CN103935030B - A kind of ultrasonic wave added micro-embossing building mortion and micro-embossing manufacturing process - Google Patents
A kind of ultrasonic wave added micro-embossing building mortion and micro-embossing manufacturing process Download PDFInfo
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Abstract
The present invention relates to a kind of ultrasonic wave added micro-embossing building mortion and micro-embossing manufacturing process, device comprises ultrasonic-frequency power supply and ultrasonic transducer, and pass through ultrasonic amplitude transformer and the porous ultrasonic horn of connecting bolt sequential concatenation, ultrasonic horn lower surface is threaded connection supporting leg, supporting leg supports whole device, ultrasonic horn upper surface connects low punch by connecting bolt, and workpiece is fixing on the lower punch, and micro-embossing mould is fixed on upper punch.It is the ultrasonic vibration by porous ultrasonic horn, the horizontal direction ultrasonic vibration of input being converted to vertical direction that micro-embossing is shaped, and drives micro-embossing shaping dies to do vertical dither together with workpiece, and the ultrasonic wave added micro-embossing realizing vertical direction is shaped.The present invention can realize the vertical ultrasonic vibration of micro-embossing building mortion in less spatial altitude, and completes ultrasonic micro-embossing forming process, and the present invention is conducive to the realization of ultrasonic micro-embossing process process and improves micro-embossing forming process and the quality of material.
Description
Technical field
The present invention relates to a kind of ultrasonic wave added micro-embossing building mortion and micro-embossing manufacturing process, belong to ultrasonic vibration assist formation processing technique field and micro forming field.
Background technology
Ultrasonic wave added micro-plasticity forming technique is one of forward position, current micro-plasticity forming field research direction.In ultrasonic wave added micro-plasticity forming technique, ultrasonic system produces supersonic frequency mechanical oscillation by ultrasonic-frequency power supply, ultrasonic transducer and ultrasonic amplitude transformer (also known as ultrasonic horn) and the amplitude of vibration is increased, pass to machining tool or workpiece to be machined, make it produce high-frequency resonant, thus realize the processing of ultrasonic wave added micro-plasticity forming.The ultrasonic micro-plasticity forming technique of existing Research Literature report mainly contains ultrasonic micro-extruding, ultrasonic micro-jumping-up, ultrasonic microbend, ultrasonic micro-stretching, ultrasonic micro-stamping-out and ultrasonic micro-embossing process.
Micro-embossing is a kind of typical die forming technique.In existing ultrasonic wave added micro-embossing Research of Forming Technology; ultrasonic vibration installation is generally vertically arranged along Z-direction; the patrix that end and the micro-embossing of ultrasonic amplitude transformer are shaped or counterdie are connected and realize the high-frequency resonant of Z-direction, then complete ultrasonic micro-embossing forming process.Because the ultrasonic device vertically placed needs larger installing space, need to transform existing micro-embossing building mortion; Simultaneously ultrasonic vibration installation also needs to design larger ultrasonic radiation face to realize micro-embossing device and is connected with the effective of ultrasonic amplitude transformer, and this both increases device fabrication cost and technique realizes difficulty.Therefore research and development can be applicable to the ultrasonic vibration installation of conventional micro-embossing former and corresponding ultrasonic micro-embossing forming technology becomes one of urgent need to solve the problem.
In ultrasonic vibration system, the ultrasonic transducer vertically placed and the length of ultrasonic amplitude transformer are the principal elements determining that ultrasonic device takes up space.Can reduce except the length of ultrasonic device except improving the operating frequency of ultrasonic device, ultrasonic device horizontally disposedly also can be effectively reduced device height from vertically arranging to change into and meets the space requirement of common micro-embossing former.But meet the requirement of ultrasonic micro-embossing forming technology, the ultrasonic device of horizontal positioned then needs the ultrasonic vibration producing vertical direction, therefore need to research and develop the ultrasonic horn that can realize ultrasonic vibration direction and change, the ultrasonic vibration of level can be changed into the ultrasonic vibration of vertical direction, also need load micro-embossing mould produce ultrasound resonance and realize ultrasonic micro-embossing forming process simultaneously.The dither realizing micro-embossing mould needs the carrier surface of large-size, and large-sized ultrasonic horn all exists obvious Three-dimensional Coupling Vibration characteristic, the conversion therefore adopting large scale ultrasonic horn to realize ultrasonic vibration direction is the difficult point of research at present.
Summary of the invention
The object of the invention is to the problem of assisting ultrasonic vibration in micro-embossing forming technology to be difficult to realize direction of vibration effectively to change for existing ultrasonic vibration, and a kind of ultrasonic wave added micro-embossing building mortion and micro-embossing manufacturing process are provided, by the direction of transfer adopting the porous ultrasonic horn of horizontal positioned to change ultrasonic vibration, the level of ultrasonic vibration produced by ultrasonic vibration system changes the ultrasonic vibration of vertical direction into, and realize stable vertical direction ultrasonic vibration by the upper surface load micro-embossing mould of porous ultrasonic horn, realize ultrasonic wave added micro-embossing forming process.
To achieve these goals, the technical solution used in the present invention is: provide a kind of ultrasonic wave added micro-embossing building mortion, comprise ultrasonic-frequency power supply, ultrasonic transducer, ultrasonic amplitude transformer, porous ultrasonic horn, low punch, micro-embossing mould and upper punch, described ultrasonic-frequency power supply is connected with ultrasonic transducer, ultrasonic-frequency power supply provides electric energy for ultrasonic transducer, ultrasonic transducer is used for the mechanical vibration wave signal of telecommunication being changed into high frequency, ultrasonic amplitude transformer is conventional notch cuttype ultrasonic amplitude transformer, ultrasonic amplitude transformer is used for the level of ultrasonic Amplitude amplification produced by ultrasonic transducer, the horizontal direction ultrasonic vibration of ultrasonic amplitude transformer is converted to the ultrasonic vibration of vertical direction by porous ultrasonic horn,
Described ultrasonic transducer is by connecting bolt sequential concatenation ultrasonic amplitude transformer, porous ultrasonic horn;
Described porous ultrasonic horn is made up of along the symmetrical polyhedral structure in two, top and the bottom that its normal direction gradual change is protruded the upper and lower surface of middle part cuboid block and middle part cuboid block, the upper surface of top polyhedral structure and the upper surface of porous ultrasonic horn, for the radiating surface of porous ultrasonic horn, the bottom surface of bottom polyhedral structure and the lower surface of porous ultrasonic horn, respectively by four arc surface transition between the four edges of the upper surface of top polyhedral structure and the bottom surface of bottom polyhedral structure and middle part cuboid block, the upper surface of top polyhedral structure and the bottom surface of bottom polyhedral structure are uniformly distributed along Z-direction respectively 25 there is same diameter and on, the Z-direction blind hole of bottom symmetry, described is upper, the height of the Z-direction blind hole of bottom symmetry and upper, the polyhedron height that bottom gradual change is protruded is identical, described top Z-direction blind hole has internal thread for being fixedly connected with bolt in the one end near upper surface, connecting bolt connects low punch, workpiece is fixing on the lower punch, micro-embossing mould is fixed on upper punch, bottom Z-direction blind hole has internal thread for connecting supporting leg in the one end near bottom surface, and supporting leg supports whole device, respectively arrange along horizontal X and Y both direction the horizontal through hole that 5 diameter differ respectively in the middle part of the polyhedral structure that upper and lower two gradual changes are protruded, porous ultrasonic horn changes the ultrasonic vibration characteristic of porous ultrasonic horn by the hole in X, Y, Z tri-directions arranged in the polyhedral structure of upper and lower part, the conversion realizing input level ultrasonic vibration and export between vertical ultrasonic vibration,
Described connecting bolt is studs, wherein the centerline of ultrasonic transducer and ultrasonic amplitude transformer, two connecting bolts between ultrasonic amplitude transformer and porous ultrasonic horn is in same level, and the center line of connecting bolt between porous ultrasonic horn and low punch and the central axis of aforesaid two connecting bolts.
The present invention also provides a kind of micro-embossing manufacturing process applying above-mentioned ultrasonic wave added micro-embossing device, level of ultrasonic vibration is converted to vertical ultrasonic vibration by the porous ultrasonic horn described in employing, and the upper surface of porous ultrasonic horn carrys out load low punch as radiating surface by connecting bolt and workpiece realizes high-frequency resonant; Workpiece and low punch are consolidated and make vertical dither by connecting bolt together with porous ultrasonic horn, and micro-embossing mould then moves downward precalculated position under the driving of upper punch, completes the micro-embossing forming process to workpiece together with low punch;
The micro-embossing manufacturing process of described ultrasonic wave added micro-embossing building mortion, at least comprises the steps:
Step 1, by fixing for workpiece on the lower punch, low punch is connected with porous ultrasonic horn by connecting bolt, and micro-embossing mould and upper punch link together; By computer settings and the stroke controlling micro-embossing mould;
Step 2, ultrasonic-frequency power supply and ultrasonic transducer to be coupled together by power line, open ultrasonic-frequency power supply, the mechanical vibration wave that the signal of telecommunication is changed into high frequency by ultrasonic transducer exports, the level of ultrasonic Amplitude amplification that ultrasonic transducer exports by ultrasonic amplitude transformer; The horizontal direction ultrasonic vibration of ultrasonic amplitude transformer is converted to the ultrasonic vibration of vertical direction by porous ultrasonic horn, and the upper surface of porous ultrasonic horn comes load low punch and workpiece as radiating surface by connecting bolt simultaneously; Radiating surface realizes the high-frequency resonant of vertical direction by connecting bolt support low punch and workpiece;
Step 3, low punch, workpiece make vertical dither together with porous ultrasonic horn, micro-embossing mould then moves downward under the driving of upper punch, when after micro-embossing mould and absorption surface, micro-embossing mould continues to move to precalculated position to be made produce predetermined pressure between the two and make micro-embossing mould be pressed in workpiece material, need the time keeping setting after micro-embossing mold movement to precalculated position, the micro-embossing completing workpiece is shaped;
After step 4, workpiece micro-embossing are shaped, rise upper punch and micro-embossing mould, realize being separated of micro-embossing mould and workpiece, complete whole ultrasonic micro-embossing forming process.
Porous ultrasonic horn structure of the present invention is carried out performance parameter detecting through electric impedance analyzer, laser vibration measurer and revises, and the ultrasonic vibration characteristic of porous ultrasonic horn adopts ANSYS simulation software to carry out simulative optimization design.Adopt porous ultrasonic horn to realize level of ultrasonic vibration and the conversion vertically between ultrasonic vibration, the upper surface of porous ultrasonic horn realizes vertical direction high-frequency resonant and ultrasonic micro-embossing forming process by connecting bolt carrying micro-embossing low punch and workpiece.
A kind of ultrasonic wave added micro-embossing building mortion of the present invention and micro-embossing manufacturing process have following beneficial effect:
1, device of the present invention realizes level of ultrasonic vibration and the conversion vertically between ultrasonic vibration by porous ultrasonic horn, ultrasonic wave added forming process is realized by the conversion in ultrasonic vibration direction, thus the installation of micro-embossing building mortion can be realized in less spatial altitude, the design of this device can be reduced device fabrication cost and technique realizes difficulty.Device of the present invention was not commercially met, and device and corresponding micro-embossing manufacturing process all yet there are no report in Research Literature at home and abroad.
2, ultrasonic micro-embossing process of the present invention is conducive to realizing and improves micro-embossing forming process and the quality of material.
3, the present invention can be widely used in various micro-plasticity forming process, has more wide application prospect.
Accompanying drawing explanation
Fig. 1 is ultrasonic wave added micro-embossing building mortion cross-sectional view of the present invention.
Fig. 2 is the schematic top plan view of ultrasonic wave added micro-embossing building mortion of the present invention.Not containing ultrasonic-frequency power supply in figure.
In above-mentioned figure: 1-ultrasonic-frequency power supply, 2-ultrasonic transducer, 3-ultrasonic amplitude transformer, 4-porous ultrasonic horn, 5-low punch, 6-workpiece, 7-micro-embossing mould, 8-upper punch, 9-connecting bolt, 10-supporting leg, 11-middle part cuboid block, 12-radiating surface, 13-Z-direction blind hole, 14-Y-direction horizontal through hole, 15-X is to horizontal through hole.
Detailed description of the invention
Below in conjunction with drawings and Examples, the present invention is described in further detail:
Embodiment 1: a kind of ultrasonic wave added micro-embossing building mortion provided by the invention, its structure as shown in Figure 1.Comprise ultrasonic-frequency power supply 1, ultrasonic transducer 2, ultrasonic amplitude transformer 3, porous ultrasonic horn 4, low punch 5, micro-embossing mould 7 and upper punch 8, described ultrasonic-frequency power supply 1 is connected with ultrasonic transducer 2, ultrasonic transducer 2 is by connecting bolt 9 sequential concatenation ultrasonic amplitude transformer 3, porous ultrasonic horn 4, described porous ultrasonic horn 4 lower surface is threaded connection supporting leg 10, supporting leg 10 supports whole device, porous ultrasonic horn 4 upper surface connects low punch 5 by connecting bolt, workpiece 6 is fixed on low punch 5, micro-embossing mould 7 is fixed on upper punch 8, described ultrasonic-frequency power supply 1 provides electric energy for ultrasonic transducer 2, and ultrasonic transducer 2 is for changing the mechanical vibration wave of high frequency into by the signal of telecommunication.Described ultrasonic amplitude transformer 3 is conventional notch cuttype ultrasonic amplitude transformer, and ultrasonic amplitude transformer is used for the level of ultrasonic Amplitude amplification produced by ultrasonic transducer 2; The horizontal direction ultrasonic vibration of ultrasonic amplitude transformer 3 is converted to the ultrasonic vibration of vertical direction by porous ultrasonic horn 4.
Described connecting bolt 9 is studs, wherein the centerline of ultrasonic transducer 2 and ultrasonic amplitude transformer 3, two connecting bolts 9 between ultrasonic amplitude transformer 3 and porous ultrasonic horn 4 is in same level, and the center line of connecting bolt between porous ultrasonic horn 4 and low punch 5 and the central axis of aforesaid two connecting bolts 9.
See Fig. 1, 2, described porous ultrasonic horn 4 is made up of along the symmetrical polyhedral structure in two, top and the bottom that its normal direction gradual change is protruded the upper and lower surface of middle part cuboid block 11 and middle part cuboid block, the upper surface of porous ultrasonic horn 4 is radiating surface 12, respectively by four arc surface transition between the four edges of the upper surface of top polyhedral structure and the bottom surface of bottom polyhedral structure and middle part cuboid block, the upper surface of top polyhedral structure and the bottom surface of bottom polyhedral structure are uniformly distributed along Z-direction respectively 25 there is same diameter and on, the vertical Z-direction blind hole 13 of bottom symmetry, described is upper, the height of the Z-direction blind hole 13 of bottom symmetry and upper, the polyhedron height that bottom gradual change is protruded is identical, described top Z-direction blind hole 13 has internal thread for being fixedly connected with bolt 9 in the one end near upper surface, connecting bolt connects low punch, workpiece is fixing on the lower punch, micro-embossing mould is fixed on upper punch, bottom Z-direction blind hole has internal thread for connecting supporting leg 10 in the one end near bottom surface, and supporting leg supports whole device, in the middle part of the polyhedral structure that upper and lower two gradual changes are protruded, respectively arrange that X that 5 diameter differ is to horizontal through hole 15 and Y-direction horizontal through hole 14 along horizontal X and Y both direction respectively, X to horizontal through hole 15 and Y-direction horizontal through hole 14 for the through hole that diameter differs designs according to the result of simulation optimization, porous ultrasonic horn changes the ultrasonic vibration characteristic of porous ultrasonic horn by the hole in X, Y, Z tri-directions arranged in the polyhedral structure of upper and lower part, realizes input level ultrasonic vibration to the conversion exporting vertical ultrasonic vibration.
The structure of porous ultrasonic horn 4 of the present invention is carried out performance parameter detecting through electric impedance analyzer, laser vibration measurer and revises, and the ultrasonic vibration characteristic of porous ultrasonic horn 4 adopts ANSYS simulation software to carry out simulative optimization design.Adopt porous ultrasonic horn 4 to realize level of ultrasonic vibration and the conversion vertically between ultrasonic vibration, and realize vertical direction high-frequency resonant and ultrasonic micro-embossing forming process in the upper surface of porous ultrasonic horn by connecting bolt carrying low punch 5 and workpiece 6.
Embodiment 2: the present invention also provides a kind of micro-embossing method of ultrasonic wave added micro-embossing building mortion of Application Example 1, level of ultrasonic vibration is converted to vertical ultrasonic vibration by the porous ultrasonic horn 4 described in employing, and the upper surface of porous ultrasonic horn 4 supports micro-embossing mould 7 as radiating surface 12 by connecting bolt and realizes high-frequency resonant; Workpiece 6 and low punch 5 are consolidated and make vertical dither by connecting bolt 9 together with porous ultrasonic horn 4,7, micro-embossing mould moves downward precalculated position under the driving of upper punch 8, completes the micro-embossing forming process to workpiece together with low punch 5.
The micro-embossing manufacturing process of concrete ultrasonic wave added micro-embossing device, at least comprises the steps:
Step 1, be fixed on low punch 5 by workpiece 6, low punch 5 is connected with porous ultrasonic horn 4 by connecting bolt 9, micro-embossing mould 7 and upper punch 8 is fixed together; By computer settings and the stroke controlling micro-embossing mould.
Step 2, ultrasonic-frequency power supply 1 and ultrasonic transducer 2 to be coupled together by power line, open ultrasonic-frequency power supply 1, the mechanical vibration wave that the signal of telecommunication is changed into high frequency by ultrasonic transducer 2 exports, the level of ultrasonic Amplitude amplification that ultrasonic transducer 2 transmits by ultrasonic amplitude transformer 3; The horizontal direction ultrasonic vibration of ultrasonic amplitude transformer 3 is converted to the ultrasonic vibration of vertical direction by porous ultrasonic horn 4 simultaneously, and the upper surface of porous ultrasonic horn 4 comes load low punch 5 and workpiece 6 as radiating surface 12 by connecting bolt simultaneously; Radiating surface 12 realizes the high-frequency resonant of vertical direction by connecting bolt support low punch 5 and workpiece 6.
Step 3, low punch 5, workpiece 6 make vertical dither together with porous ultrasonic horn 4,7, micro-embossing mould moves downward under the driving of upper punch 8, after micro-embossing mould 7 contacts with workpiece 6, micro-embossing mould 7 continues to move to precalculated position to be made produce predetermined pressure between the two and make micro-embossing mould be pressed in workpiece material, micro-embossing mould 7 needs the time keeping setting after moving to precalculated position, thus completes and be shaped to the micro-embossing of workpiece 6.
After step 4, workpiece 6 impression is shaped, rise upper punch 8 and micro-embossing mould 7, complete being separated of micro-embossing mould 7 and workpiece 6, complete the ultrasonic micro-embossing forming process to workpiece 6.
The present invention realizes level of ultrasonic vibration and the conversion vertically between ultrasonic vibration by porous ultrasonic horn, realizes ultrasonic wave added forming process, applies device of the present invention and be conducive to realizing and micro-embossing forming process and the quality of improving material.The present invention can be widely used in various micro-plasticity forming process, has more wide application prospect.
Claims (2)
1. a ultrasonic wave added micro-embossing building mortion, comprise ultrasonic-frequency power supply, ultrasonic transducer, ultrasonic amplitude transformer, porous ultrasonic horn, low punch, micro-embossing mould and upper punch, described ultrasonic-frequency power supply is connected with ultrasonic transducer, ultrasonic-frequency power supply provides electric energy for ultrasonic transducer, ultrasonic transducer is used for the mechanical vibration wave signal of telecommunication being changed into high frequency, ultrasonic amplitude transformer is conventional notch cuttype ultrasonic amplitude transformer, and ultrasonic amplitude transformer is used for the level of ultrasonic Amplitude amplification produced by ultrasonic transducer; The horizontal direction ultrasonic vibration of ultrasonic amplitude transformer is converted to the ultrasonic vibration of vertical direction by porous ultrasonic horn; It is characterized in that:
Described ultrasonic transducer is by connecting bolt sequential concatenation ultrasonic amplitude transformer, porous ultrasonic horn;
Described porous ultrasonic horn is made up of along the symmetrical polyhedral structure in two, top and the bottom that its normal direction gradual change is protruded the upper and lower surface of middle part cuboid block and middle part cuboid block, the upper surface of top polyhedral structure and the upper surface of porous ultrasonic horn, for the radiating surface of porous ultrasonic horn, the bottom surface of bottom polyhedral structure and the lower surface of porous ultrasonic horn, respectively by four arc surface transition between the four edges of the upper surface of top polyhedral structure and the bottom surface of bottom polyhedral structure and middle part cuboid block, the upper surface of top polyhedral structure and the bottom surface of bottom polyhedral structure are uniformly distributed along Z-direction respectively 25 there is same diameter and on, the Z-direction blind hole of bottom symmetry, described is upper, the height of the Z-direction blind hole of bottom symmetry and upper, the polyhedron height that bottom gradual change is protruded is identical, described top Z-direction blind hole has internal thread for being fixedly connected with bolt in the one end near upper surface, connecting bolt connects low punch, workpiece is fixing on the lower punch, micro-embossing mould is fixed on upper punch, bottom Z-direction blind hole has internal thread for connecting supporting leg in the one end near bottom surface, and supporting leg supports whole device, respectively arrange along horizontal X and Y both direction the horizontal through hole that 5 diameter differ respectively in the middle part of the polyhedral structure that upper and lower two gradual changes are protruded, porous ultrasonic horn changes the ultrasonic vibration characteristic of porous ultrasonic horn by the hole in X, Y, Z tri-directions arranged in the polyhedral structure of upper and lower part, the conversion realizing input level ultrasonic vibration and export between vertical ultrasonic vibration,
Described connecting bolt is studs, wherein the centerline of ultrasonic transducer and ultrasonic amplitude transformer, two connecting bolts between ultrasonic amplitude transformer and porous ultrasonic horn is in same level, and the center line of connecting bolt between porous ultrasonic horn and low punch and the central axis of aforesaid two connecting bolts.
2. the micro-embossing manufacturing process of the ultrasonic wave added micro-embossing building mortion of an application rights requirement described in 1, level of ultrasonic vibration is converted to vertical ultrasonic vibration by the porous ultrasonic horn described in employing, and the upper surface of porous ultrasonic horn carrys out load low punch as radiating surface by connecting bolt and workpiece realizes high-frequency resonant; Workpiece and low punch are consolidated and make vertical dither by connecting bolt together with porous ultrasonic horn, and micro-embossing mould then moves downward precalculated position under the driving of upper punch, completes the micro-embossing forming process to workpiece together with low punch; It is characterized in that, at least comprise the steps:
Step 1, by fixing for workpiece on the lower punch, low punch is connected with porous ultrasonic horn by connecting bolt, and micro-embossing mould and upper punch link together; By computer settings and the stroke controlling micro-embossing mould;
Step 2, ultrasonic-frequency power supply and ultrasonic transducer to be coupled together by power line, open ultrasonic-frequency power supply, the mechanical vibration wave that the signal of telecommunication is changed into high frequency by ultrasonic transducer exports, the level of ultrasonic Amplitude amplification that ultrasonic transducer exports by ultrasonic amplitude transformer; The horizontal direction ultrasonic vibration of ultrasonic amplitude transformer is converted to the ultrasonic vibration of vertical direction by porous ultrasonic horn, and the upper surface of porous ultrasonic horn comes load low punch and workpiece as radiating surface by connecting bolt simultaneously; Radiating surface realizes the high-frequency resonant of vertical direction by connecting bolt support low punch and workpiece;
Step 3, low punch, workpiece make vertical dither together with porous ultrasonic horn, micro-embossing mould then moves downward under the driving of upper punch, when after micro-embossing mould and absorption surface, micro-embossing mould continues to move to precalculated position to be made produce predetermined pressure between the two and make micro-embossing mould be pressed in workpiece material, need the time keeping setting after micro-embossing mold movement to precalculated position, the micro-embossing completing workpiece is shaped;
After step 4, workpiece micro-embossing are shaped, rise upper punch and micro-embossing mould, realize being separated of micro-embossing mould and workpiece, complete whole ultrasonic micro-embossing forming process.
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| CN201410157282.6A CN103935030B (en) | 2014-04-18 | 2014-04-18 | A kind of ultrasonic wave added micro-embossing building mortion and micro-embossing manufacturing process |
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| CN201410157282.6A CN103935030B (en) | 2014-04-18 | 2014-04-18 | A kind of ultrasonic wave added micro-embossing building mortion and micro-embossing manufacturing process |
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| CN107413871A (en) * | 2017-09-28 | 2017-12-01 | 中国地质大学（武汉） | A kind of composite ultraphonic vibration aids in micro- extrusion molding process equipment |
| CN110361928A (en) * | 2018-04-11 | 2019-10-22 | 长春工业大学 | A kind of imprinting apparatus and method of two dimension ancillary vibration |
| CN109164676A (en) * | 2018-10-31 | 2019-01-08 | 京东方科技集团股份有限公司 | Impression block and method for stamping |
| CN110013348B (en) * | 2019-04-09 | 2021-06-04 | 河南理工大学 | Preparation device and method for anti-adhesion artificial blood vessel material |
| CN113650279A (en) * | 2021-08-19 | 2021-11-16 | 天津大学 | Polymer ultrasonic-assisted linear friction imprinting device and method |
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| CN101863122A (en) * | 2010-05-18 | 2010-10-20 | 浙江大学 | Ultraphonic auxiliary micro-nano embossing forming device |
| CN103495541A (en) * | 2013-10-14 | 2014-01-08 | 中国地质大学（武汉） | Multi-hole rectangular hexahedral ultrasonic amplitude transformer |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101863122A (en) * | 2010-05-18 | 2010-10-20 | 浙江大学 | Ultraphonic auxiliary micro-nano embossing forming device |
| CN103495541A (en) * | 2013-10-14 | 2014-01-08 | 中国地质大学（武汉） | Multi-hole rectangular hexahedral ultrasonic amplitude transformer |
Non-Patent Citations (1)
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| 聚合物微结构的热辅助超声波压印工艺研究;闫旭;《中国优秀硕士学位论文全文数据库 工程科技I辑》;20130915(第9期);参见第9页的第1-4段及附图2.1-2.3 * |
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