CN115016075A - Optical module - Google Patents
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- CN115016075A CN115016075A CN202110242147.1A CN202110242147A CN115016075A CN 115016075 A CN115016075 A CN 115016075A CN 202110242147 A CN202110242147 A CN 202110242147A CN 115016075 A CN115016075 A CN 115016075A
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- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
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- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
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Abstract
The application discloses optical module includes: the upper shell, the lower shell, with the upper shell lid closes and forms the parcel cavity. The circuit board is arranged in the wrapping cavity. And the optical transceiving component is arranged in the packaging cavity and is in communication connection with the circuit board. And the MCU is arranged on the circuit board and is used for collecting temperature sampling values, and different temperature curve formulas are selected according to different temperature sampling values to calculate the DDMI temperature of the optical module. The temperature sampling value of the optical module to be measured corresponding to a certain environmental temperature is collected in a normal temperature environment and substituted into a corresponding temperature curve formula in the preset process, and then the inflection point is utilized to simultaneously meet different temperature curve formulas, so that the corresponding temperature curve formula can be obtained. The temperature of the module does not need to be calibrated at normal temperature/low temperature/high temperature respectively, and the production efficiency is improved.
Description
Technical Field
The application relates to the technical field of communication, in particular to an optical module and an optical module temperature monitoring method.
Background
With the development of new services and application modes such as cloud computing, mobile internet, video and the like, the development and progress of the optical communication technology become increasingly important. In the optical communication technology, an optical module is a tool for realizing the interconversion of optical signals and is one of key devices in optical communication equipment, and the transmission rate of the optical module is continuously increased along with the development requirement of the optical communication technology.
The temperatures reported by the DDMI (Digital Diagnostic Monitor) of the optical module are calibrated by taking the temperature of the MCU as a reference, and the system can know the current operating temperature of the optical module by reading the DDMI temperature of the optical module.
At present, the mainstream mode of obtaining the DDMI temperature by the upper computer is that the optical module adopts a unified temperature curve, and the temperature curve is obtained by acquiring the relationship between a plurality of groups of MCU temperature sampling values and the DDMI temperature. The DDMI temperature is influenced by the temperature of the MCU, the accuracy of the DDMI temperature needs to be good, and the DDMI temperature accuracy can meet the requirement when all modules adopt a unified temperature curve. If the deviation of the MCU temperature precision is large, the DDMI temperature precision of partial modules can not meet the requirements of the optical module protocol.
Disclosure of Invention
The application provides an optical module to improve optical module DDMI temperature accuracy.
In order to solve the technical problem, the embodiment of the application discloses the following technical scheme:
the embodiment of the application discloses an optical module, includes:
an upper shell is arranged on the upper side of the shell,
the lower shell is covered with the upper shell to form a wrapping cavity;
the circuit board is arranged in the wrapping cavity;
the optical transceiving component is arranged in the packaging cavity and is in communication connection with the circuit board;
and the MCU is arranged on the circuit board and used for selecting different temperature curve formulas according to the acquired MCU temperature sampling values and the difference of the MCU temperature sampling values to calculate the DDMI temperature of the optical module.
Compared with the prior art, the beneficial effects of this application do:
the application discloses optical module includes: the upper shell, the lower shell, with the upper shell lid closes and forms the parcel cavity. The circuit board is arranged in the wrapping cavity. And the light receiving and transmitting assembly is arranged in the wrapping cavity and is in communication connection with the circuit board. And the MCU is arranged on the circuit board and used for selecting different temperature curve formulas according to the acquired MCU temperature sampling values and the difference of the MCU temperature sampling values to calculate the DDMI temperature of the optical module. The temperature curve formula is continuous according to the environment temperature, in the presetting process, the temperature sampling value of the optical module MCU to be tested corresponding to a certain environment temperature is collected in the normal temperature environment and is substituted into the high temperature section temperature curve formula, the low temperature section temperature curve formula and the normal temperature section temperature curve formula, the corresponding temperature curve formula can be obtained, the temperature of the module does not need to be calibrated at normal temperature/low temperature/high temperature respectively, and the production efficiency is improved.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments are briefly described below, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;
fig. 2 is a schematic diagram of an optical network terminal structure;
fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present application;
fig. 4 is an exploded schematic structural diagram of an optical module according to an embodiment of the present disclosure;
fig. 5 is a schematic diagram of temperature acquisition of an optical module according to an embodiment of the present application;
fig. 6 is a schematic diagram of a temperature curve of a standard optical module according to an embodiment of the present disclosure.
Detailed Description
In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
One of the core links of optical fiber communication is the interconversion of optical and electrical signals. The optical fiber communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers/optical waveguides, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fibers/optical waveguides; in order to establish information connection between information transmission devices such as optical fibers and optical waveguides and information processing devices such as computers, interconversion between electrical signals and optical signals is required.
The optical module realizes the function of interconversion between optical signals and electrical signals in the technical field of optical fiber communication, and interconversion between optical signals and electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data information, grounding and the like; the electrical connection mode realized by the gold finger has become the mainstream connection mode in the optical module industry, and on the basis of the mainstream connection mode, the definition of the pins on the gold finger forms various industry protocols/specifications.
Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101, and the network cable 103.
One end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.
An optical port of the optical module 200 is externally connected to the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; an electrical port of the optical module 200 is externally connected to the optical network terminal 100, and establishes bidirectional electrical signal connection with the optical network terminal 100; the optical module realizes the mutual conversion of optical signals and electric signals, thereby realizing the establishment of information connection between the optical fiber and the optical network terminal. Specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber.
The optical network terminal is provided with an optical module interface 102, which is used for accessing an optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal is provided with a network cable interface 104, which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; the optical module 200 is connected to the network cable 103 via the optical network terminal 100. Specifically, the optical network terminal transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network terminal serves as an upper computer of the optical module to monitor the operation of the optical module.
At this point, a bidirectional signal transmission channel is established between the remote server and the local information processing device through the optical fiber, the optical module, the optical network terminal and the network cable.
Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network terminal is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an optical line terminal and the like.
Fig. 2 is a schematic diagram of an optical network terminal structure. As shown in fig. 2, the optical network terminal 100 includes a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a projection such as a fin that increases a heat radiation area.
The optical module 200 is inserted into the optical network terminal 100, specifically, an electrical port of the optical module is inserted into an electrical connector inside the cage 106, and an optical port of the optical module is connected to the optical fiber 101.
The cage 106 is positioned on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged in the cage; the optical module is inserted into the cage, held by the cage, and the heat generated by the optical module is conducted to the cage 106 and then diffused by the heat sink 107 on the cage.
Fig. 3 is a schematic view of an optical module according to an embodiment of the present disclosure, and fig. 4 is a schematic view of an exploded structure of an optical module according to an embodiment of the present disclosure. As shown in fig. 3 and 4, an optical module 200 provided in the embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking member 203, a circuit board 300, and an optical transceiver module.
The upper shell 201 is covered on the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the packaging cavity is generally square. Specifically, the lower housing 202 includes a main board and two side boards located at two sides of the main board and disposed perpendicular to the main board; the upper shell comprises a cover plate, and the cover plate covers two side plates of the upper shell to form a wrapping cavity; the upper shell may further include two side walls disposed at two sides of the cover plate and perpendicular to the cover plate, and the two side walls are combined with the two side plates to cover the upper shell 201 on the lower shell 202.
The two openings may be two ends (204, 205) in the same direction, or two openings in different directions; one opening is an electric port 204, and a gold finger of the circuit board extends out of the electric port 204 and is inserted into an upper computer such as an optical network terminal; the other opening is an optical port 205 for external optical fiber access to connect an optical transceiver module inside the optical module; the photoelectric devices such as the circuit board 300 and the optical transceiving component are positioned in the packaging cavity.
The assembly mode of combining the upper shell and the lower shell is adopted, so that the circuit board 300, the optical transceiver module and other devices can be conveniently installed in the shells, and the upper shell and the lower shell form the outermost packaging protection shell of the module; the upper shell and the lower shell are made of metal materials, electromagnetic shielding and heat dissipation are achieved, the shell of the optical module cannot be made into an integral component, and therefore when devices such as a circuit board are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component cannot be installed, and production automation is not facilitated.
The unlocking component 203 is used for realizing the fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.
The unlocking component 203 is provided with a clamping component matched with the upper computer cage; the end of the unlocking component can be pulled to enable the unlocking component to move relatively on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer by a clamping component of the unlocking component; by pulling the unlocking component, the clamping component of the unlocking component moves along with the unlocking component, so that the connection relation between the clamping component and the upper computer is changed, the clamping relation between the optical module and the upper computer is released, and the optical module can be drawn out from the cage of the upper computer.
The circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, and MOS transistors), and chips (such as the MCU301, the laser driver chip, the amplitude limiting amplifier chip, the clock data recovery CDR, the power management chip, and the data processing chip DSP).
The circuit board 300 connects the electrical devices in the optical module together according to the circuit design through circuit wiring to realize the electrical functions of power supply, electrical signal transmission, grounding and the like.
The circuit board is generally a rigid circuit board, and the rigid circuit board can also realize a bearing effect due to relatively hard materials of the rigid circuit board, for example, the rigid circuit board can stably bear a chip; when the optical transceiver component is positioned on the circuit board, the rigid circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.
A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver module by using the flexible circuit board.
The optical transceiver module includes an optical transmitter 400 and an optical receiver, which are respectively used for transmitting and receiving optical signals. The light emitting device generally comprises a light emitter, a lens and a light detector, wherein the lens and the light detector are respectively positioned on different sides of the light emitter, light beams are respectively emitted from the front side and the back side of the light emitter, and the lens is used for converging the light beams emitted from the front side of the light emitter so that the light beams emitted from the light emitter are converging light to be conveniently coupled to an external optical fiber; the optical detector is used for receiving the light beam emitted by the reverse side of the optical emitter so as to detect the optical power of the optical emitter. Specifically, light emitted by the light emitter enters the optical fiber after being converged by the lens, and the light detector detects the light emitting power of the light emitter so as to ensure the constancy of the light emitting power of the light emitter.
In general, to Monitor the ambient temperature of the optical module in real time, the DDMI (Digital Diagnostic Monitor) temperature of the optical module is calibrated by using the temperature of the MCU301 as a reference, and the system can know the current ambient temperature of the optical module by reading the DDMI temperature of the optical module.
Fig. 5 is a schematic diagram of temperature acquisition of an optical module according to an embodiment of the present application. As shown in FIG. 5, in some embodiments, a thermistor 302 may be placed in proximity to the MCU301 for collecting temperature samples. And a temperature sensor can be arranged on the circuit board and is arranged in the MCU to obtain a temperature sampling value.
The DDMI temperature of the optical module is the ambient temperature of the optical module, and in the present application, the temperature value at the position on the upper housing corresponding to the optical transceiver module is taken as the standard, and has a certain functional relationship with the temperature sampling value.
And the MCU is provided with a memory for storing a preset optical module temperature curve formula. The MCU collects temperature sampling values. Or the MCU is in communication connection with the thermistor and acquires a temperature sampling value. In order to realize the conversion of temperature and sampling data, the MCU is connected with the thermistor through an ADC acquisition line.
And the MCU is internally provided with a processor which is connected with the memory, reads a corresponding optical module temperature curve formula according to the temperature sampling value of the MCU, and calculates to obtain the DDMI temperature.
The MCU is connected with the golden finger, the golden finger is connected with the upper computer, and the upper computer is connected with the MCU through the golden finger and reads the DDMI temperature value stored in the register.
Further, the MCU selects different temperature curve formulas according to different temperature sampling values, and calculates the DDMI temperature of the optical module.
Fig. 6 is a schematic diagram of a temperature curve of a standard optical module according to an embodiment of the present disclosure. As shown in fig. 6, the optical module temperature curve formula includes: a high temperature section temperature curve formula, a low temperature section temperature curve formula and a normal temperature section temperature curve formula. And if the temperature sampling value is smaller than the low-temperature limit value, selecting a low-temperature section temperature curve formula. And if the temperature sampling value is greater than the high-temperature limit value, selecting a high-temperature section temperature curve formula. Otherwise, selecting a normal temperature section temperature curve formula.
Wherein, the temperature curve formula of the normal temperature section is as follows:
T＝a1*z+a1*(x4-z4)+b1；
wherein T represents the DDMI temperature of the optical module; a1 is the slope of the temperature curve of the optical module at the normal temperature section; z is a temperature sampling value of the optical module and is a variable; x4 is a temperature sampling value corresponding to the standard optical module at a certain environmental temperature; z4 is a temperature sampling value corresponding to the optical module at the ambient temperature; b1 is the normal temperature section temperature curve bias of the standard optical module; the ambient temperature is greater than the low temperature limit and less than the high temperature limit.
The low temperature section curve formula is:
T＝a0*z+(a1-a0)*ADC0+a1*(x4-z4)+b1；
wherein T represents the DDMI temperature of the optical module; a0 is the slope of the temperature curve of the low-temperature section of the optical module; a1 is the slope of the temperature curve of the optical module at the normal temperature section, z is the temperature sampling value of the optical module, and is a variable; the ADC0 is a temperature sampling value corresponding to the low-temperature limit value in the standard optical module; x4 is a temperature sampling value corresponding to the standard optical module at a certain ambient temperature; z4 is a temperature sampling value corresponding to the optical module at the ambient temperature; b1 represents the normal temperature section temperature curve offset of the standard optical module; the ambient temperature is greater than the low temperature limit and less than the high temperature limit.
The high temperature section curve formula is:
T＝a2*z+(a1-a2)*ADC1+a1*(x4-z4)+b1；
wherein T represents the DDMI temperature of the optical module to be tested; a2 is the slope of the temperature curve of the high-temperature section of the optical module; a1 is the slope of the temperature curve of the optical module at the normal temperature section, z is the MCU sampling value of the optical module, and is a variable; when the ADC1 is the high-temperature limit value, the temperature sampling value corresponding to the optical module is obtained; x4 is a temperature sampling value corresponding to the standard optical module at a certain ambient temperature; z4 is a temperature sampling value corresponding to the optical module to be tested at the ambient temperature; b1 represents the normal temperature section temperature curve offset of the standard optical module; the ambient temperature is greater than the low temperature limit and less than the high temperature limit.
Further, the method for obtaining the predetermined temperature curve formula of the optical module DDMI in this embodiment includes:
s100: and calculating a temperature curve formula of the standard optical module according to the DDMI temperature value of the standard optical module and the corresponding MCU temperature sampling value.
S101: and collecting the DDMI temperature value of the standard optical module and the corresponding MCU temperature sampling value thereof, and drawing a standard optical module temperature curve according to the DDMI temperature value and the corresponding MCU temperature sampling value thereof.
S102: and determining a low-temperature limit value and a high-temperature limit value corresponding to the inflection point of the standard temperature curve according to the temperature curve of the standard optical module, wherein the low-temperature limit value and the high-temperature limit value correspond to MCU temperature sampling values.
S103: and presetting a standard optical module temperature curve formula, and substituting the DDMI temperature value of the standard optical module and the corresponding MCU temperature sampling value into the standard optical module temperature curve formula for analysis. And calculating a curve correlation constant and writing a standard optical module temperature curve formula into a register. The constants include: slope of the curve and offset. And calculating a DDMI standard temperature curve formula by acquiring an MCU temperature sampling value and a DDMI temperature value of the standard optical module.
Further, the standard optical module temperature curve formula Y ═ a × x + b (1), where in formula (1): a is a slope, x is a sampling value corresponding to the temperature of the standard optical module MCU, b is the offset of the standard optical module, that is, the DDMI temperature corresponding to the MCU when x is equal to 0, and Y1 is the DDMI temperature value of the standard optical module.
The DDMI standard temperature curve is divided into three segments, which include: the low temperature section, when the MCU temperature is less than the low temperature limit value, for the low temperature section, MCU temperature sampling value and DDMI temperature value through gathering standard optical module, the substitution low temperature section temperature curve formula is: and Y is a0 x + b0, and the slope and the bias of the low-temperature section temperature curve of the standard optical module are calculated to be a0 and b0 respectively.
The high temperature section, when the MCU temperature is greater than the high temperature limit value, for the high temperature section, through MCU temperature sampling value and the DDMI temperature value of gathering standard optical module, the substitution low temperature section temperature curve formula is: and Y is a2 x + b2, and the slope and the bias of the high-temperature section temperature curve of the standard optical module are calculated to be a2 and b2 respectively.
And the normal temperature section is used for acquiring the MCU temperature sampling value and the DDMI temperature value of the standard optical module, and substituting the temperature curve formula of the low temperature section into the normal temperature section when the temperature of the MCU is between the low temperature limit value and the high temperature limit value: y is a1 × x + b1, and the slope and the bias of the normal temperature curve of the standard optical module are a1 and b1, respectively. In the embodiment of the application, the MCU temperature sampling value is taken as an example for introduction.
And calculating a DDMI temperature value and an MCU temperature sampling value corresponding to the inflection point according to the DDMI standard temperature curve, wherein: MCU low temperature limit ADC0 corresponding to standard DDMI low temperature limit; MCU high temperature limit ADC1, corresponding to a standard DDMI high temperature limit.
For convenience of explanation, in the embodiments of the present application: the MCU low temperature limit is defined as ADC0, and the corresponding standard DDMI low temperature limit is defined as Y1 d. The MCU high temperature limit is defined as ADC1 and the corresponding standard DDMI high temperature limit is defined as Y1 g.
In the embodiment of the application, the slope and the offset of the temperature curve obtained by calculation need to be written into a register, a low-temperature limit value and a high-temperature limit value are preset at the inflection point of the DDMI standard temperature curve, and the MCU temperature sampling value corresponding to the inflection point is written into the register.
The optical module component comprises a light emitting component, a light receiving component, an MCU and the like, under the same environmental condition, the difference of heat productivity of each part is small, and the heat productivity of each module can be considered to be the same, so that the DDMI temperature should be the same. The method is characterized in that a standard optical module is adopted, the temperature of the MCU is considered to be accurate, the slope of the optical module to be tested is the same as that of the standard optical module, and the bias of a three-section curve of the optical module to be tested is mainly calibrated at normal temperature, so that the accuracy of the DDMI temperature +/-3 degrees of the optical module to be tested is ensured.
Therefore, the temperature curve formula of the optical module to be tested is set according to the temperature curve formula of the standard module.
S200: presetting a temperature curve formula of the optical module to be tested, substituting the acquired temperature sampling value of the MCU of the optical module to be tested into the temperature curve formula of the optical module to be tested to obtain the temperature curve formula T of the optical module to be tested, wherein the formula T is a + z + c (2), and the formula (2) is as follows: a is a slope, z is a sampling value corresponding to the temperature of the MCU of the optical module to be measured, c is the offset of the optical module to be measured, that is, the DDMI temperature corresponding to the MCU when z is equal to 0, and Y2 is the DDMI temperature value of the optical module to be measured.
S201: and presetting a temperature curve formula of the optical module to be tested.
Further, the DDMI standard temperature curve of the optical module to be measured is divided into three sections, which include: and in the low-temperature section, when the temperature of the MCU is less than a low-temperature limit value, the slope a0 is substituted into the low-temperature section to form a temperature curve formula: t-a 0 x z + c 0.
And in the high-temperature section, when the temperature of the MCU is greater than a high-temperature limit value, the high-temperature section is substituted with the slope a2 into a temperature curve formula of the low-temperature section as follows: t-a 2 x z + c 2.
And in the normal temperature section, when the temperature of the MCU is between the low temperature limit value and the high temperature limit value, the slope a1 is substituted into the temperature curve formula of the low temperature section to form: t-a 1 x z + c 1.
And acquiring the MCU temperature value of the optical module to obtain the MCU temperature sampling value of the optical module to be tested. Generally, the MCU is disposed on the circuit board 300, and the circuit board 300 is disposed in a wrapped cavity formed by the upper housing 201 and the lower housing 202. And acquiring a temperature sampling value of the MCU by acquiring the voltage value of the thermistor arranged near the MCU.
According to the embodiment of the application, the temperature sampling value of the MCU in the normal temperature section of the optical module to be tested is only required to be collected, and the value c in the temperature curve formula T of the optical module to be tested, namely a x z + c, is obtained through calculation.
S202: collecting the ambient temperature at normal ambient temperatureDegree Y a And then, respectively substituting the corresponding MCU temperature sampling value of the standard optical module and the MCU temperature sampling value of the optical module to be tested into a normal temperature section temperature curve formula of the standard optical module and a normal temperature section temperature curve formula of the optical module to be tested, and calculating to obtain the normal temperature section temperature bias of the optical module to be tested.
Wherein the ambient temperature Y a Next, the MCU temperature sampling value of the corresponding standard optical module can be obtained by calling data in the memory; or by bringing the ambient temperature Y a And substituting the temperature curve formula into a normal temperature section temperature curve formula of the standard optical module to obtain the temperature curve formula.
According to the foregoing, the normal temperature section of the optical module to be tested corresponds to the formula T ═ a1 × z + c1, where T is the DDMI temperature value of the optical module to be tested, a1 is the slope of the normal temperature section, z is the temperature sampling value corresponding to the MCU, and c1 is the temperature offset of the normal temperature section of the optical module to be tested.
The formula Y ═ a1 × x + b1 corresponding to the normal temperature section of the standard optical module, wherein Y is the DDMI temperature value of the standard optical module, a1 is the slope of the normal temperature section, x is the temperature sampling value corresponding to the standard optical module MCU, and b1 is the temperature offset of the normal temperature section of the optical module to be tested.
The MCU temperature is different between the standard module and the optical module to be tested at normal temperature, but the corresponding DDMI temperature is basically the same, so that: there being Y ═ T ═ Y a Is known; a1 x + b1 a1 z + c 1;
thereby obtaining: and c1 is a1 (x4-z4) + b1(3), namely the offset c1 of the temperature curve of the optical module to be tested in the normal temperature section is obtained and is written into a corresponding register (or a memory). Wherein in the formula (3), x4 represents Y at ambient temperature a And meanwhile, the temperature sampling value corresponding to the standard optical module MCU. z4 is ambient temperature Y a And meanwhile, the temperature sampling value corresponding to the MCU of the optical module to be tested. a1 and b1 are constant data stored in the register, and are respectively the slope and the offset of the normal temperature section temperature curve of the standard optical module.
The normal temperature section temperature curve formula of the optical module to be measured is as follows: t ═ a1 × z + a1 × x4-z4) + b 1. And writing the calculated offset c1 of the temperature curve of the optical module to be tested at the normal temperature section into a register of the optical module to be tested, and obtaining the DDMI temperature of the module according to a1 and b1 of the corresponding registers and the ADC value of the MCU in the current environment.
S203: and calculating a low-temperature section temperature curve formula according to the condition that the low-temperature limit point of the MCU simultaneously accords with the normal-temperature section temperature curve formula and the low-temperature section temperature curve formula.
And substituting the MCU low-temperature limit ADC0 into a normal-temperature section temperature curve formula of the optical module to be tested, and calculating to obtain a DDMI low-temperature limit corresponding to the MCU low-temperature limit of the optical module to be tested. Namely, z is ADC0, and is substituted into a formula T1 z + c 1.
And substituting the MCU low-temperature limit value and the corresponding DDMI low-temperature limit value into a low-temperature section temperature curve formula T of the optical module to be tested, namely a0 z + c0, and calculating to obtain the offset in the low-temperature section temperature curve formula of the optical module to be tested, namely a1 z + c1 a0 z + c 0.
And calculating to obtain the low-temperature section bias of the optical module to be tested, wherein c0 is (a1-a0) ADC0+ c 1.
Therefore, the low-temperature section curve formula of the optical module to be tested: t-a 0 x z + (a1-a0) ADC0+ c1 a0 x z + (a1-a0) ADC0+ a1 x (x4-z4) + b 1. And writing the calculated offset c0 of the low-temperature section temperature curve of the optical module to be tested into a register of the optical module to be tested, and obtaining the DDMI temperature of the optical module to be tested according to a1, a0, ADC0 and c1 of the corresponding register and an ADC value of the MCU under the current environment.
S204: and calculating a high-temperature section temperature curve formula according to the fact that the MCU high-temperature limit value simultaneously accords with a normal-temperature section temperature curve formula and a high-temperature section temperature curve formula.
And substituting the MCU high temperature limit value into a normal temperature section temperature curve formula of the optical module to be tested, and calculating to obtain a DDMI low temperature limit value corresponding to the MCU high temperature limit value of the optical module to be tested. Namely, z is ADC1, and is substituted into a formula T2 z + c 2.
And substituting the MCU high-temperature limit value ADC1 and the corresponding DDMI value into a high-temperature section temperature curve formula T of the optical module to be tested, namely a2 z + c2, and calculating to obtain the offset in the high-temperature section temperature curve formula of the optical module to be tested, namely a1 z + c1 a2 z + c 2.
And calculating to obtain the low-temperature section bias of the optical module to be tested, wherein c2 is (a1-a2) ADC1+ c 1.
Therefore, the formula of the low-temperature section curve of the optical module to be tested is as follows:
t-a 2 z + (a1-a2) ADC1+ c 1-a2 z + (a1-a2) ADC1+ a1 (x4-z4) + b 1. Writing the calculated offset c0 of the low-temperature section temperature curve of the optical module to be tested into a register of the optical module to be tested, and obtaining the DDMI temperature of the optical module to be tested according to a1 value, a2 value, ADC0 value and c1 value of the corresponding registers and the ADC value of the MCU under the current environment.
S300: and writing a temperature curve formula of the optical module to be tested into the DDMI of the optical module to be tested, and substituting the temperature value of the MCU of the optical module to be tested into the temperature curve of the optical module to be tested by the DDMI to calculate the environment temperature of the optical module to be tested.
The embodiment of the application provides an optical module, and the temperature value that MCU was used for measuring MCU is set up to MCU's inside. And reading the MCU temperature sampling value and a corresponding optical module temperature curve formula, and calculating to obtain the DDMI temperature of the optical module. The preset temperature curve formula comprises a high-temperature section temperature curve formula, a low-temperature section temperature curve formula and a normal-temperature section temperature curve formula. And a preset temperature curve formula is obtained by calculating the standard optical module temperature curve formula according to the DDMI temperature value of the standard optical module and the corresponding MCU temperature sampling value. And setting a temperature curve formula of the optical module to be tested according to the standard optical module temperature curve formula, wherein the slope of the standard optical module temperature curve formula is the same as that of the temperature curve formula of the optical module to be tested. And acquiring a temperature sampling value of the MCU of the optical module to be tested corresponding to a certain environment temperature, substituting the temperature sampling value into a temperature curve formula of the optical module to be tested, and calculating to obtain the temperature curve formula of the optical module to be tested. In the calibration process, the temperature sampling value of the optical module MCU to be tested corresponding to a certain environmental temperature is acquired only in a normal temperature environment and is substituted into the high-temperature section temperature curve formula, the low-temperature section temperature curve formula and the normal temperature section temperature curve formula, so that the corresponding temperature curve formula can be obtained. The temperature of the module does not need to be calibrated at normal temperature/low temperature/high temperature respectively, and the production efficiency is improved. Meanwhile, each optical module can be calibrated, and the DDMI temperature precision of each optical module can meet the requirement.
Since the above embodiments are all described by referring to and combining with other embodiments, the same portions are provided between different embodiments, and the same and similar portions between the various embodiments in this specification may be referred to each other. And will not be described in detail herein.
It is noted that, in this specification, relational terms such as "first" and "second," and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a circuit structure, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such circuit structure, article, or apparatus. Without further limitation, the use of the phrase "comprising an … …" to define an element does not exclude the presence of additional like elements in circuit structures, articles, or devices comprising the element.
Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.
The above-described embodiments of the present application do not limit the scope of the present application.
Claims (10)
1. A light module, comprising: an upper housing;
the lower shell is covered with the upper shell to form a wrapping cavity;
the circuit board is arranged in the wrapping cavity;
the optical transceiving component is arranged in the packaging cavity and is electrically connected with the circuit board;
and the MCU is arranged on the circuit board and used for collecting temperature sampling values, selecting different temperature curve formulas according to the different temperature sampling values and calculating the DDMI temperature of the optical module.
2. The optical module of claim 1, wherein the MCU includes a register configured to store the temperature profile formula.
3. The light module of claim 1, wherein the temperature profile equation comprises: a high-temperature section temperature curve formula, a low-temperature section temperature curve formula and a normal-temperature section temperature curve formula;
if the temperature sampling value is smaller than the low-temperature limit value, selecting the low-temperature section temperature curve formula;
if the temperature sampling value is larger than the high-temperature limit value, selecting the high-temperature section temperature curve formula;
otherwise, selecting a normal temperature section temperature curve formula.
4. The optical module according to claim 3, wherein the temperature curve formula of the constant temperature section is as follows:
T＝a1*z+a1*(x4-z4)+b1；
wherein T represents the DDMI temperature of the optical module; a1 is the slope of the temperature curve of the optical module at the normal temperature section; z is a temperature sampling value of the optical module and is a variable; x4 is a temperature sampling value corresponding to the standard optical module at a certain environmental temperature; z4 is a temperature sampling value corresponding to the optical module at the ambient temperature; b1 represents the normal temperature section temperature curve offset of the standard optical module; the ambient temperature is greater than the low temperature limit and less than the high temperature limit.
5. The optical module of claim 3, wherein the low temperature segment curve formula is:
T＝a0*z+(a1-a0)*ADC0+a1*(x4-z4)+b1；
wherein T represents a DDMI temperature of the optical module; a0 is the slope of the temperature curve of the low-temperature section of the optical module; a1 is the slope of the temperature curve of the optical module at the normal temperature section, z is the temperature sampling value of the optical module, and is a variable; the ADC0 is a temperature sampling value corresponding to the low-temperature limit value in the standard optical module; x4 is a temperature sampling value corresponding to the standard optical module at a certain ambient temperature; z4 is a temperature sampling value corresponding to the optical module at the ambient temperature; b1 represents the normal temperature section temperature curve offset of the standard optical module; the ambient temperature is greater than the low temperature limit and less than the high temperature limit.
6. The optical module of claim 3, wherein the high temperature segment curve formula is:
T＝a2*z+(a1-a2)*ADC1+a1*(x4-z4)+b1；
wherein T represents the DDMI temperature of the optical module; a2 is the slope of the temperature curve of the high-temperature section of the optical module; a1 is the slope of the temperature curve of the optical module at the normal temperature section, z is the MCU sampling value of the optical module, and is a variable; when the ADC1 is the high-temperature limit value, the temperature sampling value corresponding to the optical module is obtained; x4 is a temperature sampling value corresponding to the standard optical module at a certain environmental temperature; z4 is a temperature sampling value corresponding to the optical module to be tested at the environmental temperature; b1 is the normal temperature section temperature curve bias of the standard optical module; the ambient temperature is greater than the low temperature limit and less than the high temperature limit.
7. The optical module according to claim 1, characterized in that the MCU is built-in with a temperature sensor for collecting the MCU temperature sample values.
8. The optical module according to claim 1, wherein the method for obtaining the temperature curve formula comprises:
calculating a standard optical module temperature curve formula according to the DDMI temperature value of the standard optical module and the corresponding temperature sampling value thereof;
setting a temperature curve formula of the optical module to be tested according to the standard optical module temperature curve formula, wherein the slope of the standard optical module temperature curve formula is the same as that of the temperature curve formula of the optical module to be tested;
and acquiring a temperature sampling value of the optical module to be tested corresponding to a certain environment temperature, substituting the temperature sampling value into a temperature curve formula of the optical module to be tested, and calculating to obtain the temperature curve formula of the optical module to be tested.
9. The optical module of claim 8, wherein said calculating a standard optical module temperature curve formula according to the DDMI temperature values of the standard optical module and the corresponding temperature sampling values comprises:
collecting a DDMI temperature value of a standard optical module and a corresponding temperature sampling value thereof, and drawing a standard optical module temperature curve according to the DDMI temperature value and the corresponding temperature sampling value thereof;
determining a low temperature limit value and a high temperature limit value corresponding to an inflection point of a standard temperature curve according to the standard optical module temperature curve;
dividing the temperature curve of the standard optical module into three sections according to the low temperature limit value and the high temperature limit value: if the temperature is lower than the low-temperature limit value, setting a low-temperature section temperature curve formula for a low-temperature section temperature curve;
if the temperature is higher than the low and high temperature limit values, setting a high temperature section temperature curve formula for a high temperature section temperature curve;
otherwise, setting a normal temperature section temperature curve formula for the normal temperature section temperature curve;
and substituting the DDMI temperature value of the standard optical module and the corresponding temperature sampling value into the temperature curve formula of the standard optical module, and solving to obtain the slope and the offset of the temperature curve formula of the standard optical module.
10. The optical module according to claim 9, wherein the acquiring a temperature sampling value of the optical module to be tested corresponding to a certain environmental temperature, and substituting the temperature sampling value into the temperature curve formula of the optical module to be tested to calculate the temperature curve formula of the optical module to be tested, includes:
collecting a temperature sampling value of a corresponding optical module to be tested at a certain environmental temperature at a normal environmental temperature;
acquiring a temperature sampling value of a corresponding standard optical module at the ambient temperature;
substituting the environment temperature, the MC temperature sampling value of the standard optical module corresponding to the environment temperature and the temperature sampling value of the optical module to be tested into a normal temperature section temperature curve formula of the optical module to be tested, and calculating to obtain a normal temperature section temperature curve formula of the optical module to be tested;
according to the fact that the low-temperature limit value simultaneously accords with a normal-temperature section temperature curve formula and a low-temperature section temperature curve formula, calculating to obtain a low-temperature section temperature curve formula of the optical module to be tested;
and calculating a high-temperature section temperature curve formula according to the fact that the high-temperature limit value simultaneously accords with the normal-temperature section temperature curve formula and the high-temperature section temperature curve formula.
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