CN106866134A - 正温度系数热敏电阻材料及热敏电阻 - Google Patents

正温度系数热敏电阻材料及热敏电阻 Download PDF

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CN106866134A
CN106866134A CN201510922838.0A CN201510922838A CN106866134A CN 106866134 A CN106866134 A CN 106866134A CN 201510922838 A CN201510922838 A CN 201510922838A CN 106866134 A CN106866134 A CN 106866134A
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titanates
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李春花
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Qingdao Xiangzhi Electronic Technology Co Ltd
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Abstract

本发明公开了一种低电阻率正温度系数热敏电阻材料及热敏电阻。该低电阻率正温度系数热敏电阻材料含有：主成分、含钇化合物、含硅化合物及含磷化合物，所述主成分为钛酸钡、钛酸锶、钛酸铅和钛酸钙；其中，钛酸钡、钛酸锶、钛酸铅和钛酸钙的摩尔数之和与所述含磷化合物中磷的摩尔比为：100:0.1～0.5。相较于传统单纯用SiO 2做玻璃相PTC陶瓷，其烧结温度明显降低，减少了能源消耗，同时含P的热敏陶瓷在烧结过程中玻璃软化点更低，玻璃相对材料中有害杂质如Fe等吸收能力更强，减少了杂质离子对热敏电阻电性能的负干扰，从而提高了热敏电阻的可靠性。

Description

正温度系数热敏电阻材料及热敏电阻
技术领域
本发明涉及一种正温度系数热敏电阻材料及热敏电阻，属于热敏电阻领域。
背景技术
正温度系数(PTC)热敏电阻具有在温度较低时电阻值较低，而温度上升到一定程度时电阻急剧上升的特性，有时候达到3～4个以上的数量级；因此PTC通电后通过自身发热温度上升而导致电阻增大，在电路中限制了电流，具有很好的安全性能。随着国民经济的发展，正温度系数(PTC)热敏电阻元件广泛应用于家电、通讯、电子设备、电气部件、温度传感与控制、加热等领域。由于变频空调，低压仪表和通讯设备在社会生产生活中使用越来越频繁，人们对其可靠性要求也越来越高。目前该类设备上通用的低电阻率正温度系数热敏电阻多采用传统方法：在BaTiO 3中直接添加SiO 2作为玻璃相降低电阻率，缺点是烧结温度较高，可靠性较低，只能在30V以下使用，在目前的需求下已越来越不能适应使用要求。
发明内容
本发明要解决的技术问题是现有的正温度系数热敏电阻可靠性低。
为了解决上述技术问题，本发明提供了一种低电阻率正温度系数热敏电阻材料，含有：主成分、含钇化合物、含硅化合物及含磷化合物，所述主成分为钛酸钡(BaTiO 3)、钛酸锶(SrTiO 3)、钛酸铅(PbTiO 3)和钛酸钙(CaTiO 3)；其中，钛酸钡、钛酸锶、钛酸铅和钛酸钙的摩尔数之和与所述含磷化合物中磷的摩尔比为：100:0.1～0.5。
本发明通过在材料中加入含磷化合物来控制正温度正温度系数热敏电阻陶瓷中的玻璃相，相较于单纯使用含硅化合物，含磷的陶瓷烧结温度更低，利于降低能源消耗；同时也使陶瓷在烧结过程中玻璃软化点更低，增加了玻璃相对材料中有害杂质的吸收力，提高电阻的可靠率。
优选地，所述主成分中各组分的摩尔配比为：钛酸钡:钛酸锶:钛酸铅:钛酸钙＝60～90:0～20:0～10:10～15。
优选地，所述钛酸钡、钛酸锶、钛酸铅和钛酸钙的摩尔数之和与所述含硅化合物中硅的摩尔比为：100:1～3；钛酸钡、钛酸锶、钛酸铅和钛酸钙的摩尔数之和与含钇化合物中钇的摩尔比为100:0.3～0.5。
优选地，所述含硅化合物为二氧化硅。
优选地，所述含钇化合物为三氧化二钇。
优选地，所述低电阻率正温度系数热敏电阻材料还含有：含锰化合物，其中，钛酸钡、钛酸锶、钛酸铅和钛酸钙的摩尔数之和与所述含锰化合物中锰的摩尔比为：100:0.01～0.05。
优选地，所述含锰化合物为硝酸锰。
优选地，还含有：二氧化钛，其中，钛酸钡、钛酸锶、钛酸铅和钛酸钙的摩尔数之和与二氧化钛的摩尔比为：100:0～2。
优选地，所述含磷化合物为磷酸盐，其中以磷酸钙为最佳。
以上所述的正温度系数热敏电阻材料制备的热敏电阻。
本发明能够达到以下技术效果：
1.相较传统单纯用SiO 2做玻璃相PTC陶瓷烧结温度在1250～1400℃，而本发明PTC烧结温度在1150～1250℃，平均降低烧结温度100℃，降低能源消耗。
2.含P的热敏陶瓷在烧结过程中玻璃软化点更低，玻璃相对材料中有害杂质如Fe等吸收能力更强，减少了杂质离子对热敏电阻电性能的负干扰，从而提高了热敏电阻的可靠性。
具体实施方式
下面结合具体实施例对本发明作进一步说明，以使本领域的技术人员可以更好地理解本发明并能予以实施，但所举实施例不作为对本发明的限定。
本发明的正温度系数热敏电阻材料，含有：主成分、含钇化合物、含硅化合物及含磷化合物，其中，主成分为钛酸钡、钛酸锶、钛酸铅和钛酸钙。钛酸钡、钛酸锶、钛酸铅和钛酸钙的摩尔数之和与含磷化合物中磷的摩尔比为：100:0.1～0.5。
本发明的正温度系数热敏电阻材料，还可含有：含锰化合物和/或二氧化钛。
本发明的优选实施例中，采用BaTiO 3，PbTiO 3，SrTiO 3，CaTiO 3，Y 2O 3，SiO 2，Ca 3(PO 4)2，TiO 2，Mn(NO 3)2做为正温度系数热敏电阻材料的成分。经过常规球磨，喷雾造粒，压制，在1150～1250℃烧结1小时得到直径为15mm，厚度为1.2mm的陶瓷，通过涂覆Ag料并在500℃下烧渗Ag电极，焊接铜引线包封硅树脂制作成热敏电阻。

Claims (5)

1.一种低电阻率正温度系数热敏电阻材料，其特征在于，含有：主成分、含钇化合物、含硅化合物及含磷化合物，所述主成分为钛酸钡、钛酸锶、钛酸铅和钛酸钙；其中，钛酸钡、钛酸锶、钛酸铅和钛酸钙的摩尔数之和与所述含磷化合物中磷的摩尔比为：100:0.1～0.5。
2.根据权利要求1所述的正温度系数热敏电阻材料，其特征在于，所述主成分中各组分的摩尔配比为：钛酸钡:钛酸锶:钛酸铅:钛酸钙＝60～90:0～20:0～10:10～15。
3.根据权利要求1所述的正温度系数热敏电阻材料，其特征在于，所述钛酸钡、钛酸锶、钛酸铅和钛酸钙的摩尔数之和与所述含硅化合物中硅的摩尔比为：100:1～3；钛酸钡、钛酸锶、钛酸铅和钛酸钙的摩尔数之和与含钇化合物中钇的摩尔比为100:0.3～0.5。
4.根据权利要求3所述的正温度系数热敏电阻材料，其特征在于，所述含硅化合物为二氧化硅。
5.根据权利要求3所述的正温度系数热敏电阻材料，其特征在于，所述含钇化合物为三氧化二钇。
CN201510922838.0A 2015-12-11 2015-12-11 正温度系数热敏电阻材料及热敏电阻 Pending CN106866134A (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112802647A (zh) * 2021-01-13 2021-05-14 江苏新林芝电子科技股份有限公司 一种耐还原性气氛强的正温度系数陶瓷热敏电阻元件及其制备方法
CN113793716A (zh) * 2021-11-17 2021-12-14 西安宏星电子浆料科技股份有限公司 一种低电压系数电阻浆料

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112802647A (zh) * 2021-01-13 2021-05-14 江苏新林芝电子科技股份有限公司 一种耐还原性气氛强的正温度系数陶瓷热敏电阻元件及其制备方法
CN112802647B (zh) * 2021-01-13 2021-11-23 江苏新林芝电子科技股份有限公司 一种耐还原性气氛强的正温度系数陶瓷热敏电阻元件及其制备方法
CN113793716A (zh) * 2021-11-17 2021-12-14 西安宏星电子浆料科技股份有限公司 一种低电压系数电阻浆料

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