CN106872061B - A kind of quick response surface mount method of glass packaged thermosensitive resistor device - Google Patents
A kind of quick response surface mount method of glass packaged thermosensitive resistor device Download PDFInfo
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- CN106872061B CN106872061B CN201611225628.7A CN201611225628A CN106872061B CN 106872061 B CN106872061 B CN 106872061B CN 201611225628 A CN201611225628 A CN 201611225628A CN 106872061 B CN106872061 B CN 106872061B
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- temperature
- pearl
- quick response
- surface mount
- groove
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
- G01K1/143—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations for measuring surface temperatures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
Abstract
A kind of quick response surface mount method of glass packaged thermosensitive resistor device, belongs to temperature sensor mounting technology field.Solves the problems such as temperature-responsive speed caused by thermal resistor conventional surface attaching method in the prior art is slow, temperature-sensitive thermal time constant is big.Attaching method of the invention directly contacts on 3/4ths temperature-sensitive surfaces of thermal resistor head sensitivity pearl with the thermometric substrate surface in groove, and remaining a quarter temperature-sensitive surface and exposed terminal pin are directly contacted with the insulating counterdie in groove.Under the premise of guaranteeing process flow reliability, the attaching method significantly increases the direct contact area between thermal resistor head sensitivity pearl temperature-sensitive surface and thermometric substrate, effectively reduce isolation bondline thickness and temperature-sensitive thermal time constant, and then realize the quick response that thermal resistor fluctuates thermometric substrate temperature, the surface mount suitable for various types glass packaged thermosensitive resistor device.
Description
Technical field
The invention belongs to temperature sensor mounting technology fields, and in particular to a kind of glass packaged thermosensitive resistor device it is quick
Response surface attaching method.
Background technique
In spacecraft ground test and in-orbit mission phase, the acquisition and control of temperature rely primarily on thermocouple, temperature-sensitive electricity
The thermo-responsive component such as resistance, platinum resistance, the precise degrees of feedback temperature will directly affect state confirmation and the control of thermal control subsystem
System strategy.Compared with other temperature sensors, thermal resistor is in construction complexity, measurement precision, response sensitivity and ring
All various aspects such as border adaptability, process implementing, economic and reliable show clear superiority.Therefore, it is in spacecraft thermal control point
The application of thermal resistor is more universal, extensive in system.
The temperature-measurement principle of thermal resistor is the map feature one by one based on resistance and temperature, and by measuring, resistance value is counter to be pushed away
Temperature at paste position out achievees the purpose that regional temperature controls in conjunction with control loop.With space optical remote technology
Deep development, the temperature control capacity of thermal control subsystem require it is also higher and higher, such as: the temperature control index of certain instrumental optics element reaches
To ± 0.1 DEG C, at this point, proposing more harsh limitation to the response speed of thermistor temperature measurement.Currently, improving temperature-sensitive
The surface mount method of resistor is to improve the effective measures of thermistor temperature response speed, also to further increase thermal control
The control precision of subsystem and the temperature stability of satellite equipment equipment are laid a good foundation.
For glass packaged thermosensitive resistor device, the temperature-sensitive surface of head sensitivity pearl is flat arc-shaped surface, non-flat surfaces,
Therefore in conventional surface attaching method, as shown in Figure 1, the direct contact area between thermal resistor and thermometric substrate is extremely micro-
Small, certain thickness fixed glue film is isolated between most of temperature-sensitive surface and thermometric substrate, and (such as: GD414 is single-component room temperature vulcanized
Silicon rubber), which will certainly reduce the temperature-responsive speed of thermal resistor, increase temperature-sensitive thermal time constant etc..
Summary of the invention
The purpose of the present invention is to solve temperature caused by thermal resistor conventional surface attaching method in the prior art
The problems such as response speed is slow, temperature-sensitive thermal time constant is big provides a kind of quick response surface patch of glass packaged thermosensitive resistor device
Dress method.
It is as follows that the present invention solves the technical solution that above-mentioned technical problem is taken:
A kind of quick response surface mount method of glass packaged thermosensitive resistor device, steps are as follows:
Step 1: determining the paste position of thermal resistor on thermometric substrate according to thermal design requirement；
Step 2: one surface roughness Ra of processing is not less than 0.8 μm of groove at the paste position that step 1 determines；
Step 3: by the groove after a part insertion cleaning of thermal resistor head sensitivity pearl, head sensitivity pearl
The cooperation of the shape and size of embedded part and groove inner wall；
It, will in a quarter surface mount insulating counterdie of groove inner wall if the material of thermometric substrate is non-insulating material
Thermal resistor head sensitivity pearl is embedded in the thermometric substrate surface in 3/4ths temperature-sensitive surfaces and groove of the part in groove
Fixed contact, remaining a quarter temperature-sensitive surface and exposed wire lead leg are contacted with the insulating counterdie fixation in groove；
If the material of thermometric substrate be insulating materials, by the temperature-sensitive surface of thermal resistor head sensitivity pearl directly and groove
The fixed contact of interior thermometric substrate surface；
Step 4: using being isolated between the head sensitivity pearl and head sensitivity pearl and fixed pearl of glue-line cover heating sensitive resistor
Exposed wire lead leg；
Step 5: the insulating resistance value between measurement thermal resistor and thermometric substrate, if thermal resistor and thermometric base
Insulating resistance value between plate is less than 20M Ω, step 3-step 5 is repeated, if exhausted between thermal resistor and thermometric substrate
Edge resistance value is more than or equal to 20M Ω, terminates encapsulation.
Further, in the step 3, washes of absolute alcohol groove is dipped using crocus cloth.
Further, in the step 2, the shape and size of groove and the geometrical property for being embedded within head sensitivity pearl
Cooperation.
Further, in the step 3, insulating counterdie is 50 μ m-thick Kapton Tapes.
Further, in the step 3, using the head sensitivity pearl of the fixed thermal resistor of 502 glue, and using clean
The light pressure head portion sensitivity pearl of crocus cloth, come into full contact with it with thermometric substrate, be completely fixed.
Further, in the step 4, isolation glue-line is GD414 single-component room-temperature-vulsilicone silicone rubber.
Further, in the step 4, be isolated glue-line with a thickness of 1-2mm.
Further, in the step 4, isolation glue-line covers uniform, continuous and bubble-free.
It further, further include being pasted and original surface heat in isolation film surface before terminating encapsulation in the step 5
Facial mask similar in physical attribute.
Further, in the step 5, pendulous frequency is at least more than three times.
Compared with prior art, the beneficial effects of the present invention are:
The quick response surface mount method of glass packaged thermosensitive resistor device of the invention is guaranteeing process flow reliability
Under the premise of, the direct contact area between temperature-sensitive surface and thermometric substrate is significantly increased, insulation rubber thickness is effectively reduced
Degree and temperature-sensitive thermal time constant, and then realize the quick response that thermal resistor fluctuates thermometric substrate temperature, it is suitable for glass
The attachment for encapsulating thermal resistor, through experimental test, the thermal time constant of the attaching method reduces by 58.6%, only 27.0s.
Detailed description of the invention
Fig. 1 is the surface mount method of glass packaged thermosensitive resistor device in the prior art；
Fig. 2 is the process flow of glass packaged thermosensitive resistor device quick response surface mount method of the invention；
Fig. 3 is the dynamic temperature response characteristic of glass packaged thermosensitive resistor device surface mount method of the invention；
In figure, 1, isolation glue-line, 2, glass, 3, temperature-sensitive sensing resistor, 4, insulating counterdie, 5, thermometric substrate, 51, groove.
Specific embodiment
The present invention will be further described below with reference to the accompanying drawings.
As shown in Fig. 2, a kind of quick response surface mount method of glass packaged thermosensitive resistor device, steps are as follows:
Step 1: determining the paste position of thermal resistor on thermometric substrate 5 according to thermal design requirement, which is this
The known common sense of field technical staff；
Step 2: one surface roughness Ra of processing is not less than 0.8 μm of groove at the paste position that step 1 determines
51, if it is determined that paste position be it is multiple, then every place processes a groove 51 and dips in anhydrous second with crocus cloth after processing is completed
Alcohol cleans recess region；
Step 3: by a part insertion groove 51 of thermal resistor head sensitivity pearl, and embedded part and head are quick
Sense pearl fits closely, i.e., the shape and size of groove 51 are matched with the geometrical property (shape and size) for being embedded within head sensitivity pearl
It closes；
If the material of thermometric substrate 5 is non-insulating material, insulating counterdie 4 is pasted in groove 51, and using completely thin
Gauze drives bubble out of, guarantees that insulating counterdie 4 is smooth, secured, corrugationless, by 3/4ths senses of thermal resistor head sensitivity pearl
The fixed contact in 5 surface of thermometric substrate in warm surface and groove 51, remaining a quarter temperature-sensitive surface and exposed wire lead leg
It is contacted with the fixation of insulating counterdie 4 in groove 51,3/4ths temperature-sensitive surfaces of general head sensitivity pearl front end and groove 51
The fixed contact in interior 5 surface of thermometric substrate, head sensitivity pearl are usually quickly fixed with a small amount of 502 glue, and using clean spun yarn
The light pressure head portion sensitivity pearl of cloth, it is ensured that it comes into full contact with thermometric substrate 5, is completely fixed；
If the material of thermometric substrate is insulating materials, by the thermometric substrate in thermal resistor head sensitivity pearl and groove 51
The directly fixed contact in 5 surfaces, head sensitivity pearl are usually quickly fixed with 502 glue, and quick using the clean light pressure head portion of crocus cloth
Feel pearl, it is ensured that it comes into full contact with thermometric substrate 5, is completely fixed；
Step 4: using isolation glue-line 1 cover thermal resistor head sensitivity pearl and head sensitivity pearl and fixed pearl it
Between exposed wire lead leg；
Glue-line 1 is isolated with a thickness of 1-2mm, usually GD414 single-component room-temperature vulcanized silicone rubber, i.e., by GD414 silicon rubber
Covering at the desired position, solidifies for 24 hours under room temperature, forms separation layer 1；
Step 5: with the insulating resistance value between multimeter detection thermal resistor and thermometric substrate 5, if insulating resistance value
Less than 20M Ω, possible step 3 operation error repeats step 3-step 5, if insulating resistance value is more than or equal to 20M Ω,
Facial mask similar in 1 surface mount of glue-line and original surface ermal physics attribute is isolated, terminates encapsulation；
The self-resistance value of thermal resistor can also be detected, it is such as different from calibration resistance value is produced, replace thermistor
Device Reseals.
Wherein, test process is generally more than three times.
It is recessed by taking DB403 electronic glass 2 encapsulates the MF501 thermal resistor of temperature-sensitive sensing resistor 3 as an example in present embodiment
The flute length of slot 51, groove width, groove depth are respectively 6mm × 3mm × 1mm, and the length and width of insulating counterdie 4 are 20mm × 15mm.It is right
Glass packaged thermosensitive resistor device surface mount method of the invention carries out dynamic temperature response characteristic test, as shown in figure 3, can be with
Find out, compared with prior art, the thermal time constant of attaching method of the present invention reduces by 58.6%, only 27.0s.
Claims (10)
1. a kind of quick response surface mount method of glass packaged thermosensitive resistor device, steps are as follows:
Step 1: determining the paste position of thermal resistor on thermometric substrate according to thermal design requirement；
It is characterized by further comprising:
Step 2: one surface roughness Ra of processing is not less than 0.8 μm of groove at the paste position that step 1 determines；
Step 3: by the groove after a part insertion cleaning of thermal resistor head sensitivity pearl, and head sensitivity pearl is embedding
Enter part and the shape and size of groove inner wall cooperate；
If the material of thermometric substrate is non-insulating material, in a quarter surface mount insulating counterdie of groove inner wall, by temperature-sensitive
Thermometric substrate surface in 3/4ths temperature-sensitive surfaces and groove of part in resistor head sensitivity pearl insertion groove is fixed
Contact, remaining a quarter temperature-sensitive surface and exposed wire lead leg are contacted with the insulating counterdie fixation in groove；
If the material of thermometric substrate is insulating materials, by the temperature-sensitive surface of thermal resistor head sensitivity pearl directly and in groove
The fixed contact of thermometric substrate surface；
Step 4: using naked between the head sensitivity pearl and head sensitivity pearl and fixed pearl of isolation glue-line cover heating sensitive resistor
Reveal wire lead leg；
Step 5: the insulating resistance value between measurement thermal resistor and thermometric substrate, if thermal resistor and thermometric substrate it
Between insulating resistance value be less than 20M Ω, repeat step 3-step 5, if the insulated electro between thermal resistor and thermometric substrate
Resistance value is more than or equal to 20M Ω, terminates encapsulation.
2. a kind of quick response surface mount method of glass packaged thermosensitive resistor device according to claim 1, feature
It is, in the step 3, washes of absolute alcohol groove is dipped using crocus cloth.
3. a kind of quick response surface mount method of glass packaged thermosensitive resistor device according to claim 1, feature
It is, in the step 2, the shape and size of groove and the geometrical property for the head sensitivity pearl being embedded within cooperate.
4. a kind of quick response surface mount method of glass packaged thermosensitive resistor device according to claim 1, feature
It is, in the step 3, insulating counterdie is the Kapton Tape of 50 μ m-thicks.
5. a kind of quick response surface mount method of glass packaged thermosensitive resistor device according to claim 1, feature
It is, in the step 3, is gently pressed using the head sensitivity pearl of the fixed thermal resistor of 502 glue, and using clean crocus cloth
Head sensitivity pearl, it is ensured that it comes into full contact with thermometric substrate, is completely fixed.
6. a kind of quick response surface mount method of glass packaged thermosensitive resistor device according to claim 1, feature
It is, in the step 4, isolation glue-line is GD414 single-component room-temperature-vulsilicone silicone rubber.
7. a kind of quick response surface mount method of glass packaged thermosensitive resistor device according to claim 1, feature
Be, in the step 4, be isolated glue-line with a thickness of 1-2mm.
8. a kind of quick response surface mount method of glass packaged thermosensitive resistor device according to claim 1, feature
It is, in the step 4, isolation glue-line covers uniform, continuous and bubble-free.
9. a kind of quick response surface mount method of glass packaged thermosensitive resistor device according to claim 1, feature
It is, further includes close with original surface ermal physics attribute in isolation film surface stickup before terminating encapsulation in the step 5
Facial mask.
10. a kind of quick response surface mount method of glass packaged thermosensitive resistor device according to claim 1, feature
It is, in the step 5, pendulous frequency is at least more than three times.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201611225628.7A CN106872061B (en) | 2016-12-27 | 2016-12-27 | A kind of quick response surface mount method of glass packaged thermosensitive resistor device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611225628.7A CN106872061B (en) | 2016-12-27 | 2016-12-27 | A kind of quick response surface mount method of glass packaged thermosensitive resistor device |
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| CN106872061A CN106872061A (en) | 2017-06-20 |
| CN106872061B true CN106872061B (en) | 2019-04-23 |
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Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85109140A (en) * | 1985-12-12 | 1987-09-30 | 湖北省襄樊市机电研究所 | Carborundum (SiC) diode temperature sensor |
| CN1576748A (en) * | 2003-07-14 | 2005-02-09 | Aos控股公司 | Temperature sensor assembly, water heater including the temperature sensor assembly, and method of sensing a temperature |
| CN101583858A (en) * | 2007-06-19 | 2009-11-18 | 株式会社村田制作所 | Temperature sensor with lead wires |
| JP2010237156A (en) * | 2009-03-31 | 2010-10-21 | Shibaura Electronics Co Ltd | Temperature sensor for measurement |
| CN201837908U (en) * | 2010-10-28 | 2011-05-18 | 常州市惠昌传感器有限公司 | Temperature control sensor of water heater |
| CN102203883A (en) * | 2008-11-07 | 2011-09-28 | 泰科电子日本合同会社 | Ptc device |
| CN102944325A (en) * | 2012-11-29 | 2013-02-27 | 东南大学 | Passive wireless temperature and humidity integrated sensor |
| CN103282754A (en) * | 2011-01-07 | 2013-09-04 | 株式会社村田制作所 | Temperature sensor and structure having temperature sensor attached thereto |
| CN203415334U (en) * | 2013-06-20 | 2014-01-29 | 兴勤（常州）电子有限公司 | Power negative-temperature thermistor |
| JP2014016158A (en) * | 2012-07-05 | 2014-01-30 | Oizumi Seisakusho:Kk | High-temperature heat-resistant temperature sensor |
| CN104422540A (en) * | 2013-09-02 | 2015-03-18 | Ls产电株式会社 | Temperature measurement apparatus using negative temperature coefficient thermistor |
| CN105606246A (en) * | 2015-12-31 | 2016-05-25 | 广东爱晟电子科技有限公司 | High-temperature-resistant quick-response thermistor and temperature sensor including the same |
| CN205352569U (en) * | 2015-12-31 | 2016-06-29 | 广东爱晟电子科技有限公司 | Temperature sensor of face contact |
| CN106248242A (en) * | 2016-10-26 | 2016-12-21 | 深圳市敏杰电子科技有限公司 | A kind of quickly insulated type plane thermometric NTC temperature sensor |
| CN205826160U (en) * | 2016-07-18 | 2016-12-21 | 南京时恒电子科技有限公司 | A kind of temperature sensor |
-
2016
- 2016-12-27 CN CN201611225628.7A patent/CN106872061B/en active Active
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85109140A (en) * | 1985-12-12 | 1987-09-30 | 湖北省襄樊市机电研究所 | Carborundum (SiC) diode temperature sensor |
| CN1576748A (en) * | 2003-07-14 | 2005-02-09 | Aos控股公司 | Temperature sensor assembly, water heater including the temperature sensor assembly, and method of sensing a temperature |
| CN101583858A (en) * | 2007-06-19 | 2009-11-18 | 株式会社村田制作所 | Temperature sensor with lead wires |
| CN102203883A (en) * | 2008-11-07 | 2011-09-28 | 泰科电子日本合同会社 | Ptc device |
| JP2010237156A (en) * | 2009-03-31 | 2010-10-21 | Shibaura Electronics Co Ltd | Temperature sensor for measurement |
| CN201837908U (en) * | 2010-10-28 | 2011-05-18 | 常州市惠昌传感器有限公司 | Temperature control sensor of water heater |
| CN103282754A (en) * | 2011-01-07 | 2013-09-04 | 株式会社村田制作所 | Temperature sensor and structure having temperature sensor attached thereto |
| JP2014016158A (en) * | 2012-07-05 | 2014-01-30 | Oizumi Seisakusho:Kk | High-temperature heat-resistant temperature sensor |
| CN102944325A (en) * | 2012-11-29 | 2013-02-27 | 东南大学 | Passive wireless temperature and humidity integrated sensor |
| CN203415334U (en) * | 2013-06-20 | 2014-01-29 | 兴勤（常州）电子有限公司 | Power negative-temperature thermistor |
| CN104422540A (en) * | 2013-09-02 | 2015-03-18 | Ls产电株式会社 | Temperature measurement apparatus using negative temperature coefficient thermistor |
| CN105606246A (en) * | 2015-12-31 | 2016-05-25 | 广东爱晟电子科技有限公司 | High-temperature-resistant quick-response thermistor and temperature sensor including the same |
| CN205352569U (en) * | 2015-12-31 | 2016-06-29 | 广东爱晟电子科技有限公司 | Temperature sensor of face contact |
| CN205826160U (en) * | 2016-07-18 | 2016-12-21 | 南京时恒电子科技有限公司 | A kind of temperature sensor |
| CN106248242A (en) * | 2016-10-26 | 2016-12-21 | 深圳市敏杰电子科技有限公司 | A kind of quickly insulated type plane thermometric NTC temperature sensor |
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| CN106872061A (en) | 2017-06-20 |
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