CN106803531A - Car headlamp secondary light source - Google Patents
Car headlamp secondary light source Download PDFInfo
- Publication number
- CN106803531A CN106803531A CN201710150695.5A CN201710150695A CN106803531A CN 106803531 A CN106803531 A CN 106803531A CN 201710150695 A CN201710150695 A CN 201710150695A CN 106803531 A CN106803531 A CN 106803531A
- Authority
- CN
- China
- Prior art keywords
- light source
- secondary light
- car headlamp
- led chip
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 16
- 230000004888 barrier function Effects 0.000 claims abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 238000005286 illumination Methods 0.000 abstract description 7
- 238000005516 engineering process Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 2
- 241000736199 Paeonia Species 0.000 description 1
- 235000006484 Paeonia officinalis Nutrition 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2102/00—Exterior vehicle lighting devices for illuminating purposes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention discloses a kind of car headlamp secondary light source, including heat sink, insulating barrier, circuit layer, solder mask and box dam and the LED chip for setting gradually, circuit layer has the die bond position for accommodating LED chip with solder mask.Car headlamp secondary light source of the invention, the characteristics of with high thermal conductivity coefficient, light-emitting area size adjustable, photochromic electric performance stablity, can provide light filling illumination for self-adapting steering headlight system, improve security during night crooked-running.
Description
Technical field
The invention belongs to Vehicular illumination device technical field, specifically, the present invention relates to a kind of car headlamp auxiliary
Light source.
Background technology
With continuing to develop for LED technology, increasing automobile is using LED light source as automobile signal light and illumination
Lamp.LED light source contrast conventional lamp has small volume, the advantage such as long lifespan, light efficiency are high, the response time is short.As LED technology exists
Application on automobile lamp so that the moulding of light fixture is more and more novel, and function also becomes increasingly complex.
The steering assistance illumination functions of traditional self-adapting steering headlight system are realized by mechanical structure, by light fixture knot
Structure is limited, and module steering angle is limited (steering angle is 0-3 °), and headlamp irradiating angle is small when causing vehicle to enter bend, no
The potential safety hazard outside vision dead zone can in time be found.In face of road conditions environment complicated and changeable, traditional self-adapting steering headlight system
System can not meet the demand that driver illuminates to nighttime driving.
The content of the invention
It is contemplated that at least solving one of technical problem present in prior art.Therefore, the present invention provides a kind of vapour
Chinese herbaceous peony illuminator secondary light source, it is therefore an objective to improve security during night crooked-running.
In order to solve the above-mentioned technical problem, the technical solution adopted in the present invention is：Car headlamp secondary light source, including
Heat sink, insulating barrier, circuit layer, solder mask and box dam and the LED chip for setting gradually, circuit layer have with solder mask and accommodate
The die bond position of LED chip.
The box dam is around the outside for setting the LED chip, box dam inside filling fluorescent glue.
The box dam uses Copper base material and electroplate.
The fluorescent glue is formed using the double-component silica gel with high temperature resistant and low-refraction with fluorescent material allotment.
The heat sink use high heat conductive material is made.
The heat sink use copper metal is made.
The LED chip is welded with the heat sink die bond technique using die bond solder paste.
Car headlamp secondary light source of the invention is steady with high thermal conductivity coefficient, light-emitting area size adjustable, photochromic electrical property
The characteristics of determining, can provide light filling illumination for self-adapting steering headlight system, improve security during night crooked-running.
Brief description of the drawings
Fig. 1 is the structural representation of car headlamp secondary light source of the present invention；
Fig. 2 is the decomposing schematic representation of car headlamp secondary light source of the present invention；
Mark in above-mentioned figure is：1st, it is heat sink；2nd, insulating barrier；3rd, circuit layer；4th, solder mask；5th, LED chip；6th, enclose
Dam；7th, fluorescent glue.
Specific embodiment
Below against accompanying drawing, by the description to embodiment, further details of is made to specific embodiment of the invention
Explanation, it is therefore an objective to help those skilled in the art to have more complete, accurate and deep reason to design of the invention, technical scheme
Solution, and contribute to it to implement.
As depicted in figs. 1 and 2, the invention provides a kind of car headlamp secondary light source, for self-adapting steering headlight
Carry out light filling illumination in system, including set gradually heat sink 1, insulating barrier 2, circuit layer 3, solder mask 4 and box dam 6 and LED
Chip 5, circuit layer 3 has the die bond position for accommodating LED chip 5 with solder mask 4.
Specifically, as depicted in figs. 1 and 2, insulating barrier 2 is arranged on heat sink 1 and between circuit layer 3 and heat sink 1,
Circuit layer 3 is arranged on insulating barrier 2 and between insulating barrier 2 and solder mask 4, and solder mask 4 is arranged on circuit layer 3, box dam 6
It is arranged on solder mask 4, the direct die bond in bottom of LED chip 5 is on heat sink 1.
LED chip 5 uses blue chip, and wavelength is 400nm-480nm.It is preferred that using Puri 45mil*45mil blue light cores
Piece BXCD4545452-G2-B1, chip size and luminous power can be customized according to actually used demand.
Die bond technique of the LED chip 5 with heat sink 1 is welded using die bond solder paste.It is preferred that using morning day science and technology ES-1000 die bonds
Tin cream (thermal conductivity factor is 60W/mK) is welded.Traditional LED is welded using die bond elargol, and the thermal conductivity factor of elargol only has 20W/mK left
The right side, heat-sinking capability is poor.
Heat sink 1 is made of copper base or other high heat conductive materials, and chip die bond position is reserved on heat sink 1.Die bond position
Silver-plated process can be used with affixed two and the LED chip 5 of the above, the die bond position surface on heat sink 1.Copper base possesses excellent
The capacity of heat transmission (401W/mK), LED chip 5 is directly welded on heat sink 1 by die bond solder paste, and this packaging technology can be carried significantly
The heat-sinking capability of LED is risen, PN junction point temperature is reduced., using aluminium base as heat sink 1, thermal conductivity factor is only for orthodox car level illumination LED
There is 237W/mK, heat-sinking capability has larger difference compared with copper.
Box dam 6 is around the outside for setting LED chip 5, the inside of box dam 6 filling fluorescent glue 7.Box dam 6 is made of Copper base material
And electroplate is processed, and is directly welded on copper base.The light-emitting area size of box dam 6 can be developed according to project demands and customized,
The light-emitting area that box dam 6 is formed is preferably dimensioned to be 3.7mm*1.5mm.
Fluorescent glue 7 is adjusted by a certain percentage using double-component (A/B) silica gel with high temperature resistant and low-refraction with fluorescent material
With forming.Used as preferred, fluorescent glue 7 is using DOW CORNING OE6550A/B silica gel and Tokyo chemistry TK-0225 fluorescent material according to 1:
1:0.28 modulation is formed.LED light effect, range of color temperature, colour rendering index can be because being changed using different fluorescent glue 7 and proportioning.
The present invention is exemplarily described above in conjunction with accompanying drawing, it is clear that the present invention is implemented and do not receive aforesaid way
Limitation, as long as employing the improvement of various unsubstantialities that method of the present invention design and technical scheme are carried out, or without changing
Enter and design of the invention and technical scheme are directly applied into other occasions, within protection scope of the present invention.
Claims (7)
1. car headlamp secondary light source, it is characterised in that：Including set gradually heat sink, insulating barrier, circuit layer, solder mask and
Box dam and LED chip, circuit layer have the die bond position for accommodating LED chip with solder mask.
2. car headlamp secondary light source according to claim 1, it is characterised in that：The box dam is described around setting
The outside of LED chip, box dam inside filling fluorescent glue.
3. car headlamp secondary light source according to claim 1, it is characterised in that：The box dam uses Copper base material and table
Face is silver-plated.
4. car headlamp secondary light source according to claim 2, it is characterised in that：The fluorescent glue is using with resistance to height
The double-component silica gel of gentle low-refraction is formed with fluorescent material allotment.
5. car headlamp secondary light source according to claim 1, it is characterised in that：The heat sink use high thermal conductivity coefficient
Material is made.
6. car headlamp secondary light source according to claim 1, it is characterised in that：The heat sink use copper metal system
Into.
7. car headlamp secondary light source according to claim 1, it is characterised in that：The LED chip is heat sink with described
Die bond technique using die bond solder paste weld.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710150695.5A CN106803531A (en) | 2017-03-14 | 2017-03-14 | Car headlamp secondary light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710150695.5A CN106803531A (en) | 2017-03-14 | 2017-03-14 | Car headlamp secondary light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106803531A true CN106803531A (en) | 2017-06-06 |
Family
ID=58988252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710150695.5A Pending CN106803531A (en) | 2017-03-14 | 2017-03-14 | Car headlamp secondary light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106803531A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109855038A (en) * | 2019-04-04 | 2019-06-07 | 华域视觉科技(上海)有限公司 | A kind of car headlight device and car light |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103474551A (en) * | 2013-08-21 | 2013-12-25 | 奇瑞汽车股份有限公司 | High-power light-emitting diode (LED) substrate and packaging method thereof |
| CN103579462A (en) * | 2013-11-12 | 2014-02-12 | 奇瑞汽车股份有限公司 | Light source of LED steering lamp of automobile |
| CN203644814U (en) * | 2013-12-02 | 2014-06-11 | 奇瑞汽车股份有限公司 | Large-power LED substrate |
-
2017
- 2017-03-14 CN CN201710150695.5A patent/CN106803531A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103474551A (en) * | 2013-08-21 | 2013-12-25 | 奇瑞汽车股份有限公司 | High-power light-emitting diode (LED) substrate and packaging method thereof |
| CN103579462A (en) * | 2013-11-12 | 2014-02-12 | 奇瑞汽车股份有限公司 | Light source of LED steering lamp of automobile |
| CN203644814U (en) * | 2013-12-02 | 2014-06-11 | 奇瑞汽车股份有限公司 | Large-power LED substrate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109855038A (en) * | 2019-04-04 | 2019-06-07 | 华域视觉科技(上海)有限公司 | A kind of car headlight device and car light |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170606 |