CN115016076A - Optical module and optical module shell temperature calculation method - Google Patents
Optical module and optical module shell temperature calculation method Download PDFInfo
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- CN115016076A CN115016076A CN202110242148.6A CN202110242148A CN115016076A CN 115016076 A CN115016076 A CN 115016076A CN 202110242148 A CN202110242148 A CN 202110242148A CN 115016076 A CN115016076 A CN 115016076A
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- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
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Abstract
The application discloses an optical module and an optical module shell temperature calculation method, which comprises the following steps: the upper shell, the lower shell and the upper shell cover to form a wrapping cavity. The circuit board is arranged in the wrapping cavity. And the optical transceiving component is arranged in the packaging cavity and is in communication connection with the circuit board. And the MCU is arranged on the circuit board, and different shell temperature calculation formulas are selected to calculate the shell temperature according to the difference between the temperature sampling value and the working voltage of the MCU. The correction value is increased during calibration under the conditions of overvoltage and overtemperature of the optical module, so that the reported precision of the shell temperature meets the specification under the conditions of overvoltage and overtemperature, and the shell temperature precision is improved.
Description
Technical Field
The application relates to the technical field of communication, in particular to an optical module and an optical module shell temperature calculation method.
Background
With the development of new services and application modes such as cloud computing, mobile internet, video and the like, the development and progress of the optical communication technology becomes more and more important. In the optical communication technology, an optical module is a tool for realizing the interconversion of optical signals, and is one of the key components in optical communication equipment, and the transmission rate of the optical module is continuously increased along with the development requirement of the optical communication technology.
DDMI (Digital Diagnostic Monitor)) is also called an intelligent module, and by adding a chip and an auxiliary circuit design, the Digital Diagnostic module can Monitor the temperature, the supply voltage, the laser bias current, and the transmitting and receiving optical power of the transceiver module in real time. The measurement of these parameters can help the management unit to find out the position of fault in the optical fiber link, simplify maintenance work and raise the reliability of the system.
At present, in an optical module, a shell temperature of the optical module is displayed by taking the shell temperature as a reference, and the shell temperature is calculated by using a compensation table by taking the temperature of an MCU as a reference.
However, under the trend of small package of the optical module, when the working voltage of the optical module is greater than 3.4V, the overall power consumption of the module is increased by more than 0.1W compared with 3.3V, and the increased power consumption also affects the heat dissipation of the MCU, but the external environment of the optical module has a good heat dissipation mechanism, so the temperature of the shell is kept at a certain temperature, and the reported temperature of the shell is higher than the temperature of the shell.
Disclosure of Invention
The application provides an optical module shell temperature calibration device and method, which aim to solve the technical problem of improving the accuracy of optical module shell temperature monitoring under overpressure.
In order to solve the technical problem, the embodiment of the application discloses the following technical scheme:
in one aspect, an embodiment of the present application discloses an optical module, including: an upper shell body is arranged on the upper side of the shell body,
the lower shell is covered with the upper shell to form a wrapping cavity;
the circuit board is arranged in the wrapping cavity;
the optical transceiving component is arranged in the packaging cavity and is in communication connection with the circuit board;
and the MCU is arranged on the circuit board, and different shell temperature calculation formulas are selected to calculate the shell temperature according to the difference between the MCU temperature sampling value and the working voltage.
The application discloses an optical module includes: the upper shell, the lower shell and the upper shell cover to form a wrapping cavity. The circuit board is arranged in the wrapping cavity. And the light receiving and transmitting assembly is arranged in the wrapping cavity and is in communication connection with the circuit board. And the MCU is arranged on the circuit board, and different shell temperature calculation formulas are selected to calculate the shell temperature according to the difference between the temperature sampling value and the working voltage of the MCU. The correction value is added during calibration under the conditions of overvoltage and overtemperature of the optical module, so that the reporting precision of the shell temperature meets the specification under the conditions of overvoltage and overtemperature, and the shell temperature precision is improved.
On the other hand, the optical module shell temperature calculation method comprises the following steps: collecting a temperature sampling value and a power supply voltage;
and selecting different shell temperature calculation formulas according to the temperature sampling value and the power supply voltage.
According to the optical module shell temperature calculation method, the correction value is added during calibration under the conditions of overvoltage and overtemperature of the optical module, so that the shell temperature reporting precision meets the specification under the conditions of overvoltage and overtemperature, and the shell temperature precision is improved.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;
fig. 2 is a schematic structural diagram of an optical network terminal;
fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present application;
fig. 4 is an exploded schematic view of an optical module according to an embodiment of the present disclosure.
Detailed Description
In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
One of the core links of optical fiber communication is the interconversion of optical and electrical signals. The optical fiber communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers/optical waveguides, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fibers/optical waveguides; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.
The optical module realizes the function of interconversion between optical signals and electrical signals in the technical field of optical fiber communication, and interconversion between optical signals and electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data information, grounding and the like; the electrical connection mode realized by the gold finger has become the mainstream connection mode of the optical module industry, and on the basis of the mainstream connection mode, the definition of the pin on the gold finger forms various industry protocols/specifications.
Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes the interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101, and the network cable 103.
One end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.
An optical port of the optical module 200 is externally accessed to the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; an electrical port of the optical module 200 is externally connected to the optical network terminal 100, and establishes bidirectional electrical signal connection with the optical network terminal 100; the optical module realizes the mutual conversion of optical signals and electric signals, thereby realizing the establishment of information connection between the optical fiber and the optical network terminal. Specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber.
The optical network terminal is provided with an optical module interface 102, which is used for accessing an optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal is provided with a network cable interface 104, which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; the optical module 200 is connected to the network cable 103 via the optical network terminal 100. Specifically, the optical network terminal transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network terminal is used as an upper computer of the optical module to monitor the operation of the optical module.
At this point, a bidirectional signal transmission channel is established between the remote server and the local information processing device through the optical fiber, the optical module, the optical network terminal and the network cable.
Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network terminal is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module.
Fig. 2 is a schematic diagram of an optical network terminal structure. As shown in fig. 2, the optical network terminal 100 includes a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a projection such as a fin that increases a heat radiation area.
The optical module 200 is inserted into the optical network terminal 100, specifically, an electrical port of the optical module is inserted into an electrical connector inside the cage 106, and an optical port of the optical module is connected to the optical fiber 101.
The cage 106 is positioned on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged in the cage; the optical module is inserted into the cage, held by the cage, and the heat generated by the optical module is conducted to the cage 106 and then diffused by the heat sink 107 on the cage.
Fig. 3 is a schematic view of an optical module according to an embodiment of the present disclosure, and fig. 4 is a schematic view of an exploded structure of an optical module according to an embodiment of the present disclosure. As shown in fig. 3 and 4, an optical module 200 provided in the embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking member 203, a circuit board 300, and an optical transceiver module.
The upper shell 201 is covered on the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the packaging cavity generally presents a square body. Specifically, the lower housing 202 includes a main board and two side boards located at two sides of the main board and arranged perpendicular to the main board; the upper shell comprises a cover plate, and the cover plate covers two side plates of the upper shell to form a wrapping cavity; the upper case may further include two side walls disposed at two sides of the cover plate and perpendicular to the cover plate, and the two side walls are combined with the two side plates to cover the upper case 201 on the lower case 202.
The two openings may be two ends (204, 205) in the same direction, or two openings in different directions; one opening is an electric port 204, and a gold finger of the circuit board extends out of the electric port 204 and is inserted into an upper computer such as an optical network terminal; the other opening is an optical port 205 for external optical fiber access to connect an optical transceiver module inside the optical module; the photoelectric devices such as the circuit board 300 and the optical transceiver module are positioned in the packaging cavity.
The assembly mode of combining the upper shell and the lower shell is adopted, so that the circuit board 300, the optical transceiver module and other devices can be conveniently installed in the shells, and the upper shell and the lower shell form the outermost packaging protection shell of the module; the upper shell and the lower shell are made of metal materials generally, electromagnetic shielding and heat dissipation are achieved, the shell of the optical module cannot be made into an integral component generally, and therefore when devices such as a circuit board are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component cannot be installed, and production automation is not facilitated.
The unlocking component 203 is used for realizing the fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.
The unlocking component 203 is provided with a clamping component matched with the upper computer cage; the end of the unlocking component can be pulled to enable the unlocking component to move relatively on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer by a clamping component of the unlocking component; by pulling the unlocking component, the clamping component of the unlocking component moves along with the unlocking component, so that the connection relation between the clamping component and the upper computer is changed, the clamping relation between the optical module and the upper computer is released, and the optical module can be drawn out from the cage of the upper computer.
The circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, and MOS transistors), and chips (such as the MCU301, the laser driver chip, the amplitude limiting amplifier chip, the clock data recovery CDR, the power management chip, and the data processing chip DSP).
The circuit board 300 connects the electrical devices in the optical module together according to the circuit design through circuit wiring to realize the electrical functions of power supply, electrical signal transmission, grounding and the like.
The circuit board is generally a rigid circuit board, and the rigid circuit board can also realize a bearing effect due to relatively hard materials of the rigid circuit board, for example, the rigid circuit board can stably bear a chip; when the optical transceiver component is positioned on the circuit board, the rigid circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/gold finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.
A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver module by using the flexible circuit board.
The optical transceiver module includes two parts, namely an optical transmitter 400 and an optical receiver, which are respectively used for transmitting and receiving optical signals. The light emitting device generally comprises a light emitter, a lens and a light detector, wherein the lens and the light detector are respectively positioned on different sides of the light emitter, light beams are respectively emitted from the front side and the back side of the light emitter, and the lens is used for converging the light beams emitted from the front side of the light emitter so that the light beams emitted from the light emitter are converging light to be conveniently coupled to an external optical fiber; the optical detector is used for receiving the light beam emitted by the reverse side of the optical emitter so as to detect the optical power of the optical emitter. Specifically, light emitted by the light emitter enters the optical fiber after being converged by the lens, and the light detector detects the light emitting power of the light emitter so as to ensure the constancy of the light emitting power of the light emitter.
In general, to Monitor the shell temperature of the optical module in real time, the DDMI (Digital Diagnostic Monitor) temperature of the optical module is calibrated by using the temperature of the MCU301 as a reference, and the system can know the current shell temperature of the optical module by reading the DDMI temperature of the optical module.
The specific calibration process is as follows: the optical module case temperature is set to be the hottest point of the module case temperature, and the point temperature position is generally the position above the BOSA heat dissipation block as shown in 2011 in fig. 4. The method comprises the steps of collecting a shell temperature value of an optical module as a shell temperature standard value, collecting an MCU temperature sampling value, and obtaining an AD value corresponding to the temperature of the MCU by using a temperature compensation meter. Temperature compensation tables common in the art are shown in the table and include: MCU temperature, MCU temperature correspond AD value, offset value, shell temperature report value.
By collecting the MCU temperature sampling value and the shell temperature standard value, the correlation curve of the shell temperature and the MCU temperature is calculated by using the following calculation formula, and a shell temperature and MCU temperature calculation formula is obtained.
The main mode for acquiring the DDMI temperature is that the optical module adopts a uniform temperature curve, and the mode has certain problems that the heat dissipation inside the module is poor, the thermal resistance is large, so the temperature of the MCU can be high, and the shell temperature of the optical module does not change obviously, that is, the shell temperature of the optical module does not change in correlation with the MCU temperature. If the MCU temperature accuracy deviation is large, the DDMI temperature accuracy of partial modules can not meet +/-3dB protocol requirements.
In order to improve optical module shell temperature monitoring accuracy under the condition of MCU superpressure, overtemperature, the optical module that this application embodiment provided includes: and the memory is arranged in the MCU and stores a preset voltage value, a first temperature compensation formula and a second temperature compensation formula.
A temperature sensor is arranged in the MCU, and the temperature value in the MCU is collected and used as a temperature sampling value; or a temperature sensor is arranged near the MCU, and the acquired temperature value is used as a temperature sampling value.
The MCU also comprises a voltage acquisition module which is connected with the MCU power supply pin and used for acquiring the power supply voltage. The MCU collects a power supply voltage value and a temperature sampling value, and selects the first temperature compensation formula or the second temperature compensation formula as a calculation formula according to a comparison result of the power supply voltage and a preset voltage value or a comparison result of the temperature sampling value and a temperature limit value.
And the MCU substitutes the collected temperature sampling value into the calculation formula to calculate to obtain a shell temperature value.
The first temperature compensation formula is: b i ＝(a i +D i -C1)/256 (1)
Wherein, in the formula (1), b i Represents the shell temperature value; a is i Is the temperature sample value; c1 is a fixed empirical AD value; d i Is a temperature compensation value.
The second temperature compensation formula is: : b i ＝(a i +D i -C1-E i )/256(2)
Wherein, b in the formula (2) i Represents the shell temperature value; a is a i Is the temperature sample value; c1 is a fixed empirical AD value; d i A temperature compensation value; e i Is a correction value.
Further, according to a comparison result between the value of the power supply voltage and a preset voltage value, or a comparison result between the temperature sampling value and an upper temperature limit value, selecting a first temperature compensation formula or a second temperature compensation formula as a calculation formula, including: if the value of the power supply voltage is larger than a preset voltage value, or if the temperature sampling value is larger than a temperature upper limit value, or if the temperature sampling value is smaller than a temperature lower limit value, selecting a second temperature compensation formula as a calculation formula; otherwise, selecting the first temperature compensation formula as a calculation formula.
In this embodiment, the preset voltage limit may be generally set to any value between 3.35V and 3.45V, and the selection of the specific value is set according to the MCU rated voltage of the optical module, for example: the preset voltage limit is 3.4V in this embodiment. The temperature upper limit value is set according to the applicable environment of the optical module, specifically, according to the requirement of a customer on the environment temperature, the MCU temperature value recorded by a corresponding temperature compensation table commonly used in the industry is recorded as the temperature upper limit value and the temperature lower limit value, and the MCU temperature value corresponding to the shell temperature value of 0 ℃ can be generally selected as the temperature upper limit value; the MCU temperature value corresponding to the shell temperature value of 70 ℃ is the upper limit value of the temperature.
Further, in order to improve the accuracy of monitoring the temperature of the optical module case under the condition of the MCU overpressure, the embodiment further provides a calibration apparatus for an optical module temperature compensation formula, including: and the CPU processor is in communication connection with the MCU and is used for acquiring a power supply voltage value of the MCU and comparing the power supply voltage value with a preset voltage limit value.
Further, to improve the accuracy of the measurement of the operating voltage of the MCU, the power supply pin of the MCU is usually connected to the pin of the circuit board.
And the thermode is arranged on the upper shell 201 of the optical module, is positioned above the MCU and is used for acquiring the shell temperature value of the optical module. The thermode is in communication connection with the CPU processor and transmits the collected shell temperature value to the CPU processor.
Further, in some embodiments, a point temperature mode may be further adopted, and the thermocouple is disposed on the surface of the upper housing, specifically above the MCU, and is used to collect a housing temperature value of the optical module, and check the housing temperature value as a standard value. The shell temperature values collected by the CPU processor are typically digital values.
The CPU processor is further connected to a thermal resistor 302, the thermal resistor 302 is disposed on the circuit board 300, and is configured to collect MCU temperature, where the obtained MCU temperature is an analog quantity. In order to improve the accuracy and the qualification of the temperature sampling value of the MCU, a thermal resistor 302 is arranged adjacent to the MCU 301. An AD conversion interface is arranged between the CPU processor and the thermal resistor, and converts the analog quantity of the thermal resistor into digital quantity.
And substituting the acquired actual temperature sampling value of the MCU into a preset calculation formula by the CPU to calculate to obtain a calculation formula, and sending the calculation formula to the MCU.
Further, in this embodiment, a temperature compensation table calculation module is disposed in the CPU processor, and the temperature compensation table calculation module includes a first calculation submodule and a second calculation submodule. And when the working voltage of the MCU is less than or equal to the preset voltage limit value, calculating a first temperature compensation formula by using a first calculation submodule. And when the working voltage of the MCU is greater than the preset voltage limit value, calculating a second temperature compensation formula by using a second calculation submodule.
In the embodiment of the application, the MCU working voltage is the module power supply voltage, and the MCU temperature value is introduced as the temperature sampling value.
Further, under normal conditions, the actual temperature sampling value of the MCU received by the CPU processor is an analog quantity, and is substituted into a temperature compensation formula to calculate a compensation value:
and when the MCU working voltage is less than or equal to the preset voltage limit value, and the MCU temperature sampling value is less than or equal to the temperature upper limit value and greater than or equal to the temperature lower limit value, calculating the first temperature compensation formula by using the first calculation submodule.
Wherein, the preset first temperature compensation formula is as follows:
b i ＝(a i +D i -C1)/256 (1)
b in formula (1) i The shell temperature value is represented and is a digital value, and the value is obtained through thermode measurement in the temperature calibration stage of the optical module. a is i The MCU temperature voltage value actually corresponding to the temperature sampling value is an AD value corresponding to the MCU temperature digital quantity. C1 is a fixed empirical AD value. The temperature compensation value D can be calculated by the formula (1) i 。
As shown in table 1, a temperature compensation table is commonly used in the industry; in the temperature compensation table, which is common in the art, C1 is a fixed empirical AD value, specifically 4095. And the AD value column represents the AD value of the acquired MCU temperature corresponding to the MCU working temperature, and the AD value is in one-to-one correspondence with the MCU actual temperature value. In this embodiment, the AD value corresponding to the MCU temperature may be an empirical value commonly used in the industry; or collected by a thermal resistor. The LUT table compensates a column of values to obtain a calculated temperature compensation value D i 。
Further, in order to reduce the error of calibrating the light module shell temperature and improve the accuracy, in this embodiment, the corresponding light module shell temperature value is averaged by measuring the same MCU temperature for multiple times.
TABLE 1 temperature compensation table commonly used in the industry
| Temperature of MCU | AD value | LUT table compensation | Temperature of the shell |
| -40 | a1 | D1 | (a1+D1-4095)/256 |
| -38 | a2 | D2 | (a2+D2-4095)/256 |
| -36 | a3 | D3 | (a3+D3-4095)/256 |
| … | … | … | … |
| 104 | c3 | Do | (c3+Do-4095)/256 |
| … | … | … | … |
And when the working voltage of the MCU is greater than a preset voltage limit value, or when the actual temperature value of the MCU is greater than a temperature upper limit value, or when the actual temperature value of the MCU is less than the temperature upper limit value, calculating the second temperature compensation table by using the second calculating submodule.
The preset second temperature compensation formula is as follows:
b i ＝(a i +D i -C1-E i )/256 (2)
b in formula (2) i The shell temperature value is represented and is a digital value, and the value is obtained through thermode measurement in the temperature calibration stage of the optical module. a is i The MCU temperature voltage value is actually corresponding to the MCU temperature, and is an AD value corresponding to the MCU temperature digital quantity. C1 is a fixed empirical AD value. D i The temperature compensation value calculated for the previous text.
E can be calculated by the formula (2) i To correct the values, a second temperature compensation table is obtained as shown in table 2.
TABLE 2 second temperature Compensation Table
| MCU temperatureDegree of rotation | AD value | Correction value | LUT table compensation | Shell temperature value |
| -40 | a1 | E1 | D1 | (a1+D1-4095-E1)/256 |
| -38 | a2 | E2 | D2 | (a2+D2-4095-E2)/256 |
| -36 | a3 | E3 | D3 | (a3+D3-4095-E3)/256 |
| … | … | … | … | … |
| 104 | c3 | Eo | Do | (c3+Do-4095-Eo)/256 |
| … | … | … | … | … |
In this embodiment, the preset voltage limit is set according to the rated voltage of the MCU of the optical module, and in this embodiment, the preset voltage limit is 3.4V.
Further, in this embodiment, in order to implement storage of calibration data, the optical module case temperature calibration apparatus further includes: and the register is in communication connection with the CPU processor and is used for storing the first temperature compensation formula and the second temperature compensation formula.
Furthermore, the CPU processor is in communication connection with the memory, the first temperature compensation formula and the second temperature compensation formula are written into the memory, the DDMI obtains a shell temperature value by monitoring the temperature and the working voltage of the MCU and calling the first temperature compensation formula and the second temperature compensation formula preset in the memory, and monitoring of the shell temperature of the optical module is achieved.
The embodiment discloses a calibration device of an optical module temperature compensation formula, which collects an environmental temperature sampling value of an optical module through a thermode; the thermal resistor collects the temperature of the MCU and transmits the environmental temperature value and the temperature of the MCU to the CPU processor. Meanwhile, the CPU processor is also connected with the MCU to collect the working voltage value of the MCU. A temperature compensation table calculation module is arranged in the CPU, and comprises a first calculation submodule and a second calculation submodule. When the working voltage of the MCU is less than or equal to the preset voltage limit value, calculating the first temperature compensation sub-table by using the first calculation sub-module to obtain a first temperature compensation formula b i ＝(a i +D i -C1)/256. When the working voltage of the MCU is larger than the preset voltage limit value, the second calculation submodule is used for calculating the second temperature compensation submeter to obtain a second temperature compensation formula b i ＝(a i +D i -C1-E i )/256. By increasing the correction value, the shell temperature reporting precision satisfaction gauge is ensured under the conditions of overvoltage and overtemperatureWithin the specification, the DDMI temperature precision is improved.
The embodiment also discloses a method of the optical module temperature compensation formula, which comprises the following steps:
s100: and collecting the working voltage of the MCU, and comparing the working voltage of the MCU with a preset voltage limit value. In this embodiment, the preset voltage limit is 3.4V.
S200: and acquiring an actual temperature value of the MCU, and comparing the actual temperature value of the MCU with an upper temperature limit value.
S300: and if the working voltage of the MCU is less than or equal to the preset voltage limit value and the actual temperature value of the MCU is less than or equal to the temperature upper limit value, acquiring a shell temperature value and an MCU temperature value of the optical module, substituting the shell temperature value and the MCU temperature value into a preset first temperature compensation formula, and calculating to obtain a first temperature compensation formula.
Generally, the MCU temperature value acquired by the DDMI in the optical module is an analog quantity. The realization mode is that a thermal resistor is arranged on the circuit board and is adjacent to the MCU.
Wherein the first temperature compensation formula is:
b i ＝(a i +D i -C1)/256 (1)
b in formula (1) i The shell temperature value is represented and is a digital value, and the value is obtained through thermode measurement in the temperature calibration stage of the optical module. a is i The MCU temperature voltage value is actually corresponding to the temperature of the MCU, and is an AD value corresponding to the digital value of the temperature of the MCU. C1 is a fixed empirical AD value. The temperature compensation value D can be calculated by the formula (1) i And obtaining a first temperature compensation formula, and writing the first temperature compensation formula into the CPU.
S400: and if the working voltage of the MCU is greater than a preset voltage limit value, or if the actual temperature value of the MCU is greater than a temperature upper limit value, or if the actual temperature value of the MCU is less than the temperature upper limit value, acquiring a shell temperature value and an MCU temperature value of the optical module, and substituting the shell temperature value and the MCU temperature value into a preset second temperature compensation formula to obtain a second temperature compensation formula.
The second temperature compensation formula is:
b i ＝(a i +D i -C1-E i )/256 (2)
b in formula (2) i The shell temperature value is represented and is a digital value, and the value is obtained through thermode measurement in the temperature calibration stage of the optical module. a is i The MCU temperature voltage value is actually corresponding to the temperature of the MCU, and is an AD value corresponding to the digital value of the temperature of the MCU. C1 is a fixed empirical AD value. D i The temperature compensation value calculated for the previous text. E can be calculated by the formula (2) i Is a correction value. And calculating to obtain a second temperature compensation formula.
S500: and writing the first temperature compensation formula and the second temperature compensation formula into the optical module.
The embodiment discloses a calibration method of an optical module temperature compensation formula, which comprises the steps of collecting an ambient temperature value of an optical module; the thermal resistor collects the temperature of the MCU and transmits the environmental temperature value and the temperature of the MCU to the CPU processor. Meanwhile, the working voltage value of the MCU is collected. When the working voltage of the MCU is less than or equal to the preset voltage limit value, calculating the compensation value by using a first temperature compensation formula to obtain a first temperature compensation formula b i ＝(a i +D i -C1)/256. When the working voltage of the MCU is larger than the preset voltage limit value, calculating the correction value by using a second temperature compensation formula to obtain a second temperature compensation formula b i ＝(a i +D i -C1-E i )/256. By increasing the correction value, the reporting precision of the shell temperature is ensured to meet the specification under the condition of overvoltage, and the DDMI temperature precision is improved.
The application discloses optical module includes: and the MCU is arranged on the circuit board and used for measuring the temperature of the MCU. The memory stores a preset voltage value, a first temperature compensation formula and a second temperature compensation formula. And the DDMI is connected with the memory and the MCU and is used for acquiring the voltage value of the MCU and receiving the temperature of the MCU, and selecting the first temperature compensation formula or the second temperature compensation formula as a calculation formula according to the comparison result of the voltage value of the MCU and the preset voltage value or the comparison result of the temperature value of the MCU and the temperature limit value. And substituting the MCU temperature into the calculation formula by the DDMI to calculate to obtain a shell temperature value. Wherein: the first temperature compensation equation is different from the second temperature compensation equation. And under the condition of overvoltage or ultrahigh temperature of the MCU, a correction value is added during calibration, so that the reporting precision of the shell temperature meets the specification or less under the condition of overvoltage and overtemperature, and the DDMI temperature precision is improved.
Since the above embodiments are all described by referring to and combining with other embodiments, the same portions are provided between different embodiments, and the same and similar portions between the various embodiments in this specification may be referred to each other. And will not be described in detail herein.
It is noted that, in this specification, relational terms such as "first" and "second," and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a circuit structure, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such circuit structure, article, or apparatus. Without further limitation, the presence of an element identified by the phrase "comprising an … …" does not exclude the presence of other like elements in a circuit structure, article or device comprising the element.
Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.
The above-described embodiments of the present application do not limit the scope of the present application.
Claims (10)
1. A light module, comprising: an upper shell body is arranged on the upper side of the shell body,
the lower shell is covered with the upper shell to form a wrapping cavity;
the circuit board is arranged in the wrapping cavity;
the optical transceiving component is arranged in the packaging cavity and is in communication connection with the circuit board;
and the MCU is arranged on the circuit board, collects a temperature sampling value and power supply voltage, and selects different shell temperature calculation formulas to calculate the shell temperature according to the difference between the temperature sampling value and the power supply voltage.
2. The optical module according to claim 1, wherein the MCU is built-in with a memory for pre-storing a preset voltage value, an upper temperature limit value, a lower temperature limit value, and the shell temperature calculation formula.
3. The optical module according to claim 2, wherein the selecting different shell temperature calculation formulas to calculate the shell temperature according to the difference between the temperature sampling value and the power supply voltage comprises:
if the power supply voltage is greater than the preset voltage value, or the temperature sampling value is greater than the temperature upper limit value, or the temperature sampling value is less than the temperature lower limit value, selecting a second temperature compensation formula to calculate the shell temperature;
otherwise, a first compensation formula is selected to calculate the shell temperature.
4. The optical module of claim 3, wherein the first temperature compensation formula:
b i ＝(a i +D i -C1)/256 (1)
wherein, in the formula (1), b i Represents the shell temperature value; a is a i Is the MCU temperature sampling value; c1 is a fixed empirical AD value; d i Is a temperature compensation value.
5. A light module as claimed in claim 3, characterized in that the second temperature compensation formula:
b i ＝(a i +D i -C1-E i )/256 (2)
wherein, b in the formula (2) i Represents the shell temperature value; a is i Is the MCU temperature sampling value; c1 is a fixed empirical AD value; d i A temperature compensation value; e i Is a correction value.
6. The light module of claim 1, wherein the MCU comprises: and the temperature sensor is used for acquiring a temperature sampling value.
7. The optical module according to claim 1, wherein the MCU voltage acquisition module is connected to an MCU power pin for acquiring the power supply voltage.
8. An optical module shell temperature calculation method is characterized by comprising the following steps: collecting a temperature sampling value and a power supply voltage;
and selecting different shell temperature calculation formulas according to the temperature sampling value and the power supply voltage.
9. The optical module case temperature calculation method according to claim 8, wherein the case temperature calculation formula includes:
first temperature compensation formula: b i ＝(a i +D i -C1)/256 (1)
Wherein, b in the formula (1) i Represents the shell temperature value; a is i Is the temperature sample value; c1 is a fixed empirical AD value; d i Is a temperature compensation value;
and a second temperature compensation equation: b i ＝(a i +D i -C1-E i )/256 (2)
Wherein, b in the formula (2) i Represents the shell temperature value; a is i Is the temperature sample value; c1 is a fixed empirical AD value; d i A temperature compensation value; e i Is a correction value.
10. The optical module shell temperature calculation method according to claim 8, wherein selecting different shell temperature calculation formulas according to the difference between the temperature sampling value and the power supply voltage comprises:
if the power supply voltage is greater than a preset voltage value, or the temperature sampling value is greater than a temperature upper limit value, or the temperature sampling value is less than a temperature lower limit value, selecting a second temperature compensation formula as a shell temperature calculation formula;
otherwise, selecting the first temperature compensation formula as a shell temperature calculation formula.
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