CN106879222A - 冷却装置 - Google Patents

冷却装置 Download PDF

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Publication number
CN106879222A
CN106879222A CN201510920618.4A CN201510920618A CN106879222A CN 106879222 A CN106879222 A CN 106879222A CN 201510920618 A CN201510920618 A CN 201510920618A CN 106879222 A CN106879222 A CN 106879222A
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China
Prior art keywords
circuit board
filling
module
modules
cooling
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CN201510920618.4A
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CN106879222B (zh
Inventor
陈锦辉
李家昀
杨承修
蔡岳霖
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Fulian Precision Electronics Tianjin Co Ltd
Original Assignee
Hongfujin Precision Electronics Tianjin Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN201510920618.4A priority Critical patent/CN106879222B/zh
Priority to US14/982,956 priority patent/US20170172011A1/en
Publication of CN106879222A publication Critical patent/CN106879222A/zh
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20627—Liquid coolant without phase change
    • H05K7/20636—Liquid coolant without phase change within sub-racks for removing heat from electronic boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种冷却装置，包括一冷却槽、收容于该冷却槽的若干电路板模组及一填充单元，该填充单元包括与若干电路板模组相对应的若干第一填充模组，该第一填充模组与冷却槽及电路板之间形成间隙，该间隙内装有冷却液以为若干电路板模组散热。相较于现有技术，本发明冷却装置通过在电路板模组上安装第一填充模组，增加占用冷却槽的空间，使第一填充模组与冷却槽及电路板之间形成间隙，使冷却液充入该间隙为电子元件散热，既节省了冷却液的体积又能有效为电路板散热。

Description

冷却装置
技术领域
本发明涉及一种冷却装置。
背景技术
现有技术中，在浸入式液冷系统中，电路板置于冷却槽中，冷却液体注满冷却槽，冷却液体需浸满电路板并为电路板散热。然而，此种方式需要消耗大量冷却液体，且冷却液体价格昂贵，成本高。
发明内容
鉴于以上内容，有必要提供一种节省冷却液体的冷却装置。
一种冷却装置，包括一冷却槽、收容于该冷却槽的若干电路板模组及一填充单元，该填充单元包括与若干电路板模组相对应的若干第一填充模组，该第一填充模组与冷却槽及电路板之间形成间隙，该间隙内装有冷却液以为若干电路板模组散热。
相较于现有技术，本发明冷却装置通过在电路板模组上安装第一填充模组，增加占用冷却槽的空间，使第一填充模组与冷却槽及电路板之间形成间隙，使冷却液充入该间隙为电子元件散热，既节省了冷却液的体积又能有效为电路板散热。
附图说明
图1是本发明冷却装置的第一较佳实施方式的立体分解图。
图2是图1的组装图。
图3是本发明冷却装置的第二较佳实施方式的组装图。
主要元件符号说明
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
请参阅图1，本发明冷却装置的第一较佳实施方式包括一冷却槽10、若干置于该冷却槽10内的电路板模组30及一置于该冷却槽10内的填充单元50。
该冷却槽10包括一壳体11，该壳体11内设有一收容空间12，该壳体11顶部设有一开口13。
每一电路板模组30包括一电路板31及一安装该电路板31的支撑板33。该支撑板33顶部设有一把手331。每一电路板31上设有若干电子元件311。
该填充单元50包括若干第一填充模组51及若干第二填充模组53。在一实施例中，每一第一填充模组51为一块具有一定体积的板体，该板体可以占用冷却槽10的收容空间12的体积。该板体上设有若干容纳电路板31上的电子元件311的通孔511。该电路板31安装于对应的第一填充模组51与支撑板33之间。
在一实施例中，每一第二填充模组53为一块具有一定体积的实体的板体，该板体可以占用冷却槽10的收容空间12的体积。每一板体上设有一把手531。
请参阅图2，组装该冷却装置时，将每一第一填充模组51安装于对应的每一电路板模组30的电路板31的一侧，使每一电路板31的电子元件311收容于每一第一填充模组51的通孔511。根据实际需要安装所需数量的电路板模组30，并将这些电路板模组30紧邻该冷却槽10的一侧壁并排插入该冷却槽10的收容空间12，每一支撑板33的把手331外露于该冷却槽10的开口13。该冷却槽10剩余的空间插入若干第二填充模组53使该冷却槽10的收容空间12被填充满，每一第二填充模组53的把手531外露于该冷却槽10的开口13。这些第一填充模组51、第二填充模组53及电路板模组30与该冷却槽10形成有间隙。向该冷却槽10的收容空间12内注入冷却液，该冷却液充入该间隙及第一填充模组51的通孔511并为电路板31的电子元件311散热。将电路板模组30及填充单元50从冷却槽10拆卸出时，操作每一支撑板33的把手331及第二填充模组53的把手531，远离冷却槽10向外拉每一电路板模组30及第二填充模组53即可。
请参阅图3，本发明冷却装置的第二较佳实施方式，其与第一较佳实施方式的区别在于：该若干电路板模组30及对应的第一填充模组51与若干第二填充模组53间隔放置。
本发明冷却装置通过在电路板31上安装第一填充模组51，并在冷却槽10内安装第二填充模组53，增加占用冷却槽10的空间，又通过第一填充模组51收容电路板31的电子元件311，使冷却液充入该第一填充模组51的通孔511并为电路板31的电子元件311散热，既节省了冷却液的体积又能有效为电路板31散热。

Claims (9)

1.一种冷却装置，包括一冷却槽、收容于该冷却槽的若干电路板模组及一填充单元，该填充单元包括与若干电路板模组相对应的若干第一填充模组，该第一填充模组与冷却槽及电路板模组之间形成间隙，该间隙内装有冷却液以为若干电路板模组散热。
2.如权利要求1所述的冷却装置，其特征在于：每一第一填充模组为一具有体积的板体，以占据冷却槽的空间。
3.如权利要求1所述的冷却装置，其特征在于：每一电路板模组包括一电路板及一安装该电路板的支撑板，每一电路板安装于支撑板与第一填充模组之间，每一支撑板的顶部设有一用于拆卸电路板模组的把手。
4.如权利要求3所述的冷却装置，其特征在于：每一电路板上设有若干电子元件，该第一填充模组设有收容该若干电子元件的通孔。
5.如权利要求3所述的冷却装置，其特征在于：该冷却槽的顶部设有一收容每一支撑板的把手的开口。
6.如权利要求1所述的冷却装置，其特征在于：该填充单元还包括若干第二填充模组，该若干第二填充模组并排位于若干电路板模组的另一侧。
7.如权利要求1所述的冷却装置，其特征在于：该填充单元还包括若干第二填充模组，该若干第二填充模组与安装该若干第一填充模组的若干电路板模组间隔设置。
8.如权利要求6或7所述的冷却装置，其特征在于：每一第二填充模组为一实体板体，以占据冷却槽的空间。
9.如权利要求6或7所述的冷却装置，其特征在于：每一第二填充模组上设有一用于拆卸第二填充模组的把手。
CN201510920618.4A 2015-12-14 2015-12-14 冷却装置 Active CN106879222B (zh)

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CN201510920618.4A CN106879222B (zh) 2015-12-14 2015-12-14 冷却装置
US14/982,956 US20170172011A1 (en) 2015-12-14 2015-12-29 Cooling device

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CN107155279B (zh) * 2016-03-03 2020-06-02 台达电子工业股份有限公司 层架式调温装置及调温系统
US10925180B2 (en) * 2019-03-04 2021-02-16 Baidu Usa Llc IT container system design approach for fast deployment and high compatibility application scenarios
US10791647B1 (en) * 2019-06-28 2020-09-29 Baidu Usa Llc Carrier safety device for heavy equipment in an immersion cooling system
US11849567B2 (en) * 2021-08-11 2023-12-19 Baidu Usa Llc Server configuration with hybrid environment design
US11696422B2 (en) * 2021-08-18 2023-07-04 Baidu Usa Llc Highly serviceable immersion cooling structural design for servers

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5177666A (en) * 1991-10-24 1993-01-05 Bland Timothy J Cooling rack for electronic devices
CN201142810Y (zh) * 2008-01-15 2008-10-29 万在工业股份有限公司 水冷式散热装置
CN102543916A (zh) * 2010-12-20 2012-07-04 鸿富锦精密工业（深圳）有限公司 液冷散热装置
US20150359140A1 (en) * 2013-03-01 2015-12-10 International Business Machines Corporation Selective clamping of electronics card to coolant-cooled structure

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7345885B2 (en) * 2004-12-22 2008-03-18 Hewlett-Packard Development Company, L.P. Heat spreader with multiple stacked printed circuit boards

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5177666A (en) * 1991-10-24 1993-01-05 Bland Timothy J Cooling rack for electronic devices
CN201142810Y (zh) * 2008-01-15 2008-10-29 万在工业股份有限公司 水冷式散热装置
CN102543916A (zh) * 2010-12-20 2012-07-04 鸿富锦精密工业（深圳）有限公司 液冷散热装置
US20150359140A1 (en) * 2013-03-01 2015-12-10 International Business Machines Corporation Selective clamping of electronics card to coolant-cooled structure

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US20170172011A1 (en) 2017-06-15

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Address after: Haiyun Binhai Economic and Technological Development Zone, Tianjin City, No. 80 300457 Street

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Address after: No. 36, North Street, West District, economic and Technological Development Zone, Binhai New Area, Tianjin

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