CN106906448A - A kind of heater for vacuum chamber - Google Patents

A kind of heater for vacuum chamber Download PDF

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Publication number
CN106906448A
CN106906448A CN201710098425.4A CN201710098425A CN106906448A CN 106906448 A CN106906448 A CN 106906448A CN 201710098425 A CN201710098425 A CN 201710098425A CN 106906448 A CN106906448 A CN 106906448A
Authority
CN
China
Prior art keywords
heating dish
rotation
print
magnetron sputtering
circular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710098425.4A
Other languages
Chinese (zh)
Inventor
王长梗
关江敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BEIJING CHUANGSHI WEINA TECHNOLOGY Co Ltd
Original Assignee
BEIJING CHUANGSHI WEINA TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BEIJING CHUANGSHI WEINA TECHNOLOGY Co Ltd filed Critical BEIJING CHUANGSHI WEINA TECHNOLOGY Co Ltd
Priority to CN201710098425.4A priority Critical patent/CN106906448A/en
Publication of CN106906448A publication Critical patent/CN106906448A/en
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/35Sputtering by application of a magnetic field, e.g. magnetron sputtering

Abstract

A kind of magnetron sputtering coating method device, it includes the fixed gear being coaxially disposed, rotatable revolution support plate and rotatable heating dish, the revolution support plate has been evenly distributed multiple rotatable rotation print disks, the axis of the rotation print disk is on a circumference centered on the axis of the fixed gear, the rotation print disk is provided with the rotating gear engaged with the fixed gear, the heating dish is above the rotation print disk, the heating dish is provided with least one processing mouthful, the circumference top processed where mouth is arranged on the axis of the rotation print disk, the area of the area more than the circular print of the processing mouth.A kind of heater for vacuum chamber provided by the present invention, substantially increases the efficiency of heating surface, furthermore, it is possible to once be put into multiple samples, the experiment of multiple different technical parameters is done, so as to greatly improve conventional efficient.

Description

A kind of heater for vacuum chamber
Technical field
The present invention relates to vacuum magnetic-control sputtering technical field, more particularly to a kind of heater for vacuum chamber.
Background technology
In semiconductor, microelectronic industry, it usually needs using vacuum plasma technology with circular magnetic control target to circular sample Product are sputtered, and various designs are had verified that so as to carry out small lot batch manufacture.In the market for circular sample small lot life The equipment of product be typically below the circular magnetic control target in vacuum chamber using gear structure set it is multiple can rotation+revolution circle Platform, so that circular sample can be placed on round platform into the rotation below magnetic control target completes sputtering processing.But the defect of this structure It is to be difficult to uniformly heat each circular sample, because generally having more complicated gear knot for placing the round platform lower section of circular sample Structure, therefore do not place the space of heater, and if by the way of the heating of side wall, due to the heat transfer medium in vacuum chamber Seldom, therefore all of circular sample is heated properly and is accomplished by for whole vacuum cavity being heated to specified temp, will also need Long time and the huge energy of consumption are wanted, so not only efficiency is low, and high cost.
The content of the invention
The technical problem to be solved in the present invention is to provide a kind of heater for vacuum chamber, before being reduced or avoided The problem that face is previously mentioned.
In order to solve the above technical problems, the present invention proposes a kind of heater for vacuum chamber, the vacuum chamber Room is provided with least one circular magnetic control target, and it is arranged on the circular magnetic control target lower section, and it is used to enter multiple circle prints Row magnetron sputtering, it includes the fixed gear, rotatable revolution support plate and the rotatable heating dish that are coaxially disposed, the revolution Support plate has been evenly distributed multiple rotatable rotation print disks, the axis of the rotation print disk with the fixed gear On a circumference centered on axis, the rotation print disk is provided with the rotating gear engaged with the fixed gear, described to add Above the rotation print disk, the heating dish is provided with least one processing mouthful to hot plate, and the processing mouth is arranged on described Circumference top where the axis of rotation print disk, the area of the area more than the circular print of the processing mouth.
Preferably, the heating dish is sheathed heater or quartz infrared heaters
Preferably, the heating dish and the distance of the rotation print disk are 3-8mm.
Preferably, the heating dish is driven from the revolution support plate by coaxial different drive shaft.
Preferably, the heating dish includes a housing, the multiple heating modules being arranged in the housing and one Cover plate.
Preferably, the processing mouth is circular, or opening spill.
A kind of heater for vacuum chamber provided by the present invention, heats from circular print top to it, So as to substantially increase the efficiency of heating surface, additionally, heating dish can shelter from other prints, sputtering will not be subject to pollute, so Multiple samples just can be once put into, the experiment of multiple different technical parameters is done, so as to greatly improve conventional efficient.
Brief description of the drawings
The following drawings is only intended to, in schematic illustration and explanation is done to the present invention, not delimit the scope of the invention.Wherein,
Fig. 1 is a kind of stereochemical structure of the heater for vacuum chamber according to a specific embodiment of the invention Principle schematic;
Fig. 2 is the dimensional decomposition structure diagram of Fig. 1.
Specific embodiment
In order to be more clearly understood to technical characteristic of the invention, purpose and effect, now control illustrates this hair Bright specific embodiment.Wherein, identical part uses identical label.
Fig. 1 is a kind of stereochemical structure of the heater for vacuum chamber according to a specific embodiment of the invention Principle schematic;Fig. 2 is the dimensional decomposition structure diagram of Fig. 1.Referring to shown in Fig. 1-2, the invention provides one kind for true The heater of plenum chamber (not shown), the vacuum chamber is provided with least one circular magnetic control target and (does not show in figure Go out), it is arranged on the circular magnetic control target lower section, and it is used to carry out magnetron sputtering to multiple circle print (not shown)s, It includes the fixed gear 1, rotatable revolution support plate 2 and the rotatable heating dish 3 that are coaxially disposed, the revolution support plate 2 Multiple rotatable rotation print disks 4 are evenly distributed, the axis of the rotation print disk 4 is in the axle with the fixed gear 1 On a circumference centered on line, the rotation print disk 4 is provided with the rotating gear 41 engaged with the fixed gear 1, described In the top of the rotation print disk 4, the heating dish 3 is provided with least one processing mouthful 31 to heating dish 3, and the processing mouth 31 sets Put above the circumference where the axis of the rotation print disk 4, the area of the processing mouth 31 is more than the circular print Area.
The heating dish 3 can be sheathed heater, or quartz infrared heaters.The heating dish 3 is arranged on The top of the revolution support plate 2, therefore it can be to being radiated by the circular print on rotation print disk 4 below Heating, the heating dish 3 can be 3-8mm with the distance of the rotation print disk 4, so on the one hand can ensure that to being placed on The heating of the circular print on rotation print disk 4 is stated, interference on the other hand will not be caused to the running of the rotation print disk 4,
The sputtering particle of the circular magnetic control target can be passed through from processing mouth 31, be splashed on the circular print of lower section. And other circle prints are due to there is the blocking for the heating dish 3 would not to be sputtered.
The heating dish 3 can be driven from the revolution support plate 2 by coaxial different drive shaft, that is to say, that The heating dish 3 can adjust to after the position of setting to remain stationary as.Those skilled in the art should be noted that Fig. 1 and Fig. 2 are equal It is principle schematic, therefore does not show in fig. 2 different from the revolution support plate 2 for driving the heating dish 3 Drive shaft.
The heating dish 3 can be include a housing 31, the multiple heating modules 32 being arranged in the housing 31 with And a cover plate 33.
Before stove multi-disc production in the prior art, is carried out described in background technology, technique will be carried out and groped, through excessive Secondary technique gropes to be adjusted with work, can just find optimal technological parameter.And during technique is groped, using described in background technology Prior art in, i.e., under simple rotation+revolution mode of operation, make a piece of sample and to do a stove print be the same.And this hair Bright the provided heater for vacuum chamber, can place multiple circular prints on the rotation print disk 4, And only a print is tested when each technique is groped, can be by setting the heating dish 3 with the revolution support The synchronous rotary of disk 2 causes the circular print with the processing synchronizing moving of mouth 31 under any one circular magnetic control target Sputtered, or caused that the circular print is more to carrying out under different described circular magnetic control targets from the processing synchronizing moving of mouth 31 Secondary sputtering forms plural layers.During due to sputtering, the heating dish 3 can shelter from other prints, and sputtering will not be subject to dirty Dye, thus can once be put into multiple samples, do the experiment of multiple different technical parameters, and the lifting to groping process efficiency is big It is beneficial, because the characteristics of vacuum equipment, after being put into print in vacuum cavity, dozens of minutes is generally required, in addition it is several small When pumpdown time, can be only achieved the vacuum condition of experiment, so the heater for vacuum chamber that is provided of invention, The experiment being greatly improved, the efficiency that technique is groped.
When needing to heat the multiple circular prints and during sputtering operation, the processing mouth 31 can be rotated to spy Under fixed described circular magnetic control target, so, each described circular print by the processing mouth 31 by the specific circle Before magnetic control target sputtering, radiant heating can be carried out by the heating dish 3, therefore the heating effect of each circular print can be ensured Rate.By the position for adjusting the processing mouth 31, you can complete each described circular print in multiple specific circular magnetic Multilayer sputtering operation under control target.
The axis of the rotation print disk 4 can so be protected on a circumference centered on the axis of the fixed gear 1 Hinder the chance being sputtered that each described circular print is obtained in that equalization, so as to ensure sputtering uniformity.
The processing mouth 31 can be circular, or opening spill, as long as its area is more than the circular print Area, you can effectively be sputtered when ensureing the circular print by the circular magnetic control target.
It will be appreciated by those skilled in the art that although the present invention is described according to the mode of multiple embodiments, Be not each embodiment only comprising an independent technical scheme.For the sake of so narration is used for the purpose of understanding in specification, Those skilled in the art should be understood specification as an entirety, and by technical scheme involved in each embodiment Regard that can be mutually combined into the mode of different embodiments understands protection scope of the present invention as.
Schematical specific embodiment of the invention is the foregoing is only, the scope of the present invention is not limited to.It is any Those skilled in the art, the equivalent variations made on the premise of design of the invention and principle is not departed from, modification and combination, The scope of protection of the invention all should be belonged to.

Claims (6)

1. a kind of magnetron sputtering coating method device, it is characterised in that the vacuum chamber is provided with least one circular magnetic control Target, it is arranged on the circular magnetic control target lower section, and it is used to carry out magnetron sputtering to multiple circle prints, and it includes being coaxially disposed Fixed gear, rotatable revolution support plate and rotatable heating dish, the revolution support plate has been evenly distributed multiple can The rotation print disk of rotation, the axis of the rotation print disk is on a circumference centered on the axis of the fixed gear, The rotation print disk is provided with the rotating gear engaged with the fixed gear, and the heating dish is on the rotation print disk Side, the heating dish is provided with least one processing mouthful, and the processing mouth is arranged on where the axis of the rotation print disk Circumference top, the area of the area more than the circular print of the processing mouth.
2. magnetron sputtering coating method device according to claim 1, it is characterised in that the heating dish is armouring heating Device or quartz infrared heaters.
3. magnetron sputtering coating method device according to claim 1, it is characterised in that the heating dish and the rotation The distance of print disk is 3-8mm.
4. magnetron sputtering coating method device according to claim 1, it is characterised in that the heating dish and the revolution Support plate is driven by coaxial different drive shaft.
5. magnetron sputtering coating method device according to claim 1, it is characterised in that the heating dish includes a shell Body, the multiple heating modules being arranged in the housing and a cover plate.
6. magnetron sputtering coating method device according to claim 1, it is characterised in that the processing mouthful is circular, or The spill of opening.
CN201710098425.4A 2017-02-23 2017-02-23 A kind of heater for vacuum chamber Pending CN106906448A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710098425.4A CN106906448A (en) 2017-02-23 2017-02-23 A kind of heater for vacuum chamber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710098425.4A CN106906448A (en) 2017-02-23 2017-02-23 A kind of heater for vacuum chamber

Publications (1)

Publication Number Publication Date
CN106906448A true CN106906448A (en) 2017-06-30

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CN201710098425.4A Pending CN106906448A (en) 2017-02-23 2017-02-23 A kind of heater for vacuum chamber

Country Status (1)

Country Link
CN (1) CN106906448A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108184964A (en) * 2017-12-29 2018-06-22 贵州黔宝食品有限公司 A kind of Rosa roxburghii Tratt flower cake preparation method
CN108184946A (en) * 2017-12-29 2018-06-22 贵州黔宝食品有限公司 A kind of flower cake baking method
CN110576001A (en) * 2019-09-19 2019-12-17 郑萍 Intelligent resource regeneration processing line for recycling regenerated metal
CN111940202A (en) * 2020-07-02 2020-11-17 滁州优立光学眼镜有限公司 Antifog water-proof membrane device is plated to spectacle lens

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11144338A (en) * 1997-11-12 1999-05-28 Ricoh Co Ltd Thin film forming apparatus to disk-shaped optical recording medium material and thin-film forming method
CN2422291Y (en) * 2000-06-07 2001-03-07 中国科学院沈阳科学仪器研制中心 Vacuum coating film device
CN200943101Y (en) * 2006-08-28 2007-09-05 北京有色金属研究总院 Batch preparation of double-faced high-temperature superconducting film device
CN101736292A (en) * 2008-11-19 2010-06-16 中国科学院沈阳科学仪器研制中心有限公司 Composite magnetic control and ion beam sputtering and depositing system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11144338A (en) * 1997-11-12 1999-05-28 Ricoh Co Ltd Thin film forming apparatus to disk-shaped optical recording medium material and thin-film forming method
CN2422291Y (en) * 2000-06-07 2001-03-07 中国科学院沈阳科学仪器研制中心 Vacuum coating film device
CN200943101Y (en) * 2006-08-28 2007-09-05 北京有色金属研究总院 Batch preparation of double-faced high-temperature superconducting film device
CN101736292A (en) * 2008-11-19 2010-06-16 中国科学院沈阳科学仪器研制中心有限公司 Composite magnetic control and ion beam sputtering and depositing system

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108184964A (en) * 2017-12-29 2018-06-22 贵州黔宝食品有限公司 A kind of Rosa roxburghii Tratt flower cake preparation method
CN108184946A (en) * 2017-12-29 2018-06-22 贵州黔宝食品有限公司 A kind of flower cake baking method
CN110576001A (en) * 2019-09-19 2019-12-17 郑萍 Intelligent resource regeneration processing line for recycling regenerated metal
CN111940202A (en) * 2020-07-02 2020-11-17 滁州优立光学眼镜有限公司 Antifog water-proof membrane device is plated to spectacle lens
CN111940202B (en) * 2020-07-02 2021-09-28 滁州优立光学眼镜有限公司 Antifog water-proof membrane device is plated to spectacle lens

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Application publication date: 20170630