CN106783641B - It is a kind of that arrangement of semiconductors is encapsulated using print glue mode - Google Patents
It is a kind of that arrangement of semiconductors is encapsulated using print glue mode Download PDFInfo
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- CN106783641B CN106783641B CN201611240422.1A CN201611240422A CN106783641B CN 106783641 B CN106783641 B CN 106783641B CN 201611240422 A CN201611240422 A CN 201611240422A CN 106783641 B CN106783641 B CN 106783641B
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Abstract
A kind of to encapsulate arrangement of semiconductors using print glue mode, which includes pushing material component, feeding assembly, lid glue component and discharge component；The pushing material component, feeding assembly, lid glue component and discharge component are sequentially connected, the pushing material component is used to for PCBA board being pushed into feeding assembly, PCBA board in feeding assembly is carried out dispensing by the lid glue component, finally PCBA board for dispensing glue is sent into discharge component, the device can impress uniform dotted insulating cement in the position of PCBA board encapsulation wafer, realize the device of quickly automation lid glue.
Description
Technical field
Arrangement of semiconductors is encapsulated using print glue mode the present invention relates to a kind of.
Background technique
Traditional D/B equipment squeezes out insulating cement and draws glue patch again on PCBA, and insulating cement thickness is uncontrollable, and insulating cement is uneven
It is even, wafer breakage when easily causing encapsulation；D/B equipment is low by needle tubing extrusion insulating cement stroke glue production efficiency on PCBA, very
It is easy to produce substandard products.
Dispenser in the prior art needs special staff that will carry out dispensing in workpiece feeding dispenser, calculates point
Glue position is simultaneously checked at any time and a little leads to inefficiency.
Traditional device has the drawback that traditional stroke glue mode by the limitation for drawing glue speed, cannot improve production
Efficiency；Traditional glue of drawing is unable to adjust a stroke glue thickness, and the wafer of different-thickness easily causes after the insulating cement patch of same thickness
Wafer breakage when bonding wire, encapsulation；Traditional stroke glue cannot coat uniform insulating cement in encapsulation wafer position, and wafer be easily caused to exist
It is damaged when encapsulation；Traditional stroke glue efficiency is slow, and insulating cement is easy to cause to fail, and wafer is easy during rear process injection molding packaging
It warps.
Summary of the invention
The invention patent be designed to provide it is a kind of using design fully-automatic equipment coat insulating cement in advance, take and impress
Mode, uniform dotted insulating cement is impressed in the position of PCBA encapsulation wafer, realizes the device of quickly automation lid glue.
The present invention adopts the following technical scheme:
A kind of to encapsulate arrangement of semiconductors using print glue mode, which includes pushing material component, feeding assembly, lid glue component
And discharge component；
The pushing material component, feeding assembly, lid glue component and discharge component are sequentially connected, which is used for PCBA
It is pushed into feeding assembly, the PCBA in feeding assembly is carried out dispensing by the lid glue component, finally send PCBA for dispensing glue to out
Expect in component.
The pushing material component includes pusher X-motor (1), scraping wings (1-1), support frame (1-2), and push rod inductor (2) pushes away
Expect bar (3), pusher belt (4), X sliding rail sensor block (5), X sliding rail (6), pusher belt pulley (7), pusher Z screw rod (8), pusher Z
Motor (9) and pusher Z inductor (10)；
One end of the scraping wings (1-1) is connected with the top of support frame (1-2), and the lower part of the other end has pusher X electricity
Machine (1), the side close to pusher X-motor (1) have push rod inductor (2), and the charging ram (3) is located on scraping wings (1-1)
One end of the side in portion, the charging ram (3) is connected with X sliding rail sensor block (5), and the two of scraping wings (1-1) the top other side
End has pusher belt pulley (7), is wrapped pusher belt (4) on the pusher belt pulley (7), the X sliding rail (6) is located at scraping wings
The top of (1-1), the rotation of pusher X-motor (1) control pusher belt pulley (7), so that pusher belt (4) drives X sliding rail
Sensor block (5) slides on the X sliding rail (6), and the side of support frame as described above (1-2) has pusher Z inductor (10), and lower part has
Pusher Z motor (9), pusher Z motor (9) connect pusher Z screw rod (8).
The feeding assembly includes charging Y screw rod (11), and feeding platform (12) is fed cartridge clip (13), cartridge clip fixator
(14), left and right adjusting motor (15) are fed, lid glue feed inlet (19), feeding-passage (12-1), lid glue platform (21), feed belt
It takes turns (22), feeding platform baffle (23), feeds X-motor (25), feed belt (26)；
One end connection of charging Y screw rod (11) feeds left and right adjusting motor (15), the other end and feeding platform (12)
Side wall be connected, the top of the feeding platform (12) has charging cartridge clip (13), the cartridge clip which passes through side
Fixator (14) is fixed on feeding platform (12), and charging cartridge clip (13) is the hollow frame that multilayer grid is equipped in one
Structure, required PCBA board for dispensing glue be placed in charging cartridge clip (13) each layer grid in, the feeding-passage (12-1) be located at into
Expect on platform (12), is lid glue feed inlet (19) close to the side of charging cartridge clip (13), there is lid in the feeding-passage (12-1)
Glue platform (21), feed belt wheel (22), feeding platform baffle (23) and feed belt (26), charging X-motor (25) position
In the side wall of feeding-passage (12-1), which connects feed belt wheel (22), feed belt (26) winding
On feed belt wheel (22), the feeding platform baffle (23) is located at the end of lid glue platform (21).
By opening left and right adjusting motor (15) rotation charging Y screw rod (11), to automatically adjust feeding platform (12)
Lateral position, so that charging cartridge clip (13) is aligned with the lid glue feed inlet (19) on feeding-passage (12-1)；It is pushed away by opening this
Z motor (9) rotation pusher Z screw rod (8) is expected, so that the lengthwise position of feeding platform (12) is automatically adjusted, so that charging cartridge clip
(13) each layer PCBA board in is successively pushed on the feed belt (26) in feeding-passage (12-1) by charging ram (3), is passed through
Charging X-motor (25) promotes the rotation of feed belt wheel (22) drive feed belt (26), so that on feed belt (26)
PCBA board reaches lid glue platform (21), and PCBA board is stopped by feeding platform baffle (23).
The lid glue component includes support frame (16-1), lid glue Y guide rail (16), lid glue Y guide rail motor (17), lid glue Y cunning
Block (18), Y inductor (20), lid lacquer disk(-sc) rotating electric machine (27), viscose glue disk (28), lid rubber head (29), lid rubber head Z motor (32), Z
Guide rail (33), Z sliding block (34)；
Support frame as described above (16-1) is located at the top of feeding platform (12), and the top of the support frame (16-1) has lid glue Y
One end of guide rail (16), the lid glue Y guide rail (16) is lid glue Y guide rail motor (17), and the lid glue Y sliding block (18) is located at lid glue Y
The top of guide rail (16) can simultaneously be slided along lid glue Y guide rail (16), and the Y guide rail (16) is close to the side of charging cartridge clip (13) tool
Have Y inductor (20), the other side is connect by lid glue Y sliding block (18) with lid rubber head Z motor (32), lid rubber head Z motor (32)
It is connect with one end of Z sliding block (34), the other end of the Z sliding block (34) is connect with lid rubber head (29), and the Z guide rail (33) is located at lid
On glue Y sliding block (18), Z sliding block (34) can be made to move up and down along Z guide rail (33) by lid rubber head Z motor (32), thus
Lid rubber head (29) are driven to move up and down；
The lower part of the lid rubber head (29) has viscose glue disk (28), viscose glue disk (28) the connection cover lacquer disk(-sc) rotating electric machine
(27), which can drive viscose glue disk (28) to rotate.
Lid glue camera (35) and lid glue workbench X inductor (24) are also equipped on support frame as described above (16-1)；The lid glue
Lid rubber head level governor (31) is installed on head (29)；The top of the viscose glue disk (28) has insulating cement caliper profiler
(30)。
The discharge component includes tapping channel (39-1), outfeed belt wheel (36), discharging machine (37), outfeed belt
(38), discharging track (39) discharge cartridge clip fixator (40), discharge cartridge clip (41), discharge Y-motor (42), outfeed platforms (43),
It discharges Y screw rod (44), discharges Z screw rod (45), discharge Z motor (46)；
The tapping channel (39-1) is corresponding with feeding-passage (12-1), and the outer wall of the tapping channel (39-1) has
Expect motor (37), inside has discharging track (39), has outfeed belt wheel (36) at internal side wall, the outfeed belt wheel (36)
It connects outfeed belt (38), the discharging track (39) faces the entrance of discharging cartridge clip (41), which passes through
Discharging cartridge clip fixator (40) is fixed on outfeed platforms (43), and the side of the outfeed platforms (43) passes through discharging Y screw rod (44)
It is connected with discharging Y-motor (42), the other side of the outfeed platforms (43) passes through discharging Z screw rod (45) and discharging Z motor (46) phase
Even.
Discharging cartridge clip (41) is the hollow frame structure that multilayer grid is equipped in one, can by PCBA board for dispensing glue
Into in each layer grid of discharging cartridge clip (41).
The utility model has the advantages that
1, fully-automatic equipment of the invention coats insulating cement in advance, take the lid glue mode impressed can realize automatically into
Expect and can be achieved after lid glue automatic loading D/B equipment cartridge clip, relieves D/B equipment and draw the slow-footed limitation of glue, make the life of D/B
It produces efficiency and improves 50% or more, defect rate is < 0.1%.
2, it by adjusting element of installation height, adjust insulating cement thickness can arbitrarily, be suitble to the wafer of different-thickness in D/B
When insulating cement thickness requirement；
3, it by way of impressing, has ensured that the thickness of wafer patch location insulating cement is uniform, has solved because of insulating cement thickness
Unevenly cause the problem of wafer ruptures when encapsulation；
4, by the control of apparatus insulated sizing material disk, insulating cement is made to complete lid glue before the deadline, solves insulating cement failure
The problem of wafer warps in injection molding packaging afterwards.
Detailed description of the invention
Fig. 1 is the stereoscopic schematic diagram of apparatus of the present invention；
Fig. 2 is pushing material component structural schematic diagram of the present invention；
Fig. 3 is feeding assembly structural schematic diagram of the present invention；
Fig. 4 is lid glue component structure diagram of the present invention；
Fig. 5 is discharge component structural schematic diagram of the present invention.
Specific embodiment
Present invention will be further explained below with reference to specific examples.
As shown in Figs. 1-5, Fig. 1 to Fig. 5 is the exploded view of Fig. 1, a kind of to encapsulate arrangement of semiconductors using print glue mode, should
Device includes pushing material component, feeding assembly, lid glue component and discharge component；
The pushing material component, feeding assembly, lid glue component and discharge component are sequentially connected, which is used for PCBA
It is pushed into feeding assembly, the PCBA in feeding assembly is carried out dispensing by the lid glue component, finally send PCBA for dispensing glue to out
Expect in component.
The pushing material component includes pusher X-motor (1), scraping wings (1-1), support frame (1-2), and push rod inductor (2) pushes away
Expect bar (3), pusher belt (4), X sliding rail sensor block (5), X sliding rail (6), pusher belt pulley (7), pusher Z screw rod (8), pusher Z
Motor (9) and pusher Z inductor (10)；
One end of the scraping wings (1-1) is connected with the top of support frame (1-2), and the lower part of the other end has pusher X electricity
Machine (1), the side close to pusher X-motor (1) have push rod inductor (2), and the charging ram (3) is located on scraping wings (1-1)
One end of the side in portion, the charging ram (3) is connected with X sliding rail sensor block (5), and the two of scraping wings (1-1) the top other side
End has pusher belt pulley (7), is wrapped pusher belt (4) on the pusher belt pulley (7), the X sliding rail (6) is located at scraping wings
The top of (1-1), the rotation of pusher X-motor (1) control pusher belt pulley (7), so that pusher belt (4) drives X sliding rail
Sensor block (5) slides on the X sliding rail (6), and the side of support frame as described above (1-2) has pusher Z inductor (10), and lower part has
Pusher Z motor (9), pusher Z motor (9) connect pusher Z screw rod (8).
The feeding assembly includes charging Y screw rod (11), and feeding platform (12) is fed cartridge clip (13), cartridge clip fixator
(14), left and right adjusting motor (15) are fed, lid glue feed inlet (19), feeding-passage (12-1), lid glue platform (21), feed belt
It takes turns (22), feeding platform baffle (23), feeds X-motor (25), feed belt (26)；
One end connection of charging Y screw rod (11) feeds left and right adjusting motor (15), the other end and feeding platform (12)
Side wall be connected, the top of the feeding platform (12) has charging cartridge clip (13), the cartridge clip which passes through side
Fixator (14) is fixed on feeding platform (12), and charging cartridge clip (13) is the hollow frame that multilayer grid is equipped in one
Structure, required PCBA board for dispensing glue be placed in charging cartridge clip (13) each layer grid in, the feeding-passage (12-1) be located at into
Expect on platform (12), is lid glue feed inlet (19) close to the side of charging cartridge clip (13), there is lid in the feeding-passage (12-1)
Glue platform (21), feed belt wheel (22), feeding platform baffle (23) and feed belt (26), charging X-motor (25) position
In the side wall of feeding-passage (12-1), which connects feed belt wheel (22), feed belt (26) winding
On feed belt wheel (22), the feeding platform baffle (23) is located at the end of lid glue platform (21).
By opening left and right adjusting motor (15) rotation charging Y screw rod (11), to automatically adjust feeding platform (12)
Lateral position, so that charging cartridge clip (13) is aligned with the lid glue feed inlet (19) on feeding-passage (12-1)；It is pushed away by opening this
Z motor (9) rotation pusher Z screw rod (8) is expected, so that the lengthwise position of feeding platform (12) is automatically adjusted, so that charging cartridge clip
(13) each layer PCBA board in is successively pushed on the feed belt (26) in feeding-passage (12-1) by charging ram (3), is passed through
Charging X-motor (25) promotes the rotation of feed belt wheel (22) drive feed belt (26), so that on feed belt (26)
PCBA board reaches lid glue platform (21), and PCBA board is stopped by feeding platform baffle (23).
The lid glue component includes support frame (16-1), lid glue Y guide rail (16), lid glue Y guide rail motor (17), lid glue Y cunning
Block (18), Y inductor (20), lid lacquer disk(-sc) rotating electric machine (27), viscose glue disk (28), lid rubber head (29), lid rubber head Z motor (32), Z
Guide rail (33), Z sliding block (34)；
Support frame as described above (16-1) is located at the top of feeding platform (12), and the top of the support frame (16-1) has lid glue Y
One end of guide rail (16), the lid glue Y guide rail (16) is lid glue Y guide rail motor (17), and the lid glue Y sliding block (18) is located at lid glue Y
The top of guide rail (16) can simultaneously be slided along lid glue Y guide rail (16), and the Y guide rail (16) is close to the side of charging cartridge clip (13) tool
Have Y inductor (20), the other side is connect by lid glue Y sliding block (18) with lid rubber head Z motor (32), lid rubber head Z motor (32)
It is connect with one end of Z sliding block (34), the other end of the Z sliding block (34) is connect with lid rubber head (29), and the Z guide rail (33) is located at lid
On glue Y sliding block (18), Z sliding block (34) can be made to move up and down along Z guide rail (33) by lid rubber head Z motor (32), thus
Lid rubber head (29) are driven to move up and down；
The lower part of the lid rubber head (29) has viscose glue disk (28), viscose glue disk (28) the connection cover lacquer disk(-sc) rotating electric machine
(27), which can drive viscose glue disk (28) to rotate.
Lid glue camera (35) and lid glue workbench X inductor (24) are also equipped on support frame as described above (16-1)；The lid glue
Lid rubber head level governor (31) is installed on head (29)；The top of the viscose glue disk (28) has insulating cement caliper profiler
(30)。
The discharge component includes tapping channel (39-1), outfeed belt wheel (36), discharging machine (37), outfeed belt
(38), discharging track (39) discharge cartridge clip fixator (40), discharge cartridge clip (41), discharge Y-motor (42), outfeed platforms (43),
It discharges Y screw rod (44), discharges Z screw rod (45), discharge Z motor (46)；
The tapping channel (39-1) is corresponding with feeding-passage (12-1), and the outer wall of the tapping channel (39-1) has
Expect motor (37), inside has discharging track (39), has outfeed belt wheel (36) at internal side wall, the outfeed belt wheel (36)
It connects outfeed belt (38), the discharging track (39) faces the entrance of discharging cartridge clip (41), which passes through
Discharging cartridge clip fixator (40) is fixed on outfeed platforms (43), and the side of the outfeed platforms (43) passes through discharging Y screw rod (44)
It is connected with discharging Y-motor (42), the other side of the outfeed platforms (43) passes through discharging Z screw rod (45) and discharging Z motor (46) phase
Even.
Discharging cartridge clip (41) is the hollow frame structure that multilayer grid is equipped in one, can by PCBA board for dispensing glue
Into in each layer grid of discharging cartridge clip (41).
The use process of the device the following steps are included:
Step 1: charging, PCBA board is put into each layer grid of charging cartridge clip (13), later by the charging cartridge clip (13)
It is placed on feeding platform (12), it is fixed using cartridge clip fixator (14)；
Step 2: charging, clicks the charging button of the completely automatic operating system on the device, left and right adjusting motor is fed
(15) rotation charging Y screw rod (11) automatically adjusts the lateral position of feeding platform (12), makes to feed cartridge clip (13) and feeding-passage
Lid glue feed inlet (19) alignment on (12-1)；
Step 3: the identification by pusher Z inductor (10) for the PCBA board of charging cartridge clip (13) each layer grid, will believe
Pusher Z motor (9) number is passed to, pusher Z motor (9) rotates pusher Z screw rod (8), the lengthwise position of feeding platform (12) is adjusted,
PCBA board and charging ram (3) in the charging cartridge clip (13) on feeding platform (12) is promoted to be maintained at a horizontal position, so that
Each layer PCBA board in charging cartridge clip (13) is successively pushed to the feed belt (26) in feeding-passage (12-1) by charging ram (3)
On；The first layer and charging ram (3) for feeding cartridge clip (13) keep the same horizontal position, every to complete a pusher movement feeding platform
(12) just decline a lattice, carry out pusher next time and act；
Step 4: pusher inductor (2) confirmation X sliding rail sensor block (5) is being felt when lid glue platform (21) does not have PCBA board
Position is answered, is started pusher X-motor (1), drives X sliding rail sensor block (5) to slide on X sliding rail (6) by pusher belt (4), band
The PCBA board fed in cartridge clip (13) is pushed in lid glue feed inlet (19) by dynamic charging ram (3)；
Step 5: PCBA board enters lid glue feed inlet (19), charging X-motor (25) starts so that belt pulley (22) rotates,
So that PCBA board is sent to lid glue platform (21) by feed belt (26), PCBA board is stopped by feeding platform baffle (23), into
Expect that X-motor (25) are out of service, feed belt (26) stops transmission therewith, and lid glue camera (35) detects the image position of PCBA board
It sets, and is moved by the X-axis of lid glue platform (21) and Y-axis, adjust the horizontal position of PCBA, start automatic cover glue；
Step 6: automatic cover glue, lid glue Y guide rail motor (17) rotation, by lid glue Y sliding block (18) along lid glue Y guide rail
(17) it is moved to above viscose glue disk (28), then is controlled by lid rubber head Z motor (32), lid rubber head (29) is dropped into viscose glue disk
(28) in, original height is risen back after being stained with glue, then rotate by lid glue Y guide rail motor (17), by lid glue Y sliding block (18) along lid
Glue Y guide rail (17) moves on to above lid glue platform (21), then makes lid rubber head (29) drop to fixation by lid rubber head Z motor (32)
Highly, the viscous insulating cement of lid rubber head (29) institute is impressed onto PCBA board, then lid rubber head (29) is risen into back original height and horizontal position
It sets, completes primary lid glue movement；
Step 7: after the completion of every piece of PCBA board lid glue, feeding platform baffle (23) decline, while feed belt wheel (22) and
Discharging machine (37) starts simultaneously, and the PCBA board after lid glue is sent into the discharging track (39) in tapping channel (39-1), is led to
It crosses outfeed belt (38) and the PCBA board after lid glue is sent into discharging cartridge clip (41), discharge Y-motor (42) and discharging Z motor (46) exists
Each time discharge after the completion of, by discharging Y screw rod (44) and discharge Z screw rod (45) adjust automatically discharging cartridge clip (41) level with
Height and position make discharge cartridge clip (41) every layer of grid position and the identical height of discharging track (39) holding and horizontal position；
Step 8: opening discharging cartridge clip fixator (44) after the cartridge clip that discharges (41) is filled by operator, lid will be filled with
The cartridge clip of glue PCBA board is removed, and empty folder is changed.
It can control the lid in viscose glue disk (28) by lid rubber head level governor (31) and insulating cement caliper profiler (30)
Glue thickness and flatness；It is different according to the size of wafer in PCBA board, pass through the corresponding different specification of replacement lid rubber head (29)；It is logical
Cross viscose glue spiral rotating motor (27) drive viscose glue disk (28) do not stop to rotate, pass through the common work of insulating cement caliper profiler (30)
With making insulating cement to be glued in viscose glue disk (28) keep smooth and smooth.Glue in the viscose glue disk (28) can be according to being covered
The needs of the PCBA board of glue are replaced.
It should be understood that these examples are only for illustrating the present invention and are not intended to limit the scope of the present invention.In addition, it should also be understood that,
After reading the content taught by the present invention, those skilled in the art can make various modifications or changes to the present invention, these
Equivalent form is also fallen within the scope of the appended claims of the present application.
Claims (7)
1. a kind of encapsulate arrangement of semiconductors using print glue mode, which includes pushing material component, feeding assembly, lid glue component and
Discharge component；
The pushing material component, feeding assembly, lid glue component and discharge component are sequentially connected, and the pushing material component is for pushing away PCBA board
Enter in feeding assembly, the PCBA in feeding assembly is carried out dispensing by the lid glue component, finally send PCBA for dispensing glue to discharging
In component；
The lid glue component includes support frame (16-1), lid glue Y guide rail (16), lid glue Y guide rail motor (17), lid glue Y sliding block
(18), Y inductor (20), lid lacquer disk(-sc) rotating electric machine (27), viscose glue disk (28), lid rubber head (29), lid rubber head Z motor (32), Z is led
Rail (33), Z sliding block (34)；
Support frame as described above (16-1) is located at the top of feeding platform (12), and the top of the support frame (16-1) has lid glue Y guide rail
(16), one end of the lid glue Y guide rail (16) is lid glue Y guide rail motor (17), and the lid glue Y sliding block (18) is located at lid glue Y guide rail
(16) top can simultaneously be slided along lid glue Y guide rail (16), which has Y close to the side of charging cartridge clip (13)
Inductor (20), the other side are connect by lid glue Y sliding block (18) with lid rubber head Z motor (32), lid rubber head Z motor (32) and Z
One end of sliding block (34) connects, and the other end of the Z sliding block (34) is connect with lid rubber head (29), and the Z guide rail (33) is located at lid glue Y
On sliding block (18), Z sliding block (34) can be made to move up and down along Z guide rail (33) by lid rubber head Z motor (32), to drive
Lid rubber head (29) moves up and down；
The lower part of the lid rubber head (29) has viscose glue disk (28), viscose glue disk (28) the connection cover lacquer disk(-sc) rotating electric machine (27), should
Lid lacquer disk(-sc) rotating electric machine (27) can drive viscose glue disk (28) to rotate.
2. a kind of use print glue mode as described in claim 1 encapsulates arrangement of semiconductors, it is characterised in that the pusher group
Part includes pusher X-motor (1), scraping wings (1-1), support frame (1-2), push rod inductor (2), charging ram (3), pusher belt
(4), X sliding rail sensor block (5), X sliding rail (6), pusher belt pulley (7), pusher Z screw rod (8), pusher Z motor (9) and pusher Z sense
Answer device (10)；
One end of the scraping wings (1-1) is connected with the top of support frame (1-2), and the lower part of the other end has pusher X-motor
(1), the side close to pusher X-motor (1) has push rod inductor (2), and the charging ram (3) is located at the top scraping wings (1-1)
Side, one end of the charging ram (3) is connected with X sliding rail sensor block (5), the both ends of scraping wings (1-1) the top other side
With pusher belt pulley (7), it is wrapped pusher belt (4) on the pusher belt pulley (7), the X sliding rail (6) is located at scraping wings
The top of (1-1), the rotation of pusher X-motor (1) control pusher belt pulley (7), so that pusher belt (4) drives X sliding rail
Sensor block (5) slides on the X sliding rail (6), and the side of support frame as described above (1-2) has pusher Z inductor (10), and lower part has
Pusher Z motor (9), pusher Z motor (9) connect pusher Z screw rod (8).
3. a kind of use print glue mode as described in claim 1 encapsulates arrangement of semiconductors, it is characterised in that the charging group
Part includes charging Y screw rod (11), and feeding platform (12) is fed cartridge clip (13), cartridge clip fixator (14), feeds left and right adjusting motor
(15), lid glue feed inlet (19), feeding-passage (12-1), lid glue platform (21), feed belt wheel (22), feeding platform baffle
(23), X-motor (25) are fed, feed belt (26)；
One end connection charging left and right adjusting motor (15) of charging Y screw rod (11), the side of the other end and feeding platform (12)
Wall is connected, and the top of the feeding platform (12) has charging cartridge clip (13), which is fixed by the cartridge clip of side
Device (14) is fixed on feeding platform (12), and charging cartridge clip (13) is the hollow frame knot that multilayer grid is equipped in one
Structure, required PCBA board for dispensing glue are placed in each layer grid of charging cartridge clip (13), and the feeding-passage (12-1) is located at charging
On platform (12), it is lid glue feed inlet (19) close to the side of charging cartridge clip (13), there is lid glue in the feeding-passage (12-1)
Platform (21), feed belt wheel (22), feeding platform baffle (23) and feed belt (26), the charging X-motor (25) are located at
The side wall of feeding-passage (12-1), the charging X-motor (25) connect feed belt wheel (22), and the feed belt (26) is wrapped in
On feed belt wheel (22), the feeding platform baffle (23) is located at the end of lid glue platform (21).
4. a kind of use print glue mode as described in claim 2 or 3 encapsulates arrangement of semiconductors, it is characterised in that by opening
Left and right adjusting motor (15) rotation charging Y screw rod (11) is opened, so that the lateral position of feeding platform (12) is automatically adjusted, so that into
Material cartridge clip (13) is aligned with the lid glue feed inlet (19) on feeding-passage (12-1)；Pusher is rotated by opening pusher Z motor (9)
Z screw rod (8), to automatically adjust the lengthwise position of feeding platform (12) so that each layer PCBA board in charging cartridge clip (13) by
Charging ram (3) is successively pushed on the feed belt (26) in feeding-passage (12-1), promotes to feed by feeding X-motor (25)
Belt pulley (22) drives the rotation of feed belt (26), so that the PCBA board on feed belt (26) reaches lid glue platform (21),
And PCBA board is stopped by feeding platform baffle (23).
5. a kind of use print glue mode as described in claim 1 encapsulates arrangement of semiconductors, it is characterised in that support frame as described above
Lid glue camera (35) and lid glue workbench X inductor (24) are also equipped on (16-1)；Lid glue is installed on the lid rubber head (29)
Head level governor (31)；The top of the viscose glue disk (28) has insulating cement caliper profiler (30).
6. a kind of use print glue mode as described in claim 1 encapsulates arrangement of semiconductors, which is characterized in that the discharging group
Part includes tapping channel (39-1), outfeed belt wheel (36), discharging machine (37), outfeed belt (38), discharging track (39), out
Expect cartridge clip fixator (40), discharge cartridge clip (41), discharge Y-motor (42), outfeed platforms (43) discharge Y screw rod (44), and discharge Z
Screw rod (45) discharges Z motor (46)；
The tapping channel (39-1) is corresponding with feeding-passage (12-1), and the outer wall of the tapping channel (39-1) has discharging electricity
Machine (37), inside have discharging track (39), have outfeed belt wheel (36) at internal side wall, the outfeed belt wheel (36) connection
Outfeed belt (38), the discharging track (39) face the entrance of discharging cartridge clip (41), which passes through discharging
Cartridge clip fixator (40) is fixed on outfeed platforms (43), and the side of the outfeed platforms (43) by discharging Y screw rod (44) and goes out
Expect that Y-motor (42) are connected, the other side of the outfeed platforms (43) is connected by discharging Z screw rod (45) with discharging Z motor (46).
7. a kind of use print glue mode as described in claim 6 encapsulates arrangement of semiconductors, which is characterized in that the discharging bullet
Pressing from both sides (41) is the hollow frame structure that multilayer grid is equipped in one, can enter discharging cartridge clip (41) by PCBA board for dispensing glue
In each layer grid.
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| CN201611240422.1A CN106783641B (en) | 2016-12-28 | 2016-12-28 | It is a kind of that arrangement of semiconductors is encapsulated using print glue mode |
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| CN201611240422.1A CN106783641B (en) | 2016-12-28 | 2016-12-28 | It is a kind of that arrangement of semiconductors is encapsulated using print glue mode |
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| CN106783641B true CN106783641B (en) | 2019-04-05 |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109390264B (en) * | 2018-10-18 | 2020-10-16 | 东莞胜镁特工业科技有限公司 | Semiconductor packaging feeding and discharging machine |
| CN110924655B (en) * | 2019-12-16 | 2021-04-02 | 广东博智林机器人有限公司 | Auxiliary tiling equipment and tiling method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201791636U (en) * | 2010-03-10 | 2011-04-13 | 深圳市东晟和科技有限公司 | LED glue dispenser |
| CN203140245U (en) * | 2013-03-26 | 2013-08-21 | 张勇 | Crystal gluing device |
| CN103662709A (en) * | 2013-12-04 | 2014-03-26 | 楚天科技股份有限公司 | Feeding platform and freeze-drying-line mobile feeding and discharging system |
-
2016
- 2016-12-28 CN CN201611240422.1A patent/CN106783641B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201791636U (en) * | 2010-03-10 | 2011-04-13 | 深圳市东晟和科技有限公司 | LED glue dispenser |
| CN203140245U (en) * | 2013-03-26 | 2013-08-21 | 张勇 | Crystal gluing device |
| CN103662709A (en) * | 2013-12-04 | 2014-03-26 | 楚天科技股份有限公司 | Feeding platform and freeze-drying-line mobile feeding and discharging system |
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| CN106783641A (en) | 2017-05-31 |
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