outside the molding body 110. Due to the leakage of the injection molding, a part of the flash 130 is formed on the heat sink 120, and the flash on the heat sink 120 is severe compared with the ordinary lead frame, and is softened. The flashing process does not remove the severe flash on the surface of the heat sink 120.
  • the flash has exceeded specifications, such as 5 mil (0.127 mm) internal control and 10 mil (0.254 mm) external control. For the flash on the heat sink, the flash can only be scraped off by a manual blade.
  • the specific operation method includes: manually checking whether the heat sink of the chip product has a flash, and if there is a flash, the flash on the heat sink is scraped off by the blade.
  • it is inefficient to scrape the flash by manual blade, and it is easy to scratch the surrounding plastic body to affect the appearance of the product.
  • an aspect of the present application provides a method for processing a surface of a heat sink.
  • the surface of the heat sink The method comprises: setting a printing area around the heat sink; performing laser printing on the printing area by using a laser printing device to remove the flash in the printing area; further removing the laser printing after the softening and flashing process The flash remaining in the print area.
  • Figure 1 is a schematic view of a product having a flash on a heat sink
  • FIG. 2 is a schematic flow chart of a method for processing a surface of a heat sink in the present invention in one embodiment
  • Figure 3 shows the print area set around the heat sink.
  • one embodiment or “an embodiment” as used herein refers to a particular feature, structure, or characteristic that can be included in at least one implementation of the invention.
  • the fin surface flash processing method 200 includes the following steps:
  • Step 210 setting a printing area around the heat sink.
  • the print area can be set around the heat sink according to the distribution of the areas of the heat sink on the heat sink.
  • the print area is a ring that surrounds the edge of the heat sink. As shown in Fig. 3, the printing area is an area between the two rectangles J1, J2, and almost all of the flash is located in this area.
  • the step of setting the printing area on the periphery of the heat sink comprises: step A, taking a first image of the unheated heat sink; and step B, taking a second image of the heat sink having the flash; In step C, the first image and the second image are compared to identify the flash area; in step D, the flash area is set as the print area.
  • the printing area is basically a flash area, and the area without flashing is basically outside the printing area, so that the laser printing basically acts on the flash area, and the area without the flash does not perform laser printing, thus improving Efficiency and cost reduction.
  • the amount of flash of each partial region within the flash region can be determined by identifying the color of the flash region, thereby controlling the parameters of the printed laser light for each partial region within the flash region. For example, if the color is darker, it means that the thicker the flash is, it is necessary to increase the relevant parameters of the laser to enhance the sintering effect. If the color is lighter, it means that the thinner the flash, it is necessary to reduce the relevant parameters of the laser and reduce the sintering effect.
  • step 220 laser printing is performed on the printing area using a laser printing apparatus to remove flash in the printing area.
  • the laser current is 99%
  • the laser frequency is 15 KHz
  • the laser speed is 10 LSB when laser printing is performed, but is not limited thereto.
  • the relevant parameters of the laser can be set according to the condition of the flash.
  • step 230 the flash remaining in the printing area after the laser printing is further removed by the softening deflashing process.
  • the heat sink surface flash processing method 200 can remove the flash material that cannot be removed on the heat sink, and saves time and labor compared with the manual blade scraping, which improves the efficiency, and the device positioning also greatly reduces the scratching during the artificial rework process.
  • a plating step is performed to plate a layer of metal on the lead frame and the heat sink, and since the flash is removed, a complete layer of metal can be electroplated on the heat sink.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Laser Beam Processing (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)

Abstract

A method of removing flashing on a heatsink plate surface comprises: configuring a printing range at the surrounding of a heatsink plate; performing, by laser printing equipment, laser printing on the printing range to remove flashing in the printing range; and removing, by means of softening and deflashing techniques, a remaining flashing in the printing range after the laser printing step. Using a laser printing equipment to remove flashing in the printing range by performing laser printing on the printing range saves the time and effort of manually scraping off the flashing using a blade, thereby increasing efficiency. In addition, device positioning reduces possibility of damaging a plastic package during a manual operation.

Description

散热片表面溢料处理方法Heat sink surface flash processing method
相关申请的交叉引用Cross-reference to related applications
本专利申请要求于2015年12月31日提交的、申请号为201511026154.9、发明名称为“散热片表面溢料处理方法”的中国专利申请的优先权，该申请的全文以引用的方式并入本文中。The present application claims priority to Chinese Patent Application No. 201511026154.9, filed on Dec. 31, 2015, entitled,,,,,,,,,,,,,,,,, in.
技术领域Technical field
本发明涉及芯片制造领域，尤其涉及一种散热片表面溢料处理方法。The present invention relates to the field of chip manufacturing, and in particular to a method for processing a surface of a heat sink.
背景技术Background technique
现有的芯片制造过程通常包括：将晶片放置于引线框架的岛区；通过引线键合工艺将键合线连接于晶片的压焊区和引线框架的引脚端子之间；通过塑封模具进行塑封以将晶片、键合线和引线框架的一部分塑封于塑封体内。引线框架的岛区的背面外露于塑封体外，以便进行散热，因此该岛区也可以被称为散热区或散热片。The existing chip manufacturing process generally includes: placing a wafer on an island area of the lead frame; connecting the bonding wire between the bonding pad of the wafer and the pin terminal of the lead frame by a wire bonding process; and molding by a plastic mold The wafer, the bonding wires, and a portion of the lead frame are molded into the molded body. The back side of the island area of the lead frame is exposed outside the plastic body for heat dissipation, so the island area may also be referred to as a heat sink or heat sink.
针对有些引线框架结构，在塑封过程中，可能会有大量的溢料溢出到散热片上。如图1所示，散热片120外露于塑封体110外，由于注塑的泄漏，有部分溢料130形成于散热片120，其散热片120上的溢料与普通引线框架相比严重，软化去飞边工艺无法将散热片120表面严重的溢料去除干净。在图1中，溢料已经超过规范，例如内控5mil(0.127mm)，外控10mil(0.254mm)。针对此种散热片上的溢料，目前只能通过人工用刀片将溢料刮除。具体操作方法包括：人工检查芯片产品的散热片是否有溢料，有溢料的，通过刀片将此散热片上的溢料刮去。然而，通过人工用刀片刮除溢料耗时，效率很低，且容易划伤四周塑封体影响产品外观。For some lead frame structures, during the molding process, a large amount of flash may overflow onto the heat sink. As shown in FIG. 1 , the heat sink 120 is exposed outside the molding body 110. Due to the leakage of the injection molding, a part of the flash 130 is formed on the heat sink 120, and the flash on the heat sink 120 is severe compared with the ordinary lead frame, and is softened. The flashing process does not remove the severe flash on the surface of the heat sink 120. In Figure 1, the flash has exceeded specifications, such as 5 mil (0.127 mm) internal control and 10 mil (0.254 mm) external control. For the flash on the heat sink, the flash can only be scraped off by a manual blade. The specific operation method includes: manually checking whether the heat sink of the chip product has a flash, and if there is a flash, the flash on the heat sink is scraped off by the blade. However, it is inefficient to scrape the flash by manual blade, and it is easy to scratch the surrounding plastic body to affect the appearance of the product.
有必要提出一种新的方案来解决上述问题。It is necessary to propose a new solution to solve the above problems.
发明内容Summary of the invention
有鉴于此，本申请的一个方面提供一种散热片表面溢料处理方法。该散热片表面溢料处 理方法包括：在散热片的周边设定打印区域；利用激光打印设备在所述打印区域进行激光打印以去除所述打印区域内的溢料；通过软化去飞边工艺进一步去除激光打印后在所述打印区域残留的溢料。In view of this, an aspect of the present application provides a method for processing a surface of a heat sink. The surface of the heat sink The method comprises: setting a printing area around the heat sink; performing laser printing on the printing area by using a laser printing device to remove the flash in the printing area; further removing the laser printing after the softening and flashing process The flash remaining in the print area.
附图说明DRAWINGS
为了更清楚地说明本发明实施例的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其它的附图。其中：In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the present invention, Those skilled in the art can also obtain other drawings based on these drawings without paying any inventive labor. among them:
图1为散热片上具有溢料的产品示意图；Figure 1 is a schematic view of a product having a flash on a heat sink;
图2为本发明中的散热片表面溢料处理方法在一个实施例中的流程示意图；2 is a schematic flow chart of a method for processing a surface of a heat sink in the present invention in one embodiment;
图3为在散热片的周边设定的打印区域。Figure 3 shows the print area set around the heat sink.
具体实施方式detailed description
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。The technical solutions in the embodiments of the present application are clearly and completely described in the following with reference to the drawings in the embodiments of the present application. It is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present application without departing from the inventive scope are the scope of the present application.
本发明的详细描述主要通过程序、步骤、逻辑块、过程或其他象征性的描述来直接或间接地模拟本发明技术方案的运作。为透彻的理解本发明，在接下来的描述中陈述了很多特定细节。而在没有这些特定细节时，本发明则可能仍可实现。所属领域内的技术人员使用此处的这些描述和陈述向所属领域内的其他技术人员有效的介绍他们的工作本质。换句话说，为避免混淆本发明的目的，由于熟知的方法和程序已经容易理解，因此它们并未被详细描述。The detailed description of the present invention is intended to directly or indirectly exemplify the operation of the embodiments of the present invention, by means of procedures, steps, logic blocks, processes, or other symbolic description. For a thorough understanding of the invention, numerous specific details are set forth in the following description. Without these specific details, the invention may still be achievable. Those skilled in the art will be able to effectively describe the nature of their work to those skilled in the art using these descriptions and statements herein. In other words, to avoid obscuring the object of the present invention, well-known methods and procedures have not been described in detail since they are readily understood.
此处所称的“一个实施例”或“实施例”是指可包含于本发明至少一个实现方式中的特定特征、结构或特性。在本说明书中不同地方出现的“在一个实施例中”并非均指同一个实施例，也不是单独的或选择性的与其他实施例互相排斥的实施例。The term "one embodiment" or "an embodiment" as used herein refers to a particular feature, structure, or characteristic that can be included in at least one implementation of the invention. The appearances of the "in one embodiment", "a" or "an"
需要说明的是，在本文中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的 包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。It should be noted that, in this document, the terms "including", "including" or any other variant thereof are intended to cover non-exclusive Included so that a process, method, article, or device that includes a series of elements includes not only those elements but also other elements not specifically listed, or elements that are inherent to the process, method, item, or device. . An element that is defined by the phrase "comprising a ..." does not exclude the presence of additional equivalent elements in the process, method, item, or device that comprises the element.
图2为散热片表面溢料处理方法200在一个实施例中的流程示意图。如图2所示，散热片表面溢料处理方法200包括如下步骤：2 is a flow diagram of a heat sink surface flash processing method 200 in one embodiment. As shown in FIG. 2, the fin surface flash processing method 200 includes the following steps:
步骤210，在散热片的周边设定打印区域。 Step 210, setting a printing area around the heat sink.
在一个实施例中，可以根据多个芯片产品的散热片上溢料的区域的分布情况，在散热片的周边设定打印区域。打印区域为环绕散热片的边缘的环形。如图3所示，打印区域为两个矩形J1、J2之间的区域，溢料几乎全部位于这个区域。In one embodiment, the print area can be set around the heat sink according to the distribution of the areas of the heat sink on the heat sink. The print area is a ring that surrounds the edge of the heat sink. As shown in Fig. 3, the printing area is an area between the two rectangles J1, J2, and almost all of the flash is located in this area.
在另一个实施例中，在散热片的周边设定打印区域的步骤包括：步骤A，拍摄未溢料的散热片的第一图像；步骤B，拍摄具有溢料的散热片的第二图像；步骤C，将第一图像和第二图像进行对比，以识别出溢料区域；步骤D，将溢料区域设定为打印区域。这样，可以针对不同的产品的不同的溢料情况，而设置不同的打印区域。且打印区域内基本上都是溢料区域，没有溢料的区域基本上都在打印区域之外，如此激光打印基本上都作用在溢料区域，没有溢料的区域不进行激光打印，因此提高了效率，降低了成本。In another embodiment, the step of setting the printing area on the periphery of the heat sink comprises: step A, taking a first image of the unheated heat sink; and step B, taking a second image of the heat sink having the flash; In step C, the first image and the second image are compared to identify the flash area; in step D, the flash area is set as the print area. In this way, different print areas can be set for different flash situations of different products. And the printing area is basically a flash area, and the area without flashing is basically outside the printing area, so that the laser printing basically acts on the flash area, and the area without the flash does not perform laser printing, thus improving Efficiency and cost reduction.
在另一个实施例中，可以通过识别溢料区域的颜色来确定在溢料区域内的各部分区域的溢料的多少，进而控制在溢料区域内的各部分区域的打印激光的参数。比如，如果颜色越深，表示溢料越厚，需要提高激光的相关参数，加强烧结效果，如果颜色越浅，表示溢料越薄，需要减少激光的相关参数，降低烧结效果，In another embodiment, the amount of flash of each partial region within the flash region can be determined by identifying the color of the flash region, thereby controlling the parameters of the printed laser light for each partial region within the flash region. For example, if the color is darker, it means that the thicker the flash is, it is necessary to increase the relevant parameters of the laser to enhance the sintering effect. If the color is lighter, it means that the thinner the flash, it is necessary to reduce the relevant parameters of the laser and reduce the sintering effect.
步骤220，利用激光打印设备在打印区域进行激光打印以去除打印区域内的溢料。在一个实施例中，在进行激光打印时，激光电流为99％，激光频率：15KHz，激光速度：10LSB，但不限于此。在其他实施例中，可以根据溢料的情况设置激光的相关参数。In step 220, laser printing is performed on the printing area using a laser printing apparatus to remove flash in the printing area. In one embodiment, the laser current is 99%, the laser frequency is 15 KHz, and the laser speed is 10 LSB when laser printing is performed, but is not limited thereto. In other embodiments, the relevant parameters of the laser can be set according to the condition of the flash.
步骤230，通过软化去飞边工艺进一步去除激光打印后在打印区域残留的溢料。In step 230, the flash remaining in the printing area after the laser printing is further removed by the softening deflashing process.
散热片表面溢料处理方法200能将散热片上无法去除的溢料去除干净，且比人工用刀片刮除溢料省时省力，提高了效率，设备定位也大大降低了人为返工过程中划伤到塑封体的可能性。The heat sink surface flash processing method 200 can remove the flash material that cannot be removed on the heat sink, and saves time and labor compared with the manual blade scraping, which improves the efficiency, and the device positioning also greatly reduces the scratching during the artificial rework process. The possibility of plastic packaging.
后续，进行电镀步骤以在引线框架以及散热片上电镀一层金属，由于溢料被去除，因此可以在散热片上电镀形成一层完整的金属。 Subsequently, a plating step is performed to plate a layer of metal on the lead frame and the heat sink, and since the flash is removed, a complete layer of metal can be electroplated on the heat sink.
上述说明已经充分揭露了本发明的具体实施方式。需要指出的是，熟悉该领域的技术人员对本发明的具体实施方式所做的任何改动均不脱离本发明的权利要求书的范围。相应地，本发明的权利要求的范围也并不仅仅局限于前述具体实施方式。 The above description has fully disclosed the specific embodiments of the present invention. It should be noted that any changes to the specific embodiments of the invention will be apparent to those skilled in the art without departing from the scope of the appended claims. Accordingly, the scope of the claims of the invention is not limited to the foregoing specific embodiments.

Claims (6)

  1. 一种散热片表面溢料处理方法，其特征在于，其包括：A heat sink surface flash processing method, characterized in that it comprises:
    在散热片的周边设定打印区域；Setting a printing area around the heat sink;
    利用激光打印设备在所述打印区域进行激光打印以去除所述打印区域内的溢料；Laser printing is performed on the printing area by a laser printing apparatus to remove flash in the printing area;
    通过软化去飞边工艺进一步去除激光打印后在所述打印区域残留的溢料。The flash remaining in the printing area after laser printing is further removed by a softening deflashing process.
  2. 根据权利要求1所述的散热片表面溢料处理方法，其特征在于：The heat sink surface flash processing method according to claim 1, wherein:
    所述打印区域为环绕所述散热片的边缘的环形。The print area is a ring that surrounds the edge of the heat sink.
  3. 根据权利要求1所述的散热片表面溢料处理方法，其特征在于：The heat sink surface flash processing method according to claim 1, wherein:
    在进行激光打印时，激光电流为99％，激光频率为15KHz，激光速度为10LSB。When laser printing is performed, the laser current is 99%, the laser frequency is 15 kHz, and the laser speed is 10 LSB.
  4. 根据权利要求1所述的散热片表面溢料处理方法，其特征在于：所述在所述散热片的周边设定打印区域包括：The heat sink surface flash processing method according to claim 1, wherein the setting the printing area at the periphery of the heat sink comprises:
    拍摄未溢料的散热片的第一图像；Shooting a first image of a non-flashing heat sink;
    拍摄溢料的散热片的第二图像；Taking a second image of the heat sink of the flash;
    将第一图像和第二图像进行对比，以识别出溢料区域；Comparing the first image and the second image to identify the flash area;
    将所述溢料区域设定为所述打印区域。The flash area is set as the print area.
  5. 根据权利要求4所述的散热片表面溢料处理方法，其特征在于：通过识别所述溢料区域的颜色来确定在所述溢料区域内的各部分区域的溢料的多少，进而控制在所述溢料区域内的各部分区域的打印激光的参数。The heat sink surface flash processing method according to claim 4, wherein the amount of flash in each partial region in the flash region is determined by identifying the color of the flash region, thereby controlling Parameters of the printing laser for each partial region within the flash region.
  6. 根据权利要求1所述的散热片表面溢料处理方法，其特征在于：其还包括：电镀步骤以在引线框架以及散热片上电镀一层金属。 The heat sink surface flash processing method according to claim 1, further comprising: a plating step of plating a layer of metal on the lead frame and the heat sink.
PCT/CN2016/112608 2015-12-31 2016-12-28 Method of removing flashing on heatsink plate surface WO2017114409A1 (en)

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