CN106768623A - For the method for pen point pressure sensor production test - Google Patents
For the method for pen point pressure sensor production test Download PDFInfo
- Publication number
- CN106768623A CN106768623A CN201710102460.9A CN201710102460A CN106768623A CN 106768623 A CN106768623 A CN 106768623A CN 201710102460 A CN201710102460 A CN 201710102460A CN 106768623 A CN106768623 A CN 106768623A
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- China
- Prior art keywords
- machinery
- pressure sensor
- fpc
- layouts
- scraper
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L25/00—Testing or calibrating of apparatus for measuring force, torque, work, mechanical power, or mechanical efficiency
Abstract
The present invention relates to a kind of method for the test of pen point pressure sensor production, solve that homogeneity of product present in prior art is not high, reliability is low, tests cumbersome technical problem.By using described device bag workbench, steel mesh, central controller, the machinery 1 being connected with the central controller, machinery 2, be provided with scraper machinery 3, including N number of suction nozzle machinery 4, be provided with lower lock block machinery 5, machinery 6 and ADC sampling modules, ADC sampling modules also with mechanical 5 technical scheme being connected, the problem is preferably resolved, in can be used in the industrial production of pen point pressure sensor.
Description
Technical field
The present invention relates to art of pressure sensors, it is related specifically to a kind of pen point pressure for computer entry device and passes
The method of sensor production test.
Background technology
Pressure sensor application, pressure sensor is assemblied between pen core and penholder, when people holds a pen to write, have to
Under gravity, nib is subject to a power opposite with gravity direction, makes pen core tail end squeeze pressure sensor, thus can be
Pressure value is detected on the golden finger of pressure sensor.A blue-tooth intelligence pen, pen point pressure sensor therein is due to technique
Compare special, be made up of soft board FPC and conducting foam, conducting foam can not be entered as capacitance resistance ware by chip mounter
Row paster, then crosses high temperature stove and is welded, but FPC and conducting foam are sticked together by specific glue, below figure,
Position for dispensing glue and assembling schematic diagram, if going dispensing by artificial mode, then paste conducting foam, and not only efficiency is low,
Hardly possible controls the amount of glue, and conducting foam and FPC also difficult control to it is very neat.Can by production method and automatic test approach
To avoid these well.Both the position of a glue and in the same size can have been ensured, it is also ensured that FPC and conducting foam pair
It is very neat.
Existing generation method is that using manually being pasted, there is that uniformity is low, the cumbersome technical problem of testing procedure.
Therefore it provides a kind of dispensing same effect of pasting is high, the simple device and method of method of testing is just necessary.
The content of the invention
The technical problems to be solved by the invention be present in prior art pen point pressure sensor assembling uniformity and
Reliability is relatively low, the cumbersome technical problem of method of testing, there is provided a kind of new to be for the test of pen point pressure sensor production
System and application method, the device and application method have uniformity high, and reliability is high, the characteristics of testing procedure is simple.
In order to solve the above technical problems, the technical scheme for using is as follows：
A kind of system for the test of pen point pressure sensor production, described device bag workbench, steel mesh, center control
Device, be connected with the central controller machinery 1, machinery 2, be provided with scraper machinery 3, including N number of suction nozzle machinery 4, be provided with
The machinery 5 of lower lock block, machinery 6 and ADC sampling modules, ADC sampling modules are also connected with described mechanical 5；Described mechanical 1 is used to take
It is placed with the FPC layouts of N number of unit；Described mechanical 2 are used to pick and place the steel mesh；Described mechanical 3 operate for frictioning；The machinery
4 are used for pressure conducting foam；Described mechanical 5 are used to applying different pressures and push thimble to be contacted with golden finger, completion pressure test；
Described mechanical 6 are used to take out the pen point pressure sensor for completing test；The steel mesh is provided with some apertures, peripheral side surface level
Direction is provided with baffle plate, and baffle plate inner side is for coating on-liquid glue；Wherein N is positive integer.
It is optimization in such scheme, further, described mechanical 4 include first pressure gears, that pressure increases successively
Two pressure gears and the 3rd pressure gear.
Further, the worktable upper surface has several locating dowels, the locating dowel position and hole in FPC layouts
Position correspondence.
Further, described mechanical 2 hook is provided with, it is described to link up with for hanging and taking the steel mesh.
Further, described mechanical 5 include the marking pen for labeled test defective products.
The present invention also provides a kind of application method of the system for the test of pen point pressure sensor production, methods described bag
Include：
(1) FPC layouts are positioned over pallet by power-on, starter, and conducting foam is positioned over material disc；
(2) control machinery 1 is taken out FPC layouts and is positioned over workbench, and the FPC layouts hole is corresponding with table positions post；
(3) control machinery 2, make to be aligned on 6 holes of steel mesh and workbench and take a seat, and steel mesh lower surface is provided with baffle plate, described
Uniform fold on-liquid glue in baffle plate.
(4) machinery 3 is started, glue operation is scraped in completion；
(4) start machinery 4, conducting foam be positioned in the FPC layouts, conducting foam is corresponding with FPC layouts position,
Start machinery 5, complete pressure test；
(5) machinery 5, machinery 4 are removed successively, are started machinery 6 and are taken out pen point pressure sensor, into next FPC layouts
Operation.
It is optimization in the above method, further, the step (3) includes：
(A) machinery 3 is started, the rightmost side of the baffle plate on mobile scraper to steel mesh is adjacent to right side and puts down, scraper lower edge and steel
Plate is contacted, at the uniform velocity toward scraper is moved left, scraper reaches the leftmost side, lifts scraper；
(B) mobile scraper, the leftmost side for being adjacent to baffle plate is put down, then at the uniform velocity toward moving right, scraper reaches the rightmost side；
(C) control machinery 3 removes scraper, and control machinery 2 removes steel mesh, obtains completing FPC layouts for dispensing glue.
Further, the step (4) includes：
A () pushes down conducting foam using suction nozzle, set first pressure gear, second pressure gear and the 3rd pressure gear,
Apply pressure by gear order, while starting machinery 5, pressure VCC is electrified to FPC golden fingers, threshold value is set；
B () starts the ADC sampling modules carries out voltage detecting to each pressure sensor, obtains magnitude of voltage VSS, VSS
More than threshold value, then pressure sensor is bad, and the poor pressure sensor is marked using marking pen on machinery 5.
Further, the first pressure gear, second pressure gear and the 3rd pressure gear be respectively 30g, 60g,
90g。
On FPC, by it is symmetrical, equidistant, etc. it is necessary around two parallel circuits, the local circuit of pitch of the laps in the way of line width
Windowing (being exactly that the copper of circuit will expose, it is impossible to have ink to cover), on coiling both sides, empty place carries out an on-liquid
Glue, liquid glue mobility is big, it is most likely that flow on circuit, once there is glue on circuit, has directly clung conducting foam, this
Resistance value is just there is always between two golden fingers of sample, it is exactly have voltage always to be electrified, whether None- identified pen is in
Lifting status, that is to say, that central controller thinks there is pressure on nib always, will produce maloperation.Glue selecting liquidity
It is smaller, can be into silk, the good on-liquid glue of viscosity.Point glues conducting foam after having got well glue, and conducting foam selection resistance is larger
Conducting foam, conventional Standard resistance range is 10 5 powers, around the number of turns it is more, range ability is bigger.After after pasting,
When there is pressure to be applied to sensor, conducting foam and exposed copper cash are contacted, on the circuit parallel equivalent to two simultaneously
Many resistance, pressure is bigger, and contact surface is bigger, and resistance it is more, the all-in resistance at golden finger two ends is just smaller, then with precision
Resistance is combined, and the magnitude of voltage that processor can be recognized is changed out in energization.
Below figure, theoretical voltage V=R2/ (R2+R1) the * VCC on resistance R2, collection voltages module can select high accuracy
ADC sampling modules, by formula V=ADC_Value/ (2^12) * VCC, you can draw magnitude of voltage, wherein ADC_Value is
The numerical value that ADC is converted to, the numerical value is changed by formula.
It is automatically controlled due to being carried out to each machinery and step using central controller, therefore eliminate what is occurred in artificial operation
Various abnormal factorses.The position consistency of each FPC point glue can thus be controlled.The glue quantity one of each FPC point can be controlled
Cause.The neat of FPC and conducting foam pair can be controlled.FPC layout-steel meshes-automatic scraping glue-automatic survey can automatically be picked and placeed
Try-mark automatically-automatically take out the pressure sensor after having tested, a series of actions.Each pressure sensing can automatically be tested
Under several different gravity, whether the pressure value for showing is marked device in the range of meeting to bad FPC.
Beneficial effects of the present invention：
Effect one, improves the uniformity and reliability of pen point pressure sensor assembling；
Effect two, reduces difficulty of test；
Effect three, marks defective products automatically.
Brief description of the drawings
The present invention is further described with reference to the accompanying drawings and examples.
Fig. 1 is used for the composition schematic diagram of the system of pen point pressure sensor production test.
Fig. 2 pen point pressure sensor application schematic diagrames.
Fig. 3 pressure sensor pressure test equivalent schematics.
FPC layouts schematic diagram in Fig. 4 embodiments 1.
Steel mesh schematic diagram in Fig. 5 embodiments 1.
Wherein, 11- baffle plates
Specific embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to embodiments, to the present invention
It is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not used to
Limit the present invention.
Fig. 1 is used for the composition schematic diagram of the system of pen point pressure sensor production test.Fig. 2 pen point pressure sensor applications
Schematic diagram.Fig. 3 pressure sensor pressure test equivalent schematics.FPC layouts schematic diagram in Fig. 4 embodiments 1.In Fig. 5 embodiments 1
Steel mesh schematic diagram.
Embodiment 1
The present embodiment provides a kind of system for the test of pen point pressure sensor production, and such as Fig. 4 has 20 in FPC layouts
Individual unit.Such as Fig. 1, described device bag workbench, steel mesh, central controller, the machinery 1 being connected with the central controller, machine
Tool 2, be provided with scraper machinery 3, including N number of suction nozzle machinery 4, be provided with lower lock block machinery 5, machinery 6 and ADC sampling modules,
ADC sampling modules are also connected with described mechanical 5；The described mechanical 1 FPC layouts for being used to pick and place N number of unit；Described mechanical 2 use
In picking and placeing the steel mesh；Described mechanical 3 operate for frictioning；Described mechanical 4 are used for pressure conducting foam；Described mechanical 5 are used for
Applying different pressures push thimble and are contacted with golden finger, complete pressure test；Described mechanical 6 are used to take out the nib for completing test
Pressure sensor；As Fig. 5, the steel mesh are provided with some apertures, peripheral side surface horizontal direction is provided with baffle plate, and baffle plate inner side is used for
Coating on-liquid glue；Wherein N is positive integer.
20 suction nozzles of mechanical 4 assembling, once can simultaneously draw 20 conducting foams.Such as Fig. 4, have 6 in FPC layouts
Individual location hole, worktable upper surface has 6 locating dowels, and the locating dowel position is corresponding with the position in hole in FPC layouts.The machine
Tool 2 is provided with hook, described to link up with for hanging and taking the steel mesh.Described mechanical 5 can set 3 pressure gears, respectively 30g,
60g, 90g, also including the marking pen for labeled test defective products.
The application method of the system for the test of pen point pressure sensor production that the present embodiment is provided includes：
(1) FPC layouts are positioned over pallet by power-on, starter, and conducting foam is positioned over material disc；
(2) control machinery 1 is taken out FPC layouts and is positioned over workbench, and the FPC layouts hole is corresponding with table positions post；
(3) control machinery 2, make to be aligned on 6 holes of steel mesh and workbench and take a seat, and steel mesh lower surface is provided with baffle plate, described
Uniform fold on-liquid glue in baffle plate.
(4) machinery 3 is started, glue operation is scraped in completion；
(4) start machinery 4, conducting foam be positioned in the FPC layouts, conducting foam is corresponding with FPC layouts position,
Start machinery 5, complete pressure test, pressure test principle such as Fig. 2, isoboles such as Fig. 3；
Pressure sensor is assemblied between pen core and penholder, when people holds a pen to write, has a downward gravity, and nib is received
To a power opposite with gravity direction, make pen core tail end squeeze pressure sensor, thus can be in the gold of pressure sensor
Pressure value is detected on finger.Theoretical voltage V=R2/ (R2+R1) * VCC on resistance R2, collection voltages module can select height
The ADC of precision, such as 12bit, by formula V=ADC_Value/ (2^12) * VCC, you can draw magnitude of voltage, wherein ADC_
Value is the numerical value that ADC is converted to, and the numerical value is not magnitude of voltage, it is necessary to be changed by formula.
(5) machinery 5, machinery 4 are removed successively, are started machinery 6 and are taken out pen point pressure sensor, into next FPC layouts
Operation.
Step (3) includes：
(A) machinery 3 is started, the rightmost side of the baffle plate on mobile scraper to steel mesh is adjacent to right side and puts down, scraper lower edge and steel
Plate is contacted, at the uniform velocity toward scraper is moved left, scraper reaches the leftmost side, lifts scraper；
(B) mobile scraper, the leftmost side for being adjacent to baffle plate is put down, then at the uniform velocity toward moving right, scraper reaches the rightmost side；
(C) control machinery 3 removes scraper, and control machinery 2 removes steel mesh, obtains completing FPC layouts for dispensing glue.
Step (4) includes：
A () pushes down conducting foam using suction nozzle, set first pressure gear, second pressure gear and the 3rd pressure gear,
First pressure gear, second pressure gear and the 3rd pressure gear are respectively 30g, 60g, 90g, and pressure is applied by gear order,
Start machinery 5 simultaneously, pressure VCC is electrified to FPC golden fingers, threshold value is set；
B () starts the ADC sampling modules carries out voltage detecting to each pressure sensor, obtains magnitude of voltage VSS, VSS
More than threshold value, then pressure sensor is bad, and the poor pressure sensor is marked using marking pen on machinery 5.
When whole machine is assembled, the pressure sensor that can be by hand torn by employee is assembled blue-tooth intelligence pen.
Embodiment 2
The present embodiment further illustrates the optimization of the suction nozzle quantity of machinery 4 on the basis of embodiment 1.The present embodiment FPC
Contain 30 units in layout.
Machinery 4 in described device assembles 30 suction nozzles, once can simultaneously draw 30 conducting foams.Therefore, suction nozzle
Quantity with FPC layouts element number change.Separately, positioning hole number is not limited to 6, only needs position correspondence.
Although being described to illustrative specific embodiment of the invention above, in order to the technology of the art
Personnel are it will be appreciated that the present invention, but the present invention is not limited only to the scope of specific embodiment, to the common skill of the art
For art personnel, as long as long as various change is in appended claim restriction and the spirit and scope of the invention for determining, one
The innovation and creation using present inventive concept are cut in the row of protection.
Claims (4)
1. it is a kind of for pen point pressure sensor production test method, it is characterised in that：Methods described includes：
(1) FPC layouts are positioned over pallet by power-on, starter, and conducting foam is positioned over material disc；
(2) control machinery 1 is taken out FPC layouts and is positioned over workbench, and the FPC layouts hole is corresponding with table positions post；
(3) control machinery 2, make to be aligned on 6 holes of steel mesh and workbench and take a seat, and steel mesh lower surface is provided with baffle plate, the baffle plate
Interior uniform fold on-liquid glue.
(4) machinery 3 is started, glue operation is scraped in completion；
(4) start machinery 4, conducting foam is positioned in the FPC layouts, conducting foam is corresponding with FPC layouts position, start
Machinery 5, completes pressure test；
(5) machinery 5, machinery 4 are removed successively, are started machinery 6 and are taken out pen point pressure sensor, into next FPC layouts operation.
2. it is according to claim 1 for pen point pressure sensor production test method, it is characterised in that：The step
(3) include：
(A) machinery 3 is started, the rightmost side of the baffle plate on mobile scraper to steel mesh is adjacent to right side and puts down, and scraper lower edge connects with steel plate
Touch, at the uniform velocity toward scraper is moved left, scraper reaches the leftmost side, lifts scraper；
(B) mobile scraper, the leftmost side for being adjacent to baffle plate is put down, then at the uniform velocity toward moving right, scraper reaches the rightmost side；
(C) control machinery 3 removes scraper, and control machinery 2 removes steel mesh, obtains completing FPC layouts for dispensing glue.
3. it is according to claim 2 for pen point pressure sensor production test method, it is characterised in that：The step
(4) include：
A () pushes down conducting foam using suction nozzle, first pressure gear, second pressure gear and the 3rd pressure gear are set, by shelves
Position order applies pressure, while starting machinery 5, pressure VCC is electrified to FPC golden fingers, sets threshold value；
B () starts the ADC sampling modules carries out voltage detecting to each pressure sensor, obtains magnitude of voltage VSS, and VSS exceedes
Then pressure sensor is bad to threshold value, and the poor pressure sensor is marked using marking pen on machinery 5.
4. it is according to claim 3 for pen point pressure sensor production test method, it is characterised in that：Described first
Pressure gear, second pressure gear and the 3rd pressure gear are respectively 30g, 60g, 90g.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710102460.9A CN106768623A (en) | 2017-02-28 | 2017-02-28 | For the method for pen point pressure sensor production test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710102460.9A CN106768623A (en) | 2017-02-28 | 2017-02-28 | For the method for pen point pressure sensor production test |
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| Publication Number | Publication Date |
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| CN106768623A true CN106768623A (en) | 2017-05-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710102460.9A Pending CN106768623A (en) | 2017-02-28 | 2017-02-28 | For the method for pen point pressure sensor production test |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6362642B1 (en) * | 1997-10-09 | 2002-03-26 | Micron Technology, Inc. | Method of chip testing of chip leads constrained in dielectric media |
| CN202003824U (en) * | 2010-11-26 | 2011-10-05 | 深圳市优创展科技有限公司 | Glue smearing device for surface mounted inductors |
| CN103066185A (en) * | 2012-08-13 | 2013-04-24 | 木林森股份有限公司 | Manufacturing method for printing chip on board (COB) |
| CN105170420A (en) * | 2015-10-22 | 2015-12-23 | 厦门欣力巨软件有限公司 | Online LCM dispenser |
| CN105842614A (en) * | 2016-06-03 | 2016-08-10 | 苏州赛腾精密电子股份有限公司 | Rotary test mechanism and PCB test method based on rotary test mechanism |
-
2017
- 2017-02-28 CN CN201710102460.9A patent/CN106768623A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6362642B1 (en) * | 1997-10-09 | 2002-03-26 | Micron Technology, Inc. | Method of chip testing of chip leads constrained in dielectric media |
| CN202003824U (en) * | 2010-11-26 | 2011-10-05 | 深圳市优创展科技有限公司 | Glue smearing device for surface mounted inductors |
| CN103066185A (en) * | 2012-08-13 | 2013-04-24 | 木林森股份有限公司 | Manufacturing method for printing chip on board (COB) |
| CN105170420A (en) * | 2015-10-22 | 2015-12-23 | 厦门欣力巨软件有限公司 | Online LCM dispenser |
| CN105842614A (en) * | 2016-06-03 | 2016-08-10 | 苏州赛腾精密电子股份有限公司 | Rotary test mechanism and PCB test method based on rotary test mechanism |
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Application publication date: 20170531 |
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| RJ01 | Rejection of invention patent application after publication |