CN106799830A - A kind of polymer surfaces micro-structural thermal marking method of plasmaassisted - Google Patents

A kind of polymer surfaces micro-structural thermal marking method of plasmaassisted Download PDF

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CN106799830A
CN106799830A CN201611113861.6A CN201611113861A CN106799830A CN 106799830 A CN106799830 A CN 106799830A CN 201611113861 A CN201611113861 A CN 201611113861A CN 106799830 A CN106799830 A CN 106799830A
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polymer
micro
plasma
template
structural
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CN106799830B (en
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彭林法
王晋
邓宇君
易培云
来新民
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Shanghai Jiaotong University
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Shanghai Jiaotong University
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/16—Cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/14—Surface shaping of articles, e.g. embossing; Apparatus therefor by plasma treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning
    • B29C2033/725—Cleaning cleaning by plasma treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing

Abstract

The present invention relates to a kind of polymer surfaces micro-structural thermal marking method of plasmaassisted, the method is comprised the following steps：Polymeric material and template surface are processed using plasma surface treatment technology；It is more than heating polymeric material to glass transition temperature (Tg)；Applying pressure makes the fine die cavity in its filling template；Unloading pressure；Cooling, makes material and template be cooled to below Tg, solidifies formed polymer micro-structural；Apply knockout press and complete the demoulding, obtaining Surface Machining there are the polymeric articles of micro-structural.Compared with prior art, the present invention reduces the resilience of polymer in thermal imprint process by strengthening adhesion, reduce and realize that high accuracy replicates required imprint temperature, effectively shorten the dwell time, even without packing stage, can significantly shorten the thermal imprint process cycle, improve processing efficiency, in addition, the present invention applies cooling again after allowing unloading completely, for the optimization of thermal imprint process process provides more effective approach.

Description

A kind of polymer surfaces micro-structural thermal marking method of plasmaassisted
Technical field
The present invention relates to a kind of polymer surfaces micro-structural thermal marking method, more particularly to reduce Polymer in Hot Embossing Lithography time The method of bullet.
Background technology
Thermal imprint process as a kind of in the direct replicating microstructured method of surface of polymer substrates, in optical thin film, micro- Had broad application prospects in the manufactures of product such as fluidic chip, MEMS and specific function material.Technique master Thermoplasticity class is mainly comprising heating, impressing, cooling and four steps of the demoulding, polymeric substrate used, concrete principle is：Room It is under temperature after the polymeric material of glassy state is heated to more than glass transition temperature (Tg) and enters rubbery state, modulus is notable Reduce (generally decline 2~3 orders of magnitude compared with room temperature), and mobile performance is then significantly improved, now, applying pressure can make Its die cavity for smoothly filling micro-nano-scale；Under rubbery state, the deformation recovery of polymeric material also becomes very easily, unloading During significant resilience (deformation recovery amount is up to more than 50%) can occur, therefore, completion fill type after, it usually needs give one Fixed pressurize or altered time, are enable to accumulate in the elastic strain energy inside polymeric material and are released by way of stress relaxation Put, so as to effectively reduce springback capacity, additionally, giving enough coolings before unloading, polymeric material is returned in conformal process Glassy state, the motion of segment, can further effectively reduce resilience in " freezing " strand, finally realize that the high accuracy of micro-structural is answered System.
It is applied to the life of people more and more widely with micro-structural polymer product, its process requirements also increasingly increases It is long, however, due to above-mentioned resilience problem, thermal imprint process needs the cooling before necessary dwell time and unloading, process cycle It is more long, it is difficult to meet requirement of the demand for processing efficiency for increasing.How to shorten the thermal imprint process process-cycle, improve it and add Work efficiency rate, is a major challenge that hot press printing technology faces in commercial Application., Tan of Princeton university etc. in 1998 People proposes hot-rolling method for stamping (Tan, H., Gilbertson, A., Chou, S.Y., 1998.Roller nanoimprint Lithography.J.Vac.Sci.Technol.B 16,3926), although the method because of its continuous, efficient mode of production and Process the ability of large area micro-structural and widely paid close attention to and studied, but resilience problem therein compares traditional concora crush Method is more obvious, main reason is that the dwell time is short during continuous rolling and is difficult to apply cooling before unloading, and is Its accuracy of repetition is improved, generally has to reduce roll-in speed.Chinese patent 201110171743.1 discloses a kind of viscoelastic Heat triggering thermoplastic polymer ultrasonic method for stamping：First, template is heated to more than the Tg 1~60 of thermoplastic polymer ℃；Then, polymer matrix film at room temperature is placed in template and loads ultrasonic vibration, using ultrasonic vibration trigger polymers The viscoplasticity heat production of material, accelerates the softening and flowing of material in formation zone；Finally, stop ultrasonic vibration and apply certain hour Dwell pressure, to prevent the deformation recovery of polymer.The inventive method is contracted using the viscoplasticity heat production feature of polymeric material Short heating and filling time, but in order to decreasing rebound still needs the dwell time more long, processed for thermal imprint process The raising of efficiency is extremely limited.
Therefore, existing thermal imprint process also needs to further improvement, and especially processing efficiency is urgently further improved, and high The method of the reduction polymer deformation recovery of effect then turns into the key for improving thermal imprint process processing efficiency.
The content of the invention
The purpose of the present invention is exactly to provide a kind of plasmaassisted for the defect for overcoming above-mentioned prior art to exist Polymer surfaces micro-structural thermal marking method.Mainly overcome present in existing thermal imprint process because polymer resilience is made Into the relatively low deficiency of processing efficiency, there is provided a kind of method for preventing polymer resilience in uninstall process using adhesion, reduce real Imprint temperature needed for now high accuracy is replicated, and the dwell time is effectively reduced, can significantly shorten the thermal imprint process cycle, meanwhile, Heating and cooling process can be simplified using the present invention, for the raising of thermal imprint process processing efficiency provides more effective approach.
The purpose of the present invention can be achieved through the following technical solutions：A kind of polymer surfaces of plasmaassisted are micro- Structure thermal marking method, it is characterised in that the method is comprised the following steps：
(1) it is surface-treated：Polymeric material and template surface are processed using plasma surface treatment technology, is increased Adhesive attraction between strength polymer material and template；
(2) type is filled in hot pressing：More than heating polymeric material to glass transition temperature (Tg), applying pressure makes its filling mould Fine die cavity on plate, and make to be formed between formed polymer micro-structural and die cavity wall using enhanced adhesive attraction can The bonding leaned on；
(3) unload：Unloading pressure, the resilience of polymer micro-structural is by the bonding resistance of formation in step (2) in uninstall process Only；
(4) cool down：It is cooled in unloading and completes after-applied, material and template is cooled to below Tg, solidifies formed gathering Compound micro-structural, while causing the strong adhesion between polymer and template to be changed into weak gluing using differing for Material shrinkage in cooling It is attached；
(5) demoulding：Apply knockout press and complete the demoulding, obtaining Surface Machining there are the polymeric articles of micro-structural.
Described Surface Treatment with Plasma technology includes changing to the cleaning of template surface and to surface of polymer material Property.
The described cleaning to template surface is plasma clean, using plasma cleaning absorption in template surface Pollutant, reduces the weak boundary layer in bonding；Template is prepared by the modulus such as metal, silicon material higher.
Described being modified as using corona or plasma surface modification raising polymeric material to surface of polymer material The method of material surface energy.
Described plasma clean includes making the organic pollution of template surface aoxidize and adopt using oxygen plasma With inert gas (argon gas, helium) plasma bombardment template surface；
Described plasma surface modification is, using oxygen, nitrogen or air plasma treatment polymeric material, to make Surface of polymer material is aoxidized or nitrogenized, generation carbonyl, carboxyl isopolarity group, improves polymer surfaces polarity and surface energy, So as to improve the model ylid bloom action power in bonding.
Described polymeric material is thermoplastic based polymer, and thickness is more than 10 μm.
After described surface of polymer material treatment, the thickness of its surface reforming layer is less than 100nm, does not influence bulk material Performance.
The modified polymeric material in surface, its surface can reach 60mJ/m2More than.
The characteristic size of described polymer micro-structural is between 100nm~1000 μm.
The surface treatment of step (1) enhancing bonding, can be independently of hot padding flow, at completion before development hot padding Reason, can also be integrated among hot padding flow.By the adhesive attraction between reinforced polymeric material and template, make formed Polymer micro-structural forms reliable Nian Jie between die cavity wall before unloading, so as to prevent polymer micro-structural in uninstall process Resilience, without the dwell time, and can be allowed apply cooling again after unloading in impressing.
Type is filled in hot pressing described in step (2) includes flat board to flat board, roller to flat board and roll-to-roll three kinds of impressing modes.
The temperature of the heating polymeric material described in step (2) according to Embosser between Tg to Tg+50 DEG C, can to provide Pressure limit, realize fully fill type on the premise of, can by imprint temperature control near Tg.
Compared with prior art, the present invention has advantages below：
1st, form reliable Nian Jie with die cavity wall after making polymeric material complete to fill type by strengthening adhesive attraction, in bullet Property strain energy less than the i.e. off-loadable demoulding under conditions of energy needed for destruction bonding interface, can significantly shorten realization high accuracy and replicate The required dwell time, it might even be possible to remove whole packing stage, therefore can significantly shorten the thermal imprint process cycle, improve multiple Efficiency processed；
2nd, the invention at a lower temperature (such as near Tg), that is, under conditions of material deformation reply volume is larger, can be realized In high precision, efficient microstructure replication, when preventing from processing under higher temperature polymeric substrate occur serious thermal deformation, it is thinning very The problems such as going bad.
3rd, the invention applies cooling again after allowing unloading, improves the adaptability of thermal imprint process, while being hot padding work The optimization of skill provides more effective approach, for example, in continuous hot-rolling imprint process, cooling is difficult to apply to unloading Before, it usually needs reduce roll-in speed and improve roll temperature to avoid the obvious resilience of structure in unloading, and in the invention, Without applying to cool down before unloading, but the resilience in utilizing adhesion to prevent unloading, therefore roll-in speed can be effectively improved and dropped Low roll temperature.
4th, individually cooling after template, polymeric replicas being separated with heating module after unloading, cooling effectiveness is high, and nothing Gentle cooling need to be repeatedly risen to heating module, can further be shortened process cycle, additionally, under efficient cooling condition, It is inconsistent with polymeric material shrinkage character using template, the adhesive attraction at its interface is weakened automatically, be conducive to reduction de- Mould power, raising demoulding efficiency.
The present invention prevents the resilience of polymer in unloading by increasing adhesion, significantly shortens process cycle, improves and replicate effect Rate, is a kind of high efficiency, high-precision imprinting moulding method while also helping reduction imprint temperature and improving demoulding efficiency.
Brief description of the drawings
Fig. 1 is the schematic diagram of polymer resilience in existing hot padding unloading；
Fig. 2 is the schematic diagram for reducing polymer resilience during hot padding is unloaded in the present invention by strengthening adhesion；
Fig. 3 is embodiments of the invention 1, that is, be applied to the process chart in flat hot padding；
Fig. 4 is the embodiment of the present invention 2, that is, be applied to the schematic device in volume to volume hot-rolling impressing；
In figure：1- templates, 2- polymeric materials, 3- plasma generators, the upper heating plates of 4-, heating plate under 5-, 6- is cold But device, 7- polymeric articles, 8- polymeric materials (coiled material), 9- let off roll, 10- plasma producing apparatus, the pre- hot chargings of 11- Put, 12- mould rollers, 13- pressure rolls, the upper cooling devices of 14-, cooling device under 15-, 16- polymeric articles (coiled material), 17- strippings Digression controls roller, 18- wind-up rolls, the template after I, II, III-cleaning, I, II, the modified polymeric material in III-surface.
Specific embodiment
The present invention is described in detail with specific embodiment below in conjunction with the accompanying drawings.
Embodiment 1
In the present embodiment, template used is the nickel mould of electroforming, and polymeric material used is PMMA (poly- methyl-props E pioic acid methyl ester, Tg=110 DEG C), using flat method for stamping, using the technological process after present invention optimization as shown in figure 3, tool Body is described as follows：
Step 1：Surface treatment.Prepare multi-disc template 1 and PMMA materials 2, and using plasma producing apparatus 3 to its table Face is processed, and template surface 30s is bombarded using argon plasma, removes the pollutants such as the greasy dirt of its remained on surface, is obtained Numbering is the template of I, II, III ..., using oxygen and nitrogen gas plasma bombardment PMMA material surface 30s, makes its top layer point Subchain is broken and is oxidized, generation carboxyl, carbonyl and hydroxyl isopolarity group, can be from 40mJ/m by its surface2Improve extremely left and right 80mJ/m2More than, obtain the PMMA materials that numbering is I, II, III ...；
Step 2：Heating.The temperature of heating plate 4, heating plate 5 is set and 130 DEG C (Tg+20 DEG C) are maintained in advance, by mould Plate I and PMMA materials I heat 120s between being positioned over heating plate 4,5, PMMA materials I is received thermal softening；
Step 3：Loading.Heating plate 4 is pushed, applies pressure 5MPa, the PMMA materials I after softening are under pressure Type flowing is filled, filling to fine die cavity in template I is completed, pressurize 30s (in PMMA materials at 130 DEG C complete pines of stress Relaxing generally needs more than 500s, and, come decreasing rebound, can reduce the dwell time due to using enhanced adhesion in the present embodiment To 30s), fill in type and pressure maintaining period, make to form reliable viscous between PMMA materials and die cavity wall using enhanced adhesive attraction Connect；
Step 4：Unloading.Heating plate 4 is moved up, unloading pressure, the resilience of PMMA materials is by step in uninstall process The bonding formed in rapid 3 is prevented.
Step 5：Cooling.As shown in step 5-1, template I and PMMA materials I are taken out between heating plate 4,5, be positioned over Less than 60s to 50 DEG C, in cooling procedure is cooled down in cooling device 6, as shown in step 5-2, heating plate 4,5 temperature keep constant, Can be used for the heating of template II and PMMA materials II, that is, return to step 2 and start next process cycle.
Step 6：The demoulding.Because nickel material differs greatly with PMMA material modulus, shrink inconsistent in cooling, its interface it is viscous Attached effect thus weaken, apply less knockout press can the smoothly demoulding, obtaining Surface Machining has the polymerization produce of fine structure Product 7, additionally, template I is circularly used among subsequent process cycle.
In the present embodiment, resilience is prevented using enhanced adhesion, shorten the dwell time, it is to avoid to heating plate repeatedly Heating and cooling, while allowing concurrent job, thus can effectively strengthen technological flexibility, shorten process cycle, significantly improve multiple Efficiency processed.
Embodiment 2
In the present embodiment, using volume to volume hot-rolling method for stamping, it is described as follows：
The device of use is as shown in figure 3, wherein the rotation of let off roll 9, wind-up roll 18 and mould roller 12 is by motor driving, pressure The rotation of power roller 13 can be driven by mould roller 12 or be driven by motor, and the hydraulic cylinder being connected with pressure roll 13 can promote pressure roll 13 Mould roller 12 is pressed to, peel angle regulation and control roller 17 can move up and down to adjust the peel angle during demoulding.
Polymeric material used is PC (makrolon, Tg=150 DEG C) coiled material, 250 μm of thickness.
After roll-in starts, PC materials 8 are spread out of from let off roll 9 with the speed of 0.5m/min, by plasma producing apparatus 10 The air plasma for inspiring starts to bombard the surface of PC materials 8, enables its surface from 45mJ/m2Improve to 90mJ/m left and right2 More than.After the completion of surface treatment, PC materials 8 are transferred into warm-up block, and 130 DEG C are preheated to by irradiating formula preheating device 11 (Tg-20℃).After the completion of preheating, PC materials 8 enter between mould roller 12 and pressure roll 13, and the temperature of mould roller 12 is set as 170 DEG C (Tg+20 DEG C), the roller pressure that pressure roll 13 applies is 10N/mm.
PC materials 8 contact follow-up temperature of continuing rising with mould roller 12, while with the rotation of mould roller 12 and pressure roll 13, loading Process starts, and the pressure being subject on PC materials 8 gradually increases, and starts the fine die cavity on Deformation Flow and filling mould roller, and With die cavity wall form reliable Nian Jie, as the pressure roll 13 of mould roller 12 is rotated further, the pressure being subject on PC materials 8 Start to be gradually reduced after reaching maximum, i.e., uninstall process starts, due to the bonding formed in loading procedure, PC materials in unloading The resilience of formed fine structure is prevented from 8, and after the completion of unloading, PC materials 8 are passed between mould roller 12 and pressure roll 13 Go out, fit together with mould roller 12 due to adhesive attraction, PC is now made by upper cooling device 14 and lower cooling device 15 Formed fine structure is cooled and solidified rapidly on material 8, and it is deviate from from die cavity by tensile force, last further cold But to room temperature, obtaining Surface Machining has the polymeric articles 16 of fine structure, and the winding of product is completed by wind-up roll 18.
In the present embodiment, resilience is prevented using enhanced adhesion, can effectively reduce roll temperature, it is to avoid under higher temperature Polymeric material occur serious thermal deformation and it is thinning the problems such as, while roll-in speed can be improved, so as to improve duplicating efficiency.

Claims (9)

1. the polymer surfaces micro-structural thermal marking method of a kind of plasmaassisted, it is characterised in that the method includes following Step：
(1) it is surface-treated：Polymeric material and template surface are processed using Surface Treatment with Plasma technology, enhancing polymerization Adhesive attraction between thing material and template；
(2) type is filled in hot pressing：More than heating polymeric material to glass transition temperature (Tg), applying pressure makes in its filling template Fine die cavity, and make to form reliable between formed polymer micro-structural and die cavity wall using enhanced adhesive attraction Bonding；
(3) unload：Unloading pressure, the resilience of polymer micro-structural is prevented by the bonding of formation in step (2) in uninstall process；
(4) cool down：It is cooled in unloading and completes after-applied, material and template is cooled to below Tg, solidifies formed polymer Micro-structural, while causing the strong adhesion between polymer and template to be changed into weak adhesion using differing for Material shrinkage in cooling；
(5) demoulding：Apply knockout press and complete the demoulding, obtaining Surface Machining there are the polymeric articles of micro-structural.
2. a kind of polymer surfaces micro-structural thermal marking method of plasmaassisted according to claim 1, its feature It is that described Surface Treatment with Plasma technology is included to the plasma template surface cleaning of template surface and to polymer The plasma polymer surface of material surface is modified.
3. a kind of polymer surfaces micro-structural thermal marking method of plasmaassisted according to claim 2, its feature It is, the plasma template surface cleaning method, including normal pressure atmospheric plasma and vacuum low-temperature plasma cleaning；
Described plasma polymer surface method of modifying, including normal pressure atmospheric plasma, vacuum low-temperature plasma surface Modified and sided corona treatment.
4. a kind of polymer surfaces micro-structural thermal marking method of plasmaassisted according to claim 3, its feature It is, it is described for the plasma that the plasma of template cleaning mixes for oxygen gas plasma or oxygen and inert gas Inert gas is argon gas or helium, and absorption is removed in template surface using the oxidation effect of oxygen and the bombardment effect of inert gas The organic pollution such as greasy dirt, reduce the weak boundary layer in bonding；
Described plasma surface modification is, using oxygen, nitrogen or air plasma treatment polymeric material, to make polymerization Thing material surface generates polar group because aoxidizing or nitrogenizing, and polymer surfaces polarity and surface energy is improved, so as to improve bonding In model ylid bloom action power.
5. a kind of polymer surfaces micro-structural thermal marking method of plasmaassisted according to claim 1, its feature It is that described polymeric material is thermoplastic based polymer, and thickness is more than 10 μm.
6. the polymer surfaces micro-structural thermal marking method of a kind of plasmaassisted according to claim 1 or 5, it is special Levy and be, after described surface of polymer material treatment, the thickness of its surface reforming layer is less than 100nm.
7. a kind of polymer surfaces micro-structural thermal marking method of plasmaassisted according to claim 6, its feature It is, the modified polymeric material in surface, its surface can reach 60mJ/m2More than.
8. a kind of polymer surfaces micro-structural thermal marking method of plasmaassisted according to claim 6, its feature It is that the characteristic size of described polymer micro-structural is between 100nm~1000 μm.
9. a kind of polymer surfaces micro-structural thermal marking method of plasmaassisted according to claim 6, its feature It is that the temperature of the heating polymeric material described in step (2) is between Tg to Tg+50 DEG C.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109850841A (en) * 2018-12-30 2019-06-07 深圳博华仕科技有限公司 A kind of bottom plate packaging system of micro-fluidic chip
CN110614861A (en) * 2019-09-12 2019-12-27 东莞光群雷射科技有限公司 Production process of CPP film laser holographic film

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JP2001058352A (en) * 1999-06-14 2001-03-06 Dainippon Printing Co Ltd Contact transfer method and apparatus and transfer mold
CN1685537A (en) * 2002-08-06 2005-10-19 艾夫西亚有限公司 Organic light emitting diodes
CN1727994A (en) * 2005-07-28 2006-02-01 上海交通大学 Method for reducing surface roughness on Nano stamping reproduction based on technique of backflow
JP2011148104A (en) * 2010-01-19 2011-08-04 Tokyo Institute Of Technology Method for joining substrate having fine structure, and method for manufacturing micro fluid device using the method for joining
CN103171222A (en) * 2013-03-07 2013-06-26 宜兴市王者塑封有限公司 High-viscosity composite film for flexible electronic packaging application, and its processing method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001058352A (en) * 1999-06-14 2001-03-06 Dainippon Printing Co Ltd Contact transfer method and apparatus and transfer mold
CN1685537A (en) * 2002-08-06 2005-10-19 艾夫西亚有限公司 Organic light emitting diodes
CN1727994A (en) * 2005-07-28 2006-02-01 上海交通大学 Method for reducing surface roughness on Nano stamping reproduction based on technique of backflow
JP2011148104A (en) * 2010-01-19 2011-08-04 Tokyo Institute Of Technology Method for joining substrate having fine structure, and method for manufacturing micro fluid device using the method for joining
CN103171222A (en) * 2013-03-07 2013-06-26 宜兴市王者塑封有限公司 High-viscosity composite film for flexible electronic packaging application, and its processing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109850841A (en) * 2018-12-30 2019-06-07 深圳博华仕科技有限公司 A kind of bottom plate packaging system of micro-fluidic chip
CN109850841B (en) * 2018-12-30 2021-09-21 深圳博华仕科技有限公司 Bottom plate packaging device of micro-fluidic chip
CN110614861A (en) * 2019-09-12 2019-12-27 东莞光群雷射科技有限公司 Production process of CPP film laser holographic film

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