CN102800541B - Low-temperature co-fired ceramic stacking protective element and manufacturing method thereof - Google Patents
Low-temperature co-fired ceramic stacking protective element and manufacturing method thereof Download PDFInfo
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- CN102800541B CN102800541B CN201210277104.8A CN201210277104A CN102800541B CN 102800541 B CN102800541 B CN 102800541B CN 201210277104 A CN201210277104 A CN 201210277104A CN 102800541 B CN102800541 B CN 102800541B
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Abstract
The invention relates to a low-temperature co-fired ceramic (LTCC) stacking protective element and a manufacturing method thereof. A ceramic substrate of the element is provided with a stamping groove, and the stamping groove is filled with LTCC porous ceramics slurry or pore-forming agent slurry. A melt layer is stacked on the ceramic substrate which is filled with the LTCC porous ceramics slurry or the pore-forming agent slurry, making an electrode pattern locate right above the stamping groove which is filled with the LTCC porous ceramics slurry or the pore-forming agent slurry. Other ceramic substrate is stacked on the ceramic substrate which has the melt layer. Stamping groove portions of the two ceramic substrates are in the same vertical planes, so that the melt layer is disposed between the stamping groove portions which are filled with the LTCC porous ceramics slurry or the pore-forming agent slurry. Using a porous filling material with an extremely low thermal coefficient and a large specific surface area can disperse an impact effect on a product, and the impact effect is caused by high-pressure heat flow generated when a fuse link moves.
Description
Technical field
The present invention relates to a kind of overflow protecting element and preparation method thereof, particularly relate to a kind of structure that adopts the stacking explained hereafter porous of in-situ solidifying LTCC over-current protecting element and preparation method thereof.
Background technology
The high-voltage and current-limitation fuse being applied in the electric equipment such as mains switch, transformer need to comprise an arc-control device (having arc quenching material or special construction) conventionally, the electric arc producing while action under fault current state in order to help extinguishing fuse element, thereby the heat of avoiding super-high-current to produce makes the melting of fuse-link element and vaporization, and in the inner phenomenon that forms high pressure hot-fluid of fuse, cause the dangerous fusing problems such as product generation explosion.The international patent application no PCT/JP2007/055083(of Matsushita Electric Industries Chinese Patent Application No. 200780009165.3) in the time making SMD fuse, propose to adopt upper and lower two base station adhesives, base station middle part forms the mode in a recess space and makes current fuse.And then merit obtains electronics and proposes in substrate to arrange in Chinese Patent Application No. 201010122121.5 and imbed the cave structure that declines to form pressure release heat build-up space, be used for focusing on fuse-link electric current by time the high temperature that produces, and let out the pressure producing except fuse-link in the time fusing, realize the application of product on high-power high voltage.But this structure has obvious shortcoming: micro-cave easily produces distortion at product when stacking and sintering, cause micro-cave size restive, and its micro-cave size is also restricted; When fuse-link is laid on micro-cave in addition, easily because Action of Gravity Field is to lower recess, cause fuse-link length restive, poor thereby the consistency of final products operating chacteristics can become.
Summary of the invention
For the problems referred to above; the present invention is to provide a kind of porous packing material by employing with utmost point low thermal conductivity and bigger serface; reduce product power consumption; the percussion of the high pressure hot-fluid producing while disperseing fuse-link action to product self, to improve the stacking protection component of LTCC of Product Safety.
To achieve these goals, the present invention takes following technical scheme: the stacking protection component of a kind of LTCC, comprise the first ceramic substrate, the second ceramic substrate, be arranged on first, melt layer between the second ceramic substrate and first, the termination electrode at the second ceramic substrate two ends, described melt layer is made up of LTCC ceramic diaphragm and electrode pattern, described electrode pattern comprises extraction electrode and fuse-link two parts, described termination electrode is electrical connected with two extraction electrodes respectively, described first, the second ceramic substrate is provided with groove on the surface towards melt layer one side, in described groove, be filled with LTCC porous ceramic slurry or pore creating material slurry, described first, the channel portions of the second ceramic substrate is positioned at same vertical plane, described ceramic substrate is made up of one or more layers ceramic diaphragm, electrode pattern in described melt layer be positioned at the first ceramic substrate groove directly over, described groove is stamped grooves, the electrode pattern of described melt layer adopts single layer structure, melt layer is made up of the electrode pattern between two-layer LTCC ceramic diaphragm and two-layer LTCC ceramic diaphragm or the electrode pattern of described melt layer adopts Multi-layer Parallel structure, melt layer is made up of the electrode pattern between two-layer above LTCC ceramic diaphragm and each LTCC ceramic diaphragm or the electrode pattern of described melt layer adopts multilayer cascaded structure, melt layer is made up of the electrode pattern between LTCC ceramic diaphragm and each LTCC ceramic diaphragm of the even number number of plies of at least four layers, between the LTCC ceramic diaphragm of each layer of centre, there is electrocondution slurry.
A manufacture method for the stacking protection component of LTCC, is characterized in that the method comprises:
1) prepare pore creating material slurry, LTCC ceramic size and LTCC porous ceramic slurry;
2) use without the LTCC ceramic size curtain coating of pore former material and become LTCC ceramic diaphragm, LTCC ceramic diaphragm stacking go out ceramic substrate, on ceramic substrate, run through substrate long axis direction and be manufactured with groove, LTCC porous ceramic slurry obtained above or pore creating material slurry are filled in groove, and are dried;
3) figure that prints electrode on above-mentioned not stacking LTCC ceramic diaphragm again, described electrode pattern comprises extraction electrode and fuse-link two parts of protection component, described melt layer is made up of LTCC ceramic diaphragm and electrode pattern; Stacking above-mentioned melt layer on the above-mentioned ceramic substrate that is filled with LTCC porous ceramic slurry or pore creating material slurry, is just positioned at electrode pattern and is filled with above the groove of LTCC porous ceramic slurry or pore creating material slurry; Then another ceramic substrate that is filled with LTCC porous ceramic slurry or pore creating material slurry is continued to be stacked to the ceramic substrate top with described electrode pattern; the channel portions of two ceramic substrates is positioned at same vertical plane, and the fuse-link part of described electrode pattern is being filled with between the channel portions of LTCC porous ceramic slurry or pore creating material slurry;
4) ceramic substrate cutting of heap being folded becomes protection component green compact, fired formation protection component, finally at two terminations of protection component product coating termination electrodes, and make itself and two extraction electrode parts in the electrode pattern of interiors of products melt layer form electric connections;
Pore creating material slurry described in step 1) comprises pore former material, solvent, adhesive and dispersant, mixes by ball milling; Pore former material described in step 1) is selected one or more in charcoal powder, starch, cellulose, polystyrene, polyvinyl alcohol, methymethacrylate, urea, sawdust, polyvinyl chloride, naphthalene, paraffin; LTCC ceramic size described in step 1) comprises mixing LTCC ceramic powder, solvent, dispersant, adhesive, plasticizer, prepares by high-energy-milling; LTCC porous ceramic slurry described in step 1) is to add pore former material in LTCC ceramic size, mixes formation by high-speed stirred, and the proportioning of pore former material and LTCC ceramic powder is 5wt% ~ 40wt%; Step 2) described in groove form by impact style; Electrode pattern in melt layer described in step 3) adopts single layer structure, then is printed on stacking another layer of LTCC ceramic diaphragm cover layer composition melt layer on the LTCC ceramic diaphragm of electrode pattern at one deck; Electrode pattern in melt layer described in step 3) adopts Multi-layer Parallel structure, stacking and in stacking another layer of LTCC ceramic diaphragm cover layer composition of outermost layer melt layer continuously at least two-layer LTCC ceramic diaphragm that is printed with electrode pattern; Electrode pattern in melt layer described in step 3) adopts multilayer cascaded structure, the membrane layer that is printed with electrode pattern of the odd number number of plies of at least three layers stacking continuously, and punch and pour into electrocondution slurry between the LTCC ceramic diaphragm of each layer of centre, to form the each layer of stacking diaphragm being electrical connected, then in stacking another layer of LTCC ceramic diaphragm cover layer composition of outermost layer melt layer.
The present invention is owing to taking above technical scheme, and it has the following advantages:
The present invention innovatively by porous ceramic film material structure applications to the arc-suppression function of overflow protecting element; by porous ceramic structure being enclosed in to fuse-link layer upper and lower faces; use its larger pore specific surface area and percent opening; make these holes in the time that protection component moves; can play and disperse the percussion of high pressure hot-fluid to porcelain body and product two ends that produce due to fuse-link melting or gasification; and capillary suction phenomenon by hole is in melting melt inlet hole, the defect such as avoid protection component to have can not disconnecting or residual resistance is lower;
2. porous ceramic coating layer can play the effect of insulation.The conductive coefficient of porous ceramic is generally low one more than the order of magnitude than ceramic substrate, thereby can reduce the thermal losses bringing soon because of substrate radiating rate, and the power consumption of product is relatively less;
3. porous ceramic can play the effect of supporting fuse-link, avoided the depressed deformation of fuse-link, thereby the dimensional uniformity of fuse-link is better;
4. adopt the stacking technique of porous LTCC pottery can realize easily the series and parallel structural design of multilayer fuse-link element, thereby improve the design specification limit of product rated current.
Brief description of the drawings
Fig. 1 is the stacking ceramic substrate sectional perspective schematic appearance of LTCC ceramic diaphragm the present invention relates to;
Fig. 2 is the sectional perspective schematic appearance after the ceramic substrate stamped grooves the present invention relates to;
Fig. 3 is the A-A generalized section after the ceramic substrate stamped grooves the present invention relates to;
Fig. 4 is the ceramic substrate sectional perspective schematic appearance after printing LTCC porous ceramic slurry or the pore creating material slurry the present invention relates to;
Fig. 5 is that schematic appearance is overlooked in the LTCC ceramic diaphragm part of printing electrode after figure the present invention relates to;
Fig. 6 is the sectional perspective schematic appearance of the ceramic substrate after the stack melt layers the present invention relates to;
Fig. 7 is the end view of the ceramic substrate after the stack melt layers (design one) the present invention relates to;
Fig. 8 is the end view of inventing the ceramic substrate after the stack melt layers (design two) relating to;
Fig. 9 is the end view of the ceramic substrate after the stack melt layers (design three) the present invention relates to;
Figure 10 is the side cutaway view that the present invention relates to stacking completes the ceramic substrate after (design one);
Figure 11 is the protection component product three-dimensional appearance schematic diagram after the cutting that relates to of the inventive example;
Figure 12 is the protection component product three-dimensional appearance schematic diagram after the print product mark the present invention relates to;
Figure 13 is the protection component product three-dimensional appearance schematic diagram after the formation termination electrode the present invention relates to;
Description of reference numerals:
1-ceramic substrate, 11-LTCC ceramic diaphragm, 2-stamped grooves, 21-LTCC porous ceramic slurry, 22-pore creating material slurry, 3-melt layer, 31-electrode pattern, 311-extraction electrode, 312-fuse-link, 4-protection component product, 41-protection component green compact, 42-protection component product identification, 5-protection component termination electrode.
Embodiment
Below in conjunction with drawings and Examples, the present invention is described in detail.
The embodiment of the stacking protection component of a kind of LTCC: the stacking protection component 4 of a kind of LTCC as shown in figure 13, comprises ceramic substrate 1, melt layer 3 and termination electrode 5.As shown in Figure 1, described ceramic substrate 1 is to form by ceramic diaphragm 11 is stacking; Described ceramic diaphragm 11 is formed by casting technique by LTCC ceramic size; As shown in Fig. 2, Fig. 3, on described ceramic substrate 1, be provided with a stamped grooves 2, as shown in Figure 4, in stamped grooves 2, there are LTCC porous ceramic slurry 21 or pore creating material slurry 22 by thick film screen printing process filling; Described melt layer 3 is made up of LTCC ceramic diaphragm 11 and electrode pattern 31, and as shown in Figure 5, described electrode pattern 31 comprises extraction electrode 311 and fuse-link 312 two parts of protection component, and electrode pattern 31 is printed on LTCC ceramic diaphragm 11; As shown in Fig. 7, Fig. 8, Fig. 9, in described melt layer 3, electrode pattern 31 has individual layer, Multi-layer Parallel, three kinds of structures of multilayer series connection; Described single layer structure is that melt layer 3 is made up of the electrode pattern 31 between two-layer LTCC ceramic diaphragm 11 and two-layer LTCC ceramic diaphragm 11; Described Multi-layer Parallel structure is that melt layer 3 is made up of the electrode pattern 31 between two-layer above LTCC ceramic diaphragm 11 and each LTCC ceramic diaphragm 11; Described multilayer cascaded structure is that melt layer 3 is made up of the electrode pattern 31 between the LTCC ceramic diaphragm 11 of the even number number of plies of at least four layers and each LTCC ceramic diaphragm 11, and punch and pour into electrocondution slurry on 11 of each layer of centre LTCC ceramic diaphragms, form the each layer of stacking diaphragm being electrical connected; As shown in Figure 6, stack melt layers 3 on the described ceramic substrate 1 that is filled with LTCC porous ceramic slurry 21 or pore creating material slurry 22, described electrode pattern 31 is positioned at be filled with LTCC porous ceramic slurry 21 or pore creating material slurry 22 stamped grooves 2 directly over; As shown in figure 10, stacking another ceramic substrate 1 again on the described ceramic substrate 1 with melt layer 3, stamped grooves 2 parts of two ceramic substrates 1 are positioned at same vertical plane, make described electrode pattern 31 between stamped grooves 2 parts that are filled with LTCC porous ceramic slurry 21 or pore creating material slurry 22; Two surface printings of described protection component 4 have the mark of product, and described product identification comprises trade mark, load voltage, load current or uses one or several aspects such as power.Described protection component 4 two ends coating termination electrodes 5, described termination electrode 5 respectively with interiors of products melt layer 3 in two extraction electrodes 311 of electrode pattern 31 be electrically connected, and realize its surface soldered function.
Second is the embodiment that realizes the technical scheme of the stacking protection component manufacture method of a kind of LTCC of the present invention, and its step is as follows:
A. slurry preparation: LTCC ceramic size is to prepare by primary raw materials such as high-energy-milling mixing LTCC ceramic powder, solvent, dispersant, adhesive, plasticizer.The proportioning of LTCC ceramic size and optional primary raw material are common in the industry, are not main contents in the present invention, and the slurry obtaining does not have particular/special requirement, are not crucial.LTCC porous ceramic slurry 21 is that to account for ceramic powder ratio be the pore former material between 5wt% ~ 40wt% by adding in the LTCC ceramic size completing in preparation, mixes formation by high-speed stirred.Described LTCC ceramic powder can adopt as common MgO-Al
2o
3-SiO
2the material of devitrified glass system, described pore former material is preferentially selected charcoal powder, starch, cellulose, polystyrene, polyvinyl alcohol, methymethacrylate, urea, sawdust, polyvinyl chloride, naphthalene, one or more in paraffin, by selecting the proportioning of difform pore former material, make the porous ceramic support finally obtaining there is higher percent opening, larger pore specific surface area, and connective between excellent hole, in order to reach this purpose, the preferential employing of the present invention adds charcoal powder: starch: cellulose ratios is 5 ~ 7:2 ~ 3:1 ~ 2(mass ratio) pore former material, also can carry out proportioning adjustment according to the composition of selected pore former material and the final purpose that will reach.The characteristic of described pore former material must meet following requirement: in heating process, be easy to get rid of; After eliminating in matrix without the Harmful Residue; Do not react with matrix.The size and shape of pore creating material particle has determined the size and shape in final LTCC porous ceramic slurry hole; How many direct porositys that affect porous ceramic of pore creating material addition.Therefore, the selection of pore former material plays a crucial role to the formation of porous ceramic, and conventional pore creating material can be selected as material listed above.Pore creating material slurry 22 is to be mixed by ball milling by main components such as pore former material, solvent, adhesive, dispersants, and pore former material can select the pore creating material of above-mentioned single component to add.Pore creating material slurry, only for to play supporter effect in the stacking process of diaphragm, will vapor away after product burns till completely, and its proportioning does not affect properties of product.
B. substrate is stacking: LTCC ceramic size is formed to ceramic diaphragm 11 by casting technique, and adopt laminated process to go out to have certain thickness ceramic substrate 1 by stacking ceramic diaphragm 11 by Fig. 1 mode.
C. stamped grooves: press shown in Fig. 2, form the stamped grooves 2 of a given shape on the substrate of above-mentioned heap poststack with punch forming process or other technique, Fig. 3 is the part sectioned view along this stamped grooves 2 of A-A direction as shown in Figure 2.The shape of stamped grooves can be determined according to the actual needs of product design, requires it to play and makes melt layer electrode pattern in the larger effect of design attitude heat build-up, thereby can make fuse-link at this position open circuit at first.
D. trench fill: press shown in Fig. 4, in the stamped grooves 2 of above-mentioned ceramic substrate 1, pass through thick film screen printing mode, print above-mentioned LTCC porous ceramic slurry 21 or pore creating material slurry 22, preferred LTCC porous ceramic slurry 21 or pore creating material slurry 22 carry out appropriateness and are dried to pasty state before printing, print the rear and substrate dry required time jointly to reduce it.
E. melt layer forms: press shown in Fig. 5, and the electrode pattern 31 of printing regulation on above-mentioned not stacking LTCC ceramic diaphragm 11, described electrode pattern 31 comprises extraction electrode 311 and fuse-link 312 two parts of protection component.Finally pass through again stacking one deck LTCC ceramic diaphragm 11 cover layers thereon, to obtain melt layer 3.
F. melt layer is stacking: press shown in Fig. 6, stacking above-mentioned melt layer 3 on the dried ceramic substrate 1 that is filled with LTCC porous ceramic slurry 21 or pore creating material slurry 22, described electrode pattern 31 is positioned at be filled with LTCC porous ceramic slurry 21 or pore creating material slurry 22 stamped grooves 2 directly over.Electrode pattern 31 can be designed to individual layer, Multi-layer Parallel, multilayer series connection melt structure by Fig. 7, Fig. 8, tri-kinds of modes of Fig. 9, and is stacked into melt layer 3.It is stacking and form at the stacking one deck cover layer 11 of outermost layer continuously that multi-layered electrode parallel connection technology relates to the above above-mentioned membrane layer that is printed with electrode pattern 31 of 2 layers or 2 layers; Multi-layered electrode tandem process relates to 3 layers or be greater than the membrane layer that is printed with electrode pattern 31 stacking continuously of 3 the odd number number of plies, and require on position, punch and pour into electrocondution slurry as shown in Figure 9 11 of each layer of centre ceramic diaphragms, to form the each layer of stacking diaphragm being electrical connected.The preferred extraction electrode part of described electrode pattern and fuse-link part adopt same electrode slurry, and one-step print, to enhance productivity; But also can be designed as two step typographies or adopt after printing extraction electrode, between extraction electrode, overlapping metal wire material technique.
G. complete stacking: shown in Figure 10; another ceramic substrate 1 is stacked to again on the ceramic substrate 1 with described melt layer 3; stamped grooves 2 parts of two ceramic substrates are positioned at same vertical plane; make described electrode pattern 31 between stamped grooves 2 parts that are filled with LTCC porous ceramic slurry 21 or pore creating material slurry 22, complete the stacking of protection component green compact bar piece.
H. product cutting: press shown in Figure 11, stacking complete green compact bar piece is cut, to obtain meeting protection component green compact product 41 dimensional requirement, some.
I. product sintering: protection component green compact product 41 is carried out to sintering, to obtain LTCC porous ceramic protection component product 4.
J. identification printing: press shown in Figure 12, in described protection component product 4 upper and lower surface print product marks 43, described product identification comprises trade mark, load voltage, load current or uses one or several aspects such as power.
K. termination electrode coating: press shown in Figure 13; form termination electrode 5 at described protection component product 4 two ends with the related process such as soaking paste or ion sputtering; so that 31 liang of extraction electrode 311 parts of the electrode pattern of interiors of products melt layer 3 are drawn, and meet product surface welding requirements.
Claims (9)
1. the stacking protection component of LTCC, comprise the first ceramic substrate, the second ceramic substrate, be arranged on first, melt layer between the second ceramic substrate and first, the termination electrode at the second ceramic substrate two ends, described melt layer is made up of LTCC ceramic diaphragm and electrode pattern, described electrode pattern comprises extraction electrode and fuse-link two parts, described termination electrode is electrical connected with two extraction electrodes respectively, it is characterized in that: described first, the second ceramic substrate is provided with groove on the surface towards melt layer one side, in described groove, be filled with LTCC porous ceramic slurry or pore creating material slurry, described first, the channel portions of the second ceramic substrate is positioned at same vertical plane, electrode pattern in described melt layer be positioned at the first ceramic substrate groove directly over, and all separated by LTCC ceramic diaphragm between electrode pattern and groove.
2. the stacking protection component of a kind of LTCC according to claim 1, is characterized in that: the electrode pattern of described melt layer adopts single layer structure, and melt layer is made up of the electrode pattern between two-layer LTCC ceramic diaphragm and two-layer LTCC ceramic diaphragm; Or the electrode pattern of described melt layer adopts Multi-layer Parallel structure, melt layer is made up of the electrode pattern between two-layer above LTCC ceramic diaphragm and each LTCC ceramic diaphragm; Or the electrode pattern of described melt layer adopts multilayer cascaded structure, and melt layer is made up of the electrode pattern between LTCC ceramic diaphragm and each LTCC ceramic diaphragm of the even number number of plies of at least four layers, between the LTCC ceramic diaphragm of each layer of centre, has electrocondution slurry.
3. a manufacture method for the stacking protection component of LTCC, is characterized in that: the method comprises:
1) prepare pore creating material slurry, LTCC ceramic size and LTCC porous ceramic slurry;
2) use without the LTCC ceramic size curtain coating of pore former material and become LTCC ceramic diaphragm, LTCC ceramic diaphragm stacking go out ceramic substrate, on ceramic substrate, run through substrate long axis direction and be manufactured with groove, LTCC porous ceramic slurry obtained above or pore creating material slurry are filled in groove, and are dried;
3) figure that prints electrode on above-mentioned not stacking LTCC ceramic diaphragm again, described electrode pattern comprises extraction electrode and fuse-link two parts of protection component, forms melt layer by LTCC ceramic diaphragm and electrode pattern; Stacking above-mentioned melt layer on the above-mentioned ceramic substrate that is filled with LTCC porous ceramic slurry or pore creating material slurry, is just positioned at electrode pattern and is filled with above the groove of LTCC porous ceramic slurry or pore creating material slurry; Then another ceramic substrate that is filled with LTCC porous ceramic slurry or pore creating material slurry is continued to be stacked to the ceramic substrate top with described electrode pattern, the channel portions of two ceramic substrates is positioned at same vertical plane, and the fuse-link part of described electrode pattern is being filled with between the channel portions of LTCC porous ceramic slurry or pore creating material slurry;
4) ceramic substrate cutting of heap being folded becomes protection component green compact; fired formation protection component; finally at two terminations of protection component product coating termination electrodes, and make itself and two extraction electrode parts in the electrode pattern of interiors of products melt layer form electric connections.
4. the manufacture method of the stacking protection component of a kind of LTCC according to claim 3, is characterized in that the pore creating material slurry described in step 1) comprises pore former material, solvent, adhesive and dispersant, mixes by ball milling.
5. the manufacture method of the stacking protection component of a kind of LTCC according to claim 4, is characterized in that pore former material described in step 1) selects one or more in charcoal powder, starch, cellulose, polystyrene, polyvinyl alcohol, methymethacrylate, urea, sawdust, polyvinyl chloride, naphthalene, paraffin.
6. the manufacture method of the stacking protection component of a kind of LTCC according to claim 3; it is characterized in that LTCC ceramic size described in step 1) comprises mixes LTCC ceramic powder, solvent, dispersant, adhesive, plasticizer, prepares by high-energy-milling.
7. the manufacture method of the stacking protection component of a kind of LTCC according to claim 6; it is characterized in that the LTCC porous ceramic slurry described in step 1) is to add pore former material in LTCC ceramic size; mix formation by high-speed stirred, the proportioning of pore former material and LTCC ceramic powder is 5wt% ~ 40wt%.
8. the manufacture method of the stacking protection component of a kind of LTCC according to claim 3, is characterized in that step 2) described in groove form by impact style.
9. the manufacture method of the stacking protection component of a kind of LTCC according to claim 3, it is characterized in that the electrode pattern in the melt layer described in step 3) adopts single layer structure, the electrode pattern being printed in stacking another layer of LTCC ceramic diaphragm cover layer composition melt layer on the LTCC ceramic diaphragm of electrode pattern or described melt layer at one deck adopts Multi-layer Parallel structure, the at least two-layer LTCC ceramic diaphragm that is printed with electrode pattern continuously electrode pattern stacking and in stacking another layer of LTCC ceramic diaphragm cover layer composition melt layer of outermost layer or described melt layer adopt multilayer cascaded structure, the membrane layer that is printed with electrode pattern of the odd number number of plies of at least three layers stacking continuously, and punch and pour into electrocondution slurry between the LTCC ceramic diaphragm of each layer of centre, to form the each layer of stacking diaphragm being electrical connected, again in stacking another layer of LTCC ceramic diaphragm cover layer composition of outermost layer melt layer.
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| CN201210277104.8A CN102800541B (en) | 2012-08-06 | 2012-08-06 | Low-temperature co-fired ceramic stacking protective element and manufacturing method thereof |
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| CN201210277104.8A CN102800541B (en) | 2012-08-06 | 2012-08-06 | Low-temperature co-fired ceramic stacking protective element and manufacturing method thereof |
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| CN113061024B (en) * | 2021-04-08 | 2022-08-26 | 山东国瓷功能材料股份有限公司 | Low-temperature co-fired material and prepared green ceramic chip and device for overcurrent protection |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1159249A (en) * | 1994-09-12 | 1997-09-10 | 库珀工业公司 | Improvements in ceramic chip fuses |
| CN102013368A (en) * | 2010-10-08 | 2011-04-13 | Aem科技(苏州)股份有限公司 | Fuse with built-in thermal-protective coating and manufacture process thereof |
| CN102194615A (en) * | 2010-03-02 | 2011-09-21 | 功得电子工业股份有限公司 | Embedded type circuit lamination protection element and manufacturing method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5532380Y2 (en) * | 1975-11-26 | 1980-08-01 | ||
| EP1074034B1 (en) * | 1998-04-24 | 2002-03-06 | Wickmann-Werke GmbH | Electrical fuse element |
| CN202695358U (en) * | 2012-08-06 | 2013-01-23 | 南京萨特科技发展有限公司 | Low temperature cofiring ceramic stack protection element |
-
2012
- 2012-08-06 CN CN201210277104.8A patent/CN102800541B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1159249A (en) * | 1994-09-12 | 1997-09-10 | 库珀工业公司 | Improvements in ceramic chip fuses |
| CN102194615A (en) * | 2010-03-02 | 2011-09-21 | 功得电子工业股份有限公司 | Embedded type circuit lamination protection element and manufacturing method thereof |
| CN102013368A (en) * | 2010-10-08 | 2011-04-13 | Aem科技(苏州)股份有限公司 | Fuse with built-in thermal-protective coating and manufacture process thereof |
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