CN106751885A - 一种导热性好、具有荧光功能的led封装材料及其制备方法 - Google Patents
一种导热性好、具有荧光功能的led封装材料及其制备方法 Download PDFInfo
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Abstract
本发明公开了一种导热性好、具有荧光功能的LED封装材料及其制备方法,其特征在于,是由以下重量份的原料制成:碳纳米管2‑4,乙烯基硅油30‑40,金刚石1‑2,乙烯基MQ 树脂7‑11,二甲苯10‑20,柠檬酸4‑8,乙二胺3‑6,聚乙二醇2‑4,去离子水5‑10,硅微粉5‑10,硅烷偶联剂KH550 5‑10,含氢硅油交联剂25‑35,氯铂酸异丙醇2‑3。本发明利用用碳点荧光材料对硅微粉进行浸泡,并引入到封装用硅胶材料中,所得硅胶材料具有荧光功能,并且防开裂性能优良;配合添加的碳纳米管等,使材料的导热性更加优良。
Description
技术领域
本发明涉及一种LED封装材料,具体涉及一种导热性好、具有荧光功能的LED封装材料及其制备方法。
背景技术
LED 封装用有机硅材料通常是以乙烯基硅树脂或乙烯基硅油为基础胶料,低粘度含氢硅油为交联剂,再配合补强树脂、稀释剂、催化剂、抑制剂等,在一定条件下交联固化而得。随着 LED 封装技术的进步,特别是大功率白光 LED 的发展,有机硅类封装材料越来越显示出其优势。LED 封装用硅胶材料不同于一般的有机硅材料,除了要具备较好的力学性能外,又须保持优良的耐热性和高透明性。有机硅封装材料的制备大多采用双组份加成型配方体系,在 Pt 系催化剂存在的条件下通过热固化成型。
刘金龙在其硕士学位论文《LED 封装用硅胶材料的制备及性能研究》中,利用乙烯基硅油和含氢硅油交联剂制备了LED封装用硅胶材料,但是还存在着防开裂性能欠缺、不具有荧光功能等问题。
发明内容
基于以上思考,本发明旨在提供一种防开裂,并且具有荧光功能的LED封装材料。
本发明所要解决的技术问题采用以下的技术方案来实现 :
一种导热性好、具有荧光功能的LED封装材料,其特征在于,是由以下重量份的原料制成:
碳纳米管2-4,乙烯基硅油30-40,金刚石1-2,乙烯基MQ 树脂7-11,二甲苯10-20,柠檬酸4-8,乙二胺3-6,聚乙二醇2-4,去离子水5-10,硅微粉5-10,硅烷偶联剂KH550 5-10,含氢硅油交联剂25-35,氯铂酸异丙醇2-3。
所述的一种导热性好、具有荧光功能的LED封装材料及其制备方法,其特征在于,是由以下步骤制成:
a. 在装有搅拌器、热电偶的容器中投入乙烯基硅油、聚乙二醇,升温至80-120℃;将乙烯基MQ 树脂溶于二甲苯溶液中,搅拌至溶解后,缓慢滴加到上述乙烯基硅油中,滴毕后继续恒温搅拌 10-30min,最后充分脱除溶剂得到基础胶;
b. 以柠檬酸为碳源,加入乙二胺、去离子水,在150-250℃条件下放置3-7天,得到在紫外光激发下,具有蓝光发射、绿光发射及红光发射的液体状碳点荧光材料;
c. 将硅微粉、碳纳米管、金刚石加入到步骤b所得液体中,再加入硅烷偶联剂KH550,超声分散10-30min后,浸泡3-5h,过滤、水洗、烘干,得到吸附碳点荧光材料的混合物;
d. 向步骤a所得基础胶中加入含氢硅油交联剂和步骤c所得混合物,然后注入氯铂酸异丙醇,混合均匀后真空脱泡 20-50 min,然后分别于80-100 ℃预交联 0.5-2 h,130-160℃深度固化 1-3 h,冷却至室温得到封装材料;
所述的一种导热性好、具有荧光功能的LED封装材料及其制备方法,其特征在于,步骤a中脱除溶剂的条件为温度120-140℃,压力-0.06~-0.1MPa。
本发明的有益效果是:采用乙烯基MQ 树脂补强乙烯基硅油,制得的封装材料耐热性较好,拉伸强度较大;硅烷偶联剂KH550处理过的硅微粉吸附性、分散性较好,浸泡于碳点荧光材料中后,可以吸附碳点荧光材料,从而赋予封装材料可荧光的特点,同时,其均匀分散在硅胶封装材料中,避免了碳点荧光材料和LED芯片的直接接触,有效解决了由于 LED芯片发热而导致荧光材料衰减速率过高、失效过快的问题,进而提高了 LED 灯的使用寿命和综合品质;另一方面,硅微粉的引入不仅可以作为碳点荧光材料的载体,还能降低硅材料固化反应的放热峰值温度,降低固化物的线膨胀系数和收缩率,从而消除固化物的内应力,防止开裂;配合添加的碳纳米管等,使材料的导热性更加优良。
具体实施方式
下面结合实施例, 对本发明的具体实施方式作进一步描述。
实施例
一种导热性好、具有荧光功能的LED封装材料,其特征在于,是由以下重量份的原料制成:
碳纳米管4,乙烯基硅油40,金刚石2,乙烯基MQ 树脂11,二甲苯20,柠檬酸8,乙二胺6,聚乙二醇4,去离子水10,硅微粉10,硅烷偶联剂KH550 10,含氢硅油交联剂35,氯铂酸异丙醇3。
所述的一种导热性好、具有荧光功能的LED封装材料及其制备方法,其特征在于,是由以下步骤制成:
a. 在装有搅拌器、热电偶的容器中投入乙烯基硅油、聚乙二醇,升温至80-120℃;将乙烯基MQ 树脂溶于二甲苯溶液中,搅拌至溶解后,缓慢滴加到上述乙烯基硅油中,滴毕后继续恒温搅拌 10-30min,最后充分脱除溶剂得到基础胶;
b. 以柠檬酸为碳源,加入乙二胺、去离子水,在150-250℃条件下放置3-7天,得到在紫外光激发下,具有蓝光发射、绿光发射及红光发射的液体状碳点荧光材料;
c. 将硅微粉、碳纳米管、金刚石加入到步骤b所得液体中,再加入硅烷偶联剂KH550,超声分散10-30min后,浸泡3-5h,过滤、水洗、烘干,得到吸附碳点荧光材料的混合物;
d. 向步骤a所得基础胶中加入含氢硅油交联剂和步骤c所得混合物,然后注入氯铂酸异丙醇,混合均匀后真空脱泡 20-50 min,然后分别于80-100 ℃预交联 0.5-2 h,130-160℃深度固化 1-3 h,冷却至室温得到封装材料;
所述的一种导热性好、具有荧光功能的LED封装材料及其制备方法,其特征在于,步骤a中脱除溶剂的条件为温度120-140℃,压力-0.06~-0.1MPa。
本发明的技术参数为:硬度≥62度;拉伸强度≥ 4.94 MPa;断裂伸长率≥231%;透光率≥90%。
Claims (3)
1.一种导热性好、具有荧光功能的LED封装材料,其特征在于,是由以下重量份的原料制成:
碳纳米管2-4,乙烯基硅油30-40,金刚石1-2,乙烯基MQ 树脂7-11,二甲苯10-20,柠檬酸4-8,乙二胺3-6,聚乙二醇2-4,去离子水5-10,硅微粉5-10,硅烷偶联剂KH550 5-10,含氢硅油交联剂25-35,氯铂酸异丙醇2-3。
2.根据权利要求1所述的一种导热性好、具有荧光功能的LED封装材料及其制备方法,其特征在于,是由以下步骤制成:
a. 在装有搅拌器、热电偶的容器中投入乙烯基硅油、聚乙二醇,升温至80-120℃;将乙烯基MQ 树脂溶于二甲苯溶液中,搅拌至溶解后,缓慢滴加到上述乙烯基硅油中,滴毕后继续恒温搅拌 10-30min,最后充分脱除溶剂得到基础胶;
b. 以柠檬酸为碳源,加入乙二胺、去离子水,在150-250℃条件下放置3-7天,得到在紫外光激发下,具有蓝光发射、绿光发射及红光发射的液体状碳点荧光材料;
c. 将硅微粉、碳纳米管、金刚石加入到步骤b所得液体中,再加入硅烷偶联剂KH550,超声分散10-30min后,浸泡3-5h,过滤、水洗、烘干,得到吸附碳点荧光材料的混合物;
d. 向步骤a所得基础胶中加入含氢硅油交联剂和步骤c所得混合物,然后注入氯铂酸异丙醇,混合均匀后真空脱泡 20-50 min,然后分别于80-100 ℃预交联 0.5-2 h,130-160℃深度固化 1-3 h,冷却至室温得到封装材料。
3.根据权利要求2所述的一种导热性好、具有荧光功能的LED封装材料及其制备方法,其特征在于,步骤a中脱除溶剂的条件为温度120-140℃,压力-0.06~-0.1MPa。
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