CN106884108A - 一种新型电容器用无铅喷金料 - Google Patents

一种新型电容器用无铅喷金料 Download PDF

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Publication number
CN106884108A
CN106884108A CN201710085394.9A CN201710085394A CN106884108A CN 106884108 A CN106884108 A CN 106884108A CN 201710085394 A CN201710085394 A CN 201710085394A CN 106884108 A CN106884108 A CN 106884108A
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China
Prior art keywords
content ratio
weight content
lanthanum cerium
cerium mischmetal
spraying material
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CN201710085394.9A
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刘汉尧
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Foshan Sanshui Shunda Yongfeng Tin Material Co Ltd
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Foshan Sanshui Shunda Yongfeng Tin Material Co Ltd
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Priority to CN201710085394.9A priority Critical patent/CN106884108A/zh
Publication of CN106884108A publication Critical patent/CN106884108A/zh
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C18/00Alloys based on zinc
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C13/00Alloys based on tin
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/04Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
    • C23C4/06Metallic material
    • C23C4/08Metallic material containing only metal elements

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

一种新型电容器用无铅喷金料,其特征在于由Sn、Zn、Cu、Al、镧铈稀土构成,其中Sn的重量含量比为82%—28%,Cu的重量含量比为0.8%—0.2%,Al的重量含量比为0.080%—0.013%,镧铈稀土的重量含量比为0.050%—0.010%,其它的为Zn。本发明与已有技术相比,具有在维持铝薄膜电容器优良品率的同时,又不会产生重金属污染的优点。

Description

一种新型电容器用无铅喷金料
技术领域:
本发明涉及一种焊接材料。
背景技术:
铝薄膜电容器一般是由芯子、固定在芯子两端的引线、将芯子包裹的保护层构成,芯子是由铝薄膜卷绕而成,在引线与芯子端面间还喷涂有无铅喷金料,以便引线能稳定地与芯子连接在一起。其中,无铅喷金料在生产质量稳定的电容中是一种重要的原料,受电容的使用环境的制约,要求所制造的电容的优良品率要达到很高的水平。已有的无铅喷金料主要由Sn、Zn、Cu、Sb、Ni、Al构成,其中的Sb、Ni是属于重金属,已有技术的无铅喷金料制成的铝薄膜电容器,其优良品率虽然满足要求,但是由于有重金属的存在,产品废弃后,会污染环境。
发明内容:
本发明的发明目的在于提供一种能既能保证制成的铝薄膜电容器的优良品率,同时又不会产生重金属污染的新型电容器用无铅喷金料。
本发明是这样实现的,由Sn、Zn、Cu、Al、镧铈稀土构成,其中Sn的重量含量比为82%—28%,Cu的重量含量比为0.8%—0.2%, Al的重量含量比为0.080%—0.013%,镧铈稀土的重量含量比为0.050%—0.010%,其它的为Zn,当Sn的重量含量比大于60%时,Cu的重量含量比为0.3%—0.2%, Al的重量含量比为0.020%—0.013%,镧铈稀土的重量含量比为0.015%—0.010%;当Sn的重量含量比小于40%时,Cu的重量含量比为0.8%—0.7%, Al的重量含量比为0.080%—0.070%,镧铈稀土的重量含量比为0.050%—0.045%;当Sn的重量含量比为60%—40%时,Cu的重量含量比为0.7%—0.3%, Al的重量含量比为0.070%—0.020%,镧铈稀土的重量含量比为0.045%—0.015%,而且,Cu、Al、镧铈稀土的用量随着Sn的用量的减少而加大。同领域的一般技术人员都知道,在采用传统配比的情况下,若没有了Sb、Ni,就会严重地影响产品的质量,体现在延展性、温度变化适应性差,在外部冲击及温度急剧变化时,容易使焊点分裂甚至脱落,本发明创造性地通过提升Cu、Al的用量,配合适当减少用量的镧铈稀土的作用就能有效地弥补去除Sb、Ni而导致的问题的发生,使采用了本发明技术产品的电容的优良品率能维持在98%以上。
本发明与已有技术相比,具有在维持铝薄膜电容器优良品率的同时,又不会产生重金属污染的优点。
具体实施方式:
现结合实施例对本发明作进一步详细描述:
本发明是这样实现的,由Sn、Zn、Cu、Al、镧铈稀土构成。下表为不同实施例的各种组分的含量以及所制成的铝薄膜电容器优良品率。
从上述的实施例可以看出,采用本发明的电容器用无铅喷金料所生产的铝薄膜电容器,其优良品率可维持在98%以上。
当Sn的重量含量比为60%—40%时,Cu的重量含量比为0.7%—0.3%, Al的重量含量比为0.070%—0.020%,镧铈稀土的重量含量比为0.045%—0.015%,而且,Cu、Al、镧铈稀土的用量随着Sn的用量的减少而呈线性加大。
(单位:重量百分比)

Claims (1)

1.一种新型电容器用无铅喷金料,其特征在于由Sn、Zn、Cu、Al、镧铈稀土构成,其中Sn的重量含量比为82%—28%,Cu的重量含量比为0.8%—0.2%, Al的重量含量比为0.080%—0.013%,镧铈稀土的重量含量比为0.050%—0.010%,其它的为Zn,当Sn的重量含量比大于60%时,Cu的重量含量比为0.3%—0.2%, Al的重量含量比为0.020%—0.013%,镧铈稀土的重量含量比为0.015%—0.010%;当Sn的重量含量比小于40%时,Cu的重量含量比为0.8%—0.7%, Al的重量含量比为0.080%—0.070%,镧铈稀土的重量含量比为0.050%—0.045%;当Sn的重量含量比为60%—40%时,Cu的重量含量比为0.7%—0.3%, Al的重量含量比为0.070%—0.020%,镧铈稀土的重量含量比为0.045%—0.015%,而且,Cu、Al、镧铈稀土的用量随着Sn的用量的减少而加大。
CN201710085394.9A 2017-02-17 2017-02-17 一种新型电容器用无铅喷金料 Pending CN106884108A (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108018521A (zh) * 2017-12-22 2018-05-11 黄山申格电子科技有限公司 一种马达电容器喷金工艺

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001259885A (ja) * 2000-03-17 2001-09-25 Teikoku Metal Kogyo Kk はんだ合金および金属化プラスチックフィルムコンデンサ端面電極
JP2003003223A (ja) * 2001-04-11 2003-01-08 Miura Gokin Kogyosho:Kk 金属化プラスチックフィルムコンデンサの外部電極用無鉛合金
CN101050528A (zh) * 2007-05-17 2007-10-10 戴国水 一种无铅喷金料

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001259885A (ja) * 2000-03-17 2001-09-25 Teikoku Metal Kogyo Kk はんだ合金および金属化プラスチックフィルムコンデンサ端面電極
JP2003003223A (ja) * 2001-04-11 2003-01-08 Miura Gokin Kogyosho:Kk 金属化プラスチックフィルムコンデンサの外部電極用無鉛合金
CN101050528A (zh) * 2007-05-17 2007-10-10 戴国水 一种无铅喷金料

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108018521A (zh) * 2017-12-22 2018-05-11 黄山申格电子科技有限公司 一种马达电容器喷金工艺

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