CN109850841A - A kind of bottom plate packaging system of micro-fluidic chip - Google Patents

Abstract

The invention discloses a kind of bottom plate packaging systems of micro-fluidic chip, a kind of bottom plate packaging system of micro-fluidic chip includes: the first transfer assembly, first pressing assembly described in second glue spreading assembly, the first pressing assembly includes mutual corresponding first press bonding roller, the second pressing cylinder, the first section, the village layer and the battery plate band above the first transmission substrate that have the encapsulation glue-line to be laminated, micro-fluidic chip band is formed, the present invention carries out micro-fluidic chip print using print principle combination micro-fluidic chip manufacturing process and makes.

Description

A kind of bottom plate packaging system of micro-fluidic chip

Technical field

The present invention relates to microfluidic art more particularly to a kind of bottom plate packaging systems of micro-fluidic chip.

Background technique

Micro-fluidic chip is a frontier interdisciplinary, be new century analysis science, micro electro mechanical processing, life science, The important development forward position in many fields such as chemical synthesis, analysis instrument and environmental science.

Microfabrication of the processing technology of microfluidic analysis chip originating from semiconductor and IC chip, but chip is logical The processing dimension in road is much larger than large scale integrated circuit, and the size approximate number square centimeter of chip, microchannel width and depth are micro- Meter level.On the other hand, it is then to the design of the selection of chip material, microchannel, the surface modification of microchannel and the production of chip The critical issue of microfluidic analysis chip.

In the prior art, in micro-fluidic chip processing technology, mainly there are laser engraving, chemical etching, the side such as photoetching Method, these methods cut both ways, major defect be it is complicated for operation, the process-cycle is long, has selection to material, and channel roughness is big, And poor repeatability, and be difficult to produce in batches, it is difficult as a kind of general effective chip processing method.As modern numerical control is micro- The development of processing technology has been able to satisfy the technical requirements of micro-fluidic chip, but existing number in machining accuracy and scale Control micro Process equipment is not fully dedicated to the design and processing of micro-fluidic chip in design, causes using upper unnecessary to material Waste and destruction.

Therefore, there is also very big development spaces for the prior art.

Summary of the invention

Place in view of above-mentioned deficiencies of the prior art, the present invention provide a kind of micro-fluidic chip print and make system and its user Method manufactures micro-fluidic chip using the principle of printing technique, has unique technical characteristic, and improve the spirit of operation Activity.

To achieve the above object, this invention takes following technical schemes: a kind of bottom plate packaging system of micro-fluidic chip, It include: the first transfer assembly, first transfer assembly includes the first head end roller, first end roller, and is set to described the The first transmission substrate between one head end roller, the first beam end roller, the first transmission substrate, which carries, is provided with band functional material Fluid channel first material layer；Second glue spreading assembly: second glue spreading assembly is set to the first head end roller, first end Between roller.An encapsulation glue-line to be transferred in the non-fluid channel area of the first material layer；First pressing assembly, first pressure Seaming element is set between second glue spreading assembly and the first end roller, and first pressing assembly includes mutual corresponding First press bonding roller, the second pressing cylinder will have the first section, village layer of the encapsulation glue-line and be located at the first transmission base Battery plate band above material is laminated, and forms micro-fluidic chip band.

Preferably, the bottom plate packaging system, further includes glue spreader, and the glue spreader is equipped with the second gravure template, The second gravure shape of template is corresponding with the non-fluid channel；Second gluing mouth mold, the second gluing mouth mold and the painting Rubber roller is corresponding, by encapsulation glue-line blade coating to the second gravure template, holds rubber roller, the glue spreader is opposite with rubber roller is held Setting, the glue spreader rotates backward with rubber roller is held, make encapsulation glue-line in this second gravure template be transferred to described first In material layer.

Preferably, second glue spreading assembly further include: glue spreader, the glue spreader are equipped with the second gravure template, institute It states the second gravure template and is equipped with the salient point for being coated with encapsulation glue-line.Net roll, the net roll and the tangent setting of the glue spreader, institute The leak adhesive pattern for stating net roll is corresponding with the salient point: the second gluing mouth mold, the second gluing mouth mold is corresponding with the net roll, will The encapsulation glue-line blade coating is transferred on the salient point of the second gravure template to stating in net roll by the net roll；

Hold rubber roller, the glue spreader is oppositely arranged with rubber roller is held, the glue spreader with hold rubber roller and rotate backward, make institute this Encapsulation glue-line in two gravure templates is transferred in the first material layer.

Preferably, second glue spreading assembly is silk screen hectograph and the second gluing mouth corresponding with the silk screen hectograph Mould, the leak adhesive pattern of the silk screen hectograph are corresponding with the non-fluid channel area of the first material layer.

Preferably, second glue spreading assembly is silk screen roller and the gluing mouth mold that is set in the silk screen roller, described The leak adhesive pattern of silk screen roller is corresponding with the non-fluid channel area of first material section floor, by the gluing mouth mold by packaging plastic Floor is transferred to the non-fluid channel area.

Preferably, it is equipped with the second accommodating chamber in the first press bonding roller of first pressing assembly, is equipped in the accommodating chamber Second solidification device, for solidifying to the encapsulation glue-line.

Preferably, the encapsulation glue-line is uv-curable glue, and second solidification device is ultraviolet lighting machine；First pressure Odd roller is formed by transparent material.

Preferably, the hardness of the second pressing cylinder is 20-40；The hardness of first press bonding roller is 80-100；So that First press bonding roller, described second when pressing simple mutual extrusion, and the second pressing cylinder compressional deformation forces the electrode Band, the first material layer are contacted with first press bonding roller there are band-like.

Preferably, first seaming element further include: the transparent third that hardness is 20-40 presses cylinder, the third pressing Cylinder is sheathed on outside first press bonding roller, is corresponding with the second pressing cylinder,

Preferably, the material of first press bonding roller is quartz: the second pressing cylinder, the material of the third pressing cylinder For silica gel.

Preferably, external transfer assembly is additionally provided between second glue spreading assembly and first pressing assembly: described External transfer assembly includes first roller and tail roller, and is set to the first roller, and substrate is transmitted in the outside first between tail roller；It is described Tail roller and the first transmission substrate are tangent, and the band encapsulating products are transferred to first transmission by the external transfer assembly Substrate is covered on the glue-line with the space of a whole page.

Preferably, further include packing device, the packaging be set to first pressing assembly and the first end roller it Between, post package is cut to the micro-fluidic chip band to realize.

Preferably, the transfer assembly further includes several correction limiters, and each correction limiter includes: setting In the limit hole on the first transmission substrate and corresponding to the deviation rectification roller of limit hole setting；The first transmission base It constantly avoids deviateing transmission route by deviation rectification roller and limit hole cooperation in material displacement.

The utility model has the advantages that the process week that the use that (1), such as gravure are set up effectively can shorten entire chip manufacturing Phase, the first curing schedule and first material layer printing step carry out simultaneously, and set up in first gluing into gluing Be the first discharging mouth mold be also can corresponding first material fill, do not need another step and complete later to carry out again Next step effectively saves the time, while solving operational complexity, the problem of process-cycle length.

(2), each device of whole system can be independently operated, whole system can according to different chip property into Row selects specific operating procedure to have repeatability well.

(3) there are multiselect operations for some components in device, therefore can print different micro-fluidic chips, and not only It is only only limited to one kind, substantially can be used as a kind of general effective micro-fluidic chip system of processing, compared with prior art There is very big breakthrough.

(4) property of first pressing assembly is the thickness ratio alternatively, still the number of plies of the chip is relatively more When larger, thus possible the problem of will being related to the hardness of pressing device, described first presses the hard of component in the present invention Degree is alternatively, can be good at being suitable for various chips manufacturing process.

(5) print of entire micro-fluidic chip makes assembly line that process is produced similar to one and the filling device is equipped with Multiple ink guns, dust nozzle, the electrode coining, first material layer coining, bottom plate encapsulation etc. is all to be grasped in batches Make, solves the deficiencies in the prior art.

Detailed description of the invention

In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with The structure shown according to these attached drawings obtains other attached drawings.

Fig. 1 is that the micro-fluidic chip print of the embodiment of the present invention 1 makes the structural schematic diagram of system；

Fig. 2 is that the first material layer print of the embodiment of the present invention 1 makes the structural schematic diagram of device；

Fig. 3 is the structural schematic diagram of the surface processing device of the embodiment of the present invention 1；

Fig. 4 is the structural schematic diagram of the filling device of the embodiment of the present invention 1；

Fig. 5 is that the electrode print of the embodiment of the present invention 1 makes the structural schematic diagram of device；

Fig. 6 is the structural schematic diagram of the bottom plate packaging system of the embodiment of the present invention 1；

Fig. 7 is the structural schematic diagram of the first punching component of the embodiment of the present invention 1；

Fig. 8 is the structural schematic diagram of the first material layer interstitital texture of the embodiment of the present invention 1；

Fig. 9 is that the micro-fluidic chip print of the embodiment of the present invention 1 makes method flow diagram.

Drawing reference numeral explanation:

The embodiments will be further described with reference to the accompanying drawings for the realization, the function and the advantages of the object of the present invention.

Specific embodiment

Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that described embodiment is only a part of the embodiments of the present invention, instead of all the embodiments.Base Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts it is all its His embodiment, shall fall within the protection scope of the present invention.

It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute is only used in the embodiment of the present invention In explanation in the phase under a certain particular pose (as shown in the picture) between each component

To positional relationship, motion conditions etc., if the particular pose changes, directionality is indicated also correspondingly It changes correspondingly.

In the present invention unless specifically defined or limited otherwise, term " connection ", " fixation " etc. shall be understood in a broad sense, For example, " fixation " may be a fixed connection, it may be a detachable connection, or integral；It can be mechanical connection, be also possible to Electrical connection；It can be directly connected, the connection inside two elements or two can also be can be indirectly connected through an intermediary The interaction relationship of a element, unless otherwise restricted clearly.It for the ordinary skill in the art, can basis Concrete condition understands the concrete meaning of above-mentioned term in the present invention.

In addition, the description for being such as related to " first ", " second " in the present invention is used for description purposes only, and should not be understood as Its relative importance of indication or suggestion or the quantity for implicitly indicating indicated technical characteristic.Define as a result, " first ", The feature of " second " can explicitly or implicitly include at least one of the features.In addition, the technical side between each embodiment Case can be combined with each other, but must be based on can be realized by those of ordinary skill in the art, when the combination of technical solution Conflicting or cannot achieve when occur will be understood that the combination of this technical solution is not present, also not the present invention claims guarantor Within the scope of shield.

The present invention proposes that a kind of micro-fluidic chip print makes system according to Fig. 1.Micro-fluidic chip is conveniently made, Efficiency is obviously improved on the basis of being limited to technology, and it includes: the first transfer assembly 1 that the micro-fluidic chip print, which makes system, described First transfer assembly 1 includes the first head end roller 10, and the be set between the first head end roller 10, first end roller 11 One transmission substrate 12, the first transmission substrate 12 use a kind of transparent the first gravure of medical grade PMM template 2110, PC, CBC, COC, COP, PS wait polymerization species coiled material, and width is differed from 50mm to 360mm, and thickness is differed from 0.1mm to 2mm.Concrete specification Size is determined according to product size and typesetting situation；The transmission plane and ground level of the first transmission substrate 12.

It further includes 9 gravure device 2 of first material layer, first material that the micro-fluidic chip print, which makes system, as shown in Figure 2 9 gravure device 2 of the bed of material includes that print makes component 21, and the print makes component 21 and includes:

First discharging mouth mold 210, so that the first material is flowed out from the first discharging mouth mold 210, first material can For a kind of medical grade thermoplastic or heat cured powdered resin or pellet resins etc. in the present embodiment using a kind of thermoplastic The pellet resins of property；

Further, it is described first discharging 210 side of mouth mold be equipped with infrared heater 216, to first material into Row heating, keeps its outflow more smooth.

Forme roller 211 corresponding with the first discharging mouth mold 210 is arranged, the forme roller 211 and first head end Roller 10, the rotation direction of first end roller 11 are corresponding, and the forme roller 211 rotates perpendicular to the ground, and 211 surface of forme roller is set There is the first gravure template 2110；The first discharging mouth mold 210 is in contact with the first gravure template 2110, and described first goes out Material mouth mould 210 can also play the role of paving first material while discharging in the first gravure template 2110, institute It states forme roller 211 and at least keeps tangent with first transmission belt upper surface；Enable first material and first transmission Substrate 12 contacts, and is set to the first solidification equipment 214 of 12 lower section of the first transmission substrate, in the present embodiment root It is a kind of thermoplastic according to the glue-line of selection and the property of the first material, so first solidification equipment 214 is cold knife, First solidification equipment 214 is corresponding with the forme roller 211, so as to be filled in the first material in the first gravure template 2110 Material is formed by curing the first material layer 9 with fluid channel 90, and the first material layer 9 is driven by the first transmission substrate 12 Deviate from from the first gravure template 2110 and mobile to the first end roller 11.

Specifically, the print makes component 21 further include: at least one hot-pressing roller 215, the hot-pressing roller 215 are set to institute State the first discharging mouth mold 210 and it is described first transmission substrate 12 between and it is tangent with the first gravure template 2110, rolling Push to first material play the role of one pressing, make the first object being filled in the first gravure template 2110 Material by the hot-pressing roller 215, be sufficient filling in the first gravure template 2110, while guarantee first material into Material is sufficient filling in the first gravure template 2110 before row pressing.

Specifically, being equipped with the first accommodating chamber 2111 inside the forme roller 211, it is equipped in first accommodating chamber 2111 First thermostat 2112, first thermostat 2112 carry out temperature holding to first material, make it close to the first constant temperature The part of device 2112 will not solidify, first thermostat 2112 be detachably connected in first accommodating chamber 2111.

Specifically, the functional layer gravure device further include: the first glue spreading assembly 22, first glue spreading assembly 22 are set to Before making component 21 into the print, first glue spreading assembly 22 includes: to correspond to be suspended from table on the first transmission substrate 12 The first gluing mouth mold 220 in face, so that the first viscose is squeezed out from the first gluing mouth mold 220；And it is butted on described First carrier 221 of one transmission 12 lower surface of substrate, first carrier 221 is roller arrangement in the present embodiment, corresponding It is rotated in the first transmission substrate 12, first carrier 221 and 220 corresponding matching of the first gluing mouth mold make institute The first glue-line is adhered on the first transmission 12 surface of substrate stated on the first transmission substrate 12, and the mucigel is one in the present embodiment Kind hot melt adhesive.

Specifically, the functional layer gravure device further include: thermostatic assembly 24, the thermostatic assembly 24 include Warming machine, The thermostatic assembly 24 is set to first glue spreading assembly 22 and the print is made between component 21, to being coated with described the first of glue-line It transmits substrate 12 and carries out constant temperature, solidify glue-line not.

In the present embodiment since the property of the first viscose used is hot melt adhesive, the property of first material is also heat Plasticity, so the corresponding thermostatic assembly 24, hot-pressing roller 215, the first thermostat 2112, the first solidification device is all corresponding Be arranged with their property, when the glue-line property use UV glue when, the first material property also select similarly, this When a, the hot-pressing roller 215 replaces with compression roller 215, that is, closes the warming-up device of hot-pressing roller 215, and described first Thermostat 2112 and institute's infrared heater 216 are in off state, and first solidification equipment is illumination machine or LED light Band, the present invention in do not do specific restriction.

Specifically, further including the first corona machine 23 being arranged corresponding to the first transmission substrate 12, first corona Machine 23 is set to before first glue spreading assembly 22, for improving the surface tension of the first transmission substrate 12, increases glue The adhesive force of layer.

Specifically, it further includes the first roller platen 212 and the second roller platen 213 that the print, which makes component 21,；First pressure Roller 212, the second roller platen 213 and the forme roller 211 cooperation clamping the first transmission substrate 12 are printed, so that described first passes It send substrate 12 to come into full contact with the first material in the first gravure template 2110, forms a bonding zone, in the present embodiment The shape of the bonding zone corresponds to the radian of the forme roller 211, the corresponding bonding zone of first roller platen 212 into Mouthful, the outlet of the corresponding bonding zone of second roller platen 213, first solidification equipment 214 is correspondingly arranged at the bonding Area's setting, first roller platen 212, the second roller platen 213 are mutually at regular intervals, in the present embodiment the bonding zone Arc length accounts for about 30% to the 50% of whole circumference, specific spacing, and the difference according to material solidification speed degree is adjusted.

Further, it further includes the stripper 217 corresponding to gravure roll setting, the demoulding that the print, which makes component 21, Liquid parting is stored in device 217；Before first material precoating is overlying on the first gravure template 2110, the demoulding Device 217 is sprayed in the first gravure template 2110 so that first material and the first gravure template 2110 it Between form separation layer, the release agent can be polytetrafluoroethylene (PTFE)；Fluororesin powder；Fluorine resin coating etc., the present invention, which is not done, to be had Body limitation.

Specifically, as shown in fig. 7, it further includes the first punching component that the print, which is made between component 21 and the end fixing roller, 3, first punching component 3 includes: to be respectively arranged at 12 top of the first transmission substrate, the first transmission substrate 12 First die cutting roller 30 of lower section, first, which are held, cuts roller 31；So as to first die cutting roller 30, hold with described first and to cut that roller 31 is corresponding to match It closes, through-hole is arranged in the first material layer 9 by the first die cutting roller 30, first die cutting roller 30 holds with described first and cuts Roller 31 is corresponding, and first punching component 3 stamps notch on the near side (ns) of the first base material two sides, to determine chip fluid channel 90 positions cooperate the contraposition of subsequent fitting and encapsulation reagent.Way is: each notch represents a kind of signal, corresponding opposite 90 region of fluid channel, identify to read by photoelectricity and obtain position signal, be transferred to external control system, outside control system System, provides corresponding action command, such as spray test-run a machine.

Specifically, as shown in figure 3, it further includes surface processing device 4 that micro-fluidic chip print, which makes system, at the surface Reason device 4 includes the surface liquid flush coater 41 corresponding to the fluid channel 90 setting, to spray the first feed liquid to the fluid channel 90 are surface-treated, and second material layer 92 is obtained, and the second material layer 92 invests the surface of the fluid channel 90.

Further, the surface processing device 4 further includes the second corona machine 40, drier 42 or refrigerator 43, described Second corona machine 40, surface liquid flush coater 41, drier 42 or refrigerator 43 are successively arranged far from the first head end roller 10, institute It states drying machine and the refrigeration machine both to choose whether to require according to the characteristic of the characteristic layer or alternative, described second Corona machine 40 is used to carry out sided corona treatment to the surface of the first material layer 9, increases dyne value of the first material layer 9 Add.

The finish materials can be used that a kind of improvement micro-fluidic chip water passage surface is hydrophobic or hydrophilic or bio-compatible The fluent materials such as property protein.

Specifically, as shown in figure 4, being additionally provided with filling between the surface processing device 4 and the first end roller 11 Device 5, the filling device 5 include: the nozzle for being correspondingly arranged in 90 top of fluid channel, will be stored in the nozzle The second feed liquid fill into the reaction zone of 92 fluid channel 90 of second material layer, obtain third material layer 93, it is specific such as Fig. 8 It is shown.

Further, the filling device 5 further includes that dry powder dusts component 50, and corresponding with the first material layer 9； The dry powder component 50 that dusts includes dust nozzle 500, and the dust nozzle 500 is corresponding with the reaction zone of the fluid channel 90；

Further, further include photoelectric probe 54, the photoelectric probe 54 be set to the surface processing device 4 with it is described It dusts between component 50 with dry powder, the reaction zone in the fluid channel 90 is positioned；The photoelectric probe 54 described is dusted First 500 are connected by external control system respectively, are controlled the dry powder component 50 that dusts by the external control system and are positioned Filling.

It further, further include drop spray component 51, the drop spray component 51 is set to the photoelectric probe 54 and first end Between roller 11, the drop spray component 51 includes several ink guns 510,510 position of ink gun and the fluid channel 90 Reaction zone is corresponding, is similar to ink jet printing mechanism, it is changeable that the ink gun 510 can fill reagent type.

Further, further includes: electrostatic digital printing component 52, the electrostatic digital printing component 52 are set to the photoelectricity Between probe 54 and first end roller 11, the reaction zone pair of the electrostatic digital printing component 52 and the fluid channel 90 It answers, for electrostatic digital printing component 52 similar to Xerox's electrostatic digital printer, the relief printing plate for reacting acupuncture point size by corresponding chip is convex Point Electrostatic Absorption mode is transferred in the acupuncture point.

Further, further includes: slide assemblies 53, the electrostatic digital printing component 52, drop spray component 51, described The dry powder component 50 that dusts is mounted on the slide assemblies 53, and the electrostatic digital printing component 52, the drop spray component 51, institute It states the dry powder component 50 that dusts to be connect with the external control system by servo motor 530, passes through the servo motor 530 driving The displacement of component 50 that the electrostatic digital printing component 52, the drop spray component 51, the dry powder dusts switchs.

In the present invention, the electrostatic digital printing component 52, the drop spray component 51, the dry powder dust 50 three of component For selectable unit (SU), according to the mode of the property of chip selection filling, it may be selected to fill a kind of device, can also all select, it can also be with Two kinds are selected, also just forgiving the bill kept on file material layer 93 can be multilayer, and present aspect is without limitation.

It is the electrostatic digital printing component 52, described specifically, the slide assemblies 53 further include height adjuster 531 Drop sprays component 51, the dry powder dusts, and group is connect by the height adjuster 531 with the servo motor 530, described outer Under the control of portion's control system, the electrostatic digital printing component 52, the drop is driven to spray component by the servo motor 530 51, the dry powder dusts 50 upper and lower displacement of component.

Specifically, as shown in figure 5, it further includes that electrode print makes device 6, the electrode print that micro-fluidic chip print, which makes system, Making device 6 includes: the second transfer assembly 60, and second transfer assembly 60 includes the second head end roller 600, second end roller 601, And it is set to the second transmission substrate 602 between the second head end roller 600, second end roller 601, it is used for carry electrode Raw material, a kind of copper foil or aluminium foil suitable for biochemistry detection can be used in the electrode material in the present embodiment, can also select Suitable for thin-film materials coiled strips such as the metal coating that does electrode etc., the present invention does not do specific restriction；

It further include cutting component 61, the component 61 that cuts includes: to correspond respectively to the second head end roller 600 and The diaphragm cutter 610 that is arranged between two end rollers 601, second, which are held, cuts roller 611, traction roller, the diaphragm cutter 610 and described the Two hold and cut roller 611 and be correspondingly arranged；Second transmission, the 602 carry electrode raw material of substrate passes through the diaphragm cutter 610, holds and cut roller Between with the traction roller establish connection, by the diaphragm cutter 610 and hold and cut roller corresponding matching in second transmission Crush-cutting goes out the clout around electrode slice and electrode slice on substrate 602；In the present embodiment, the traction roller and the electrode are former Material connection, the traction roller is far from the second head end roller 600, and traction roller corresponds to the speed of the second transmission substrate 602 Degree is by the clout and coiling on the traction roller, and remaining electrode slice is on the second transmission substrate 602, and described second It transmits substrate 602 and is equipped with slewing rollers 623.

Specifically, the pole print makes assembling device further include: third transfer assembly 62, the third transfer assembly 62 include Third head end roller 620, third end roller 621, and be set between the third head end roller 620, third end roller 621 Three transmission substrates 622 are additionally provided with slewing rollers 623 on third transmission substrate 622, will be with the by the slewing rollers 623 The one of three glue-lines is facing towards the electrode slice, and the third transmission substrate 622 is for transmitting the second base；

Third glue spreading assembly 63, the third glue spreading assembly 63 are set to the third head end roller 620 and the slewing rollers 623 Between third transmission substrate 622 on, the third glue spreading assembly 63 includes, corresponding to be suspended from the third transmission substrate 622 The third gluing mouth mold 630 on surface, so that viscose is squeezed out from the third gluing mouth mold 630；And

Be butted on the third carrier 631 of third transmission 622 lower surface of substrate, the third carrier 631 with it is described 630 corresponding matching of third gluing mouth mold makes second base upper surface adhere to third glue-line；In the present embodiment, described The property of three glue-lines is as second glue-line 94.First carrier, the second carrier, third are held in the present embodiment Carrying device is roller arrangement.

Third end roller 621 is tangential on second cut between component 61 and second pressing assembly 64 It transmits on substrate 602, the rotation corresponding with the second transmission substrate 602 of third end roller 621 is used for second base The incoming second transmission substrate 602 of layer.

Specifically, the electrode print makes device 6, further includes: the second pressing assembly 64, second pressing assembly 64 are set to On the second transmission substrate 602 cut between component 61 and the second end roller 601, second pressing assembly 64 Including third press bonding roller 640, the 4th press bonding roller 641, the third press bonding roller 640 and second transmission, 602 upper surface of substrate It is tangent, the 4th press bonding roller 641 and it is described second transmission 602 lower surface of substrate it is tangent, by the third press bonding roller 640, The electrode slice is affixed on the glue-line of second base by 641 corresponding matching of the 4th press bonding roller, forms the with electrode slice Two bases, in the present embodiment in the electrode slice coining and the third glue-line, so that the electrode slice and the third glue Layer is concordant.

Specifically, third end fixing roller is the first press bonding roller 710.

Specifically, further include the second thermostat 65, second thermostat 65 be set to third end fixing roller with Between the third glue spreading assembly 63, heated at constant temperature is carried out corresponding to second base for being coated with glue-line, to described second It is conducive to bonding when base and the electrode slice are pressed to stablize.

Specifically, the second punching component 66 is additionally provided between second pressing assembly 64 and second end roller 601, it is described Second punching component 66, two punching component include: to be respectively arranged at 602 top of the second transmission substrate, described second Transmit the second convex roller 660, the second runner 661 of 602 lower section of substrate；So as to first die cutting roller 30, hold and cut with described first Through-hole is arranged in second base by the first die cutting roller 30 in 31 corresponding matching of roller.

Specifically, as shown in fig. 6, micro-fluidic chip print makes system further include:

Electrode band 73；And

Bottom plate packaging system 7, the bottom plate packaging system 7 include: the second glue spreading assembly 72 and the first pressing assembly 71,

Second glue spreading assembly 72 includes corresponding the second gluing mouth mold for being suspended from 9 upper surface of first material layer 722, so that the second viscose is squeezed out from the second gluing mouth mold 722, second viscose is photosensitive in the present embodiment Glue, ultraviolet curing glue (UV glue)；And it is butted on the second carrier of first transmission, 12 lower surface of substrate, described second Carrier and described the and gluing mouth mold corresponding matching, so that the adhesion zone on 9 surface of first material layer is adhered to the second glue-line 94； First pressing assembly 71 is set between second glue spreading assembly 72 and the first end roller 11, first pressing assembly 71 include corresponding to each other the first press bonding roller 710 and the second pressing cylinder 711, first transmission with the first material layer 9 Substrate 12, the electrode band 73 synchronize across first press bonding roller 710 and second press bonding roller, pass through described first Press bonding roller 710, the second press bonding roller press the electrode band 73 and the first material layer 9, form micro-fluidic chip band.

Further, the second end roller 601 is connect with the electrode band 73, by the second base of the electrification pole piece It is passed on the first transmission substrate 12.

Further, second glue spreading assembly 72 further includes glue spreader 720, and it is recessed that the glue spreader 720 is equipped with second Die plate 7200,7200 shape of the second gravure template are corresponding with the non-fluid channel area 91；

Second gluing mouth mold 722, the second gluing mouth mold 722 is corresponding with the glue spreader 720, by the encapsulation glue-line It scratches in the second gravure template 7200；

Hold rubber roller 723, the glue spreader 720 is oppositely arranged with rubber roller 723 is held, the glue spreader 720 with to hold rubber roller 723 anti- To rotation, make encapsulation glue-line in this second gravure template 7200 be transferred to non-fluid channel area in the first material layer 9 91, the second glue-line 94 is formed, second carrier is to hold rubber roller 723 in this embodiment.

In the present invention, the bottom plate packaging system, can also there is net roll, and the net roll 72 can also be silk screen hectograph And the second gluing mouth mold 722 corresponding with the silk screen hectograph, the leak adhesive pattern of the silk screen hectograph and described first 91st area of non-fluid channel of material layer 9 is corresponding, the second gluing mouth mold 722 be set to above the silk screen, second gluing Mouth mold 722 is driven by servo motor 530, and circulation sliding bites the glue-line and the non-microflow layer on the silk screen On, the servo motor 530 is connect with external control system；Either, second glue spreading assembly 72 be silk screen roller 721 and The gluing mouth mold being set in the silk screen roller 721, the leak adhesive pattern of the silk screen roller 721 and the first material layer 9 91st area of non-fluid channel it is corresponding, 91st area of non-fluid channel etc. mode sheet is transferred to for glue-line is encapsulated by the gluing mouth mold Invention is not specifically limited.

Specifically, the second accommodating chamber 7100 is equipped in the first press bonding roller 710 of first pressing assembly 71, described second The second solidification device 7101 is equipped in accommodating chamber 7100, for solidifying to the encapsulation glue-line.

Further, since the glue-line that encapsulates used in the present embodiment is uv-curable glue, second solidification device 7101 be ultraviolet lighting machine, the ultraviolet irradiation and be LED light strip, be set to 7100 kinds of the second accommodating chamber near described first Transmit the position of substrate 12；First press bonding roller 710 is formed by transparent material, to guarantee that translucency is good.

Specifically, the hardness of the second pressing cylinder 711 is 20-40；The hardness of first press bonding roller 710 is 80- 100；So that the second pressing cylinder 711 squeezes shape when first press bonding roller 710, the second pressing 711 mutual extrusion of cylinder Become, the electrode band 73, the first material layer 9 is forced to contact with first press bonding roller 710 there are band-like.

Further, first seaming element further include: the transparent third that hardness is 20-40 presses cylinder 712, the third It is outer, corresponding with the second pressing cylinder 711 that pressing cylinder 712 is sheathed on first press bonding roller 710.

Further, the material of first press bonding roller 710 is quartz；The second pressing cylinder 711, third pressing The material of cylinder 712 is silica gel.

Due in the invention of this hair, the number of plies of coining be it is changeable, when the number of plies of pressing is more or itself is to be laminated Chip semi-finished product when there is certain rigidity, first press bonding roller 710, second can be adjusted accordingly and press cylinder 711, the Three pressing cylinders 712 suitable hardness so that pressing more sufficiently and chip will not be damaged.

Further, external transfer assembly is additionally provided between second glue spreading assembly 72 and first pressing assembly 71 (not shown): the external transfer assembly includes first roller and tail roller, and the outside first being set between the first roller, tail roller Transmit substrate 12；The tail roller and the first transmission substrate 12 are tangent, and the external transfer assembly is by the band encapsulating products The first transmission substrate 12 is transferred to be covered on the glue-line with the space of a whole page.

Further, it further includes packing device that micro-fluidic chip print, which makes system, and the packaging is set to described first Between pressing assembly 71 and the first end roller 11, post package is cut in the present embodiment to the micro-fluidic chip band to realize In, the packing device is vacuum plastic-absorbing machine.

The packing device further includes printing assembly, and the printing equipment includes digital ink-jet groups of printers, to chip Two dimensional code, coding etc. you etc. printing.

Specifically, it further includes detection device that the micro-fluidic chip print, which makes system, the detection device is set to the printing On the first transmission substrate 12 between component and the first end roller 11, the detection device includes artificial intelligence visual scanning Machine, in the present embodiment, the visual scanning machine are micro-fluidic chip detection machine.

Specifically, the transfer assembly further includes several correction limiters 8, each correction limiter 8 includes: The limit hole being set on the first transmission substrate 12 and the deviation rectification roller corresponding to limit hole setting；Described first It constantly avoids deviateing transmission route by deviation rectification roller and limit hole cooperation in the transmission displacement of substrate 12.

A kind of print of micro-fluidic chip makes method, as shown in figure 9, including the following steps:

One first transmission substrate 12 and a forme roller 211 are provided, the forme roller 211 is in the first transmission substrate 12 Drive lower rotation.

S1: the first corona step: the surface dynes of the first transmission substrate 12 are increased by first corona machine 23 Value makes dyne value increase to 30 and reaches English up to English to 60.

S2: the first glue application step: correspond to the one side setting the of the forme roller 211 on the first transmission substrate 12 One glue-line, first bondline thickness are between 1.5 microns to 10 microns.

S3: constant temperature step: constant temperature is carried out to first glue-line by the thermostatic assembly 24, makes first glue-line not Solidification.

S4: pre-release step: before the first material is coated on the first gravure template 2110, pass through stripper 217 Spray liquid parting it is described with the first gravure template 2110 on, make described to make first material layer 9 and the first gravure mould A separation layer is formed before plate 2110.

S5: gravure step: the first material flowed out from the first discharging mouth mold 210 and be filled into surface be provided with it is described In the forme roller 211 of first gravure template 2110.

S6: punch out step, first punching component 3 to first material layer 9 first transmission substrate 12 and/or The first material layer 9 is punched.

S71: increasing the surface dynes value of the first material layer 9 by the second corona machine 40, increases described dyne of value English is reached to 30 up to English to 60.The first feed liquid being stored in surface processing device 4 and/or nozzle, the second feed liquid are transferred to institute It states in fluid channel 90；Hydrophilic layer or hydrophobic layer are obtained by drier and/or refrigerator processing.

S8: specifically, the filler step further include: dry powder transfer means, the dry powder transfer means include: powder out Mouth is respectively arranged at turning powder roller and being set to holding for 12 lower section of the first transmission substrate for 9 top of the first material layer Print roller；Under printing roller cooperation, turns powder roller described in from the feed powder that powder mouth is sent out described out and be filled in the fluid channel In 90.

S9: print glue step: using silk-screen printing or cylinder silk-screen or flexographic printing processes, avoid the fluid channel 90, The adhesion zone surface of the first material layer 9 coats the second glue-line 94；

S10: pressing step: electrode band 73 and the first material layer 9 with second viscose are synchronized and is sent into first Between press bonding roller 710, the second press bonding roller, so that the correspondence of the electrode band 73 is attached on the adhesion zone；

S11: the second curing schedule: the second solidification dress is provided in first press bonding roller 710 and/or the second press bonding roller It sets, second solidification equipment is corresponding with second viscose, so that the electrode band 73 and the first material layer 9 press together When, realize second viscose solidification.

Specifically, second curing schedule includes: the band-like ultra-violet curing being set in first press bonding roller 710 Device, second glue-line 94 are uv-curable glue, and second press bonding roller is flexible second press bonding roller, when flexible second pressure It closes roller and first press bonding roller 710 cooperation squeezes, so that the electrode band 73, the first transmission substrate 12 and described the One press bonding roller 710 has the consolidation zone of planar.

Specifically, be repeated in the gravure step, the first curing schedule, filling step, print glue step, pressing step, Second curing schedule, at least once.

The above description is only a preferred embodiment of the present invention, is not intended to limit the scope of the invention, all at this Under the inventive concept of invention, using equivalent structure transformation made by description of the invention and accompanying drawing content, or directly/use indirectly It is included in other related technical areas in scope of patent protection of the invention.

Claims (10)

1. a kind of bottom plate packaging system of micro-fluidic chip characterized by comprising

First transfer assembly, first transfer assembly includes the first head end roller, first end roller, and is set to described first The first transmission substrate between head end roller, the first beam end roller, the first transmission substrate, which carries, is provided with the micro- of the first material The first material layer of runner；

Second glue spreading assembly: second glue spreading assembly is set between the first head end roller, first end roller, by an encapsulation Glue-line is transferred in the non-fluid channel area of the first material layer；

First pressing assembly, first pressing assembly are set between second glue spreading assembly and the first end roller, institute Stating the first pressing assembly includes mutual corresponding first press bonding roller, the second pressing cylinder, will have the first of the encapsulation glue-line Section, village layer and the battery plate band above the first transmission substrate are laminated, and form micro-fluidic chip band.

2. bottom plate packaging system according to claim 1, which is characterized in that further include:

Glue spreader, the glue spreader are equipped with the second gravure template, the second gravure shape of template and the non-fluid channel area It is corresponding；

Second gluing mouth mold, the second gluing mouth mold is corresponding with the glue spreader, by encapsulation glue-line blade coating to described the In two gravure templates,

Hold rubber roller, the glue spreader is oppositely arranged with rubber roller is held, the glue spreader with hold rubber roller and rotate backward, making institute, this is second recessed Encapsulation glue-line in die plate is transferred to the non-fluid channel area in the first material layer.

3. bottom plate packaging system according to claim 1, which is characterized in that second glue spreading assembly further include:

Glue spreader, the glue spreader are equipped with the second gravure template, and the second gravure template, which is equipped with, is coated with encapsulation glue-line Salient point described in paint point shape it is corresponding with the non-fluid channel area；

Net roll, the net roll and the tangent setting of the glue spreader, the leak adhesive pattern of the net roll are corresponding with the salient point:

Second gluing mouth mold, the second gluing mouth mold is corresponding with the net roll, by encapsulation glue-line blade coating to stating in net roll, It is transferred to by the net roll on the salient point of the second gravure template；

Hold rubber roller, the glue spreader is oppositely arranged with rubber roller is held, the glue spreader with hold rubber roller and rotate backward, making institute, this is second recessed Encapsulation glue-line in die plate is transferred to the non-fluid channel area in the first material layer.

4. bottom plate packaging system according to claim 1, which is characterized in that second glue spreading assembly be silk screen hectograph with And the second gluing mouth mold corresponding with the silk screen hectograph, the leak adhesive pattern of the silk screen hectograph and the first material layer Non- fluid channel area it is corresponding.

5. bottom plate packaging system according to claim 1, which is characterized in that second glue spreading assembly be silk screen roller and The gluing mouth mold being set in the silk screen roller, the non-miniflow of the leak adhesive pattern of the silk screen roller and first material section layer Road area is corresponding, is transferred to the non-fluid channel area for glue-line is encapsulated by the gluing mouth mold.

6. bottom plate packaging system according to claim 1, which is characterized in that the first press bonding roller of first pressing assembly It is inside equipped with the second accommodating chamber, the second solidification device is equipped in the accommodating chamber, for solidifying to the encapsulation glue-line.

7. bottom plate packaging system according to claim 4, which is characterized in that the encapsulation glue-line is uv-curable glue, institute Stating the second solidification device is ultraviolet lighting machine；Described first presses odd roller to be formed by transparent material.

8. bottom plate packaging system according to claim 4 or 5, which is characterized in that the hardness of the second pressing cylinder is 20- 40；The hardness of first press bonding roller is 80-100；So that first press bonding roller, described second when pressing simple mutual extrusion, The second pressing cylinder compressional deformation, forcing the electrode band, the first material layer and first press bonding roller, there are band-like Contact.

9. bottom plate packaging system according to claim 6, which is characterized in that first seaming element further include: hardness is The transparent third of 20-40 presses cylinder, and it is outer, right with the second pressing cylinder that the third pressing cylinder is sheathed on first press bonding roller It answers.

10. bottom plate packaging system according to claim 7, which is characterized in that the material of first press bonding roller is quartz: The material of the second pressing cylinder, the third pressing cylinder is silica gel.