CN106774503B - A kind of optical module shell temperature monitoring method and device - Google Patents
A kind of optical module shell temperature monitoring method and device Download PDFInfo
- Publication number
- CN106774503B CN106774503B CN201611091777.9A CN201611091777A CN106774503B CN 106774503 B CN106774503 B CN 106774503B CN 201611091777 A CN201611091777 A CN 201611091777A CN 106774503 B CN106774503 B CN 106774503B
- Authority
- CN
- China
- Prior art keywords
- temperature
- optical module
- module shell
- value
- output valve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
Abstract
The invention discloses a kind of optical module shell temperature monitoring method and device, to improve optical module shell temperature each temperature section monitoring precision.This method includes：According to the first output valve of optical module shell temperature；When determining that the first output valve is in low temperature threshold section, driving chip temperature sampling value is obtained；According to driving chip temperature sampling value and the linear relationship met with optical module shell temperature, the second output valve of optical module shell temperature is determined；According to the second output valve of optical module shell temperature, when determining that the second output valve is in high temperature threshold value section, control chip temperature sampled value is obtained；According to control chip temperature sampled value and the linear relationship met with optical module shell temperature, the third output valve of optical module shell temperature is determined.The monitoring that different temperature sampling sources carries out optical module shell temperature, monitoring precision of the raising optical module shell temperature in each temperature section are chosen in different temperature sections.
Description
Technical field
The present embodiments relate to field of communication technology more particularly to a kind of optical module shell temperature monitoring method and devices.
Background technology
Recently as the rapid development of the communications industry, more and more communication equipments are applied to increasingly harsher nature
In environment, requirement of the extreme weather conditions to temperature of communication equipment adaptability is continuously improved.Accurate monitoring temperature can be more
Good reflection adjusts for optical module self-adaptive when the working condition of front optical module and improves more accurate temperature reference.It also can be timely
Temperature warning made to overtemperature applicable cases, trigger equipment protection functional circuit, prevent overtemperature from applying caused by equipment not
Reversible damage.
But current optical module shell temperature monitoring, the basic temperature sensor using optical module control chip interior carry out temperature
Sampling, then fits current shell temperature with algorithm.Since control chip itself is also as one of the pyrotoxin in optical module, no
Synthermal lower control chip fever itself and heat dissipation effect are different, calorific value of the control chip relative to module under different temperatures
It is also different with heat dissipation capacity, cause this shell temperature monitor mode to report precision different in different temperatures section, portion temperature section occurs
The precision that reports can degradation.When product is produced in batches, due to the consistency meeting of the temperature sensor of control chip interior
Variant, portion temperature section reports accuracy error that will be further amplified.These problems cause optical module producer in production
Shell temperature in order to meet module reports precision, generally requires that mass production resource, production efficiency is spent to be difficult to improve.
To sum up, chip is controlled come when monitoring optical module shell temperature using optical module in the prior art, the prison in different temperatures section
Control precision there is technical issues that.
Invention content
A kind of optical module shell temperature monitoring method of present invention offer and device, to solve to use optical module control in the prior art
Coremaking piece is come when monitoring optical module shell temperature, the monitoring precision in different temperatures section there is technical issues that.
The embodiment of the present invention provides a kind of optical module shell temperature monitoring method, including：
According to the first output valve of optical module shell temperature；When determining that first output valve is in low temperature threshold section, obtain
Driving chip temperature sampling value；When optical module shell temperature is in the low temperature threshold section, driving chip temperature sampling value and light
Module case temperature meets linear relationship；
Met with optical module shell temperature according to the driving chip temperature sampling value and the driving chip temperature sampling value
Linear relationship determines the second output valve of optical module shell temperature；
According to first output valve of optical module shell temperature, when determining that first output valve is in high temperature threshold value section,
Obtain control chip temperature sampled value；When optical module shell temperature is in the high temperature threshold value section, chip temperature sampled value is controlled
Meet linear relationship with optical module shell temperature；
Met with optical module shell temperature according to the control chip temperature sampled value and the control chip temperature sampled value
Linear relationship determines the third output valve of optical module shell temperature.
The embodiment of the present invention provides a kind of optical module shell temperature monitoring device, including：
First reporting unit, for reporting driving chip temperature sampling value to the processing unit；
Second reporting unit, for reporting optical module to control chip temperature sampled value to the processing unit；
Processing unit determines that first output valve is in low temperature threshold for the first output valve according to optical module shell temperature
When being worth section, the driving chip temperature sampling value that first reporting unit reports is obtained；It is in described low in optical module shell temperature
When warm threshold interval, driving chip temperature sampling value meets linear relationship with optical module shell temperature；According to the driving chip temperature
The linear relationship that sampled value and the driving chip temperature sampling value meet with optical module shell temperature, determines the second of optical module shell temperature
Output valve；
The processing unit is additionally operable to first output valve according to optical module shell temperature, determines first output valve
When in high temperature threshold value section, the control chip temperature sampled value that second reporting unit reports is obtained；In optical module shell temperature
When in the high temperature threshold value section, control chip temperature sampled value meets linear relationship with optical module shell temperature；According to the control
The linear relationship that coremaking piece temperature sampling value and the control chip temperature sampled value meet with optical module shell temperature, determines optical module
The third output valve of shell temperature.
In above-described embodiment, linear relationship is presented under high temperature, room temperature with optical module shell temperature by controlling chip temperature, with
And linear relationship is presented with optical module shell temperature in driving chip temperature at low temperature, and low temperature threshold section and high temperature threshold value area is arranged
Between, and control chip is used to do the temperature sampling source of optical module high temperature section and room temperature section, optical module low temperature is done using driving chip
The temperature sampling source of section.When determining that optical module shell temperature is in low temperature threshold section, temperature sampling source is switched to driving core
Piece obtains optical module driving chip temperature sampling value；It is showed in turn with optical module shell temperature according to driving chip temperature linear
Relationship determines optical module shell temperature；When determining that optical module shell temperature is in high temperature threshold value section, temperature sampling source is switched to
Chip is controlled, control chip temperature sampled value is obtained；It is showed in turn with optical module shell temperature according to control chip temperature linear
Relationship determines optical module shell temperature, in complete warm range in the prior art all using pair of control chip temperature and optical module shell temperature
It should be related to and be compared to calculate optical module shell temperature, driving chip is chosen as temperature sampling source, in high temperature and room temperature section in low-temperature zone
Using control chip as temperature sampling source, it is ensured that in the optical module shell temperature of each temperature section be all accurate, ensure that optical mode
The monitoring precision of optical module shell temperature of the block in complete warm range.
Description of the drawings
Attached drawing is used to provide further understanding of the present invention, and a part for constitution instruction, is implemented with the present invention
Example is used to explain the present invention together, not be construed as limiting the invention.In the accompanying drawings：
Fig. 1 is a kind of method flow diagram of optical module shell temperature monitoring method provided in an embodiment of the present invention；
Fig. 2 is the connection relation that a kind of optical module provided in an embodiment of the present invention controls chip and driving chip；
Fig. 3 is a kind of method flow diagram of optical module shell temperature monitoring method provided in an embodiment of the present invention；
Fig. 4 is a kind of structural schematic diagram of optical module shell temperature monitoring device provided in an embodiment of the present invention；
Fig. 5 is a kind of structural schematic diagram of optical module shell temperature monitoring device provided in an embodiment of the present invention.
Specific implementation mode
In order to make technical problem solved by the invention, technical solution and it is effective be more clearly understood, below in conjunction with
Preferred embodiment of the present invention will be described for Figure of description, it should be understood that preferred embodiment described herein is only used for
The description and interpretation present invention, is not intended to limit the present invention.And in the absence of conflict, the embodiment and reality in the application
The feature applied in example can be combined with each other.
First, it is worth noting that, the optical module shell temperature in the embodiment of the present invention represents the temperature of optical module shell, optical mode
Block shell temperature is influenced by the environment temperature of optical module, and usual optical module shell temperature is obtained by carrying out linear compensation to control chip temperature
It arrives.Optical module environment temperature refers to the air themperature of optical module working environment.Driving chip temperature refers to the temperature on driving chip
Spend the temperature of sensor detection.Control chip temperature is the temperature detected by controlling the temperature sensor of chip interior.
Since control chip is in different spatial positions from optical module shell, skin temperature exists with control chip temperature
The temperature difference, control chip temperature are not directly equal to current optical module shell temperature.Existing optical module shell temperature monitor mode is：First
The temperature value of optical module control chip interior temperature sensor is obtained, then the temperature value of this temperature sensor is fitted, is counted
Current optical module shell temperature value is calculated, the communication equipment of upstream then will be reported to when front housing temperature value.
But since control chip itself is also as one of the pyrotoxin in optical module, chip sheet is controlled under different temperatures
Body generates heat and heat dissipation effect is different, and calorific value and heat dissipation capacity of the control chip relative to module are also different under different temperatures, lead
This optical module shell temperature monitor mode is caused to report precision different in different temperatures section.
In order to improve the monitoring precision of optical module shell temperature, the inventors found that：
The variation of optical module environment temperature can have an impact the thermal characteristics of optical module.In most of temperature range, control
Linear relationship is presented with optical module shell temperature in chip temperature processed, but in other temperature ranges, such as low-temperature range, controls chip temperature
Non-linear relation is presented with optical module shell temperature.
When monitoring optical module shell temperature, even if being compensated using Different Slope in different temperatures section, the light after compensation
Module case temperature still can have relatively large deviation in portion temperature section.
Want by algorithm full temperature section by optical module shell temperature with control chip temperature be accurately mapped it is extremely difficult.
Especially in large-scale production process, still have compared with multivariable, such as device consistency, environment temperature difference, it can be to optical module shell
The calibration value of temperature has an impact.
The present inventor also found during solving above-mentioned technical problem：
First, in room temperature, high temperature section, control chip temperature shows linear relationship with optical module shell temperature, and control chip is suitable
Close do optical module room temperature, high temperature section temperature sampling source；
The power consumption for controlling chip is very low for optical module other devices, in contrast calorific value is also minimum
's.When optical module is in high temperature, room temperature temperature range, the heat inside optical module is dissipated by the surface of optical module shell
Hair, optical module shell temperature is less than the larger device of internal calorific power at this time.According to room temperature end, the hot simulation analysis knot of high temperature section
Fruit, since control chip is relatively low with respect to calorific value, control chip temperature is in a linear zone with optical module shell temperature correspondence,
It only needs to do simple compensation to control chip temperature, can obtain accurate optical module shell temperature value.Therefore, control chip is suitble to
Do optical module room temperature, high temperature section temperature sampling source.
Second, in entire low-temperature zone, control chip temperature shows non-linear relation with optical module shell temperature, and control chip is not
It is suitble to do the temperature sampling source of optical module low-temperature zone；
It was found by the inventors of the present invention that when optical module is in the working environment of low temperature, the shell temperature of optical module is higher than environment
Temperature.According to the hot simulation analysis of low-temperature zone as a result, under different conditions, the variation of optical module shell temperature and optical module environment temperature
Show nonlinear relationship.At this time since control chip calorific value is too low, and the temperature of module other parts device is far above
Control chip temperature.It controls chip calorific value and optical module case surface heat dissipation deviation is excessive, and be difficult to find out optical module shell temperature
The accurate correspondence between control chip temperature.Therefore, in entire low-temperature zone, control chip since calorific value itself is low,
And heat is rapidly losing, control chip temperature shows non-linear relation with optical module shell temperature.
Third, in entire low-temperature zone, linear relationship is presented with optical module shell temperature in driving chip temperature, and driving chip is suitble to do
The temperature sampling source of optical module low-temperature zone.
It was found by the inventors of the present invention that the driving chip of optical module assumes responsibility for optical module Electric signal processing, optical device electric current
The functions such as driving, power consumption is maximum, is the main heating source of optical module.At low ambient temperatures, with the reduction of ambient temperature, light
The heat energy Quick diffusing of module housing.Driving chip temperature is no longer concentrated under low temperature, and even heat is distributed on pcb board,
From the point of view of the hot simulation result of low-temperature zone, driving chip temperature shows a kind of linear relationship with optical module shell temperature.Therefore, low
Temperature section, optical module driving chip temperature show simple linear relationship with optical module shell temperature, and driving chip is suitble to do optical module
The temperature sampling source of low-temperature zone.
4th, in high temperature section, driving chip temperature shows non-linear relation with optical module shell temperature, and driving chip is not suitable for
Do the temperature sampling source of optical module high temperature section.
It was found by the inventors of the present invention that the main heating source of optical module comes from driving chip.According to the heat emulation of high temperature section
Analysis result, driving chip temperature is the thermal self-restraint stress of all devices on pcb board, and heat is concentrated.At this point, driving chip temperature
Degree will present out a kind of non-linear relation with optical module shell temperature (optical mode deblocking temperature).In high temperature section, since the difference of optical device is special
Property, the size deviation of the driving current of different driving chip is larger, and the calorific value deviation of different driving chip is larger, it is difficult to unite
One.In high temperature section, if will face algorithm consistency using driving chip as temperature sampling source, therefore, core is driven
Piece is not suitable for doing the temperature sampling source of optical module high temperature section.
It was found by the inventors of the present invention that the fever trend of optical module shell temperature is identical as hot environment.
Optical module internal drive chip, control chip, the optical module shell of above-mentioned analysis based on the present inventor
Thermal characteristics at different temperatures, the present inventor propose following optical module shell temperature calibration program, and inventive concept is：
The temperature sampling source that optical module high temperature section and room temperature section are done using control chip, the temperature of optical module low-temperature zone is done using driving chip
Spend sampling source.
Foregoing invention design based on the present inventor, as shown in Figure 1, the embodiment of the present invention provides a kind of optical module
Shell temperature monitoring method, including：
Step 101, in the first output valve according to optical module shell temperature；Determine that the first output valve is in low temperature threshold section
When, obtain driving chip temperature sampling value；When optical module shell temperature is in low temperature threshold section, driving chip temperature sampling value with
Optical module shell temperature meets linear relationship；
Step 102, met with optical module shell temperature according to driving chip temperature sampling value and driving chip temperature sampling value
Linear relationship determines the second output valve of optical module shell temperature；
Step 103, in the first output valve according to optical module shell temperature, determine that the first output valve is in high temperature threshold value section
When, obtain control chip temperature sampled value；When optical module shell temperature is in high temperature threshold value section, control chip temperature sampled value with
Optical module shell temperature meets linear relationship；
Step 104, according to the control chip temperature sampled value of acquisition and control chip temperature sampled value and optical module shell temperature
The linear relationship of satisfaction determines the third output valve of optical module shell temperature.
Above method flow is executed by the control chip in optical module.Control chip in the embodiment of the present invention, refers to working as
The communication control chip used in most optical module in preceding optical communications industry.Communication control chip can be connect by its digital communication
Mouthful to Laser Driven, receive limit put, clock and number restores chip, a series of units of transmitting-receiving optical device etc. are adjusted and control
Optical module is set to reach best working condition.And communication control chip has the work(collected when the working condition of front optical module
Can, after the working condition (including optical module shell temperature) of optical module is carried out signal processing, it is reported to the communication equipment of upstream, is convenient for
Upstream communication device real-time monitoring works as front optical module working condition.Under abnormality, upstream communication equipment can pass through control
Chip makes corresponding protection to optical module.
It is worth noting that the driving chip in the embodiment of the present invention refers to any in low-temperature zone and optical module in optical module
The driving chip of linear relationship, such as the driving chip of Laser Driven is presented in shell temperature, receives and dispatches the driving chip etc. of optical device.This hair
The quantity for the driving chip chosen in bright embodiment is not specifically limited.The low temperature threshold section chosen in the embodiment of the present invention and
The quantity in high temperature threshold value section is not specifically limited.
For example, use two driving chips, each driving chip to correspond to a low temperature threshold section respectively in low-temperature range,
Driving chip or the basis for selecting in the corresponding low temperature threshold section of driving chip are exactly that driving chip is in corresponding low temperature threshold
In section, specific linear relationship is presented with optical module skin temperature in driving chip temperature.
It is worth noting that in above method flow, driving chip temperature sampling value, by the temperature sensing in driving chip
The temperature value of device acquisition.Chip temperature sampled value is controlled, by the temperature value of the temperature sensor acquisition in control chip.
On the temperature sensor on driving chip, driving chip, control chip and control chip in the embodiment of the present invention
Temperature sensor connection relation referring to attached drawing 2.
Driving chip temperature sampling value represents driving chip temperature, above-mentioned low temperature threshold section and above-mentioned driving chip
The linear relationship that temperature sampling value meets with optical module shell temperature is according to optical module internal drive chip, optical module shell in low temperature
What the hot simulation analysis result under environment obtained.Optical module internal drive chip, the heat of optical module shell at low ambient temperatures are imitative
True analysis result is related with optical module internal drive chip, the thermal characteristics of optical module shell at low ambient temperatures.
It controls chip temperature sampled value and represents control chip temperature, above-mentioned high temperature threshold value section, above-mentioned control chip temperature
The linear relationship that sampled value and optical module shell temperature meet be according to optical module internal control chip, optical module shell in high temperature, often
What the hot simulation analysis result under warm environment obtained.Optical module internal control chip, optical module shell are under high temperature, normal temperature environment
Hot simulation analysis result it is related to optical module internal control chip, thermal characteristics of the optical module shell under high temperature, normal temperature environment.
Further, in above method flow, low temperature threshold section and high temperature threshold value section constitute the complete of optical module shell temperature
Between warm area, wherein high temperature threshold value section also includes the temperature value in room temperature section.
Different optical modules, because the driving chip chosen in the control chip or optical module in optical module specification not
Together, the difference of thermal characteristics at different temperatures, therefore, the corresponding low temperature threshold section of different optical modules and high temperature threshold value area
Between slightly difference.
Optionally, low temperature threshold section is：- 40 DEG C~25 DEG C.
Optionally, high temperature threshold value section is：25 DEG C~100 DEG C.
Further, above-mentioned steps 102, including：
According to the linear relationship that driving chip temperature sampling value and optical module shell temperature meet, the driving chip temperature obtained is determined
Spend the temperature compensation value corresponding to sampled value；
According to temperature compensation value, the driving chip temperature sampling value of acquisition is compensated, obtains the of optical module shell temperature
Two output valves.
Further, after above-mentioned steps 102, further include：To the second output valve of external equipment output light module case temperature.
External equipment is the communication equipment of upstream, and the optical module skin temperature of front optical module is worked as convenient for upstream communication device real-time monitoring.
Optical module reports the output valve of optical module shell temperature by controlling chip communication interface upstream device.
Further, above-mentioned steps 104 include：
According to the linear relationship that control chip temperature sampled value meets with optical module shell temperature, the control chip temperature obtained is determined
Spend the temperature compensation value corresponding to sampled value；
According to temperature compensation value, the control chip temperature sampled value of acquisition is compensated, obtains the of optical module shell temperature
Three output valves.
Further, after above-mentioned steps 104, further include：To the third output valve of external equipment output light module case temperature.
Work as the optical module skin temperature of front optical module convenient for upstream communication device real-time monitoring.
Example one specific embodiment illustrates above method flow below.
As shown in figure 3, specifically including following steps：
Step 301, control chip obtains the output valve T0 (if T0=30 DEG C) of optical module shell temperature；
Step 302, control chip judges whether the output valve T0 of optical module shell temperature is in low temperature threshold section, wherein low temperature
Threshold interval is (- 40 DEG C, 25 DEG C)；If it is not, entering step 303；If so, entering step 306；
Step 303, control chip determines that the output valve T0 of optical module shell temperature is in high temperature threshold value section, wherein high temperature threshold
It is (25 DEG C, 100 DEG C) to be worth section；Enter step 304；
Step 304, control chip obtains control chip temperature sampled value T1, and control chip temperature is expired with optical module shell temperature
The linear relationship of foot, if the linear relationship of control chip temperature and the satisfaction of optical module shell temperature is the second linear relationship, according to
Second linear relationship determines temperature compensation value t1 (can be positive value can also be negative value)；And enter step 305；
Step 305, control chip compensates control chip temperature sampled value T1, calculates according to temperature compensation value t1
The output valve T2 (if T3=-5 DEG C) of light extraction module case temperature；By in the value assignment to T0 of output valve T2 (by optical module shell temperature
Output valve T0 replaces with the output valve T2 of optical module shell temperature), return to step 301；
Step 306, control chip obtains driving chip temperature sampling value T3, and driving chip temperature expires with optical module shell temperature
Sufficient linear relationship, if the linear relationship of driving chip temperature processed and the satisfaction of optical module shell temperature is the first linear relationship, according to
Temperature compensation value t2 (can be positive value can also be negative value) is determined in first sexual intercourse；And enter step 307；
Step 307, control chip compensates driving chip temperature sampling value T3 according to temperature compensation value t2, calculates
The output valve T4 of light extraction module case temperature；(the output valve T0 of optical module shell temperature will be replaced in the value assignment to T0 of output valve T2
The output valve T4 of optical module shell temperature), return to step 301.
In above method flow, the linear pass that is presented under high temperature, room temperature by controlling chip temperature and optical module shell temperature
The linear relationship that system and driving chip temperature are presented at low temperature with optical module shell temperature, is arranged low temperature threshold section and high temperature
Threshold interval, and control chip is used to do the temperature sampling source of optical module high temperature section and room temperature section, optical mode is done using driving chip
The temperature sampling source of block low-temperature zone.When determining that optical module shell temperature is in low temperature threshold section, temperature sampling source is switched to
Driving chip obtains optical module driving chip temperature sampling value；And then it is showed according to driving chip temperature and optical module shell temperature
Linear relationship determine optical module shell temperature；When determining that optical module shell temperature is in high temperature threshold value section, by temperature sampling source
Chip, acquisition control chip temperature sampled value in order to control for switching；And then it is showed with optical module shell temperature according to control chip temperature
Linear relationship determine optical module shell temperature, in complete warm range in the prior art all using control chip temperature and optical module shell
Temperature correspondence compared to calculate optical module shell temperature, low-temperature zone choose driving chip be used as temperature sampling source, high temperature with
Room temperature section is using control chip as temperature sampling source, it is ensured that is all accurate in the optical module shell temperature of each temperature section, ensures
The monitoring precision of optical module shell temperature of the optical module in complete warm range.
Based on above method flow, an embodiment of the present invention provides a kind of optical module shell temperature monitoring device, these devices
The content that content is recorded referring to above-described embodiment, is not repeated herein.
As shown in figure 4, the embodiment of the present invention provides a kind of optical module shell temperature monitoring device, optical module shell temperature monitoring device is answered
In control chip in optical module, including：
First reporting unit 401, for reporting driving chip temperature sampling value to processing unit 403；
Second reporting unit 402, for reporting control chip temperature sampled value to processing unit 403；
Processing unit 403 determines that the first output valve is in low temperature threshold for the first output valve according to optical module shell temperature
When section, the driving chip temperature sampling value that the first reporting unit 401 reports is obtained；It is in low temperature threshold area in optical module shell temperature
Between when, driving chip temperature sampling value and optical module shell temperature meet linear relationship；According to driving chip temperature sampling value and driving
The linear relationship that chip temperature sampled value meets with optical module shell temperature, determines the second output valve of optical module shell temperature；
Processing unit is additionally operable to the first output valve according to optical module shell temperature, determines that the first output valve is in high temperature threshold value
When section, the control chip temperature sampled value that the second reporting unit 402 reports is obtained；It is in high temperature threshold value area in optical module shell temperature
Between when, control chip temperature sampled value and optical module shell temperature meet linear relationship；According to control chip temperature sampled value and control
The linear relationship that chip temperature sampled value meets with optical module shell temperature, determines the third output valve of optical module shell temperature.
Further, processing unit 403 is specifically used for：
According to the linear relationship that driving chip temperature sampling value and optical module shell temperature meet, the driving chip temperature obtained is determined
Spend the temperature compensation value corresponding to sampled value；
According to temperature compensation value, driving chip temperature sampling value is compensated, obtains the second output of optical module shell temperature
Value.
Further, processing unit 403 is specifically used for：
According to the linear relationship that control chip temperature sampled value meets with optical module shell temperature, the control chip temperature obtained is determined
Spend the temperature compensation value corresponding to sampled value；
According to temperature compensation value, control chip temperature sampled value is compensated, obtains the third output of optical module shell temperature
Value.
Further, as shown in figure 5, further including output unit 404；
Processing unit 403 is additionally operable to after the second output valve for determining optical module shell temperature, instruction output unit 404 to
External equipment exports the second output valve；
Output unit 404 exports the second output valve for the instruction according to processing unit 403 to external equipment；
Processing unit 403 is additionally operable to after the third output valve for determining optical module shell temperature, instruction output unit 404 to
External equipment exports third output valve；
Output unit 404 is additionally operable to the instruction according to processing unit 403, and third output valve is exported to external equipment.
Further, between low temperature threshold section and the full warm area of high temperature threshold value section composition optical module shell temperature, wherein wherein,
Low temperature threshold section is：- 40 DEG C~25 DEG C；High temperature threshold value section is：25 DEG C~100 DEG C.
In above-described embodiment, the control chip that is presented under high temperature, room temperature by controlling chip temperature and optical module shell temperature
The linear relationship and driving chip temperature that temperature sampling value meets with optical module shell temperature are presented at low temperature with optical module shell temperature
The linear relationship that meets of driving chip temperature sampling value and optical module shell temperature, low temperature threshold section and high temperature threshold value area are set
Between, and control chip is used to do the temperature sampling source of optical module high temperature section and room temperature section, optical module low temperature is done using driving chip
The temperature sampling source of section.When determining that optical module shell temperature is in low temperature threshold section, temperature sampling source is switched to driving core
Piece obtains optical module driving chip temperature sampling value；It is showed in turn with optical module shell temperature according to driving chip temperature linear
Relationship determines optical module shell temperature；When determining that optical module shell temperature is in high temperature threshold value section, temperature sampling source is switched to
Chip is controlled, control chip temperature sampled value is obtained；It is showed in turn with optical module shell temperature according to control chip temperature linear
Relationship determines optical module shell temperature, in complete warm range in the prior art all using pair of control chip temperature and optical module shell temperature
It should be related to and be compared to calculate optical module shell temperature, driving chip is chosen as temperature sampling source, in high temperature and room temperature section in low-temperature zone
Using control chip as temperature sampling source, it is ensured that in the optical module shell temperature of each temperature section be all accurate, ensure that optical mode
The monitoring precision of optical module shell temperature of the block in complete warm range.
Although preferred embodiments of the present invention have been described, it is created once a person skilled in the art knows basic
Property concept, then additional changes and modifications may be made to these embodiments.So it includes excellent that the following claims are intended to be interpreted as
It selects embodiment and falls into all change and modification of the scope of the invention.
Obviously, various changes and modifications can be made to the invention without departing from essence of the invention by those skilled in the art
God and range.In this way, if these modifications and changes of the present invention belongs to the range of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to include these modifications and variations.
Claims (10)
1. a kind of optical module shell temperature monitoring method, which is characterized in that including：
In the first output valve according to optical module shell temperature, when determining that first output valve is in low temperature threshold section, obtains and drive
Dynamic chip temperature sampled value；When optical module shell temperature is in the low temperature threshold section, driving chip temperature sampling value and optical mode
Block shell temperature meets linear relationship；
Met with optical module shell temperature according to the driving chip temperature sampling value and the driving chip temperature sampling value linear
Relationship determines the second output valve of optical module shell temperature；
It is obtained when determining that first output valve is in high temperature threshold value section according to first output valve of optical module shell temperature
Take control chip temperature sampled value；When optical module shell temperature is in the high temperature threshold value section, control chip temperature sampled value with
Optical module shell temperature meets linear relationship；
Met with optical module shell temperature according to the control chip temperature sampled value and the control chip temperature sampled value linear
Relationship determines the third output valve of optical module shell temperature.
2. the method as described in claim 1, which is characterized in that according to the driving chip temperature sampling value and the driving core
The linear relationship that piece temperature sampling value meets with optical module shell temperature, determines the second output valve of optical module shell temperature, including：
According to the linear relationship that the driving chip temperature sampling value and optical module shell temperature meet, the driving core obtained is determined
Temperature compensation value corresponding to piece temperature sampling value；
According to the temperature compensation value, the driving chip temperature sampling value is compensated, obtains the second of optical module shell temperature
Output valve.
3. the method as described in claim 1, which is characterized in that
Met with optical module shell temperature according to the control chip temperature sampled value and the control chip temperature sampled value linear
Relationship determines the third output valve of optical module shell temperature, including：
According to the linear relationship that the control chip temperature sampled value meets with optical module shell temperature, the control core obtained is determined
Temperature compensation value corresponding to piece temperature sampling value；
According to the temperature compensation value, the control chip temperature sampled value is compensated, the third of optical module shell temperature is obtained
Output valve.
4. the method as described in claim 1, which is characterized in that described after the second output valve for determining optical module shell temperature
Method further includes：
To the second output valve of external equipment output light module case temperature；
After the third output valve for determining optical module shell temperature, the method further includes：
To the third output valve of the external equipment output light module case temperature.
5. method according to any one of claims 1 to 4, which is characterized in that the low temperature threshold section and the high temperature
Threshold interval is constituted between the full warm area of optical module shell temperature, wherein the low temperature threshold section is：- 40 DEG C~25 DEG C；The high temperature
Threshold interval is：25 DEG C~100 DEG C.
6. a kind of optical module shell temperature monitoring device, which is characterized in that including：
First reporting unit, for reporting driving chip temperature sampling value to processing unit；
Second reporting unit, for reporting optical module to control chip temperature sampled value to the processing unit；
Processing unit, in the first output valve according to optical module shell temperature, determining that first output valve is in low temperature threshold
When section, the driving chip temperature sampling value that first reporting unit reports is obtained；It is in the low temperature in optical module shell temperature
When threshold interval, driving chip temperature sampling value meets linear relationship with optical module shell temperature；It is adopted according to the driving chip temperature
The linear relationship that sample value and the driving chip temperature sampling value meet with optical module shell temperature, determines that the second of optical module shell temperature is defeated
Go out value；
The processing unit is additionally operable to, in first output valve according to optical module shell temperature, determine at first output valve
When high temperature threshold value section, the control chip temperature sampled value that second reporting unit reports is obtained；At optical module shell temperature
When the high temperature threshold value section, control chip temperature sampled value meets linear relationship with optical module shell temperature；According to the control
The linear relationship that chip temperature sampled value and the control chip temperature sampled value meet with optical module shell temperature, determines optical module shell
The third output valve of temperature.
7. device as claimed in claim 6, which is characterized in that the processing unit is specifically used for：
According to the linear relationship that the driving chip temperature sampling value and optical module shell temperature meet, the driving core obtained is determined
Temperature compensation value corresponding to piece temperature sampling value；
According to the temperature compensation value, the driving chip temperature sampling value is compensated, obtains the second of optical module shell temperature
Output valve.
8. device as claimed in claim 6, which is characterized in that the processing unit is specifically used for：
According to the linear relationship that the control chip temperature sampled value meets with optical module shell temperature, the control core obtained is determined
Temperature compensation value corresponding to piece temperature sampling value；
According to the temperature compensation value, the control chip temperature sampled value is compensated, the third of optical module shell temperature is obtained
Output valve.
9. device as claimed in claim 6, which is characterized in that further include output unit；
The processing unit is additionally operable to after the second output valve for determining optical module shell temperature, indicates that the output unit is outside
Portion's equipment exports second output valve；
The output unit exports second output valve for the instruction according to the processing unit to the external equipment；
The processing unit is additionally operable to after the third output valve for determining optical module shell temperature, indicates the output unit to institute
It states external equipment and exports the third output valve；
The output unit is additionally operable to the instruction according to the processing unit, and the third output is exported to the external equipment
Value.
10. the device as described in any one of claim 6 to 9, which is characterized in that
The low temperature threshold section and the high temperature threshold value section are constituted between the full warm area of optical module shell temperature, wherein the low temperature
Threshold interval is：- 40 DEG C~25 DEG C；The high temperature threshold value section is：25 DEG C~100 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611091777.9A CN106774503B (en) | 2016-12-01 | 2016-12-01 | A kind of optical module shell temperature monitoring method and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611091777.9A CN106774503B (en) | 2016-12-01 | 2016-12-01 | A kind of optical module shell temperature monitoring method and device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106774503A CN106774503A (en) | 2017-05-31 |
| CN106774503B true CN106774503B (en) | 2018-10-26 |
Family
ID=58913726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611091777.9A Active CN106774503B (en) | 2016-12-01 | 2016-12-01 | A kind of optical module shell temperature monitoring method and device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106774503B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109213231B (en) * | 2018-08-17 | 2022-01-14 | 奥比中光科技集团股份有限公司 | Temperature control system |
| CN111678613A (en) * | 2020-06-11 | 2020-09-18 | 江苏华创微系统有限公司 | DSP chip shell temperature detection method based on shell interior temperature sensing |
| CN115016075B (en) * | 2021-03-04 | 2023-08-18 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN115016076B (en) * | 2021-03-04 | 2023-08-08 | 青岛海信宽带多媒体技术有限公司 | Optical module and optical module shell temperature calculation method |
| CN113503986A (en) * | 2021-05-21 | 2021-10-15 | 武汉联特科技股份有限公司 | Optical module temperature monitoring and calibrating method and device |
| CN113612531A (en) * | 2021-10-09 | 2021-11-05 | 深圳市迅特通信技术股份有限公司 | Method and device for automatically calibrating optical module and storage medium |
| CN117109776B (en) * | 2023-10-24 | 2024-01-19 | 成都明夷电子科技有限公司 | Single-point temperature calibration method for optical module |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004228384A (en) * | 2003-01-23 | 2004-08-12 | Sumitomo Electric Ind Ltd | Light-emitting module and power conduction control system |
| CN102970080A (en) * | 2012-10-31 | 2013-03-13 | 青岛海信宽带多媒体技术有限公司 | Optical module and adjusting method of working temperature of laser thereof |
| CN203166927U (en) * | 2013-03-18 | 2013-08-28 | 青岛海信宽带多媒体技术有限公司 | Bidirectional optical module |
| CN203774607U (en) * | 2014-04-04 | 2014-08-13 | 嘉兴禾润电子科技有限公司 | A temperature compensation circuit applied to a laser diode driver |
| CN106027157B (en) * | 2016-05-16 | 2018-09-07 | 青岛海信宽带多媒体技术有限公司 | The current compensation method and optical module of optical module |
-
2016
- 2016-12-01 CN CN201611091777.9A patent/CN106774503B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN106774503A (en) | 2017-05-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106774503B (en) | A kind of optical module shell temperature monitoring method and device | |
| CN103954022A (en) | Temperature-detection protective device and air conditioner | |
| CN107579429B (en) | Semiconductor laser and temperature control method thereof | |
| CN103401607A (en) | Method and device for acquiring monitoring temperature of optical module | |
| EP2710444B1 (en) | Process device with light change triggered display | |
| CN104165701A (en) | Method and device for detecting abnormal heat dissipation of electronic device | |
| CN108760082A (en) | A kind of smart mobile phone temperature taking method and system | |
| CN105928516A (en) | Inertial measurement unit and heating device thereof, and inertial measurement system | |
| CN102346162B (en) | Active temperature compensation type gas detector and temperature compensation method thereof | |
| CN208272348U (en) | The optics cabin atmosphere monitoring device of great-power solid laser | |
| CN101145058A (en) | Temperature regulation device and method thereof | |
| CN111879417A (en) | Temperature control device and method for thermal infrared imaging module | |
| CN203378990U (en) | Milk heating device based on MCH (metal ceramics heater) | |
| CN205922136U (en) | Automatic accessory drive of artifical high -efficient healing system of grafting | |
| CN215494740U (en) | Constant temperature control device of weather radar receiver | |
| Veeranjaneyulu et al. | Home Automation and Security System Using IOT. | |
| CN203734132U (en) | Laser light source | |
| CN104331110A (en) | Greenhouse temperature adjusting method based on semiconductor temperature control system | |
| CN114877405A (en) | Two-network balance detection system based on sensor fusion | |
| CN204479974U (en) | A kind of heating equipment controller | |
| CN106527537A (en) | Thermal link operating temperature intelligent detector | |
| CN108241393A (en) | Control system, control method and the household electrical appliance of radio temperature sensor | |
| CN201555900U (en) | Device for testing steady state thermal resistance and junction temperature of micro-single-phase full-wave bridge rectifier | |
| CN202216933U (en) | Active temperature compensation type gas detector | |
| CN209615899U (en) | It is a kind of according to the automated system for requiring voluntarily to adjust temperature and humidity maintenance |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |