CN101863122A - Ultraphonic auxiliary micro-nano embossing forming device - Google Patents

Ultraphonic auxiliary micro-nano embossing forming device Download PDF

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Publication number
CN101863122A
CN101863122A CN 201010175812 CN201010175812A CN101863122A CN 101863122 A CN101863122 A CN 101863122A CN 201010175812 CN201010175812 CN 201010175812 CN 201010175812 A CN201010175812 A CN 201010175812A CN 101863122 A CN101863122 A CN 101863122A
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heating plate
forming device
auxiliary micro
nano
embossing
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CN101863122B (en
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贺永
傅建中
章婷
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Zhejiang University ZJU
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Zhejiang University ZJU
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Abstract

The invention discloses an ultraphonic auxiliary micro-nano embossing forming device comprising a lower heating plate and an upper heating plate, wherein the lower heating plate and the upper heating plate are respectively used for placing a substrate and an embossing mould; the embossing mould acts on the substrate when the lower heating plate and the upper heating plate are mutually approached; one side of the upper heating plate, which is back on to the lower heating plate, is provided with an ultrasonic vibration generation device. Compared with the traditional embossing, the ultraphonic auxiliary micro-nano embossing molding device obviously improves the flow characteristics of a polymer by adopting ultrasonic vibration and a clamping cover and can reduce the cooling shrinkage heat stress to minimum, thereby enhancing the embossing quality of the polymer; and besides, the whole embossing process can be directly carried out in the air without carrying out vacuumizing treatment due to the addition of ultrasonic waves, thereby not only simplifying the mechanical structure, but also saving the vacuumizing process and enhancing the embossing forming efficiency.

Description

Ultraphonic auxiliary micro-nano embossing forming device
Technical field
The present invention relates to the micro-nano imprint technology, relate in particular to a kind of nano-imprinting device that adds ultrasonic vibration and prevent the uniformity contraction.
Background technology
Polymer micro-nanometer imprinting moulding technology since nineteen ninety-five is put forward by the StephenY Chou of Princeton university since its have low cost, advantage such as the processing that can walk abreast, become the main method that polymer micro-nano yardstick member is processed.Its typical technical process is mainly the preparation of (1) mould, and employing photoetching technology, electron beam lithography technology etc. process the micro/nano level dimensional structure on the seal (mould).(2) moulding process, mould and polymer are put into imprinting apparatus, be heated to after vacuumizing more than the softening temperature of polymer, pressurization makes the micro-nano structure on the mould be transferred to polymer surfaces, pressurize a period of time then, cool off the micro-nano structure on the polymer fixed-typely again, last release pressure and vacuum obtain finished product.
In the micro-nano imprint forming technique, the Forming Quality of micro/nano-scale member is the main performance assessment criteria of forming process.Polymer still has higher viscosity when softening, and the characteristic dimension of mould all is in micro-nano magnitude, and this makes the complete filling of polymer expire a large amount of time of space requirement in the mould.And outer conventional micro-nano imprint technology also needs extraction repeatedly and discharges vacuum, and these unfavorable factors have influenced the efficient of micro-nano imprint undoubtedly.Seeking time that a kind of effective method improves the mobile of polymer and avoid repeatedly extracting vacuum to waste just seems and is necessary very much.
In the knockout course of this external micro-nano member, because The thermal expansion of polymer coefficient ratio mould is much bigger, make cooling back polymer micro-nano member have bigger thermal stress to concentrate, the feature of micro/nano-scale was easy to destroyed when this had caused the demoulding.Therefore during a desirable reduction demoulding method of micro-nano structure damage be exactly when guaranteeing the demoulding amount of contraction of polymer and mould identical.
Summary of the invention
The invention provides a kind of ultrasonic wave auxiliary micro-nano embossing device, can add the flow behavior of strength polymer, and reduce the generation of thermal stress in the cooling and demolding process, realize high-quality micro nano structure impression.
A kind of Ultraphonic auxiliary micro-nano embossing forming device, comprise and be respectively applied for the following heating plate of laying substrate and impressing mould and go up heating plate, when following heating plate and last heating plate are close mutually, impressing mould acts on substrate, and the described heating plate of going up plays a side of heating plate that the ultrasonic vibration generating means is housed dorsad.
The present invention introduces ultrasonic technique on the basis of typical micro-nano imprint moulding process, by the high frequency ultrasound vibration, utilize effects such as ultrasonic cavitation, local big temperature rise to quicken flowing of polymer in pressure process, improves charging efficiency.Simultaneously because the adding of ultrasonic vibration, the air on the mould in the micro-nano feature can come along with ultrasonic vibration is easy to row when impression, thereby can avoid extracting in original technology and discharging the time that vacuum is wasted.
Described ultrasonic vibration generating means by supersonic generator and be positioned at its bottom ultrasonic amplifier constitute, wherein ultrasonic amplifier is positioned at the end face of heating plate.Supersonic generator mainly acts on and is to produce ultrasonic wave, and the function of ultrasonic amplifier is to enlarge the amplitude of vibration end face, transmits the energy of sound wave, ultrasonic wave is delivered to the surface of mould and polymer.The effect of clamping cover is fixed substrate exactly when polymer matrix film is cooled to uniform temperature, produces bigger thermal stress with the excess shrinkage that prevents polymer matrix film, influences the demoulding quality of follow-up micro-nano structure.
The first thermal insulation ceramics pad and first cooling tube are equipped with in the inside of described ultrasonic amplifier.It is overheated to prevent to cause the ultrasonic vibration generating means at last heating plate adstante febre.
Be provided with to be used for supporting and to drive and go up the straight-line supporting mechanism of heating plate, during last heating plate rectilinear motion can away from or near under heating plate.Described supporting mechanism comprises the bracing frame of tape guide axle, is installed in the slide block on the axis of guide and drives the driving mechanism that slide block moves along the axis of guide by linear bearing, and supersonic generator is connected with slide block.Can drive slide block and ultrasonic vibration generating means and last heating plate during slide block movement together moves.
The driving mechanism that described driving slide block moves along the axis of guide comprises first torque motor that is fixed on the bracing frame, the ball-screw that links to each other with the first torque motor output shaft and the ball-screw nut of fixedlying connected with slide block, wherein ball-screw nut and ball-screw threaded engagement.Certainly also can take other prior aries for the rectilinear motion of realizing slide block.
Described heating plate bottom down is installed on the pony sill by second cooling tube and the second thermal insulation ceramics pad successively, and it is overheated that the second thermal insulation ceramics pad and second cooling tube can prevent to cause pony sill at following heating plate adstante febre.
Can feed cooling water or other cryogenic medias in first cooling tube and second cooling tube.
For in the process of cooling and demolding, the contraction of the contraction of polymer and mould is consistent during the demoulding, reduces the generation of thermal stress in the cooling procedure, is provided with liftable clamping cover at described heating plate periphery down.
Described clamping cover is by its driving mechanism lifting, and its driving mechanism comprises second torque motor that is fixed on pony sill, the driven gear that links to each other with the output shaft of second torque motor, and the threaded rod of clamping cover threaded engagement, is fixed on the gear on the threaded rod; Its middle gear and driven gear engagement.Certainly also can take other prior aries for the rectilinear motion of realizing the clamping cover.
The beneficial effect that the present invention has is:
Owing to adopted ultrasonic vibration and clamping cover, to compare with traditional impression, the flow behavior of polymer improves, and cooling contraction heat stress can be reduced to minimum, makes the impression quality of polymer be improved.In addition, because hyperacoustic adding, whole moulding process can directly carry out in air, needn't vacuumize processing, has so not only simplified frame for movement, has also saved the process that vacuumizes, and has improved the efficient of imprinting moulding.
Description of drawings
Fig. 1 is the structural principle schematic diagram of Ultraphonic auxiliary micro-nano embossing forming device of the present invention.
Fig. 2 is the mounting portion schematic diagram of supersonic generator and clamping cover.
Fig. 3 is the vertical view of clamping cover.
Fig. 4 a and Fig. 4 b be for reducing the schematic diagram of demoulding thermal stress between mould and polymer, and wherein Fig. 4 a shows the schematic diagram of mould and polymer free shrink when temperature is higher than Tu; Fig. 4 b shows that polymer is held the fixing schematic diagram of device when temperature is higher than Tu.
The specific embodiment
The invention will be further described below in conjunction with drawings and Examples.
As depicted in figs. 1 and 2, Ultraphonic auxiliary micro-nano embossing forming device torque motor 1 of the present invention is installed on the bracing frame 21, the crossbeam below of bracing frame 21 is provided with two axis of guides 7, and slide block 4 two ends link to each other with the axis of guide 7 by linear bearing 5, can make linear relative movement along the axis of guide 7.
Slide block 4 is fixed with on the ball-screw nut 3, ball-screw 2 links to each other by the output shaft of shaft coupling with torque motor 1, ball-screw nut 3 cooperates with ball-screw 2, and the rotation of torque motor 1 is done rectilinear motion up and down by ball-screw nut 3 and ball-screw 2 driving-belt movable sliders 4.
The slide block 4 bottoms supersonic generator 6 that is connected, the lower end of supersonic generator 6 links to each other with ultrasonic amplifier 8.Thermal insulation ceramics 9 and cooling tube 10 are equipped with in the inside of ultrasonic amplifier 8, and cooling tube 10 passes ultrasonic amplifier 8 and links to each other with outside.Last heating plate 11 is installed in the below of ultrasonic amplifier 8.Heating plate 11 belows are used to install impressing mould.
Following heating plate 20 bottoms are installed on the pony sill 14 by cooling tube 19 and thermal insulation ceramics 18, and cooling tube 19 passes pony sill 14 and links to each other with the outside.Processed substrate is installed in down on the heating plate 20, and clamping cover 12 is connected on the threaded rod 13.Another torque motor 16 can rotate and gear 15 engagements by driven gear 17, thereby drives the rotation of threaded rod 13, makes clamping cover 12 do rectilinear motion up and down.
The course of work of the present invention is as follows:
(1) open torque motor 1, slide block 4 is promoted to the stroke peak, the stall motor is installed in template on the heating plate 11, and substrate is installed in down on the heating plate 20 and the location.
(2) open torque motor 1 once more, drive slide block 4 by ball screw assembly, and do rectilinear motion downwards, apply precompression by last heating plate 11 to substrate and carry out precompressed; Give heating plate energising up and down simultaneously, mould and substrate are carried out thermoplastic;
(3) when temperature reaches imprint temperature, open supersonic generator, begin to produce ultrasonic vibration, slide block 4 applies force of impression for mould and substrate by last heating plate; Pin motor, keep temperature and constant a period of time of pressure fully to be shaped up to substrate.
(4) stop ultrasonic vibration, open liquid cooling loop the heat of heating plate and substrate is left, when temperature is reduced to T uWhen (temperature that can guarantee that polymer is identical with the mold shrinkage amount), open torque motor 16 drives the clamping cover by gear and threaded rod and moves downward, and blocks locked motor after the substrate, keeps the clamping cover motionless, continues cooling.At this moment clamped owing to substrate, it is not shrinking with the temperature reduction, and mould still continues to shrink, because the thermal coefficient of expansion of mould is less than polymer, corresponding to a calcining temperature T d, always have a clamping temperature T u, make when being cooled to calcining temperature T dThe time, mould has identical amount of contraction with polymer.T uWith calcining temperature T dRelation can pass through (T g-T d) α m=(T g-T u) α pCalculate, here α mBe the thermal coefficient of expansion of mould, α pBe the The thermal expansion of polymer coefficient, T gIt is the glass transition temperature of polymer.
(5) when temperature is reduced to calcining temperature, the beginning demoulding treats that the demoulding finishes, and slide block 4 is promoted to peak, and starting torque motor 16 unclamps the clamping cover, takes out substrate and mould.
Compare with traditional micro-nano imprint molding process, this device has been done corresponding improvement in the following aspects:
(1) added the flow behavior that ultrasonic vibration can effectively be improved polymer.For the polymer nanocomposite impression, topmost is exactly the charging efficiency of polymer, and the adding of ultrasonic vibration can effectively improve the flow behavior of polymer, promotes the filling of polymer in mould.Next be ultrasonic vibration adding can so that processing can in air, directly carry out, need not vacuumize again, improved impression efficient and simplified frame for movement.
(2) use of clamping cover can guarantee the uniformity contraction.In the cooling contraction phase, the generation of thermal stress mainly is exactly the contraction inconsistent generation of mould and substrate, so at cooling stage when the shrinkage factor of substrate and mould is consistent when reaching unanimity, with the clamping cover substrate is clamped, to stop the further contraction of substrate, thereby can guarantee the uniformity contraction, so just can effectively reduce the generation of thermal stress.
Fig. 3 is the vertical view of clamping cover, Fig. 4 a is the signal during cooling and demolding in the conventional imprint process, because mould and polymer matrix film all can free shrink, and the amount of contraction of polymer is than big many of mould, cause both shrinkage degrees inhomogeneous, thereby produce bigger thermal stress.Fig. 4 b is a technology of the present invention, and after dropping to temperature T u, clamping cover work stops the further contraction of polymer, can guarantee that the amount of contraction of mould and polymer is consistent, thus the thermal stress when significantly reducing the demoulding.

Claims (8)

1. Ultraphonic auxiliary micro-nano embossing forming device, comprise and be respectively applied for the following heating plate (20) of laying substrate and impressing mould and go up heating plate (11), when following heating plate (20) and last heating plate (11) are close mutually, impressing mould acts on substrate, it is characterized in that: the described heating plate (11) of going up plays a side of heating plate (20) that the ultrasonic vibration generating means is housed dorsad.
2. Ultraphonic auxiliary micro-nano embossing forming device as claimed in claim 1, it is characterized in that: described ultrasonic vibration generating means is made of supersonic generator (6) and the ultrasonic amplifier (8) that is positioned at its bottom, and wherein ultrasonic amplifier (8) is positioned at the end face of heating plate (11).
3. Ultraphonic auxiliary micro-nano embossing forming device as claimed in claim 2 is characterized in that: the first thermal insulation ceramics pad (9) and first cooling tube (10) are equipped with in the inside of described ultrasonic amplifier (8).
4. Ultraphonic auxiliary micro-nano embossing forming device as claimed in claim 3, it is characterized in that: be provided with to be used for supporting and to drive and go up the straight-line supporting mechanism of heating plate (11), described supporting mechanism comprises the bracing frame of tape guide axle (7), be installed in the slide block (4) on the axis of guide (7) and drive the driving mechanism of slide block (4) along the axis of guide (7) motion by linear bearing (5), described supersonic generator (6) is connected with slide block (4).
5. Ultraphonic auxiliary micro-nano embossing forming device as claimed in claim 4, it is characterized in that: described driving slide block (4) comprises first torque motor (1) that is fixed on the bracing frame, the ball-screw (2) that links to each other with first torque motor (1) output shaft and the ball-screw nut (3) of fixedlying connected with slide block (4) along the driving mechanism of the axis of guide (7) motion, wherein ball-screw nut (3) and ball-screw (2) threaded engagement.
6. as each described Ultraphonic auxiliary micro-nano embossing forming device of claim 1~5, it is characterized in that: described heating plate (20) bottom down is installed on the pony sill (14) by second cooling tube (19) and the second thermal insulation ceramics pad (18) successively.
7. Ultraphonic auxiliary micro-nano embossing forming device as claimed in claim 6 is characterized in that: described heating plate (20) periphery down is provided with liftable clamping cover (12).
8. Ultraphonic auxiliary micro-nano embossing forming device as claimed in claim 7, it is characterized in that: described clamping cover (12) is by its driving mechanism lifting, and its driving mechanism comprises second torque motor (16) that is fixed on pony sill (14), the driven gear (17) that links to each other with the output shaft of second torque motor (16), and the threaded rod (13) of clamping cover (12) threaded engagement, is fixed on the gear (15) on the threaded rod (13); Its middle gear (15) and driven gear (17) engagement.
CN2010101758121A 2010-05-18 2010-05-18 Ultraphonic auxiliary micro-nano embossing forming device Expired - Fee Related CN101863122B (en)

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Cited By (16)

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CN102336016A (en) * 2011-06-23 2012-02-01 大连理工大学 Viscoelastic heat triggering thermoplastic polymer ultrasonic stamping method
CN102357972A (en) * 2011-10-13 2012-02-22 重庆大学 Ultrasonic vibration molding device of superfine plastic component
CN102615797A (en) * 2012-04-06 2012-08-01 大连理工大学 Device and method for controlling molding shrinkage of precision injection-molded product based on action of ultrasonic outfield
CN104833568A (en) * 2015-05-06 2015-08-12 上海理工大学 Vibration damping device for optical glass ultrasonic vibration indentation experiment
CN105034345A (en) * 2015-06-12 2015-11-11 天津大学 Dual-vibration-ultrasound micro-nano embossing molding device
CN105372931A (en) * 2015-07-16 2016-03-02 山东科技大学 Nanoimprinting method
CN103935030B (en) * 2014-04-18 2016-03-30 中国地质大学(武汉) A kind of ultrasonic wave added micro-embossing building mortion and micro-embossing manufacturing process
CN105479926A (en) * 2015-11-11 2016-04-13 浙江真爱时尚家居有限公司 Printing and embossing assembly and manufacturing method thereof
CN107310141A (en) * 2017-07-10 2017-11-03 嘉善梦溪服饰辅料厂(普通合伙) A kind of multistation button texturizing equipment
CN107856427A (en) * 2017-11-24 2018-03-30 华中科技大学 A kind of ultrasonic vibration assistant metal coin chapter impressing building mortion and method
CN108688133A (en) * 2018-05-04 2018-10-23 利辛县宝隆橡塑密封件有限责任公司 A kind of Embosser of rubber washer production
CN109164676A (en) * 2018-10-31 2019-01-08 京东方科技集团股份有限公司 Impression block and method for stamping
CN109501216A (en) * 2017-09-14 2019-03-22 长春工业大学 A kind of device and method of vibration auxiliary hot padding
CN110361928A (en) * 2018-04-11 2019-10-22 长春工业大学 A kind of imprinting apparatus and method of two dimension ancillary vibration
CN112213918A (en) * 2019-07-10 2021-01-12 长春工业大学 Nano-imprinting device based on non-resonance assistance
CN115157706A (en) * 2022-07-12 2022-10-11 山东大学 Resin mineral composite material ultrasonic vibration defoaming device and process

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WO2004093171A1 (en) * 2003-04-11 2004-10-28 Scivax Corporation Pattern forming apparatus and pattern forming method
US20050184436A1 (en) * 2004-02-24 2005-08-25 Korea Institute Of Machinery & Materials UV nanoimprint lithography process and apparatus
CN1775546A (en) * 2005-12-02 2006-05-24 华中科技大学 Nano marking press

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Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102336016B (en) * 2011-06-23 2013-11-06 大连理工大学 Viscoelastic heat triggering thermoplastic polymer ultrasonic stamping method
CN102336016A (en) * 2011-06-23 2012-02-01 大连理工大学 Viscoelastic heat triggering thermoplastic polymer ultrasonic stamping method
CN102357972A (en) * 2011-10-13 2012-02-22 重庆大学 Ultrasonic vibration molding device of superfine plastic component
CN102615797A (en) * 2012-04-06 2012-08-01 大连理工大学 Device and method for controlling molding shrinkage of precision injection-molded product based on action of ultrasonic outfield
CN103935030B (en) * 2014-04-18 2016-03-30 中国地质大学(武汉) A kind of ultrasonic wave added micro-embossing building mortion and micro-embossing manufacturing process
CN104833568B (en) * 2015-05-06 2017-06-06 上海理工大学 For the vibration absorber of optical glass ultrasonic vibration indentation test
CN104833568A (en) * 2015-05-06 2015-08-12 上海理工大学 Vibration damping device for optical glass ultrasonic vibration indentation experiment
CN105034345A (en) * 2015-06-12 2015-11-11 天津大学 Dual-vibration-ultrasound micro-nano embossing molding device
CN105372931A (en) * 2015-07-16 2016-03-02 山东科技大学 Nanoimprinting method
CN105479926A (en) * 2015-11-11 2016-04-13 浙江真爱时尚家居有限公司 Printing and embossing assembly and manufacturing method thereof
CN107310141A (en) * 2017-07-10 2017-11-03 嘉善梦溪服饰辅料厂(普通合伙) A kind of multistation button texturizing equipment
CN109501216A (en) * 2017-09-14 2019-03-22 长春工业大学 A kind of device and method of vibration auxiliary hot padding
CN107856427A (en) * 2017-11-24 2018-03-30 华中科技大学 A kind of ultrasonic vibration assistant metal coin chapter impressing building mortion and method
CN110361928A (en) * 2018-04-11 2019-10-22 长春工业大学 A kind of imprinting apparatus and method of two dimension ancillary vibration
CN108688133A (en) * 2018-05-04 2018-10-23 利辛县宝隆橡塑密封件有限责任公司 A kind of Embosser of rubber washer production
CN109164676A (en) * 2018-10-31 2019-01-08 京东方科技集团股份有限公司 Impression block and method for stamping
CN112213918A (en) * 2019-07-10 2021-01-12 长春工业大学 Nano-imprinting device based on non-resonance assistance
CN115157706A (en) * 2022-07-12 2022-10-11 山东大学 Resin mineral composite material ultrasonic vibration defoaming device and process

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