CN106783391B - High voltage planar construction of switch and preparation method thereof based on flexible manufacturing technique - Google Patents
High voltage planar construction of switch and preparation method thereof based on flexible manufacturing technique Download PDFInfo
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- CN106783391B CN106783391B CN201611219449.2A CN201611219449A CN106783391B CN 106783391 B CN106783391 B CN 106783391B CN 201611219449 A CN201611219449 A CN 201611219449A CN 106783391 B CN106783391 B CN 106783391B
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- negative electrode
- positive electrode
- exploding foil
- electrode plate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H39/00—Switching devices actuated by an explosion produced within the device and initiated by an electric current
- H01H39/004—Closing switches
Abstract
The invention discloses a kind of high voltage planar construction of switch and preparation method thereof based on flexible manufacturing technique, pole plate is inputted including positive electrode plate, negative electrode plate and signal, positive electrode plate includes positive plate insulating substrate and positive electrode, negative electrode plate includes negative plate insulating substrate and negative electrode, it includes Exploding Foil insulating substrate, Exploding Foil positive electrode, Exploding Foil negative electrode that signal, which inputs pole plate, and Exploding Foil positive electrode, Exploding Foil negative electrode are correspondingly arranged；Negative electrode plate, signal input pole plate, positive electrode plate are laminated constitute high voltage planar construction of switch up and down, there are cross sections on spatial position for positive electrode and negative electrode, and it is separated between positive electrode plate and negative electrode plate by insulating substrate, the line between Exploding Foil positive electrode and Exploding Foil negative electrode passes through the cross section.The present invention prepares high voltage planar switch using flexible circuit board technique, reduces the volume of high voltage planar construction of switch, integrated convenient for realizing between other devices；Due to generating plasma breakdown dielectric breakdown using discharge-induced explosion, the switch response time is faster.
Description
Technical field
The present invention relates to priming system technology and technical field of pulse power more particularly to a kind of based on flexible manufacturing technique
High voltage planar construction of switch and preparation method thereof.
Background technique
In priming system technology and technical field of pulse power, XY switch is different from traditional three-dimensional gas spark gap and opens
Close and vacuum switch, have the characteristics that minimize and be miniaturized, system bulk can be reduced, convenient for switch and other devices integrate.
2006, Wang Guiji etc. delivered the paper of entitled " the three electrode switch development of plane gap and performance test ", proposed in poly- first
Positive and negative electrode and electric heater are processed on base methyl acrylate substrate, wherein positive and negative electrode material is stainless steel and two kinds of brass,
Electric heater is copper-tungsten, but this volume of switch is larger, is not easy to integrate use with other devices, and access circuit
It is larger to generate inductance, biggish weakening effect can be generated to the peak value of discharge current.Generally for guarantee switch current-carrying capability,
Designed switch works in the case where needing certain atmosphere, and operating voltage range limitation is more obvious, and is easy by strong
Vibration and strong electromagnetic radiation environment influence, and actual use occasion is restricted.
Summary of the invention
Place in view of the shortcomings of the prior art, the purpose of the present invention is to provide a kind of based on flexible manufacturing technique
High voltage planar construction of switch and preparation method thereof passes through positive electrode plate, negative electrode plate and letter using flexible circuit board technique
Number input pole plate three-decker press, more minimize and be miniaturized, reduce the volume of high voltage planar construction of switch, more
Easy realize between other devices is added to integrate.
The purpose of the invention is achieved by the following technical solution:
A kind of high voltage planar construction of switch based on flexible manufacturing technique, including positive electrode plate, negative electrode plate and signal are defeated
Enter pole plate, the positive electrode plate includes positive plate insulating substrate and the positive electrode that is set in positive plate insulating substrate, described negative
Electrode plate includes negative plate insulating substrate and the negative electrode that is set in negative plate insulating substrate, and the signal input pole plate includes
Exploding Foil insulating substrate and the Exploding Foil positive electrode being set in Exploding Foil insulating substrate, Exploding Foil negative electrode, the Exploding Foil
Positive electrode, Exploding Foil negative electrode are correspondingly arranged；The negative electrode plate, signal input pole plate, the corresponding lamination structure up and down of positive electrode plate
At high voltage planar construction of switch, the positive electrode of the positive electrode plate and the negative electrode of negative electrode plate exist on spatial position to intersect
Part, and separated between positive electrode plate and negative electrode plate by insulating substrate, the Exploding Foil positive electrode and Exploding Foil negative electricity
Line between pole passes through the cross section.
In order to which the present invention is better achieved, the Exploding Foil positive electrode is electrically connected with Exploding Foil negative electrode by conductive material
It connects, which passes through the cross section on spatial position.
Further technical solution is: the negative electrode plate corresponds to Exploding Foil positive electrode and is provided with notch, the negative electrode plate
Corresponding Exploding Foil negative electrode is provided with notch.
Currently preferred technical solution is: the positive electrode is integrally rectangle；The negative electrode plate is and positive electrode
The corresponding oblong-shaped of plate, the negative electrode are integrally rectangle；The signal input pole plate is corresponding with positive electrode plate
Oblong-shaped；Successively pressing is constituted up and down using lamination bonding pattern for the negative electrode plate, signal input pole plate, positive electrode plate
The cross section of high voltage planar construction of switch, high voltage planar construction of switch is rectangle or square.
Preferably, the positive plate insulating substrate, negative plate insulating substrate, Exploding Foil insulating substrate are by polyimides
Material is fabricated, and the positive electrode, negative electrode, Exploding Foil positive electrode, Exploding Foil negative electrode are what copper foil material produced
Copper membrane.
A kind of preparation method of high voltage planar construction of switch, preparation method are as follows:
A, it prepares positive electrode plate: positive plate insulating substrate being produced using polyimide material, and insulate and serves as a contrast in positive plate
Bottom upper surface covers one layer of copper foil and forms copper membrane, is then exposed, develops to the copper membrane, etch process handles to obtain just
Electrode；Positive electrode can be fabricated on positive plate insulating substrate upper surface at this time and finally obtain positive electrode plate.
B, it prepares negative electrode plate: negative plate insulating substrate being produced using polyimide material, and insulate and serves as a contrast in negative plate
Bottom upper surface covers one layer of copper foil and forms copper membrane, is then exposed, develops to the copper membrane, etch process is handled and born
Electrode；Negative electrode can be fabricated on negative plate insulating substrate upper surface at this time and finally obtain negative electrode plate.
C, it prepares signal input pole plate: Exploding Foil insulating substrate being produced using polyimide material, and exhausted in Exploding Foil
Copper foil forms copper membrane at two at edge upper surface of substrate covering two, is then exposed, develops, etches respectively to copper membrane at two
Process obtains Exploding Foil positive electrode and Exploding Foil negative electrode；It at this time can be by Exploding Foil positive electrode and Exploding Foil negative electrode
It is fabricated on Exploding Foil insulating substrate upper surface and finally obtains signal input pole plate.
D, negative electrode plate, signal input pole plate, positive electrode plate are successively pressed together up and down using lamination bonding technology,
And finally obtain high voltage planar construction of switch；At this point, the positive electrode of positive electrode plate and the negative electrode of negative electrode plate are in spatial position
On there are cross sections, and separated between positive electrode plate and negative electrode plate by insulating substrate, the Exploding Foil positive electrode with
Line between Exploding Foil negative electrode passes through the cross section.
The present invention compared with the prior art, have the following advantages that and the utility model has the advantages that
(1) present invention is convenient under the premise of guaranteeing product quality consistency using general flexible print manufacturing process
High-volume manufactures and reduces cost；During manufacture, positive electrode plate, negative electrode plate and signal input pole plate can be made respectively
It makes, is then closely linked by being laminated bonding pattern, forms closed environment, the electrode of switch is in one always
The stable state of kind, it is not easy to be influenced by environment such as humidities.Moreover, positive electrode plate, negative electrode plate and signal input pole plate
Thickness can be controlled for different applications, keep its application range wider.Importantly, the present invention is using electricity
The mode that explosion generates plasma punctures the dielectric between positive and negative electrode, and discharge-induced explosion generates plasma and receives 100
It can be completed in time second, therefore its response time is considerably more rapid.
(2) present invention inputs pole plate three-decker by positive electrode plate, negative electrode plate and signal and presses, more small-sized
Change and be miniaturized, reduce the volume of high voltage planar construction of switch, is more easier integrated with realization between other devices；Due to adopting
The dielectric between positive and negative electrode is punctured with the mode that discharge-induced explosion generates plasma, the switch response time is faster.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of positive electrode plate of the present invention；
Fig. 2 is the structural schematic diagram of negative electrode plate of the present invention；
Fig. 3 is the structural schematic diagram that signal of the present invention inputs pole plate；
Fig. 4 is the assembling schematic diagram of high voltage planar construction of switch.
Wherein, title corresponding to the appended drawing reference in attached drawing are as follows:
1- positive electrode plate, 11- positive plate insulating substrate, 12- positive electrode, 2- negative electrode plate, the insulation of 21- negative plate
Substrate, 22- negative electrode, 23- notch, 3- signal input pole plate, 31- Exploding Foil insulating substrate, 32- Exploding Foil positive electrode,
33- Exploding Foil negative electrode.
Specific embodiment
The present invention is described in further detail below with reference to embodiment:
Embodiment
As shown in Figure 1 to 4, a kind of high voltage planar construction of switch based on flexible manufacturing technique, including positive electrode plate 1,
Negative electrode plate 2 and signal input pole plate 3, and positive electrode plate 1 includes positive plate insulating substrate 11 and is set to positive plate insulating substrate
Positive electrode 12 on 11, positive electrode 12 is with a thickness of several microns；Positive electrode plate 1 is whole to be rectangle, and positive electrode 12 is whole in length
It is rectangular.Negative electrode plate 2 includes negative plate insulating substrate 21 and the negative electrode 22 being set in negative plate insulating substrate 21, negative electrode
22 with a thickness of several microns；Negative electrode plate 2 is oblong-shaped corresponding with positive electrode plate 1, and negative electrode 22 is whole to be rectangle.
Signal input pole plate 3 include Exploding Foil insulating substrate 31 and be set in Exploding Foil insulating substrate 31 Exploding Foil positive electrode 32,
Exploding Foil negative electrode 33, Exploding Foil positive electrode 32, Exploding Foil negative electrode 33 are correspondingly arranged；Exploding Foil positive electrode 32, Exploding Foil are negative
Electrode 33 is with a thickness of several microns.Negative electrode plate 2, signal input pole plate 3, the corresponding lamination up and down of positive electrode plate 1 constitute high-voltage flat
Face construction of switch, the positive electrode 12 of positive electrode plate 1 and the negative electrode 22 of negative electrode plate 2 on spatial position there are cross section 4,
As shown in figure 4, the positive electrode 12 of the negative electrode 22 of the negative electrode plate 2 of top layer and undermost positive electrode plate 1 is in upright projection
Cross section present on direction is cross section 4.And it is separated between positive electrode plate 1 and negative electrode plate 2 by insulating substrate,
As shown in figure 4, after negative electrode plate 2, signal input pole plate 3, positive electrode plate 1 successively presss, the negative electrode 22 of negative electrode plate 2 and just
It is just separated by the insulating substrate of negative plate insulating substrate 21, Exploding Foil insulating substrate 31 between the positive electrode 12 of electrode plate 1；When quick-fried
Fried foil positive electrode 32, Exploding Foil negative electrode 33 are powered after moment generates high temperature and pressure plasma, and plasma is by insulating materials
(negative plate insulating substrate 21, Exploding Foil insulating substrate 31) is destroyed, and plasma electric conductivity itself is good, can make
Positive electrode 12 and negative electrode 22 are connected, and play the role of switch.Company between Exploding Foil positive electrode 32 and Exploding Foil negative electrode 33
Line passes through the cross section 4.It is oblong-shaped corresponding with positive electrode plate 1 that signal, which inputs pole plate 3, and negative electrode plate 2, signal are defeated
Entering pole plate 3, positive electrode plate 1, successively pressing constitutes high voltage planar construction of switch up and down using lamination bonding pattern, and high voltage planar is opened
The cross section 4 for closing structure is rectangle or square.
Negative electrode plate 2, the signal of high voltage planar construction of switch of the present invention input the three-layer lamination knot of pole plate 3, positive electrode plate 1
Structure is also an option that such as laminated overlapping sequence:
The first, it is followed successively by positive electrode plate 1, signal input pole plate 3, negative electrode plate 2 from top to bottom；
The second, it is followed successively by negative electrode plate 2, positive electrode plate 1, signal input pole plate 3 from top to bottom；
Third is followed successively by positive electrode plate 1, negative electrode plate 2, signal input pole plate 3 from top to bottom；
4th, it is followed successively by signal input pole plate 3, positive electrode plate 1, negative electrode plate 2 from top to bottom；
5th, it is followed successively by signal input pole plate 3, negative electrode plate 2, positive electrode plate 1 from top to bottom.
Above-mentioned five kinds of laminations overlapping sequence implements the working principle phase of selected lamination overlapping sequence when in use with this
Together.
As shown in figure 4, it can be seen from the figure that after positive electrode plate 1 and negative electrode plate 2 mutually stack pressing, positive electrode 12
There are cross sections 4 on spatial position with negative electrode 22, but positive electrode 12 is separated among negative electrode 22 by insulating materials, because
This positive electrode 12 and negative electrode 22 are in off state, when the Exploding Foil positive electrode 32 and Exploding Foil negative electricity of signal input pole plate 3
Pole 33 is powered after moment generation high temperature and pressure plasma, and plasma destroys insulating materials, and plasma itself is led
Electrical property is good, and positive electrode 12 and negative electrode 22 can be made to be connected, play the role of switch.
As shown in figure 3, Exploding Foil positive electrode 32 is electrically connected with Exploding Foil negative electrode 33 by conductive material, the conductive material
Pass through the cross section 4 on spatial position.
As shown in Fig. 2, the corresponding Exploding Foil positive electrode 32 of negative electrode plate 2 is provided with notch 23, the corresponding Exploding Foil of negative electrode plate 2 is negative
Electrode 33 is provided with notch 23.When negative electrode plate 2 and signal input pole plate 3 are superimposed together, can expose just at notch 23
Exploding Foil positive electrode 32 and Exploding Foil negative electrode 33, convenient for being connect with external circuit.
Positive plate insulating substrate 11, negative plate insulating substrate 21, Exploding Foil insulating substrate 31 are by polyimide material system
It makes, positive electrode 12, negative electrode 22, Exploding Foil positive electrode 32, Exploding Foil negative electrode 33 are covering of producing of copper foil material
Copper film.
A kind of preparation method of high voltage planar construction of switch, preparation method are as follows:
A, it prepares positive electrode plate: positive plate insulating substrate 11 being produced using polyimide material, and is insulated in positive plate
11 upper surface of substrate covers one layer of copper foil and forms copper membrane, the process such as is then exposed, develops, etching to the copper membrane
Obtain positive electrode 12；Positive electrode 12 can be fabricated on 11 upper surface of positive plate insulating substrate at this time and finally obtain positive electricity
Pole plate 1.
B, it prepares negative electrode plate: negative plate insulating substrate 21 being produced using polyimide material, and is insulated in negative plate
21 upper surface of substrate covers one layer of copper foil and forms copper membrane, the process such as is then exposed, develops, etching to the copper membrane
Obtain negative electrode 22；Exploding Foil positive electrode 32 is respectively corresponded in negative plate insulating substrate 21, Exploding Foil negative electrode 33 is provided with two
A notch 23；Negative electrode 22 can be fabricated on 21 upper surface of negative plate insulating substrate at this time and finally obtain negative electrode plate
2。
C, it prepares signal input pole plate: Exploding Foil insulating substrate 31 being produced using polyimide material, and in Exploding Foil
Copper foil forms copper membrane at two at 31 upper surface of insulating substrate covering two, copper membrane at two is exposed respectively then, is developed,
The process such as etching obtain Exploding Foil positive electrode 32 and Exploding Foil negative electrode 33；It at this time can be by 32 He of Exploding Foil positive electrode
Exploding Foil negative electrode 33 is fabricated on 31 upper surface of Exploding Foil insulating substrate and finally obtains signal input pole plate 3.
D, negative electrode plate 2, signal input pole plate 3, positive electrode plate 1 are successively pressed together on one up and down using lamination bonding technology
It rises, and finally obtains high voltage planar construction of switch；At this point, the negative electrode 22 of the positive electrode 12 of positive electrode plate 1 and negative electrode plate 2 exists
There are cross sections 4 on spatial position, and are separated between positive electrode plate 1 and negative electrode plate 2 by insulating substrate, and Exploding Foil is just
Line between electrode 32 and Exploding Foil negative electrode 33 passes through the cross section 4.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (1)
1. the preparation method of high voltage planar construction of switch, it is characterised in that: preparation method is as follows:
A, it prepares positive electrode plate: being produced positive plate insulating substrate (11) using polyimide material, and insulate and serve as a contrast in positive plate
Bottom (11) upper surface covers one layer of copper foil and forms copper membrane, is then exposed, develops to the copper membrane, etch process is handled
To positive electrode (12)；
B, it prepares negative electrode plate: being produced negative plate insulating substrate (21) using polyimide material, and insulate and serve as a contrast in negative plate
Bottom (21) upper surface covers one layer of copper foil and forms copper membrane, is then exposed, develops to the copper membrane, etch process is handled
To negative electrode (22)；
C, it prepares signal input pole plate: Exploding Foil insulating substrate (31) being produced using polyimide material, and exhausted in Exploding Foil
Copper foil forms copper membrane at two at edge substrate (31) upper surface covering two, copper membrane at two is exposed respectively then, is developed,
Etch process handles to obtain Exploding Foil positive electrode (32) and Exploding Foil negative electrode (33)；
D, negative electrode plate (2), signal input pole plate (3), positive electrode plate (1) are successively pressed together on up and down using lamination bonding technology
Together, and high voltage planar construction of switch is finally obtained；At this point, the positive electrode (12) of positive electrode plate (1) and negative electrode plate (2) is negative
There are cross section (4) on spatial position for electrode (22), and pass through insulation between positive electrode plate (1) and negative electrode plate (2)
Substrate separates, and the line between the Exploding Foil positive electrode (32) and Exploding Foil negative electrode (33) passes through the cross section (4)；
The high voltage planar construction of switch, including positive electrode plate (1), negative electrode plate (2) and signal input pole plate (3), it is described just
Electrode plate (1) includes positive plate insulating substrate (11) and the positive electrode (12) being set on positive plate insulating substrate (11), described
Negative electrode plate (2) includes negative plate insulating substrate (21) and the negative electrode (22) being set on negative plate insulating substrate (21), institute
State signal input pole plate (3) include Exploding Foil insulating substrate (31) and the Exploding Foil being set on Exploding Foil insulating substrate (31) just
Electrode (32), Exploding Foil negative electrode (33), the Exploding Foil positive electrode (32), Exploding Foil negative electrode (33) are correspondingly arranged；It is described
Negative electrode plate (2), signal input pole plate (3), the corresponding lamination up and down of positive electrode plate (1) constitute high voltage planar construction of switch, described
The positive electrode (12) of positive electrode plate (1) and the negative electrode (22) of negative electrode plate (2) on spatial position there are cross section (4),
And it is separated between positive electrode plate (1) and negative electrode plate (2) by insulating substrate, the Exploding Foil positive electrode (32) and Exploding Foil
Line between negative electrode (33) passes through the cross section (4)；The positive plate insulating substrate (11), negative plate insulating substrate
(21), Exploding Foil insulating substrate (31) is fabricated by polyimide material, the positive electrode (12), negative electrode (22), quick-fried
Fried foil positive electrode (32), Exploding Foil negative electrode (33) are the copper membrane that copper foil material produces；The Exploding Foil positive electrode
(32) it is electrically connected with Exploding Foil negative electrode (33) by conductive material, which passes through the cross section on spatial position
(4)；The negative electrode plate (2) corresponding Exploding Foil positive electrode (32) is provided with notch (23), the corresponding Exploding Foil of the negative electrode plate (2)
Negative electrode (33) is provided with notch (23)；The positive electrode plate (1) is integrally rectangle, and the positive electrode (12) is integrally in rectangular
Shape；The negative electrode plate (2) is oblong-shaped corresponding with positive electrode plate (1), and the negative electrode (22) is integrally rectangle；
Signal input pole plate (3) is oblong-shaped corresponding with positive electrode plate (1)；The negative electrode plate (2), signal input pole
Successively pressing constitutes high voltage planar construction of switch up and down using lamination bonding pattern for plate (3), positive electrode plate (1), and high voltage planar is opened
The cross section (4) for closing structure is rectangle or square.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201611219449.2A CN106783391B (en) | 2016-12-26 | 2016-12-26 | High voltage planar construction of switch and preparation method thereof based on flexible manufacturing technique |
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| CN201611219449.2A CN106783391B (en) | 2016-12-26 | 2016-12-26 | High voltage planar construction of switch and preparation method thereof based on flexible manufacturing technique |
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| CN106783391A CN106783391A (en) | 2017-05-31 |
| CN106783391B true CN106783391B (en) | 2019-04-23 |
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| CN110411284B (en) * | 2019-07-19 | 2022-01-07 | 南京理工大学 | Exploding foil overpressure chip integrated with micro-foil switch and detonating device |
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| CN103344151A (en) * | 2013-07-12 | 2013-10-09 | 南京理工大学 | Schottky junction plane explosion switch used for exploding foil initiator and preparation method thereof |
| CN103396282A (en) * | 2013-07-31 | 2013-11-20 | 电子科技大学 | Film bridge type igniter |
| CN103868417A (en) * | 2014-04-02 | 2014-06-18 | 中国工程物理研究院化工材料研究所 | Chip type exploding foil component and production method for same |
| CN104039086A (en) * | 2014-06-06 | 2014-09-10 | 中国航天科技集团公司第九研究院第七七一研究所 | Three-dimensional bumping printed circuit board and manufacturing method thereof |
| CN206451658U (en) * | 2016-12-26 | 2017-08-29 | 中国工程物理研究院化工材料研究所 | High voltage planar construction of switch based on flexible manufacturing technique |
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2016
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|---|---|---|---|---|
| CN102946054A (en) * | 2012-10-22 | 2013-02-27 | 北京理工大学 | Plane solid high-voltage switch |
| CN103344151A (en) * | 2013-07-12 | 2013-10-09 | 南京理工大学 | Schottky junction plane explosion switch used for exploding foil initiator and preparation method thereof |
| CN103396282A (en) * | 2013-07-31 | 2013-11-20 | 电子科技大学 | Film bridge type igniter |
| CN103868417A (en) * | 2014-04-02 | 2014-06-18 | 中国工程物理研究院化工材料研究所 | Chip type exploding foil component and production method for same |
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