CN202695358U - Low temperature cofiring ceramic stack protection element - Google Patents
Low temperature cofiring ceramic stack protection element Download PDFInfo
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- CN202695358U CN202695358U CN 201220386168 CN201220386168U CN202695358U CN 202695358 U CN202695358 U CN 202695358U CN 201220386168 CN201220386168 CN 201220386168 CN 201220386168 U CN201220386168 U CN 201220386168U CN 202695358 U CN202695358 U CN 202695358U
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Abstract
The utility model relates to a low temperature cofiring ceramic stack protection element, a ceramic substrate of the element is provided with a stamping groove, the stamping groove is printed with a LTCC porous ceramic material layer, a melt layer is stacked on the ceramic substrate filled with the LTCC porous ceramic material layer, an electrode pattern is positioned right above the stamping groove filled with the LTCC porous ceramic material layer, another ceramic substrate is stacked on the ceramic substrate provided with the melt layer, stamping groove portions of the two ceramic substrates are positioned on one same vertical plane, so the electrode pattern is positioned between the stamping groove portions filled with the LTCC porous ceramic material layers, porous filling material layers with extremely low heat conduction coefficient and large specific surface area are employed, and impact effects to products by high pressure hot-fluid generated by fuse-link motion are dispersed.
Description
Technical field
The utility model relates to a kind of overflow protecting element, particularly relates to a kind of porous LTCC over-current protecting element that adopts the stacking technique of in-situ solidifying to form.
Background technology
The high-voltage and current-limitation fuse that is applied in the electric equipments such as mains switch, transformer need to comprise an arc-control device (having arc quenching material or special construction) usually, the electric arc that produces when moving under the fault current state in order to help extinguishing fuse element, thereby the heat of avoiding super-high-current to produce makes the melting of fuse-link element and vaporization, and in the inner phenomenon that forms the high pressure hot-fluid of fuse, cause the dangerous fusing problems such as product generation explosion.The international patent application no PCT/JP2007/055083(of Matsushita Electric Industries Chinese patent application numbers 200780009165.3) when making SMD fuse, propose to adopt up and down two base station adhesives, the base station middle part forms the mode in a recess space and makes current fuse.And then merit gets electronics and proposes to arrange in substrate in Chinese patent application numbers 201010122121.5 and imbed the cave structure that declines to form pressure release heat build-up space, be used for focusing on fuse-link electric current by the time high temperature that produces, and let out the pressure that when fusing, produces except fuse-link, realize the application of product on high-power high voltage.But this structure has obvious shortcoming: little cave easily produces distortion at product during stacking and sintering, cause little cave size restive, and its little cave size also is restricted; When fuse-link is laid in little cave in addition, easily because of Action of Gravity Field to lower recess, cause fuse-link length restive, relatively poor thereby the consistency of final products operating chacteristics can become.
The utility model content
For the problems referred to above; the utility model provides a kind of porous packing material that has utmost point low thermal conductivity and bigger serface by employing; reduce the product power consumption; the high pressure hot-fluid that produces when disperseing the fuse-link action is to the percussion of product self, thus the stacking protection component of LTCC of raising Product Safety.
To achieve these goals, the utility model is taked following technical scheme: the stacking protection component of a kind of LTCC, comprise the first ceramic substrate, the second ceramic substrate, be arranged on first, melt layer between the second ceramic substrate and first, the termination electrode at the second ceramic substrate two ends, described melt layer is comprised of LTCC ceramic diaphragm and electrode pattern, described electrode pattern comprises extraction electrode and fuse-link two parts, described termination electrode is electrical connected with two extraction electrodes respectively, described first, the second ceramic substrate is provided with groove on the surface towards melt layer one side, be filled with LTCC porous ceramic film material layer in the described groove, described first, the channel portions of the second ceramic substrate is positioned at same vertical plane; Described ceramic substrate is comprised of one or more layers ceramic diaphragm; Electrode pattern in the described melt layer be positioned at the first ceramic substrate groove directly over; Described groove is stamped grooves; The electrode pattern of described melt layer adopts single layer structure, and melt layer is comprised of the electrode pattern between two-layer LTCC ceramic diaphragm and the two-layer LTCC ceramic diaphragm; Perhaps the electrode pattern of described melt layer adopts the Multi-layer Parallel structure, and melt layer is comprised of two-layer above LTCC ceramic diaphragm and the electrode pattern between each LTCC ceramic diaphragm; Perhaps the electrode pattern of described melt layer adopts the multilayer cascaded structure, melt layer is comprised of the LTCC ceramic diaphragm of four layers the even number number of plies and the electrode pattern between each LTCC ceramic diaphragm at least, and between middle each layer LTCC ceramic diaphragm, punch and the perfusion electrocondution slurry, form the stacking diaphragm that each layer is electrical connected.
The utility model is owing to taking above technical scheme, and it has the following advantages:
The present invention innovatively with porous ceramic film material layer structure applications to the arc-suppression function of overcurrent protection component, by porous ceramic structure being enclosed in fuse-link layer upper and lower faces, use its larger pore specific surface area and percent opening, make these holes when protection component moves, can play disperse since the high pressure hot-fluid that fuse-link melting or gasification produce to the percussion of porcelain body and product two ends, and the capillary suction phenomenon by the hole is in the melting melt inlet hole, the defective such as avoids protection component to have can not disconnecting or residual resistance is lower;
2. the porous ceramic coating layer can play the effect of insulation.The conductive coefficient of porous ceramic generally hangs down one more than the order of magnitude than ceramic substrate, thereby can reduce the thermal losses that brings soon because of the substrate radiating rate, and the power consumption of product is relatively less;
3. porous ceramic can play the effect of supporting fuse-link, avoided the depressed deformation of fuse-link, thereby the dimensional uniformity of fuse-link is better;
4. adopt the stacking technique of porous LTCC pottery can realize easily the series and parallel structural design of multilayer fuse-link element, thereby improve the design specification limit of product rated current.
Description of drawings
Fig. 1 is the stacking ceramic substrate sectional perspective schematic appearance of LTCC ceramic diaphragm that the utility model relates to;
Fig. 2 is the sectional perspective schematic appearance after the ceramic substrate stamped grooves that relates to of the utility model;
Fig. 3 is the A-A generalized section after the ceramic substrate stamped grooves that relates to of the utility model;
Fig. 4 is the ceramic substrate sectional perspective schematic appearance behind the printing LTCC porous ceramic slurry that relates to of the utility model;
Fig. 5 is that schematic appearance is overlooked in the LTCC ceramic diaphragm part behind the figure that prints electrode that relates to of the utility model;
Fig. 6 is the sectional perspective schematic appearance of the stack melt layers ceramic substrate that relates to of the utility model;
Fig. 7 is the end view of the ceramic substrate of the stack melt layers that relates to of the utility model (design one);
Fig. 8 is the end view of the ceramic substrate of the stack melt layers that relates to of the utility model (design two);
Fig. 9 is the end view of the ceramic substrate of the stack melt layers that relates to of the utility model (design three);
Figure 10 is the side cutaway view that stacking that the utility model relates to finished the ceramic substrate after (design one);
Figure 11 is the protection component product three-dimensional appearance schematic diagram after the cutting that relates to of the utility model example;
Figure 12 is the protection component product three-dimensional appearance schematic diagram after the print product sign that relates to of the utility model;
Figure 13 is the formation termination electrode protection component product three-dimensional appearance schematic diagram that the utility model relates to;
Description of reference numerals:
1-ceramic substrate, 11-LTCC ceramic diaphragm, 2-stamped grooves, 21-LTCC porous ceramic film material layer, 3-melt layer, 31-electrode pattern, 311-extraction electrode, 312-fuse-link, 4-protection component product, 41-protection component green compact, 42-protection component Product Identifying, 5-protection component termination electrode.
Embodiment
Below in conjunction with drawings and Examples the present invention is described in detail.
The stacking protection component 4 of a kind of LTCC as shown in figure 13 comprises ceramic substrate 1, melt layer 3 and termination electrode 5.As shown in Figure 1, described ceramic substrate 1 is by ceramic diaphragm 11 stacking forming; Described ceramic diaphragm 11 is formed by casting technique by the LTCC ceramic size; Shown in Fig. 2, Fig. 3, described ceramic substrate 1 is provided with a stamped grooves 2, as shown in Figure 4, by the thick film screen printing process filling LTCC porous ceramic slurry is arranged in the stamped grooves 2, and is dried to LTCC porous ceramic film material layer 21; Described melt layer 3 is comprised of LTCC ceramic diaphragm 11 and electrode pattern 31, as shown in Figure 5, electrode pattern 31 is printed on the not stacking LTCC ceramic diaphragm 11, stacking one deck LTCC ceramic diaphragm 11 cover layers are to form melt layer 3 again above the diaphragm 31 that is printed on this electrode pattern, and described electrode pattern 31 comprises extraction electrode 311 and fuse-link 312 two parts of protection component; Such as Fig. 7, Fig. 8, shown in Figure 9, electrode pattern 31 in the described melt layer 3 has individual layer, Multi-layer Parallel, three kinds of structures of multilayer series connection melt, and described single layer structure is that melt layer 3 is comprised of the electrode pattern 31 between two-layer LTCC ceramic diaphragm 11 and the two-layer LTCC ceramic diaphragm 11; Described Multi-layer Parallel structure is that melt layer 3 is comprised of two-layer above LTCC ceramic diaphragm 11 and the electrode pattern 31 between each LTCC ceramic diaphragm 11; Described multilayer cascaded structure is that melt layer 3 is comprised of the electrode pattern 31 between the LTCC ceramic diaphragm 11 of four layers the even number number of plies and each LTCC ceramic diaphragm 11 at least, and between middle each layer LTCC ceramic diaphragm 11 punchings and perfusion electrocondution slurry, form the stacking diaphragm that each layer is electrical connected, as shown in Figure 9, the stack melt layers that is electrical connected to form each layer; As shown in Figure 6, stack melt layers 3 on the described ceramic substrate 1 that is filled with LTCC porous ceramic film material layer 21 so that described electrode pattern 31 be positioned at the stamped grooves 2 that is filled with LTCC porous ceramic film material layer 21 directly over; As shown in figure 10, continue again stacking another ceramic substrate 1 on the described ceramic substrate 1 that has had a melt layer 3, stamped grooves 2 parts of two ceramic substrates 1 are positioned at same vertical plane, and described electrode pattern 31 is being filled with between stamped grooves 2 parts of LTCC porous ceramic film material layer 21; As shown in figure 11, for finishing stacking protection component product 41, behind the uniform temperature sintering, just obtained protection component 4.As shown in figure 12, be printed with respectively Product Identifying 42 on 4 two surfaces of described protection component, described Product Identifying comprises one or several aspects such as trade mark, load voltage, load current or use power.At described protection component 4 two ends coating termination electrode 5, two extraction electrodes, 311 parts of electrode pattern 31 are electrically connected in described termination electrode 5 and the interiors of products melt layer 3, and realize the surface soldered function of product.
Claims (5)
1. stacking protection component of LTCC; comprise the first ceramic substrate; the second ceramic substrate; be arranged on first; melt layer between the second ceramic substrate and first; the termination electrode at the second ceramic substrate two ends; described melt layer is comprised of LTCC ceramic diaphragm and electrode pattern; described electrode pattern comprises extraction electrode and fuse-link two parts; described termination electrode is electrical connected with two extraction electrodes respectively; it is characterized in that described first; the second ceramic substrate is provided with groove on the surface towards melt layer one side; be filled with LTCC porous ceramic film material layer in the described groove, described first; the channel portions of the second ceramic substrate is positioned at same vertical plane.
2. the stacking protection component of described LTCC according to claim 1 is characterized in that described ceramic substrate is comprised of one or more layers ceramic diaphragm.
3. the stacking protection component of described LTCC according to claim 1, it is characterized in that electrode pattern in the described melt layer be positioned at the first ceramic substrate groove directly over.
4. the stacking protection component of a kind of LTCC according to claim 1 is characterized in that described groove is stamped grooves.
5. the stacking protection component of a kind of LTCC according to claim 1 is characterized in that the electrode pattern of described melt layer adopts single layer structure, and melt layer is comprised of the electrode pattern between two-layer LTCC ceramic diaphragm and the two-layer LTCC ceramic diaphragm; Perhaps the electrode pattern of described melt layer adopts the Multi-layer Parallel structure, and melt layer is comprised of two-layer above LTCC ceramic diaphragm and the electrode pattern between each LTCC ceramic diaphragm; Perhaps the electrode pattern of described melt layer adopts the multilayer cascaded structure, melt layer is comprised of the LTCC ceramic diaphragm of four layers the even number number of plies and the electrode pattern between each LTCC ceramic diaphragm at least, and between middle each layer LTCC ceramic diaphragm, punch and the perfusion electrocondution slurry, form the stacking diaphragm that each layer is electrical connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220386168 CN202695358U (en) | 2012-08-06 | 2012-08-06 | Low temperature cofiring ceramic stack protection element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220386168 CN202695358U (en) | 2012-08-06 | 2012-08-06 | Low temperature cofiring ceramic stack protection element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202695358U true CN202695358U (en) | 2013-01-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220386168 Expired - Lifetime CN202695358U (en) | 2012-08-06 | 2012-08-06 | Low temperature cofiring ceramic stack protection element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202695358U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102800541A (en) * | 2012-08-06 | 2012-11-28 | 南京萨特科技发展有限公司 | Low-temperature co-fired ceramic stacking protective element and manufacturing method thereof |
-
2012
- 2012-08-06 CN CN 201220386168 patent/CN202695358U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102800541A (en) * | 2012-08-06 | 2012-11-28 | 南京萨特科技发展有限公司 | Low-temperature co-fired ceramic stacking protective element and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130123 |