CN106774503A - A kind of optical module shell temperature monitoring method and device - Google Patents
A kind of optical module shell temperature monitoring method and device Download PDFInfo
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- CN106774503A CN106774503A CN201611091777.9A CN201611091777A CN106774503A CN 106774503 A CN106774503 A CN 106774503A CN 201611091777 A CN201611091777 A CN 201611091777A CN 106774503 A CN106774503 A CN 106774503A
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- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
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Abstract
The invention discloses a kind of optical module shell temperature monitoring method and device, it is used to improve monitoring precision of the optical module shell temperature in each temperature section.The method includes：According to the first output valve of optical module shell temperature；When determining that the first output valve is in low temperature threshold interval, driving chip temperature sampling value is obtained；According to driving chip temperature sampling value and the linear relationship met with optical module shell temperature, the second output valve of optical module shell temperature is determined；According to the second output valve of optical module shell temperature, when determining that the second output valve is in high temperature threshold value interval, control chip temperature sampling value is obtained；According to control chip temperature sampling value and the linear relationship met with optical module shell temperature, the 3rd output valve of optical module shell temperature is determined.Choosing different temperature sampling sources in different temperature sections carries out the monitoring of optical module shell temperature, improves monitoring precision of the optical module shell temperature in each temperature section.
Description
Technical field
The present embodiments relate to communication technical field, more particularly to a kind of optical module shell temperature monitoring method and device.
Background technology
Recently as developing rapidly for the communications industry, increasing communication equipment is applied to increasingly harsher nature
In environment, the requirement of extreme weather conditions to temperature of communication equipment adaptability is improved constantly.Accurate monitoring temperature can be more
Good reflection, when the working condition of front optical module, is that optical module self-adaptive regulation improves more accurately temperature reference.Also can be timely
Overtemperature applicable cases are made with temperature warning, trigger equipment protection functional circuit, prevent overtemperature application from being caused not to equipment
Reversible damage.
But current optical module shell temperature monitoring, the basic temperature sensor using inside optical module control chip is carried out to temperature
Sampling, then fits current shell temperature with algorithm.Also serve as one of pyrotoxin in optical module in itself due to control chip, no
Synthermal lower control chip generates heat in itself and radiating effect is different, caloric value of the control chip relative to module under different temperatures
It is also different with heat dissipation capacity, cause this shell temperature monitor mode to report precision different in different temperatures interval, there is portion temperature section
The precision that reports can degradation.When product is produced in batches, due to the uniformity meeting of the temperature sensor inside control chip
Variant, the accuracy error that reports of portion temperature section will further amplify.These problems cause optical module producer in production
In order to the shell temperature for meeting module reports precision, generally require to spend a large amount of resources of production, production efficiency is difficult to improve.
To sum up, when optical module shell temperature is monitored using optical module control chip in the prior art, the interval prison of different temperatures
There is the technical problem of relatively large deviation in control precision.
The content of the invention
The present invention provides a kind of optical module shell temperature monitoring method and device, is used to solve use optical module control in the prior art
Coremaking piece is monitored during optical module shell temperature, and the interval monitoring precision of different temperatures has the technical problem of relatively large deviation.
The embodiment of the present invention provides a kind of optical module shell temperature monitoring method, including：
According to the first output valve of optical module shell temperature；When determining that first output valve is in low temperature threshold interval, obtain
Driving chip temperature sampling value；Optical module shell temperature be in the low temperature threshold it is interval when, driving chip temperature sampling value and light
Module case temperature meets linear relationship；
According to the driving chip temperature sampling value and the driving chip temperature sampling value and optical module shell temperature satisfaction
Linear relationship, determines the second output valve of optical module shell temperature；
According to first output valve of optical module shell temperature, when determining that first output valve is in high temperature threshold value interval,
Obtain control chip temperature sampling value；When optical module shell temperature is in high temperature threshold value interval, control chip temperature sampling value
Meet linear relationship with optical module shell temperature；
According to the control chip temperature sampling value and the control chip temperature sampling value and optical module shell temperature satisfaction
Linear relationship, determines the 3rd output valve of optical module shell temperature.
The embodiment of the present invention provides a kind of optical module shell temperature supervising device, including：
First reporting unit, for reporting driving chip temperature sampling value to the processing unit；
Second reporting unit, for reporting optical module control chip temperature sampling value to the processing unit；
Processing unit, for the first output valve according to optical module shell temperature, determines that first output valve is in low temperature threshold
When value is interval, the driving chip temperature sampling value that first reporting unit is reported is obtained；It is in optical module shell temperature described low
During warm threshold interval, driving chip temperature sampling value meets linear relationship with optical module shell temperature；According to the driving chip temperature
The linear relationship that sampled value and the driving chip temperature sampling value meet with optical module shell temperature, determines the second of optical module shell temperature
Output valve；
The processing unit, is additionally operable to first output valve according to optical module shell temperature, determines first output valve
During in high temperature threshold value interval, the control chip temperature sampling value that second reporting unit is reported is obtained；In optical module shell temperature
During in high temperature threshold value interval, control chip temperature sampling value meets linear relationship with optical module shell temperature；According to the control
The linear relationship that coremaking piece temperature sampling value and the control chip temperature sampling value meet with optical module shell temperature, determines optical module
3rd output valve of shell temperature.
In above-described embodiment, linear relationship is presented under high temperature, normal temperature by control chip temperature and optical module shell temperature, with
And driving chip temperature is presented linear relationship at low temperature with optical module shell temperature, low temperature threshold interval and high temperature threshold value area are set
Between, and using control chip do optical module high temperature section and normal temperature section temperature sampling source, optical module low temperature is done using driving chip
The temperature sampling source of section.When determining that optical module shell temperature is in low temperature threshold interval, temperature sampling source is switched into driving core
Piece, obtains optical module driving chip temperature sampling value；And then it is linear with what optical module shell temperature showed according to driving chip temperature
Relation determines optical module shell temperature；When determining that optical module shell temperature is in high temperature threshold value interval, temperature sampling source is switched to
Control chip, obtains control chip temperature sampling value；And then it is linear with what optical module shell temperature showed according to control chip temperature
Relation determines optical module shell temperature, with optical module shell temperature right all using control chip temperature with full temperature scope in the prior art
Should be related to compare calculating optical module shell temperature, driving chip be chosen as temperature sampling source in low-temperature zone, in high temperature and normal temperature section
Using control chip as temperature sampling source, it is ensured that in the optical module shell temperature of each temperature section be all accurate, it is ensured that optical mode
The monitoring precision of optical module shell temperature of the block in full temperature scope.
Brief description of the drawings
Accompanying drawing is used for providing a further understanding of the present invention, and constitutes a part for specification, implements with the present invention
Example is used to explain the present invention together, is not construed as limiting the invention.In the accompanying drawings：
Fig. 1 is a kind of method flow diagram of optical module shell temperature monitoring method provided in an embodiment of the present invention；
Fig. 2 is the annexation of a kind of optical module control chip provided in an embodiment of the present invention and driving chip；
Fig. 3 is a kind of method flow diagram of optical module shell temperature monitoring method provided in an embodiment of the present invention；
Fig. 4 is a kind of structural representation of optical module shell temperature supervising device provided in an embodiment of the present invention；
Fig. 5 is a kind of structural representation of optical module shell temperature supervising device provided in an embodiment of the present invention.
Specific embodiment
In order that technical problem solved by the invention, technical scheme and it is effective become more apparent, below in conjunction with
Figure of description is illustrated to the preferred embodiments of the present invention, it will be appreciated that preferred embodiment described herein is only used for
The description and interpretation present invention, is not intended to limit the present invention.And in the case where not conflicting, embodiment and reality in the application
Applying the feature in example can be mutually combined.
First, what deserves to be explained is, the optical module shell temperature in the embodiment of the present invention represents the temperature of optical module shell, optical mode
Block shell temperature is influenceed by the environment temperature of optical module, and usual optical module shell temperature is obtained by carrying out linear compensation to control chip temperature
Arrive.Optical module environment temperature refers to the air themperature of optical module working environment.Driving chip temperature refers to the temperature on driving chip
The temperature of degree sensor detection.Control chip temperature be by control chip inside the temperature that detects of temperature sensor.
Because control chip and optical module shell are in different locus, skin temperature exists with control chip temperature
The temperature difference, control chip temperature is not directly equal to current optical module shell temperature.Existing optical module shell temperature monitor mode is：First
The temperature value of optical module control chip internal temperature sensor is obtained, then the temperature value of this temperature sensor is fitted, counted
Current optical module shell temperature value is calculated, then the communication equipment of upstream will be reported when fore shell temperature value.
But, also serve as one of pyrotoxin in optical module, control chip sheet under different temperatures in itself due to control chip
Body generates heat and radiating effect is different, and control chip is also different relative to the caloric value and heat dissipation capacity of module under different temperatures, leads
This optical module shell temperature monitor mode is caused to report precision different in different temperatures interval.
In order to improve the monitoring precision of optical module shell temperature, the inventors found that：
The change of optical module environment temperature can produce influence to the thermal characteristics of optical module.In most of temperature range, control
Chip temperature processed is presented linear relationship with optical module shell temperature, but in other temperature ranges, such as low-temperature range, control chip temperature
Non-linear relation is presented with optical module shell temperature.
When optical module shell temperature is monitored, even if being compensated using Different Slope in different temperatures interval, the light after compensation
Still can there is relatively large deviation in portion temperature section in module case temperature.
Want optical module shell temperature and control chip temperature are accurately mapped in full temperature section by algorithm it is extremely difficult.
Especially in large-scale production process, still have compared with multivariable, such as device uniformity, environment temperature difference, can be to optical module shell
The calibration value of temperature produces influence.
The present inventor also found during above-mentioned technical problem is solved：
First, in normal temperature, high temperature section, control chip temperature shows linear relationship with optical module shell temperature, and control chip is fitted
The temperature sampling source of optical module normal temperature, high temperature section is done in conjunction；
The power consumption of control chip is very low for optical module other devices, and comparatively its caloric value is also minimum
's.When optical module is in high temperature, normal temperature temperature range, the heat inside optical module is dissipated by the surface of optical module shell
Hair, now optical module shell temperature is less than the larger device of internal calorific power.According to normal temperature end, the hot simulation analysis knot of high temperature section
Really, because control chip is relatively low with respect to caloric value, control chip temperature is in a linear zone with optical module shell temperature corresponding relation,
Only need to do control chip temperature simple compensation, can just draw accurate optical module shell temperature value.Therefore, control chip is adapted to
Do the temperature sampling source of optical module normal temperature, high temperature section.
Second, in whole low-temperature zone, control chip temperature shows non-linear relation with optical module shell temperature, and control chip is not
It is adapted to do the temperature sampling source of optical module low-temperature zone；
It was found by the inventors of the present invention that when optical module is in the working environment of low temperature, the shell temperature of optical module is higher than environment
Temperature.According to the hot simulation analysis result of low-temperature zone, under different conditions, the change of optical module shell temperature and optical module environment temperature
Show nonlinear relation.Now because control chip caloric value is too low, and the temperature of module other parts device is far above
Control chip temperature.Control chip caloric value is excessive with optical module case surface radiating deviation, and is difficult to find out optical module shell temperature
The accurate corresponding relation between control chip temperature.Therefore, in whole low-temperature zone, control chip is low due to caloric value itself,
And heat is quickly lost in, control chip temperature shows non-linear relation with optical module shell temperature.
3rd, in whole low-temperature zone, driving chip temperature is presented linear relationship with optical module shell temperature, and driving chip is adapted to do
The temperature sampling source of optical module low-temperature zone.
It was found by the inventors of the present invention that the driving chip of optical module assume responsibility for optical module Electric signal processing, optical device electric current
The functions such as driving, power consumption is maximum, is the main heating source of optical module.At low ambient temperatures, with the reduction of ambient temperature, light
The heat energy Quick diffusing of module housing.Under low temperature driving chip temperature is no longer concentrated, and even heat is distributed on pcb board,
From the point of view of the hot simulation result of low-temperature zone, driving chip temperature shows a kind of linear relationship with optical module shell temperature.Therefore, low
Temperature section, optical module driving chip temperature shows simple linear relationship with optical module shell temperature, and driving chip is adapted to do optical module
The temperature sampling source of low-temperature zone.
4th, in high temperature section, driving chip temperature shows non-linear relation with optical module shell temperature, and driving chip is not suitable for
Do the temperature sampling source of optical module high temperature section.
It was found by the inventors of the present invention that the main heating source of optical module comes from driving chip.Heat emulation according to high temperature section
Analysis result, driving chip temperature be pcb board on all devices thermal self-restraint stress, and heat concentrate.Now, driving chip temperature
Degree can show a kind of non-linear relation with optical module shell temperature (optical mode deblocking temperature).In high temperature section, because the difference of optical device is special
Property, the size deviation of the driving current of different driving chip is larger, and the caloric value deviation of different driving chip is larger, it is difficult to unite
One.In high temperature section, if the problem of algorithm uniformity will be faced as temperature sampling source using driving chip, therefore, drive core
Piece is not suitable for doing the temperature sampling source of optical module high temperature section.
It was found by the inventors of the present invention that the heating trend of optical module shell temperature is identical with hot environment.
The optical module internal drive chip of the above-mentioned analysis based on the present inventor, control chip, optical module shell
Thermal characteristics at different temperatures, the present inventor proposes following optical module shell temperature calibration program, and its inventive concept is：
The temperature sampling source of optical module high temperature section and normal temperature section is done using control chip, the temperature of optical module low-temperature zone is done using driving chip
Degree sampling source.
Foregoing invention design based on the present inventor, as shown in figure 1, the embodiment of the present invention provides a kind of optical module
Shell temperature monitoring method, including：
Step 101, in the first output valve according to optical module shell temperature；Determine that the first output valve is in low temperature threshold interval
When, obtain driving chip temperature sampling value；Optical module shell temperature be in low temperature threshold it is interval when, driving chip temperature sampling value with
Optical module shell temperature meets linear relationship；
Step 102, according to driving chip temperature sampling value and driving chip temperature sampling value and optical module shell temperature satisfaction
Linear relationship, determines the second output valve of optical module shell temperature；
Step 103, in the first output valve according to optical module shell temperature, determines that the first output valve is in high temperature threshold value interval
When, obtain control chip temperature sampling value；Optical module shell temperature be in high temperature threshold value it is interval when, control chip temperature sampling value with
Optical module shell temperature meets linear relationship；
Step 104, according to the control chip temperature sampling value and control chip temperature sampling value and the optical module shell temperature that obtain
The linear relationship of satisfaction, determines the 3rd output valve of optical module shell temperature.
Above method flow is performed by the control chip in optical module.Control chip in the embodiment of the present invention, refers to work as
The communication control chip used in most optical module in preceding optical communications industry.Communication control chip can be connect by its digital communication
Mouth is put to Laser Driven, reception limit, clock and numeral recover a series of units such as chip, transmitting-receiving optical device and be adjusted and control
Optical module is set to reach optimal working condition.And communication control chip has the work(for collecting the working condition when front optical module
Can, after the working condition (including optical module shell temperature) of optical module is carried out into signal transacting, the communication equipment of upstream is reported, it is easy to
Upstream communication device real-time monitoring works as front optical module working condition.Under abnormality, upstream communication equipment can be by control
Chip makes corresponding protection to optical module.
What deserves to be explained is, the driving chip in the embodiment of the present invention refers to any in low-temperature zone and optical module in optical module
Shell temperature is presented the driving chip of linear relationship, and the driving chip of such as Laser Driven receives and dispatches driving chip of optical device etc..This hair
The quantity of the driving chip chosen in bright embodiment is not specifically limited.The low temperature threshold chosen in the embodiment of the present invention it is interval and
The interval quantity of high temperature threshold value is not specifically limited.
For example, use two driving chips, each driving chip to correspond to a low temperature threshold interval respectively in low-temperature range,
Driving chip or the interval basis for selecting of the corresponding low temperature threshold of driving chip are exactly that driving chip is in corresponding low temperature threshold
In interval, driving chip temperature is presented clear and definite linear relationship with optical module skin temperature.
What deserves to be explained is, in above method flow, driving chip temperature sampling value, by the TEMP in driving chip
The temperature value of device collection.Control chip temperature sampling value, the temperature value gathered by the temperature sensor in control chip.
On the temperature sensor on driving chip, driving chip, control chip and control chip in the embodiment of the present invention
Temperature sensor annexation referring to accompanying drawing 2.
Driving chip temperature sampling value represents driving chip temperature, above-mentioned low temperature threshold interval and above-mentioned driving chip
The linear relationship that temperature sampling value meets with optical module shell temperature is in low temperature according to optical module internal drive chip, optical module shell
What the hot simulation analysis result under environment was obtained.Optical module internal drive chip, optical module shell heat at low ambient temperatures are imitated
True analysis result is relevant with optical module internal drive chip, optical module shell thermal characteristics at low ambient temperatures.
Control chip temperature sampling value represents control chip temperature, and above-mentioned high temperature threshold value is interval, above-mentioned control chip temperature
The linear relationship that sampled value and optical module shell temperature meet is in high temperature, normal according to optical module internal control chip, optical module shell
What the hot simulation analysis result under warm environment was obtained.Optical module internal control chip, optical module shell are under high temperature, normal temperature environment
Hot simulation analysis result it is related to optical module internal control chip, thermal characteristics of the optical module shell under high temperature, normal temperature environment.
Further, in above method flow, low temperature threshold is interval and the interval composition optical module shell temperature of high temperature threshold value complete
Between warm area, wherein, high temperature threshold value is interval also comprising the temperature value that normal temperature is interval.
Different optical modules, because in the control chip or optical module in optical module choose driving chip specification not
Together, the difference of thermal characteristics at different temperatures, therefore, the corresponding low temperature threshold of different optical modules is interval and high temperature threshold value area
Between slightly difference.
Optionally, low temperature threshold interval is：- 40 DEG C~25 DEG C.
Optionally, high temperature threshold value interval is：25 DEG C~100 DEG C.
Further, above-mentioned steps 102, including：
According to the linear relationship that driving chip temperature sampling value and optical module shell temperature meet, it is determined that the driving chip temperature for obtaining
Temperature compensation value corresponding to degree sampled value；
According to temperature compensation value, the driving chip temperature sampling value to obtaining is compensated, and obtains the of optical module shell temperature
Two output valves.
Further, after above-mentioned steps 102, also include：To the second output valve of external equipment output light module case temperature.
External equipment is the communication equipment of upstream, is easy to upstream communication device real-time monitoring when the optical module skin temperature of front optical module.
Optical module reports the output valve of optical module shell temperature by control chip communication interface upstream device.
Further, above-mentioned steps 104 include：
According to the linear relationship that control chip temperature sampling value and optical module shell temperature meet, it is determined that the control chip temperature for obtaining
Temperature compensation value corresponding to degree sampled value；
According to temperature compensation value, the control chip temperature sampling value to obtaining is compensated, and obtains the of optical module shell temperature
Three output valves.
Further, after above-mentioned steps 104, also include：To the 3rd output valve of external equipment output light module case temperature.
It is easy to upstream communication device real-time monitoring when the optical module skin temperature of front optical module.
Example one specific embodiment is illustrated to above method flow below.
As shown in figure 3, specifically including following steps：
Step 301, control chip obtains the output valve T0 (if T0=30 DEG C) of optical module shell temperature；
Step 302, control chip judges whether the output valve T0 of optical module shell temperature is interval in low temperature threshold, wherein low temperature
Threshold interval is (- 40 DEG C, 25 DEG C)；If it is not, into step 303；If so, into step 306；
Step 303, control chip determines that the output valve T0 of optical module shell temperature is in high temperature threshold value interval, wherein, high temperature threshold
It is (25 DEG C, 100 DEG C) that value is interval；Into step 304；
Step 304, control chip obtains control chip temperature sampling value T1, and control chip temperature expires with optical module shell temperature
The linear relationship of foot, if control chip temperature is the second linear relationship with the linear relationship of the satisfaction of optical module shell temperature, according to
Second linear relationship, determines temperature compensation value t1 (can be on the occasion of can also be negative value)；And enter step 305；
Step 305, control chip is compensated according to temperature compensation value t1 to control chip temperature sampling value T1, is calculated
The output valve T2 (if T3=-5 DEG C) of light extraction module case temperature；By in the value assignment of output valve T2 to T0 (by optical module shell temperature
Output valve T0 replaces with the output valve T2 of optical module shell temperature), return to step 301；
Step 306, control chip obtains driving chip temperature sampling value T3, and driving chip temperature expires with optical module shell temperature
Sufficient linear relationship, if it is the first linear relationship with the linear relationship of the satisfaction of optical module shell temperature to drive chip temperature processed, according to
First sexual intercourse, determines temperature compensation value t2 (can be on the occasion of can also be negative value)；And enter step 307；
Step 307, control chip is compensated according to temperature compensation value t2 to driving chip temperature sampling value T3, is calculated
The output valve T4 of light extraction module case temperature；(the output valve T0 of optical module shell temperature will be replaced with the value assignment of output valve T2 to T0
The output valve T4 of optical module shell temperature), return to step 301.
In above method flow, the linear pass presented under high temperature, normal temperature by control chip temperature and optical module shell temperature
System, and the linear relationship that driving chip temperature is presented at low temperature with optical module shell temperature, set low temperature threshold interval and high temperature
Threshold interval, and the temperature sampling source of optical module high temperature section and normal temperature section is done using control chip, optical mode is done using driving chip
The temperature sampling source of block low-temperature zone.When determining that optical module shell temperature is in low temperature threshold interval, temperature sampling source is switched to
Driving chip, obtains optical module driving chip temperature sampling value；And then showed with optical module shell temperature according to driving chip temperature
Linear relationship determine optical module shell temperature；When determining that optical module shell temperature is in high temperature threshold value interval, by temperature sampling source
Control chip is switched to, control chip temperature sampling value is obtained；And then showed with optical module shell temperature according to control chip temperature
Linear relationship determine optical module shell temperature, with full temperature scope in the prior art in all using control chip temperature and optical module shell
The corresponding relation of temperature is compared calculating optical module shell temperature, and driving chip is chosen as temperature sampling source in low-temperature zone, in high temperature and
Normal temperature section is using control chip as temperature sampling source, it is ensured that in the optical module shell temperature of each temperature section be all accurate, it is ensured that
The monitoring precision of optical module shell temperature of the optical module in full temperature scope.
Based on above method flow, a kind of optical module shell temperature supervising device is the embodiment of the invention provides, these devices
The content that content is recorded referring to above-described embodiment, is not repeated herein.
As shown in figure 4, the embodiment of the present invention provides a kind of optical module shell temperature supervising device, optical module shell temperature supervising device should
In the control chip in optical module, including：
First reporting unit 401, for reporting driving chip temperature sampling value to processing unit 403；
Second reporting unit 402, for reporting control chip temperature sampling value to processing unit 403；
Processing unit 403, for the first output valve according to optical module shell temperature, determines that the first output valve is in low temperature threshold
When interval, the driving chip temperature sampling value that the first reporting unit 401 is reported is obtained；Low temperature threshold area is in optical module shell temperature
Between when, driving chip temperature sampling value and optical module shell temperature meet linear relationship；According to driving chip temperature sampling value and driving
The linear relationship that chip temperature sampled value meets with optical module shell temperature, determines the second output valve of optical module shell temperature；
Processing unit, is additionally operable to the first output valve according to optical module shell temperature, determines that the first output valve is in high temperature threshold value
When interval, the control chip temperature sampling value that the second reporting unit 402 is reported is obtained；High temperature threshold value area is in optical module shell temperature
Between when, control chip temperature sampling value and optical module shell temperature meet linear relationship；According to control chip temperature sampling value and control
The linear relationship that chip temperature sampled value meets with optical module shell temperature, determines the 3rd output valve of optical module shell temperature.
Further, processing unit 403 specifically for：
According to the linear relationship that driving chip temperature sampling value and optical module shell temperature meet, it is determined that the driving chip temperature for obtaining
Temperature compensation value corresponding to degree sampled value；
According to temperature compensation value, driving chip temperature sampling value is compensated, obtain the second output of optical module shell temperature
Value.
Further, processing unit 403 specifically for：
According to the linear relationship that control chip temperature sampling value and optical module shell temperature meet, it is determined that the control chip temperature for obtaining
Temperature compensation value corresponding to degree sampled value；
According to temperature compensation value, control chip temperature sampling value is compensated, obtain the 3rd output of optical module shell temperature
Value.
Further, as shown in figure 5, also including output unit 404；
Processing unit 403, be additionally operable to it is determined that after the second output valve of optical module shell temperature, indicate output unit 404 to
External equipment exports the second output valve；
Output unit 404, for the instruction according to processing unit 403, the second output valve is exported to external equipment；
Processing unit 403, be additionally operable to it is determined that after the 3rd output valve of optical module shell temperature, indicate output unit 404 to
External equipment exports the 3rd output valve；
Output unit 404, is additionally operable to the instruction according to processing unit 403, and the 3rd output valve is exported to external equipment.
Further, low temperature threshold is interval and between the interval full warm area for constituting optical module shell temperature of high temperature threshold value, wherein wherein,
Low temperature threshold interval is：- 40 DEG C~25 DEG C；High temperature threshold value interval is：25 DEG C~100 DEG C.
In above-described embodiment, the control chip presented under high temperature, normal temperature by control chip temperature and optical module shell temperature
The linear relationship that temperature sampling value meets with optical module shell temperature, and driving chip temperature is presented at low temperature with optical module shell temperature
The linear relationship that meets of driving chip temperature sampling value and optical module shell temperature, set that low temperature threshold is interval and high temperature threshold value area
Between, and using control chip do optical module high temperature section and normal temperature section temperature sampling source, optical module low temperature is done using driving chip
The temperature sampling source of section.When determining that optical module shell temperature is in low temperature threshold interval, temperature sampling source is switched into driving core
Piece, obtains optical module driving chip temperature sampling value；And then it is linear with what optical module shell temperature showed according to driving chip temperature
Relation determines optical module shell temperature；When determining that optical module shell temperature is in high temperature threshold value interval, temperature sampling source is switched to
Control chip, obtains control chip temperature sampling value；And then it is linear with what optical module shell temperature showed according to control chip temperature
Relation determines optical module shell temperature, with optical module shell temperature right all using control chip temperature with full temperature scope in the prior art
Should be related to compare calculating optical module shell temperature, driving chip be chosen as temperature sampling source in low-temperature zone, in high temperature and normal temperature section
Using control chip as temperature sampling source, it is ensured that in the optical module shell temperature of each temperature section be all accurate, it is ensured that optical mode
The monitoring precision of optical module shell temperature of the block in full temperature scope.
, but those skilled in the art once know basic creation although preferred embodiments of the present invention have been described
Property concept, then can make other change and modification to these embodiments.So, appended claims are intended to be construed to include excellent
Select embodiment and fall into having altered and changing for the scope of the invention.
Obviously, those skilled in the art can carry out various changes and modification without deviating from essence of the invention to the present invention
God and scope.So, if these modifications of the invention and modification belong to the scope of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to comprising these changes and modification.
Claims (10)
1. a kind of optical module shell temperature monitoring method, it is characterised in that including：
In the first output valve according to optical module shell temperature, when determining that first output valve is in low temperature threshold interval, obtain and drive
Dynamic chip temperature sampled value；Optical module shell temperature be in the low temperature threshold it is interval when, driving chip temperature sampling value and optical mode
Block shell temperature meets linear relationship；
It is linear with what optical module shell temperature met according to the driving chip temperature sampling value and the driving chip temperature sampling value
Relation, determines the second output valve of optical module shell temperature；
In first output valve according to optical module shell temperature, when determining that first output valve is in high temperature threshold value interval, obtain
Take control chip temperature sampling value；Optical module shell temperature be in the high temperature threshold value it is interval when, control chip temperature sampling value with
Optical module shell temperature meets linear relationship；
It is linear with what optical module shell temperature met according to the control chip temperature sampling value and the control chip temperature sampling value
Relation, determines the 3rd output valve of optical module shell temperature.
2. the method for claim 1, it is characterised in that according to the driving chip temperature sampling value and the driving core
The linear relationship that piece temperature sampling value meets with optical module shell temperature, determines the second output valve of optical module shell temperature, including：
According to the linear relationship that the driving chip temperature sampling value and optical module shell temperature meet, it is determined that the driving core for obtaining
Temperature compensation value corresponding to piece temperature sampling value；
According to the temperature compensation value, the driving chip temperature sampling value is compensated, obtain the second of optical module shell temperature
Output valve.
3. the method for claim 1, it is characterised in that
It is linear with what optical module shell temperature met according to the control chip temperature sampling value and the control chip temperature sampling value
Relation, determines the 3rd output valve of optical module shell temperature, including：
According to the linear relationship that the control chip temperature sampling value and optical module shell temperature meet, it is determined that the control core for obtaining
Temperature compensation value corresponding to piece temperature sampling value；
According to the temperature compensation value, the control chip temperature sampling value is compensated, obtain the 3rd of optical module shell temperature
Output valve.
4. the method for claim 1, it is characterised in that it is determined that after the second output valve of optical module shell temperature, it is described
Method also includes：
To the second output valve of external equipment output light module case temperature；
It is determined that after the 3rd output valve of optical module shell temperature, methods described also includes：
To the 3rd output valve of the external equipment output light module case temperature.
5. the method as any one of Claims 1-4, it is characterised in that the interval and described high temperature of the low temperature threshold
Between threshold interval constitutes the full warm area of optical module shell temperature, wherein, the low temperature threshold interval is：- 40 DEG C~25 DEG C；The high temperature
Threshold interval is：25 DEG C~100 DEG C.
6. a kind of optical module shell temperature supervising device, it is characterised in that including：
First reporting unit, for reporting driving chip temperature sampling value to the processing unit；
Second reporting unit, for reporting optical module control chip temperature sampling value to the processing unit；
Processing unit, in the first output valve according to optical module shell temperature, determining that first output valve is in low temperature threshold
When interval, the driving chip temperature sampling value that first reporting unit is reported is obtained；The low temperature is in optical module shell temperature
During threshold interval, driving chip temperature sampling value meets linear relationship with optical module shell temperature；Adopted according to the driving chip temperature
The linear relationship that sample value and the driving chip temperature sampling value meet with optical module shell temperature, determines that the second of optical module shell temperature is defeated
Go out value；
The processing unit, is additionally operable to, in first output valve according to optical module shell temperature, determine at first output valve
When high temperature threshold value is interval, the control chip temperature sampling value that second reporting unit is reported is obtained；At optical module shell temperature
When the high temperature threshold value is interval, control chip temperature sampling value meets linear relationship with optical module shell temperature；According to the control
The linear relationship that chip temperature sampled value and the control chip temperature sampling value meet with optical module shell temperature, determines optical module shell
3rd output valve of temperature.
7. device as claimed in claim 6, it is characterised in that the processing unit specifically for：
According to the linear relationship that the driving chip temperature sampling value and optical module shell temperature meet, it is determined that the driving core for obtaining
Temperature compensation value corresponding to piece temperature sampling value；
According to the temperature compensation value, the driving chip temperature sampling value is compensated, obtain the second of optical module shell temperature
Output valve.
8. device as claimed in claim 6, it is characterised in that the processing unit specifically for：
According to the linear relationship that the control chip temperature sampling value and optical module shell temperature meet, it is determined that the control core for obtaining
Temperature compensation value corresponding to piece temperature sampling value；
According to the temperature compensation value, the control chip temperature sampling value is compensated, obtain the 3rd of optical module shell temperature
Output valve.
9. device as claimed in claim 6, it is characterised in that also including output unit；
The processing unit, is additionally operable to it is determined that after the second output valve of optical module shell temperature, indicating the output unit outside
Portion's equipment exports second output valve；
The output unit, for the instruction according to the processing unit, second output valve is exported to the external equipment；
The processing unit, is additionally operable to it is determined that after the 3rd output valve of optical module shell temperature, indicating the output unit to institute
State external equipment and export the 3rd output valve；
The output unit, is additionally operable to the instruction according to the processing unit, to external equipment output the 3rd output
Value.
10. the device as any one of claim 6 to 9, it is characterised in that
Between the interval full warm area for constituting optical module shell temperature of the interval and described high temperature threshold value of the low temperature threshold, wherein wherein, it is described
Low temperature threshold interval is：- 40 DEG C~25 DEG C；The high temperature threshold value interval is：25 DEG C~100 DEG C.
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