CN106793730A - A kind of mobile phone composite shielding lid and preparation method - Google Patents
A kind of mobile phone composite shielding lid and preparation method Download PDFInfo
- Publication number
- CN106793730A CN106793730A CN201611232364.8A CN201611232364A CN106793730A CN 106793730 A CN106793730 A CN 106793730A CN 201611232364 A CN201611232364 A CN 201611232364A CN 106793730 A CN106793730 A CN 106793730A
- Authority
- CN
- China
- Prior art keywords
- copper coin
- mobile phone
- convered structure
- shielding lid
- stainless steel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
Abstract
The application is related to a kind of mobile phone composite shielding lid, it includes main body and kink, and in main body surrounding, main body and kink are formed in one structure bending part, screening cover includes the first copper coin, stainless steel plate and the second copper coin, and the first copper coin, stainless steel plate and the second copper coin are fitted successively.The application combines the advantage of stainless steel and copper product, and the mobile phone composite shielding lid for obtaining is while have good intensity and heat-sinking capability.
Description
Technical field
The application is related to mobile communication device field, specifically, is related to a kind of composite shielding lid for mobile phone, and should
The preparation method of screening cover.
Background technology
Various electronic components are provided with interior of mobile phone.Wherein, central processing unit (CPU, Central Processing
Unit it is) one piece of ultra-large integrated circuit, is the arithmetic core and control core of electronic product.PCB(Printed
Circuit Board, printed circuit board (PCB)), it is the supporter of electronic component, while for electronic component provides electrical connection.
In order that these electronic components do not produce interference mutually, it is necessary to set screening cover in interior of mobile phone when working, it is most heavy to protect
The CPU for wanting.Performance with mobile phone persistently strengthens, and mobile phone volume relative decrease, power consumption and heating is turned into user increasingly
Concern.Hot mobile phone directly affects Consumer's Experience, and discomfort is brought to user, so whether the heat dissipation design having had is
One of significant design index as mobile phone.
The material for being presently used for making master chip screening cover mainly has two kinds：Stainless steel and foreign copper-nickel alloy.The two respectively has excellent lacking
Point, it is specific as follows：The thermal conductivity factor of stainless steel is low, and the capacity of heat transmission is limited, but intensity is high with rigidity, will not be shaken when mobile phone falls
Strike chip；The thermal conductivity ratio stainless steel of foreign copper-nickel alloy doubles, and heat-sinking capability is strong, but rigidity is weak, intensity difference, screening cover
Body mutability be collapsed.Therefore the advantage with reference to above two material is needed, the Mobile phone screen that intensity and heat-sinking capability have both is made
Cover lid.
In consideration of it, special propose the application.
The content of the invention
The first purpose of the application is to propose a kind of mobile phone composite shielding lid.
The second purpose of the application is the preparation method for proposing the screening cover.
In order to complete the purpose of the application, the technical scheme for using for：
The application is related to a kind of mobile phone composite shielding lid, and it includes main body and kink, and the bending part is in the master
Body surrounding, the main body and the kink are formed in one structure, and the screening cover includes the first copper coin, stainless steel plate and the
Two copper coins, first copper coin, the stainless steel plate and second copper coin are fitted successively.
Preferably, fitted using bonding agent between first copper coin, the stainless steel plate and second copper coin.
Preferably, it is first copper coin, first convered structure, described also including the first convered structure and the second convered structure
Stainless steel plate, second convered structure and second copper coin are fitted successively.
Preferably, first convered structure includes that multiple first bonding sections and multiple second are bonded section, and each described first glues
The extension line for connecing section and the second bonding section intersects, to form latticed convered structure；And/or second convered structure is including more
The extension line of individual 3rd bonding section and multiple 4th bonding sections, each 3rd bonding section and the 4th bonding section intersects, with
Form latticed convered structure.
Preferably, the angle between the first bonding section and the second bonding section is right angle；And/or the described 3rd is viscous
The angle connect between section and the 4th bonding section is right angle.
Preferably, the thickness of first copper coin, the stainless steel plate and two copper coin is 0.05~0.08mm.
Preferably, the thickness of first convered structure and/or second convered structure is 0.01~0.02mm.
Preferably, the length of the first bonding section and/or the second bonding section is 0.5~2mm.
The application further relates to the preparation method of the screening cover, including by first copper coin, first convered structure, institute
State and pressed after stainless steel plate, second convered structure and second copper coin are sequentially overlapped.
Preferably, the time of the pressing >=15s, presses the pressure >=0.5MPa for applying.
The technical scheme of the application at least has following beneficial effect：
The application is related to a kind of mobile phone composite shielding lid, is prepared by the way that stainless steel plate and two-layer copper coin are pressed, its
Middle two-layer copper coin is located at the outside of screening cover, plays a part of flash heat transfer；Stainless steel plate is located between two-layer copper coin, plays increasing
The effect of strong rigidity, can support whole screening cover.The application combines the advantage of stainless steel and copper product, the mobile phone for obtaining
Composite shielding lid has good intensity and heat-sinking capability simultaneously.
Brief description of the drawings
Fig. 1 is the structural representation that the screening cover of the application is used for mobile phone.
Fig. 2 is the profile of the mobile phone composite shielding lid of the application.
Fig. 3 is the structural representation of the first convered structure and/or the second convered structure.
Wherein：
1- screening covers；
101- main bodys；102- kinks；
The copper coins of 11- first；
12- stainless steel plates；
The copper coins of 13- second；
The convered structures of 14- first；
141- first is bonded section；
142- second is bonded section；
The convered structures of 15- second；
2-CPU；
3-PCB plates.
Specific embodiment
The application is described in further detail below by specific embodiment and with reference to accompanying drawing.Described in text
"front", "rear", "left", "right", " on ", D score is with the placement of the mobile phone composite shielding lid in accompanying drawing and mobile phone composite shielding lid
State is reference.It should be understood that these embodiments are merely to illustrate the application rather than limitation scope of the present application.
The application is related to a kind of mobile phone composite shielding lid 1, and it includes main body 101 and kink 102, and kink 102 is located at
The surrounding of main body 101, main body 101 and kink 102 are formed in one structure.As shown in figure 1, CPU2 and the screening cover 1 are installed
On pcb board 2, the main body 101 of screening cover 1 is used to form CPU2 shielding, and the kink 102 of screening cover 1 is used for and pcb board 2
It is fixedly connected.The screening cover 1 can completely enclose CPU2, the electronic components such as CPU2, pcb board 2 is each worked independently, and prevent
Interference each other and electromagnetic exposure.
The screening cover 1 includes the first copper coin 11, the copper coin 13 of stainless steel plate 12 and second, the first copper coin 11, stainless steel plate 12
Fitted successively with the second copper coin 13.Wherein the first copper coin 11 and the second copper coin 13 are located at the outside of screening cover 1, play flash heat transfer
Effect；Stainless steel plate 12 is located between two-layer copper coin, plays a part of strengthen rigidity, can support whole screening cover 1.This
Application combines the advantage of stainless steel and copper product, and the mobile phone composite shielding lid 1 for obtaining is while have good intensity and radiating
Ability.The material of the first copper coin 11 and the second copper coin 13 is preferably foreign copper-nickel alloy.
Further, answered with forming mobile phone in order that being combined between the first copper coin 11, the copper coin 13 of stainless steel plate 12 and second
Screening cover 1 is closed, the first copper coin 11, the copper coin 13 of stainless steel plate 12 and second can be fitted using bonding agent.
Improved as the one kind to laminating type, as shown in Fig. 2 the mobile phone composite shielding lid 1 of the application also includes first
The convered structure 15 of convered structure 14 and second.First copper coin 11, the first convered structure 14, stainless steel plate 12, the second convered structure 15 and second
Copper coin 13 is fitted successively.Compared to other bonding ways such as gluing, disposably above-mentioned device can be fitted using convered structure, kept away
Exempt to be bonded loosely caused by glue is hardened during gluing.
It is further preferred that as shown in figure 3, the first convered structure 14 includes that multiple first bonding sections 141 and multiple second are bonded
Section 142, the extension line of each first bonding section 141 and second bonding section 142 intersects, to form latticed convered structure.It is viscous with first
The design of junctor 14 is identical, and the second convered structure 15 includes that multiple 3rd bonding sections and the multiple 4th are bonded section, and each 3rd glues
The extension line for connecing section and the 4th bonding section intersects, to form latticed convered structure.If in the first copper coin 11 and stainless steel plate 12
Faying face, and coat bonded adhesives on the second copper coin 13 and the whole area of the faying face of stainless steel plate 12, then above-mentioned metal
Device is fitted completely, and heat conduction is too fast in a thickness direction for screening cover 1, is likely to result in unbalanced along the heat conduction of in-plane, is caused
CPU2 is damaged because of hot-spot.And when using latticed convered structure, heat is only capable of in the first bonding bonding section of section 141 and second
Conducted between 142, and be not provided with the position of the bonding section 142 of the first bonding section 141 and second, the copper coin of stainless steel plate 12 and first
11 second do not contact between copper coin 13, only carry out heat transfer by air.Due to much slower than metal of the heat-transfer rate of air,
Heat that CPU2 and the operation of pcb board 3 can so produced is main along in-plane, in other words along the first bonding section 141 and the
Two bonding sections 142 bearing of trends conduction, realize the even heat in screening cover 1, it is to avoid the heat that CPU2 is produced everywhere can and
When derive.
It is further preferred that first bonding section 141 and second bonding section 142 between angle, and the 3rd bonding section and
Angle between the 4th bonding section is right angle.So processing is relatively easy to, and under the conditions of bonding section is the same number of,
Bonding section is the most uniform in the distribution of plane, can farthest reduce the copper coin 11 of stainless steel plate 12 and first or the second copper coin
Contact area between 13.Certainly, the first convered structure 14 and the second convered structure 15 can also be set using other manner.
To ensure shielding properties and bond strength, screening cover 1 needs certain thickness.But blocked up screening cover 1 can increase again
Add weight, occupies excessive inner space.In the application, the thickness of screening cover 1 is arranged on 0.15~3mm and is advisable.Can be by
One copper coin 11, the thickness of the copper coin 13 of stainless steel plate 12 and second are arranged on 0.05~0.08mm.For example, the first copper coin 11, stainless
The thickness of the copper coin 13 of steel plate 12 and second is 0.06mm.
Likewise, the thickness of the first convered structure 14 and/or the second convered structure 15, it is also possible to be considered the first bonding section 141
And/or second bonding section 142 thickness be preferably provided within the specific limits, with can take into account adhesive strength and take up space to the greatest extent
The few demand of amount.Preferably, the thickness of the first convered structure 14 and/or the second convered structure 15 is 0.01~0.02mm.For example, first
The thickness of the convered structure 15 of convered structure 14 and second is 0.01mm.
Being bonded the length of section can also influence bonding and heat conductivility.Preferably, the first bonding section 141 and/or second is bonded
The length of section 142 is 0.5~2mm, and now the first convered structure 14 and/or the second convered structure 15 have preferable adhesive property,
Nor difficult to realize in the preparation of material.For example, the length of the first bonding bonding section 142 of section 141 and/or second is
1mm。
The application further relates to the preparation method of screening cover 1, including by the first copper coin 11, the first convered structure 14, stainless steel plate
12nd, pressed after the second convered structure 15 and the second copper coin 13 are sequentially overlapped.That is, using the first convered structure 14 and the second convered structure 15 as
It is overall, pressed after being overlapped with other devices, rather than the gluing on bonding plane, procedure of processing can be so reduced, optimize
Production technology.
Further, pressing is preferably carried out under pressure, and pressurize is for a period of time, and the effect of pressing is more preferable.When
The time of pressing >=15s, when pressing the pressure >=0.5Mpa for applying, disclosure satisfy that the bond strength of the screening cover 1 for preparing.
It is not for limiting claim although the application is disclosed as above with preferred embodiment.Any this area skill
Art personnel are not being departed from the premise of the application conceives, and can make some possible variations and modification, therefore the application
The scope that protection domain should be defined by claim is defined.
Claims (10)
1. a kind of mobile phone composite shielding lid, it includes main body and kink, and the bending part is in the main body surrounding, the master
Body and the kink are formed in one structure,
Characterized in that, the screening cover include the first copper coin, stainless steel plate and the second copper coin, first copper coin, it is described not
Rust steel plate and second copper coin are fitted successively.
2. mobile phone composite shielding lid according to claim 1, it is characterised in that first copper coin, the stainless steel plate
Fitted using bonding agent and second copper coin between.
3. mobile phone composite shielding lid according to claim 1, it is characterised in that be also bonded including the first convered structure and second
Body, first copper coin, first convered structure, the stainless steel plate, second convered structure and second copper coin are successively
Laminating.
4. mobile phone composite shielding lid according to claim 3, it is characterised in that first convered structure includes multiple first
The extension line of bonding section and multiple second bonding sections, each first bonding section and the second bonding section intersects, to form net
Trellis convered structure；And/or
Second convered structure includes that multiple three are bonded sections and the multiple 4th and are bonded sections, each 3rd bonding section and described the
The extension line of four bonding sections intersects, to form latticed convered structure.
5. mobile phone composite shielding lid according to claim 4, it is characterised in that the first bonding section and described second is glued
It is right angle to connect the angle between section；And/or
Angle between the 3rd bonding section and the 4th bonding section is right angle.
6. mobile phone composite shielding lid according to any one of claim 1 to 5, it is characterised in that first copper coin, institute
The thickness for stating stainless steel plate and second copper coin is 0.05~0.08mm.
7. the mobile phone composite shielding lid according to any one of claim 3 to 5, it is characterised in that first convered structure
And/or the thickness of second convered structure is 0.01~0.02mm.
8. the mobile phone composite shielding lid according to claim 4 or 5, it is characterised in that the first bonding section and/or described
The length of the second bonding section is 0.5~2mm.
9. according to any one of claim 1 to 8 screening cover preparation method, it is characterised in that including by described first
Copper coin, first convered structure, the stainless steel plate, second convered structure and second copper coin are pressed after being sequentially overlapped.
10. method according to claim 9, it is characterised in that the time of the pressing >=15s, presses the pressure for applying
≥0.5MPa。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611232364.8A CN106793730A (en) | 2016-12-28 | 2016-12-28 | A kind of mobile phone composite shielding lid and preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611232364.8A CN106793730A (en) | 2016-12-28 | 2016-12-28 | A kind of mobile phone composite shielding lid and preparation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106793730A true CN106793730A (en) | 2017-05-31 |
Family
ID=58922398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611232364.8A Pending CN106793730A (en) | 2016-12-28 | 2016-12-28 | A kind of mobile phone composite shielding lid and preparation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106793730A (en) |
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Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101175394A (en) * | 2006-10-31 | 2008-05-07 | 比亚迪股份有限公司 | Anti-electromagnetic interference multilayer composite material and method for producing the same |
| CN201584189U (en) * | 2009-08-05 | 2010-09-15 | 田悦明 | Conductive foam assembly and display screen component |
| CN102792442A (en) * | 2010-03-10 | 2012-11-21 | 日东电工株式会社 | Heat insulation/heat dissipation sheet and intra-device structure |
| CN102695406A (en) * | 2011-03-23 | 2012-09-26 | 环旭电子股份有限公司 | Electromagnetic shielding structure and manufacture method thereof |
| US20120243191A1 (en) * | 2011-03-23 | 2012-09-27 | Universal Global Scientific Industrial Co., Ltd. | Miniaturized electromagnetic interference shielding structure and manufacturing method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170531 |
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| RJ01 | Rejection of invention patent application after publication |