CN102336016B - Viscoelastic heat triggering thermoplastic polymer ultrasonic stamping method - Google Patents
Viscoelastic heat triggering thermoplastic polymer ultrasonic stamping method Download PDFInfo
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- CN102336016B CN102336016B CN 201110171743 CN201110171743A CN102336016B CN 102336016 B CN102336016 B CN 102336016B CN 201110171743 CN201110171743 CN 201110171743 CN 201110171743 A CN201110171743 A CN 201110171743A CN 102336016 B CN102336016 B CN 102336016B
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- polymer
- mould
- thermoplastic polymer
- ultrasonic
- viscoelastic
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- 229920001169 thermoplastic Polymers 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims abstract description 14
- 229920000642 polymer Polymers 0.000 claims abstract description 31
- 239000011521 glass Substances 0.000 claims abstract description 11
- 238000006243 chemical reaction Methods 0.000 claims abstract description 9
- 239000011159 matrix material Substances 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 230000020169 heat generation Effects 0.000 abstract 2
- 229920000307 polymer substrate Polymers 0.000 abstract 1
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000003466 welding Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 5
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 4
- 239000004926 polymethyl methacrylate Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The invention discloses a viscoelastic heat triggering thermoplastic polymer ultrasonic stamping method which is applied to forming of a thermoplastic polymer microstructure. The method is characterized by comprising the following steps of: heating a mould to 1 to 60 DEG C more than glass point conversion temperature of a thermoplastic polymer, placing a polymer substrate on the mould and loading ultrasonic vibration to ensure that the polymer is subjected to viscoelastic heat generation under the action of ultrasonic vibration, softening the polymer in a forming area, and allowing the polymer to flow under the action of pressure and fill a microstructure of the mould. Before ultrasonic vibration is loaded, the polymer in the forming area is subjected to viscoelastic heat generation by heating the mould, so solid-solid contact in a polymer-mould interface high-hardness state is avoided, vibration damage to the mould is slight, the service life of the mould can be effectively prolonged and forming efficiency is improved.
Description
Technical field
The invention belongs to the MEMS polymer and make the field, relate to a kind of manufacturing technology of thermoplastic polymer micro-structural, be used for realizing the shaping of micro-structural on polymer matrix film.
Background technology
Along with the application of polymeric material in the MEMS field, the forming technology of polymer micro-structural becomes one of the technology that enables that advances the polymers micro-devices industrialized development.
In based on hyperacoustic forming polymer technology, mainly be divided into ultrasonic heat production impression (Hyun Woo Yu, et al, Micro/Nanolith.MEMS MOEM, 021113) and ultrasonic auxiliary heat impression (Harutaka Mekaru 2009,8 (2):, et al, Microsyst Technol, 2008,14:1325-1333) two kinds.Wherein, in ultrasonic heat production imprint process process, the needed origin of heat of polymer temperature rise is in the effect of ultrasonic vibration to polymer; And ultrasonic auxiliary heat impression has been introduced external heat source, at first polymer matrix film is heated to it more than glass point conversion temperature, apply ultrasonic wave when exerting pressure, utilize ultrasonic vibration to play effect (the Harutaka Mekaru that distributes in exhaust and even molten polymer fluid sheet, et al, Microelectronic Engineering, 2007,84:1282-1287).Ultrasonic auxiliary heat impression can improve the forming accuracy of micro-structural in hot forming, but the heating process in its early stage reaches several minutes, and process efficiency is low, and polyalcohol integral is in it more than glass point conversion temperature, in forming process under pressure, the polymer matrix film bulk deformation is large.
Summary of the invention
The invention provides a kind of viscoelastic heat triggering thermoplastic polymer ultrasonic stamping method that is applied to the thermoplastic polymer micro-structure forming.By arriving mold heated more than the glass point conversion temperature of polymer, contact and apply ultrasonic wave with polymer under room temperature afterwards, because the polymer interface that contacts with mould reaches its glass point conversion temperature, the heat production mechanism of thermoplastic polymer under ul-trasonic irradiation is the viscoplasticity heat production, heat production efficient is high, and the micrographics quick copy on mould is to polymer matrix film.
Technical scheme of the present invention is as follows:
The first step is heated to impressing mould on the glass point conversion temperature of thermoplastic polymer 1-60 ℃;
Second step after mold temperature is constant, is placed thermoplastic polymer based on mould; Soldering tip with supersonic welder contacts with polymer matrix film immediately, closes simultaneously thermal source and loads ultrasonic vibration and pressure.When contact reaches the triggering pressure of setting in ultrasonic bonding, begin to apply ultrasonic wave load, trigger pressure and change the welding pressure that pre-sets into this moment in welding machine, keep a period of time, polymer temperature rise under ultrasonic vibration and welding pressure effect, the polymer of shaped region is softening, and occurs to flow under the welding pressure effect that the supersonic welder soldering tip provides, and fills mold graph.
The 3rd step stopped ultrasonicly, and the pressure of supersonic welder is automatically changeb to the dwell pressure that pre-sets, and the polymer that still is in soft state further is shaped, and prevented that it from elastic recovery occuring affect the micro-structure forming precision.Lift at last wave welding head of ultrasonic wave, complete viscoelastic heat and trigger the thermoplastic polymer ultrasonic moulding process.
Effect of the present invention and benefit are: the contact interface place of polymer and mould is because the heat conduction has reached glass point conversion temperature, and the heat production rule after ultrasonic wave applies is the viscoplasticity heat production, and heat production efficient is high, and forming efficiency is high; Be the non-conductor of heat due to polymer, the matrix of thermoplastic polymer based is still lower than its glass point temperature, and in the impression forming process, the bulk deformation of polymer matrix film is little; When occuring due to ultrasonic vibration, polymer is in elastomeric state or viscoelastic attitude, and is little to the vibration damage of mould, can adopt glass and silicon materials to make impressing mould, reduced die manufacturing cost.
Description of drawings
Fig. 1 is structural representation of the present invention.
In figure: 1 wave welding head of ultrasonic wave; 2 polymer matrix films; 3 moulds; 4 hot plates; 5 welder bases.
The specific embodiment
Below in conjunction with technical scheme and accompanying drawing, trigger the ultrasonic example that is embossed to of thermoplasticity with the viscoelastic of thermoplastic polymer PMMA (polymethyl methacrylate) heat and be described in detail concrete enforcement of the present invention.
1) the glass point conversion temperature of PMMA is 105 ℃, so the present embodiment makes the temperature constant of mould upper surface by hot plate 4 is heated to 120 ℃ under heat conducting effect, and this moment, its temperature was about 110 ℃.
2) place PMMA polymer matrix film 2 on silicon mould 3.Wave welding head of ultrasonic wave 1 descends until contact with polymer matrix film 2 and on-load pressure, closes the hot plate power supply, stops hot plate and heats; Trigger pressure 44N when pressure reaches to preset, begin to apply ultrasonic load, frequency is 35kHz, and welding pressure 450N, ultrasonic pressing time 25s, amplitude are 15 μ m.
3) after ultrasonic load time 25s reaches, pressure is automatically changeb to dwell pressure 400N, dwell time is 15s, to prevent from still being in polymer resilience in cooling procedure of soft state, improve the precision of micro-structure forming, after dwell time reached, soldering tip lifted, and viscoelastic heat triggers the thermoplastic polymer ultrasonic imprint process and completes.
Claims (1)
1. a viscoelastic heat triggers ultrasonic wave micro-structural method for stamping, is applied to the thermoplastic polymer micro-structure forming, it is characterized in that:
The first step is heated to impressing mould on the glass point conversion temperature of thermoplastic polymer 1-60 ℃;
Second step is placed thermoplastic polymer based on mould; The tool heads of supersonic welder is contacted with thermoplastic polymer based, close simultaneously thermal source and load ultrasonic vibration and impression that pressure carries out micro-structural on polymer matrix film is shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110171743 CN102336016B (en) | 2011-06-23 | 2011-06-23 | Viscoelastic heat triggering thermoplastic polymer ultrasonic stamping method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110171743 CN102336016B (en) | 2011-06-23 | 2011-06-23 | Viscoelastic heat triggering thermoplastic polymer ultrasonic stamping method |
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| Publication Number | Publication Date |
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| CN102336016A CN102336016A (en) | 2012-02-01 |
| CN102336016B true CN102336016B (en) | 2013-11-06 |
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| CN 201110171743 Expired - Fee Related CN102336016B (en) | 2011-06-23 | 2011-06-23 | Viscoelastic heat triggering thermoplastic polymer ultrasonic stamping method |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108688134A (en) * | 2018-05-15 | 2018-10-23 | 天津大学 | A kind of method that high efficiency, low cost and no pollution prepares polymer hydrophobic surface |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101528442A (en) * | 2006-09-27 | 2009-09-09 | 东丽株式会社 | Intermittent film forming device and intermittent film forming method |
| CN101863122A (en) * | 2010-05-18 | 2010-10-20 | 浙江大学 | Ultraphonic auxiliary micro-nano embossing forming device |
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2011
- 2011-06-23 CN CN 201110171743 patent/CN102336016B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101528442A (en) * | 2006-09-27 | 2009-09-09 | 东丽株式会社 | Intermittent film forming device and intermittent film forming method |
| CN101863122A (en) * | 2010-05-18 | 2010-10-20 | 浙江大学 | Ultraphonic auxiliary micro-nano embossing forming device |
Non-Patent Citations (2)
| Title |
|---|
| 纳米压印技术进展及应用;罗康等;《电子工艺技术》;20090930;第30卷(第5期);253-257 * |
| 罗康等.纳米压印技术进展及应用.《电子工艺技术》.2009,第30卷(第5期),253-257. |
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| CN102336016A (en) | 2012-02-01 |
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