CN109941958A - A kind of filling device of microchannel chip - Google Patents

Abstract

The invention discloses a kind of filling devices of microchannel chip, for filling functional material in the fluid channel reaction zone, it include: the first transfer assembly, dry powder dusts component, the dry powder component that dusts includes dust nozzle, the dust nozzle is corresponding with the reaction zone of the fluid channel: photoelectric probe described in photoelectric probe, the dust nozzle are connected by external control system respectively, are controlled the dry powder by the external control system and are dusted component positioning filling.The present invention carries out micro-fluidic chip print using print principle combination micro-fluidic chip manufacturing process and makes.

Description

A kind of filling device of microchannel chip

Technical field

The present invention relates to microfluidic art more particularly to a kind of filling devices of microchannel chip.

Background technique

Micro-fluidic chip is a frontier interdisciplinary, be new century analysis science, micro electro mechanical processing, life science, The important development forward position in many fields such as chemical synthesis, analysis instrument and environmental science.

Microfabrication of the processing technology of microfluidic analysis chip originating from semiconductor and IC chip, but chip The processing dimension in channel is much larger than large scale integrated circuit, and the size approximate number square centimeter of chip, microchannel width and depth are Micron order.On the other hand, then to the design of the selection of chip material, microchannel, the surface modification of microchannel and the production of chip It is the critical issue of microfluidic analysis chip.

In the prior art, in micro-fluidic chip processing technology, mainly there are laser engraving, chemical etching, the side such as photoetching Method, these methods cut both ways, major defect be it is complicated for operation, the process-cycle is long, has selection to material, and channel roughness is big, And poor repeatability, and be difficult to produce in batches, it is difficult as a kind of general effective chip processing method.With modern numerical control The development of micro-processing technology has been able to satisfy the technical requirements of micro-fluidic chip in machining accuracy and scale, but existing Numerical control micro Process equipment is not fully dedicated to the design and processing of micro-fluidic chip in design, causes using upper unnecessary right The waste and destruction of material.

Therefore, there is also very big development spaces for the prior art.

Summary of the invention

Place in view of above-mentioned deficiencies of the prior art, the present invention provide a kind of micro-fluidic chip print and make system and its use Method manufactures micro-fluidic chip using the principle of printing technique, has unique technical characteristic, and improve operation Flexibility.

To achieve the above object, this invention takes following technical schemes: a kind of filling device of microchannel chip, uses In filling functional material, including the first transfer assembly in the fluid channel reaction zone, first transfer assembly includes First Roller, first end roller are held, and the first transmission substrate being set between the first head end roller, first end roller, described the One transmission substrate is loaded with the first material layer for being provided with fluid channel；Dry powder dusts component, and the dry powder dusts component set on institute It states between the first head end roller, first end roller.And it is corresponding with the first material layer；The dry powder dusts component including dusting Head, the dust nozzle are corresponding with the reaction zone of the fluid channel；Photoelectric probe, the photoelectric probe are set to first head end Roller and dry powder dust between component, position to the reaction zone in the fluid channel: the photoelectric probe, the dust nozzle It is connected respectively by external control system, the dry powder is controlled by the external control system and is dusted component positioning filling.

It preferably, further include drop spray component, the drop spray component is set between the photoelectric probe and first end roller, The drop spray component includes several ink guns, and the inkjet head position is corresponding with the reaction zone of the fluid channel.

Preferably, further includes: electrostatic digital printing component, the electrostatic digital printing component are set to the photoelectric probe Between first end roller, the electrostatic digital printing component is corresponding with the reaction zone of the fluid channel.

Preferably, further includes: slide assemblies, the electrostatic digital printing component, drop spray component, dry powder spray Component powder is mounted on the slide assemblies, group that the electrostatic digital printing component, the drop spray component, the dry powder dusts Part is connect by servo motor with the external control system, drives the electrostatic digital printing group by the servo motor Component displacement that part, the drop spray component, the dry powder dusts switchs.

Preferably, the slide assemblies further include height adjuster, the electrostatic digital printing component, the drop spray group Part, the dry powder, which dust to organize, to be connect by the height adjuster with the servo motor, is controlled in the external control system Under, drive the electrostatic digital printing component, drop spray component, the dry powder to dust on component by the servo motor Bottom offset.

Preferably, the filling device is photographed in an isolation, and the biography that the first transmission substrate enters and leaves is equipped between the isolation Send mouth.

The utility model has the advantages that the process week that the use that (1), such as gravure are set up effectively can shorten entire chip manufacturing Phase, the first curing schedule and first material layer printing step carry out simultaneously, and set up in first gluing into gluing Be the first discharging mouth mold be also can corresponding first material fill, do not need another step complete it is later again into Row next step effectively saves the time, while solving operational complexity, the problem of process-cycle length.

(2), what each device of whole system can be independently operated, whole system can be according to different chip property It carries out selecting specific operating procedure that there is repeatability well.

(3) there are multiselect operations for some components in device, therefore can print different micro-fluidic chips, not It is only only limited to one kind, substantially can be used as a kind of general effective micro-fluidic chip system of processing, with prior art phase The very big breakthrough than having.

(4) property of first pressing assembly is the thickness alternatively, still the number of plies of the chip is relatively more When bigger, thus possible the problem of will being related to the hardness of pressing device, described first presses component in the present invention Hardness is alternatively, can be good at being suitable for various chips manufacturing process.

(5) print of entire micro-fluidic chip makes assembly line that process is produced similar to one and the filling device is set There are multiple ink guns, dust nozzle, the electrode coining, first material layer coining, bottom plate encapsulation etc. is all to carry out in batches Operation, solve the deficiencies in the prior art.

Detailed description of the invention

In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, below will to embodiment or Attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only Some embodiments of the present invention, for those of ordinary skill in the art, without creative efforts, also The structure that can be shown according to these attached drawings obtains other attached drawings.

Fig. 1 is that the micro-fluidic chip print of the embodiment of the present invention 1 makes the structural schematic diagram of system；

Fig. 2 is that the first material layer print of the embodiment of the present invention 1 makes the structural schematic diagram of device；

Fig. 3 is the structural schematic diagram of the surface processing device of the embodiment of the present invention 1；

Fig. 4 is the structural schematic diagram of the filling device of the embodiment of the present invention 1；

Fig. 5 is that the electrode print of the embodiment of the present invention 1 makes the structural schematic diagram of device；

Fig. 6 is the structural schematic diagram of the bottom plate packaging system of the embodiment of the present invention 1；

Fig. 7 is the structural schematic diagram of the first punching component of the embodiment of the present invention 1；

Fig. 8 is the structural schematic diagram of the first material layer interstitital texture of the embodiment of the present invention 1；

Fig. 9 is that the micro-fluidic chip print of the embodiment of the present invention 1 makes method flow diagram.

Drawing reference numeral explanation:

The embodiments will be further described with reference to the accompanying drawings for the realization, the function and the advantages of the object of the present invention.

Specific embodiment

Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that described embodiment is only a part of the embodiments of the present invention, instead of all the embodiments.Base Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts all Other embodiments shall fall within the protection scope of the present invention.

It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute is only used in the embodiment of the present invention In explanation in the phase under a certain particular pose (as shown in the picture) between each component

To positional relationship, motion conditions etc., if the particular pose changes, directionality instruction is also corresponding Ground changes correspondingly.

In the present invention unless specifically defined or limited otherwise, term " connection ", " fixation " etc. shall be understood in a broad sense, For example, " fixation " may be a fixed connection, it may be a detachable connection, or integral；It can be mechanical connection, it can also be with It is electrical connection；It can be directly connected, the connection inside two elements can also be can be indirectly connected through an intermediary Or the interaction relationship of two elements, unless otherwise restricted clearly.For the ordinary skill in the art, may be used To understand the concrete meaning of above-mentioned term in the present invention as the case may be.

In addition, the description for being such as related to " first ", " second " in the present invention is used for description purposes only, and cannot understand For its relative importance of indication or suggestion or implicitly indicate the quantity of indicated technical characteristic.Define as a result, " the One ", the feature of " second " can explicitly or implicitly include at least one of the features.In addition, the skill between each embodiment Art scheme can be combined with each other, but must be based on can be realized by those of ordinary skill in the art, when technical solution It will be understood that the combination of this technical solution is not present in conjunction with there is conflicting or cannot achieve when, also do not wanted in the present invention Within the protection scope asked.

The present invention proposes that a kind of micro-fluidic chip print makes system according to Fig. 1.Conveniently make micro-fluidic core Piece, efficiency is obviously improved on the basis of being limited to technology, and it includes: the first transfer assembly 1 that the micro-fluidic chip print, which makes system, First transfer assembly 1 include the first head end roller 10, and be set to the first head end roller 10, first end roller 11 it Between first transmission substrate 12, it is described first transmission substrate 12 use a kind of transparent the first gravure of medical grade PMM template 2110, PC, CBC, COC, COP, PS wait polymerization species coiled material, and width is differed from 50mm to 360mm, and thickness is differed from 0.1mm to 2mm. Concrete specification size is determined according to product size and typesetting situation；The transmission plane and the surface water of the first transmission substrate 12 It is flat.

It further includes 9 gravure device 2 of first material layer, first material that the micro-fluidic chip print, which makes system, as shown in Figure 2 9 gravure device 2 of the bed of material includes that print makes component 21, and the print makes component 21 and includes:

First discharging mouth mold 210, so that the first material is flowed out from the first discharging mouth mold 210, first material can For a kind of medical grade thermoplastic or heat cured powdered resin or pellet resins etc. in the present embodiment using a kind of thermoplastic The pellet resins of property；

Further, it is described first discharging 210 side of mouth mold be equipped with infrared heater 216, to first material into Row heating, keeps its outflow more smooth.

Forme roller 211 corresponding with the first discharging mouth mold 210 is arranged, the forme roller 211 and first head end Roller 10, the rotation direction of first end roller 11 are corresponding, and the forme roller 211 rotates perpendicular to the ground, 211 surface of forme roller Equipped with the first gravure template 2110；The first discharging mouth mold 210 is in contact with the first gravure template 2110, and described the One discharging mouth mold 210 can also play while discharging and pave first material and the work in the first gravure template 2110 With the forme roller 211 at least keeps tangent with first transmission belt upper surface；Enable first material and described One transmission substrate 12 contacts, and is set to the first solidification equipment 214 of 12 lower section of the first transmission substrate, in this implementation According to the glue-line of selection and the property of the first material be in example it is a kind of thermoplastic, so first solidification equipment 214 For cold knife, first solidification equipment 214 is corresponding with the forme roller 211, so as to be filled in the first gravure template First material solidification forms the first material layer 9 for having fluid channel 90 in 2110, and the first material layer 9 passes through described first It is from the first gravure template 2110 abjection and mobile to the first end roller 11 to transmit the drive of substrate 12.

Specifically, the print makes component 21 further include: at least one hot-pressing roller 215, the hot-pressing roller 215 are set to institute State the first discharging mouth mold 210 and it is described first transmission substrate 12 between and it is tangent with the first gravure template 2110, rolling Dynamic push plays the role of a pressing to first material, makes to be filled in the in the first gravure template 2110 One material passes through the hot-pressing roller 215, is sufficient filling in the first gravure template 2110, while guaranteeing first material Material material before being pressed is sufficient filling in the first gravure template 2110.

Specifically, being equipped with the first accommodating chamber 2111 inside the forme roller 211, it is equipped in first accommodating chamber 2111 First thermostat 2112, first thermostat 2112 carry out temperature holding to first material, make it close to the first constant temperature The part of device 2112 will not solidify, first thermostat 2112 be detachably connected in first accommodating chamber 2111.

Specifically, the functional layer gravure device further include: the first glue spreading assembly 22, first glue spreading assembly 22 are set Before entering the print and making component 21, first glue spreading assembly 22 includes: corresponding is suspended from the first transmission substrate 12 The first gluing mouth mold 220 on surface, so that the first viscose is squeezed out from the first gluing mouth mold 220；And it is butted on described First carrier 221 of the first transmission 12 lower surface of substrate, first carrier 221 is roller arrangement in the present embodiment, right First transmission substrate 12 described in Ying Yu rotates, and first carrier 221 and 220 corresponding matching of the first gluing mouth mold make The first glue-line is adhered on the first transmission 12 surface of substrate on the first transmission substrate 12, in the present embodiment the mucigel For a kind of hot melt adhesive.

Specifically, the functional layer gravure device further include: thermostatic assembly 24, the thermostatic assembly 24 include Warming machine, The thermostatic assembly 24 is set to first glue spreading assembly 22 and the print is made between component 21, to being coated with described the of glue-line One transmission substrate 12 carries out constant temperature, solidifies glue-line not.

In the present embodiment since the property of the first viscose used is hot melt adhesive, the property of first material is also Thermoplastic, so the corresponding thermostatic assembly 24, hot-pressing roller 215, the first thermostat 2112, the first solidification device is all phase The corresponding property with them is arranged, when the glue-line property uses UV glue, the property of the first material also select phase therewith Seemingly, this when, the hot-pressing roller 215 replaces with compression roller 215, that is, closes the warming-up device of hot-pressing roller 215, institute State the first thermostat 2112 and institute's infrared heater 216 be in off state, first solidification equipment be illumination machine or LED light strip, the present invention in do not do specific restriction.

Specifically, further including the first corona machine 23 being arranged corresponding to the first transmission substrate 12, first corona Machine 23 is set to before first glue spreading assembly 22, for improving the surface tension of the first transmission substrate 12, increases glue The adhesive force of layer.

Specifically, it further includes the first roller platen 212 and the second roller platen 213 that the print, which makes component 21,；Described first Roller platen 212, the second roller platen 213 and the forme roller 211 cooperation clamping the first transmission substrate 12, so that described the One transmission substrate 12 comes into full contact with the first material in the first gravure template 2110, a bonding zone is formed, in this implementation The shape of bonding zone described in example corresponds to the radian of the forme roller 211, the corresponding bonding zone of first roller platen 212 Import, the outlet of the corresponding bonding zone of second roller platen 213, first solidification equipment 214 is correspondingly arranged at described Bonding zone setting, first roller platen 212, the second roller platen 213 are mutually at regular intervals, described in the present embodiment viscous The arc length for closing area accounts for about 30% to the 50% of whole circumference, and specific spacing, different according to material solidification speed degree carry out It adjusts.

Further, it further includes the stripper 217 corresponding to gravure roll setting that the print, which makes component 21, described de- Liquid parting is stored in mold 217；It is described de- before first material precoating is overlying on the first gravure template 2110 Mold 217 is sprayed in the first gravure template 2110, so that first material and the first gravure template 2110 Between form separation layer, the release agent can be polytetrafluoroethylene (PTFE)；Fluororesin powder；Fluorine resin coating etc., the present invention is not done Concrete restriction.

Specifically, as shown in Fig. 2, it further includes the first punching group between component 21 and the end fixing roller that the print, which is made, Part 3, first punching component 3 include: to be respectively arranged at 12 top of the first transmission substrate, the first transmission substrate First die cutting roller 30 of 12 lower sections, first, which are held, cuts roller 31；So as to first die cutting roller 30, hold with described first that cut roller 31 right It should cooperate, through-hole is arranged in the first material layer 9 by the first die cutting roller 30, first die cutting roller 30 and described the One holds and cuts that roller 31 is corresponding, and first punching component 3 stamps notch on the near side (ns) of the first base material two sides, to determine core 90 position of piece fluid channel cooperates the contraposition of subsequent fitting and encapsulation reagent.Way is: each notch represents a kind of signal, Corresponding opposite 90 region of fluid channel identifies by photoelectricity and reads acquisition position signal, is transferred to external control system, outside Portion's control system provides corresponding action command, such as spray test-run a machine.

Specifically, as shown in figure 3, it further includes surface processing device 4, the surface that micro-fluidic chip print, which makes system, Processing unit 4 includes the surface liquid flush coater 41 corresponding to the fluid channel 90 setting, to spray the first feed liquid to the miniflow Road 90 is surface-treated, and second material layer 92 is obtained, and the second material layer 92 invests the surface of the fluid channel 90.

Further, the surface processing device 4 further includes the second corona machine 40, drier 42 or refrigerator 43, described Second corona machine 40, surface liquid flush coater 41, drier 42 or refrigerator 43 are successively arranged far from the first head end roller 10, The drying machine and the refrigeration machine choose whether the two according to the characteristic of the characteristic layer and require still alternative, described Second corona machine 40 is used to carry out sided corona treatment to the surface of the first material layer 9, makes dyne of the first material layer 9 Value increases.

The finish materials can be used that a kind of improvement micro-fluidic chip water passage surface is hydrophobic or hydrophilic or bio-compatible The fluent materials such as property protein.

Specifically, as shown in figure 4, being additionally provided with filling between the surface processing device 4 and the first end roller 11 Device 5, the filling device 5 include: the nozzle for being correspondingly arranged in 90 top of fluid channel, will be stored in the nozzle In the second feed liquid fill into the reaction zone of 92 fluid channel 90 of second material layer, obtain third material layer 93.

Further, the filling device 5 further includes that dry powder dusts component 50, and corresponding with the first material layer 9； The dry powder component 50 that dusts includes dust nozzle 500, and the dust nozzle 500 is corresponding with the reaction zone of the fluid channel 90；

Further, further include photoelectric probe 54, the photoelectric probe 54 be set to the surface processing device 4 with it is described It dusts between component 50 with dry powder, the reaction zone in the fluid channel 90 is positioned；The photoelectric probe 54, the spray Prostitute 500 is connected by external control system respectively, and it is fixed to control the dry powder component 50 that dusts by the external control system Position filling.

It further, further include drop spray component 51, the drop spray component 51 is set to the photoelectric probe 54 and first end Between roller 11, the drop spray component 51 includes several ink guns 510,510 position of ink gun and the fluid channel 90 Reaction zone is corresponding, is similar to ink jet printing mechanism, it is changeable that the ink gun 510 can fill reagent type.

Further, further includes: electrostatic digital printing component 52, the electrostatic digital printing component 52 are set to the light Between electric probe 54 and first end roller 11, the reaction zone of the electrostatic digital printing component 52 and the fluid channel 90 Corresponding, electrostatic digital printing component 52 reacts the relief printing plate of acupuncture point size by corresponding chip similar to Xerox's electrostatic digital printer Salient point Electrostatic Absorption mode is transferred in the acupuncture point.

Further, further includes: slide assemblies 53, the electrostatic digital printing component 52, the drop spray component 51, institute It states the dry powder component 50 that dusts to be mounted on the slide assemblies 53, the electrostatic digital printing component 52, the drop spray component 51, the dry powder component 50 that dusts is connect by servo motor 530 with the external control system, passes through the servo motor The displacement of component 50 that the 530 drivings electrostatic digital printing component 52, the drop spray component 51, the dry powder dusts switchs.

In the present invention, the electrostatic digital printing component 52, the drop spray component 51, the dry powder dust component 50 3 Person is selectable unit (SU), according to the mode of the property of chip selection filling, may be selected to fill a kind of device, can also all select, can also To select two kinds, present aspect is without limitation.

It is the electrostatic digital printing component 52, described specifically, the slide assemblies 53 further include height adjuster 531 Drop sprays component 51, the dry powder dusts, and group is connect by the height adjuster 531 with the servo motor 530, described outer Under the control of portion's control system, the electrostatic digital printing component 52, the drop is driven to spray component by the servo motor 530 51, the dry powder dusts 50 upper and lower displacement of component.

Specifically, as shown in figure 5, it further includes that electrode print makes device 6, the electrode that micro-fluidic chip print, which makes system, It includes: the second transfer assembly 60 that print, which makes device 6, and second transfer assembly 60 includes the second head end roller 600, second end roller 601, and the second transmission substrate 602 being set between the second head end roller 600, second end roller 601, for transmitting Electrode material, a kind of copper foil or aluminium foil suitable for biochemistry detection can be used in the electrode material in the present embodiment, can also be with It selects and is suitable for making thin-film materials coiled strip such as metal coating of electrode etc., the present invention does not do specific restriction；

It further include cutting component 61, the component 61 that cuts includes: to correspond respectively to the second head end roller 600 and The diaphragm cutter 610 that is arranged between two end rollers 601, second, which are held, cuts roller 611, traction roller, the diaphragm cutter 610 with it is described Second holds and cuts roller 611 and be correspondingly arranged；Second transmission, the 602 carry electrode raw material of substrate passes through the diaphragm cutter 610, holds It cuts and establishes connection with the traction roller between roller, by the diaphragm cutter 610 and hold and cut roller corresponding matching described Crush-cutting goes out the clout around electrode slice and electrode slice on two transmission substrates 602；In the present embodiment, the traction roller and institute Electrode material connection is stated, the traction roller is far from the second head end roller 600, and traction roller corresponds to the second transmission base The speed of material 602 is by the clout and coiling on the traction roller, and remaining electrode slice is in the second transmission substrate 602 On, the second transmission substrate 602 is equipped with slewing rollers 623.

Specifically, the pole print makes assembling device further include: third transfer assembly 62, the third transfer assembly 62 include Third head end roller 620, third end roller 621, and be set between the third head end roller 620, third end roller 621 Third transmits substrate 622, is additionally provided with slewing rollers 623 on the third transmission substrate 622, will be had by the slewing rollers 623 The one of third glue-line is facing towards the electrode slice, and the third transmission substrate 622 is for transmitting the second base；

Third glue spreading assembly 63, the third glue spreading assembly 63 are set to the third head end roller 620 and the slewing rollers On third transmission substrate 622 between 623, the third glue spreading assembly 63 includes, corresponding to be suspended from the third transmission substrate The third gluing mouth mold 630 of 622 upper surfaces, so that viscose is squeezed out from the third gluing mouth mold 630；And

Be butted on the third carrier 631 of third transmission 622 lower surface of substrate, the third carrier 631 with it is described 630 corresponding matching of third gluing mouth mold makes second base upper surface adhere to third glue-line；In the present embodiment, described The property of three glue-lines is as second glue-line 94.First carrier, the second carrier, third in the present embodiment Carrier is roller arrangement.

Third end roller 621 is tangential on second cut between component 61 and second pressing assembly 64 It transmits on substrate 602, the rotation corresponding with the second transmission substrate 602 of third end roller 621 is used for described second The incoming second transmission substrate 602 of base.

Specifically, the electrode print makes device 6, further includes: the second pressing assembly 64, second pressing assembly 64 are set It is transmitted on substrate 602 in second cut between component 61 and the second end roller 601, second pressing assembly 64 include third press bonding roller 640, the 4th press bonding roller 641, and the third press bonding roller 640 transmits table on substrate 602 with described second Face is tangent, and the 4th press bonding roller 641 and second transmission, 602 lower surface of substrate are tangent, passes through the third press bonding roller 640, the electrode slice is affixed on the glue-line of second base by 641 corresponding matching of the 4th press bonding roller, is formed and is had electrode Second base of piece, in the present embodiment electrode slice coining in the third glue-line so that the electrode slice with it is described Third glue-line is concordant.

Specifically, third end fixing roller is the first press bonding roller 710.

Specifically, further include the second thermostat 65, second thermostat 65 be set to third end fixing roller with Between the third glue spreading assembly 63, heated at constant temperature is carried out corresponding to second base for being coated with glue-line, to described second It is conducive to bonding when base and the electrode slice are pressed to stablize.

Specifically, being additionally provided with the second punching component 66, institute between second pressing assembly 64 and second end roller 601 State the second punching component 66, two punching component includes: to be respectively arranged at 602 top of the second transmission substrate, described the The second convex roller 660, the second runner 661 of two transmission substrates, 602 lower section；So as to first die cutting roller 30, hold with described first 31 corresponding matching of roller is cut, through-hole is arranged in second base by the first die cutting roller 30.

Specifically, as shown in fig. 6, micro-fluidic chip print makes system further include:

Electrode band 73；And

Bottom plate packaging system 7, the bottom plate packaging system 7 include: the second glue spreading assembly 72 and the first pressing assembly 71,

Second glue spreading assembly 72 includes corresponding the second gluing mouth mold for being suspended from 9 upper surface of first material layer 722, so that the second viscose is squeezed out from the second gluing mouth mold 722, second viscose is photosensitive in the present embodiment Glue, ultraviolet curing glue (UV glue)；And it is butted on the second carrier of first transmission, 12 lower surface of substrate, described second holds Carry device and described the and gluing mouth mold corresponding matching, so that the adhesion zone on 9 surface of first material layer is adhered to the second glue-line 94； First pressing assembly 71 is set between second glue spreading assembly 72 and the first end roller 11, the first pressing group Part 71 includes corresponding to each other the first press bonding roller 710 and the second pressing cylinder 711, and described first with the first material layer 9 passes Substrate 12, the electrode band 73 is sent to synchronize across first press bonding roller 710 and second press bonding roller, by described First press bonding roller 710, the second press bonding roller press the electrode band 73 and the first material layer 9, form micro-fluidic chip Band.

Further, the second end roller 601 is connect with the electrode band 73, by electroded second base It is passed on the first transmission substrate 12.

Further, second glue spreading assembly 72 further includes glue spreader 720, and it is recessed that the glue spreader 720 is equipped with second Die plate 7200,7200 shape of the second gravure template are corresponding with the non-fluid channel area 91；

Second gluing mouth mold 722, the second gluing mouth mold 722 is corresponding with the glue spreader 720, by the packaging plastic Layer blade coating is into the second gravure template 7200；

Hold rubber roller 723, the glue spreader 720 is oppositely arranged with rubber roller 723 is held, the glue spreader 720 with hold rubber roller 723 Rotate backward, make encapsulation glue-line in this second gravure template 7200 be transferred to non-fluid channel in the first material layer 9 Area 91 forms the second glue-line 94, and second carrier is to hold rubber roller 723 in this embodiment.

In the present invention, the bottom plate packaging system, can also there is net roll, and the net roll 72 can also be silk screen glue Version and the second gluing mouth mold 722 corresponding with the silk screen hectograph, the leak adhesive pattern of the silk screen hectograph and described the 91st area of non-fluid channel of one material layer 9 is corresponding, and with above the silk screen, described second applies the second gluing mouth mold 722 Glue mouth mold 722 is driven by servo motor 530, and circulation sliding bites the glue-line and the non-miniflow on the silk screen On layer, the servo motor 530 is connect with external control system；Either, second glue spreading assembly 72 is silk screen roller 721 And it is set to the gluing mouth mold in the silk screen roller 721, the leak adhesive pattern of the silk screen roller 721 and first material 91st area of non-fluid channel of the bed of material 9 is corresponding, is transferred to described 91st area of non-fluid channel etc. for glue-line is encapsulated by the gluing mouth mold Etc. modes the present invention is not specifically limited.

Specifically, be equipped with the second accommodating chamber 7100 in the first press bonding roller 710 of first pressing assembly 71, described the It is equipped with the second solidification device 7101 in two accommodating chambers 7100, for solidifying to the encapsulation glue-line.

Further, since the glue-line that encapsulates used in the present embodiment is uv-curable glue, second solidification device 7101 be ultraviolet lighting machine, the ultraviolet irradiation and be LED light strip, is set to 7100 kinds of the second accommodating chamber near described the The position of one transmission substrate 12；First press bonding roller 710 is formed by transparent material, to guarantee that translucency is good.

Specifically, the hardness of the second pressing cylinder 711 is 20-40；The hardness of first press bonding roller 710 is 80- 100；So that the second pressing cylinder 711 squeezes when first press bonding roller 710, the second pressing 711 mutual extrusion of cylinder Deformation forces the electrode band 73, the first material layer 9 to contact with first press bonding roller 710 there are band-like.

Further, first seaming element further include: the transparent third that hardness is 20-40 presses cylinder 712, and described the It is outer, corresponding with the second pressing cylinder 711 that three pressing cylinders 712 are sheathed on first press bonding roller 710.

Further, the material of first press bonding roller 710 is quartz；Second the pressing cylinder 711, the third pressure The material for closing cylinder 712 is silica gel.

Due in the invention of this hair, the number of plies of coining be it is changeable, when the number of plies of pressing is more or itself is to be laminated Chip semi-finished product when there is certain rigidity, can adjust accordingly first press bonding roller 710, second press cylinder 711, Third pressing cylinder 712 suitable hardness so that pressing more sufficiently and chip will not be damaged.

Further, external transmission group is additionally provided between second glue spreading assembly 72 and first pressing assembly 71 Part (not shown): the external transfer assembly includes first roller and tail roller, and the outside being set between the first roller, tail roller First transmission substrate 12；The tail roller and the first transmission substrate 12 are tangent, and the external transfer assembly encapsulates the band Product is transferred to the first transmission substrate 12 and is covered on the glue-line with the space of a whole page.

Further, it further includes packing device that micro-fluidic chip print, which makes system, and the packaging is set to described first Between pressing assembly 71 and the first end roller 11, post package is cut in this implementation to the micro-fluidic chip band to realize In example, the packing device is vacuum plastic-absorbing machine.

The packing device further includes printing assembly, and the printing equipment includes digital ink-jet groups of printers, to chip Two dimensional code, coding etc. you etc. printing.

Specifically, it further includes detection device that the micro-fluidic chip print, which makes system, the detection device is set to the printing On the first transmission substrate 12 between component and the first end roller 11, the detection device includes that artificial intelligence vision is swept Machine is retouched, in the present embodiment, the visual scanning machine is micro-fluidic chip detection machine.

Specifically, the transfer assembly further includes several correction limiters 8, each correction limiter 8 includes: The limit hole being set on the first transmission substrate 12 and the deviation rectification roller corresponding to limit hole setting；Described first It constantly avoids deviateing transmission route by deviation rectification roller and limit hole cooperation in the transmission displacement of substrate 12.

Each device is placed in isolation in the present invention, and the first transmission base is equipped between the isolation The transmission mouth that material enters and leaves, primarily to preventing ingredient from polluting.

A kind of print of micro-fluidic chip makes method, as shown in figure 9, including the following steps:

One first transmission substrate 12 and a forme roller 211 are provided, the forme roller 211 is in the first transmission substrate 12 drive lower rotation.

S1: the first corona step: the surface dynes of the first transmission substrate 12 are increased by first corona machine 23 Value makes dyne value increase to 30 and reaches English up to English to 60.

S2: the first glue application step: the one side for corresponding to the forme roller 211 on the first transmission substrate 12 is arranged First glue-line, first bondline thickness are between 1.5 microns to 10 microns.

S3: constant temperature step: constant temperature is carried out to first glue-line by the thermostatic assembly 24, makes first glue-line Do not solidify.

S4: pre-release step: before the first material is coated on the first gravure template 2110, pass through stripper 217 Spray liquid parting it is described with the first gravure template 2110 on, make described to make first material layer 9 and the first gravure mould A separation layer is formed before plate 2110.

S5: gravure step: the first material flowed out from the first discharging mouth mold 210 and be filled into surface be provided with it is described In the forme roller 211 of first gravure template 2110.

S6: punch out step, first punching component 3 to first material layer 9 first transmission substrate 12 and/or The first material layer 9 is punched.

S71: increasing the surface dynes value of the first material layer 9 by the second corona machine 40, increases described dyne of value English is reached to 30 up to English to 60.The first feed liquid being stored in surface processing device 4 and/or nozzle, the second feed liquid are transferred to institute It states in fluid channel 90；Hydrophilic layer or hydrophobic layer are obtained by drier and/or refrigerator processing.

S8: specifically, the filler step further include: dry powder transfer means, the dry powder transfer means include: powder out Mouth is respectively arranged at turning powder roller and being set to 12 lower section of the first transmission substrate for 9 top of the first material layer Printing roller；Under printing roller cooperation, turns powder roller described in from the feed powder that powder mouth is sent out described out and be filled in the miniflow In road 90.

S9: print glue step: using silk-screen printing or cylinder silk-screen or flexographic printing processes, avoid the fluid channel 90, The adhesion zone surface of the first material layer 9 coats the second glue-line 94；

S10: pressing step: it send electrode band 73 and first material layer 9 with second viscose are synchronous into the Between one press bonding roller 710, the second press bonding roller, so that the correspondence of the electrode band 73 is attached on the adhesion zone；

S11: the second curing schedule: the second solidification dress is provided in first press bonding roller 710 and/or the second press bonding roller It sets, second solidification equipment is corresponding with second viscose, so that the electrode band 73 and the first material layer 9 press Simultaneously, the second viscose solidification is realized.

Specifically, second curing schedule includes: the band-like ultra-violet curing being set in first press bonding roller 710 Device, second glue-line 94 are uv-curable glue, and second press bonding roller is flexible second press bonding roller, when described flexible second Press bonding roller and first press bonding roller 710 cooperation squeeze, so that the electrode band 73, the first transmission substrate 12 and described the One press bonding roller 710 has the consolidation zone of planar.

Specifically, be repeated in the gravure step, the first curing schedule, filling step, print glue step, pressing step, Second curing schedule, at least once.

The above description is only a preferred embodiment of the present invention, is not intended to limit the scope of the invention, all at this Under the design of invention, using equivalent structure transformation made by description of the invention and accompanying drawing content, or directly/be used in indirectly Other related technical areas are included in scope of patent protection of the invention.

Claims (6)

1. a kind of filling device of microchannel chip, for filling functional material in the fluid channel reaction zone, which is characterized in that Include:

First transfer assembly, first transfer assembly includes the first head end roller, first end roller, and is set to described first The first transmission substrate between head end roller, first end roller, the first transmission substrate, which is loaded with, is provided with the first of fluid channel Material layer；

Dry powder dusts component, and the dry powder component that dusts is set between the first head end roller, first end roller, and with described the One material layer is corresponding；The dry powder component that dusts includes dust nozzle, and the dust nozzle is corresponding with the reaction zone of the fluid channel:

Photoelectric probe, the photoelectric probe is dusted set on the first head end roller and dry powder between component, in the fluid channel Reaction zone positioned: the photoelectric probe, the dust nozzle respectively by external control system connect, pass through the outside Control system controls the dry powder and dusts component positioning filling.

2. filling device according to claim 1, which is characterized in that further include drop spray component, the drop spray component is set to Between the photoelectric probe and first end roller, the drop spray component includes several ink guns, the inkjet head position and institute The reaction zone for stating fluid channel is corresponding.

3. filling device according to claim 1 or 2, which is characterized in that further include: electrostatic digital printing component, it is described Electrostatic digital printing component is set between the photoelectric probe and first end roller, the electrostatic digital printing component and institute The reaction zone for stating fluid channel is corresponding.

4. filling device according to claim 3, which is characterized in that further include:

Slide assemblies, the electrostatic digital printing component, the drop spray component, the dry powder dusts, and component is mounted on the slideway On component, the electrostatic digital printing component, the drop spray component, the dry powder component that dusts pass through servo motor and described outer Control system connection in portion's drives the electrostatic digital printing component, the drop to spray component, the dry powder by the servo motor The component that dusts displacement or switch.

5. according to claim 4 fill out a gram device, which is characterized in that the slide assemblies further include height adjuster, institute State electrostatic digital printing component, the drop sprays component, the dry powder dusts, and group passes through the height adjuster and servo electricity Machine connection drives the electrostatic digital printing component, described by the servo motor under external control system control Component upper and lower displacement that drop sprays component, the dry powder dusts.

6. filling device according to claim 3, which is characterized in that the filling device is photographed in an isolation, described The transmission mouth that the first transmission substrate enters and leaves is equipped between isolation.