CN102336016A - Viscoelastic heat triggering thermoplastic polymer ultrasonic stamping method - Google Patents

Viscoelastic heat triggering thermoplastic polymer ultrasonic stamping method Download PDF

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Publication number
CN102336016A
CN102336016A CN2011101717431A CN201110171743A CN102336016A CN 102336016 A CN102336016 A CN 102336016A CN 2011101717431 A CN2011101717431 A CN 2011101717431A CN 201110171743 A CN201110171743 A CN 201110171743A CN 102336016 A CN102336016 A CN 102336016A
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China
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polymer
mould
thermoplastic polymer
viscoelastic
ultrasonic
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CN2011101717431A
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CN102336016B (en
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罗怡
祁娜
赵倩雯
王晓东
王良江
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Dalian University of Technology
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Dalian University of Technology
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Abstract

The invention discloses a viscoelastic heat triggering thermoplastic polymer ultrasonic stamping method which is applied to forming of a thermoplastic polymer microstructure. The method is characterized by comprising the following steps of: heating a mould to 1 to 60 DEG C more than glass point conversion temperature of a thermoplastic polymer, placing a polymer substrate on the mould and loading ultrasonic vibration to ensure that the polymer is subjected to viscoelastic heat generation under the action of ultrasonic vibration, softening the polymer in a forming area, and allowing the polymer to flow under the action of pressure and fill a microstructure of the mould. Before ultrasonic vibration is loaded, the polymer in the forming area is subjected to viscoelastic heat generation by heating the mould, so solid-solid contact in a polymer-mould interface high-hardness state is avoided, vibration damage to the mould is slight, the service life of the mould can be effectively prolonged and forming efficiency is improved.

Description

A kind of viscoelastic heat triggers thermoplastic polymer ultrasonic wave method for stamping
Technical field
The invention belongs to the MEMS polymer and make the field, relate to a kind of manufacturing technology of thermoplastic polymer micro-structural, be used to realize the shaping of micro-structural on the polymer matrix film.
Background technology
Along with the application of polymeric material in the MEMS field, the forming technology of polymer micro-structural becomes one of technology of enabling that advances the polymers micro-devices industrialized development.
In based on hyperacoustic forming polymer technology, mainly be divided into ultrasonic heat production impression (Hyun Woo Yu, et al; Micro/Nanolith.MEMS MOEM, 021113) and ultrasonic auxiliary heat impression (Harutaka Mekaru 2009,8 (2):; Et al; Microsyst Technol, 2008,14:1325-1333) two kinds.Wherein, in the ultrasonic heat production imprint process process, the needed origin of heat of polymer temperature rise is in the effect of ultrasonic vibration to polymer; And ultrasonic auxiliary heat impression has been introduced external heat source; Polymer matrix film at first is heated to it more than glass point conversion temperature, when exerting pressure, applies ultrasonic wave, utilizes ultrasonic vibration to play exhaust and interior effect (the Harutaka Mekaru that distributes of even molten polymer fluid sheet; Et al; Microelectronic Engineering, 2007,84:1282-1287).Ultrasonic auxiliary heat impression can improve the forming accuracy of micro-structural in the hot forming; But the heating process in its early stage reaches several minutes, and process efficiency is low, and polyalcohol integral is in it more than glass point conversion temperature; In the forming process under pressure, the polymer matrix film bulk deformation is big.
Summary of the invention
The invention provides a kind of viscoelastic heat that is applied to the thermoplastic polymer micro-structure forming and trigger thermoplastic polymer ultrasonic wave method for stamping.Through arriving mold heated more than the glass point conversion temperature of polymer; Afterwards with room temperature under polymer contact and apply ultrasonic wave; Because the polymer interface that contacts with mould reaches its glass point conversion temperature; The heat production mechanism of thermoplastic polymer under the ultrasonic wave effect is the viscoplasticity heat production, and heat production efficient is high, and the micrographics quick copy on the mould is to polymer matrix film.
Technical scheme of the present invention is following:
The first step is heated to impressing mould on the glass point conversion temperature of thermoplastic polymer 1-60 ℃;
In second step, after mold temperature is constant, on mould, place thermoplastic polymer based; Soldering tip with supersonic welder contacts with polymer matrix film immediately, closes thermal source simultaneously and loads ultrasonic vibration and pressure.When contact pressure reaches the triggering pressure of setting in the ultrasonic bonding; Begin to apply ultrasonic wave load, trigger pressure and change the welding pressure that in welding machine, pre-sets into this moment, keeps a period of time; Polymer temperature rise under ultrasonic vibration and welding pressure effect; The polymer of shaped region is softening, and under the welding pressure effect that the supersonic welder soldering tip provides, takes place to flow, and fills mold graph.
The 3rd step stopped ultrasonicly, and the pressure of supersonic welder is automatically changeb to the dwell pressure that pre-sets, and the polymer that still is in soft state further is shaped, and prevented that it from elastic recovery taking place influence the micro-structure forming precision.Lift wave welding head of ultrasonic wave at last, accomplish viscoelastic heat and trigger thermoplastic polymer ultrasonic wave moulding process.
Effect of the present invention and benefit are: the contact interface place of polymer and mould is because the heat conduction has reached glass point conversion temperature, and the heat production rule after ultrasonic wave applies is the viscoplasticity heat production, and heat production efficient is high, and forming efficiency is high; Because polymer is the non-conductor of heat, thermoplastic polymer based matrix still is lower than its glass point temperature, and the bulk deformation of polymer matrix film is little in the impression forming process; Because when ultrasonic vibration took place, polymer is in elastomeric state or viscoelastic attitude, and was little to the vibration damage of mould, can adopt glass and silicon materials to make impressing mould, reduced die manufacturing cost.
Description of drawings
Fig. 1 is a structural representation of the present invention.
Among the figure: 1 wave welding head of ultrasonic wave; 2 polymer matrix films; 3 moulds; 4 hot plates; 5 welding machine bases.
The specific embodiment
Below in conjunction with technical scheme and accompanying drawing, trigger the ultrasonic example that is embossed to of thermoplasticity with the viscoelastic of thermoplastic polymer PMMA (polymethyl methacrylate) heat and be described in detail practical implementation of the present invention.
1) the glass point conversion temperature of PMMA is 105 ℃, so present embodiment is through being heated to 120 ℃ with hot plate 4, under heat conducting effect, makes the temperature constant of mould upper surface, and this moment, its temperature was about 110 ℃.
2) place PMMA polymer matrix film 2 on silicon mould 3.Wave welding head of ultrasonic wave 1 descends until contacting with polymer matrix film 2 and on-load pressure, closes the hot plate power supply, stops the hot plate heating; Trigger pressure 44N when pressure reaches to preestablish, begin to apply ultrasonic load, frequency is 35kHz, and welding pressure 450N, ultrasonic wave load time 25s, amplitude are 15 μ m.
3) after ultrasonic load time 25s reaches; Pressure is automatically changeb to dwell pressure 400N, and the dwell time is 15s, to prevent still to be in polymer resilience in cooling procedure of soft state; Improve the precision of micro-structure forming; After dwell time reached, soldering tip lifted, and viscoelastic heat triggers thermoplastic polymer ultrasonic wave imprint process and accomplishes.

Claims (1)

1. a viscoelastic heat triggers ultrasonic wave micro-structural method for stamping, is applied to the thermoplastic polymer micro-structure forming, it is characterized in that:
The first step is heated to impressing mould on the glass point conversion temperature of thermoplastic polymer 1-60 ℃;
In second step, on mould, place thermoplastic polymer based; The tool heads of supersonic welder is contacted with thermoplastic polymer based, close thermal source simultaneously and load ultrasonic vibration and impression that pressure carries out micro-structural on the polymer matrix film is shaped.
CN 201110171743 2011-06-23 2011-06-23 Viscoelastic heat triggering thermoplastic polymer ultrasonic stamping method Expired - Fee Related CN102336016B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201110171743 CN102336016B (en) 2011-06-23 2011-06-23 Viscoelastic heat triggering thermoplastic polymer ultrasonic stamping method

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Application Number Priority Date Filing Date Title
CN 201110171743 CN102336016B (en) 2011-06-23 2011-06-23 Viscoelastic heat triggering thermoplastic polymer ultrasonic stamping method

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CN102336016A true CN102336016A (en) 2012-02-01
CN102336016B CN102336016B (en) 2013-11-06

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108688134A (en) * 2018-05-15 2018-10-23 天津大学 A kind of method that high efficiency, low cost and no pollution prepares polymer hydrophobic surface

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101528442A (en) * 2006-09-27 2009-09-09 东丽株式会社 Intermittent film forming device and intermittent film forming method
CN101863122A (en) * 2010-05-18 2010-10-20 浙江大学 Ultraphonic auxiliary micro-nano embossing forming device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101528442A (en) * 2006-09-27 2009-09-09 东丽株式会社 Intermittent film forming device and intermittent film forming method
CN101863122A (en) * 2010-05-18 2010-10-20 浙江大学 Ultraphonic auxiliary micro-nano embossing forming device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
罗康等: "纳米压印技术进展及应用", 《电子工艺技术》 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108688134A (en) * 2018-05-15 2018-10-23 天津大学 A kind of method that high efficiency, low cost and no pollution prepares polymer hydrophobic surface

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