CN106738360B - Quartz pendulous reed substrate and preparation method thereof - Google Patents
Quartz pendulous reed substrate and preparation method thereof Download PDFInfo
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- CN106738360B CN106738360B CN201710046645.2A CN201710046645A CN106738360B CN 106738360 B CN106738360 B CN 106738360B CN 201710046645 A CN201710046645 A CN 201710046645A CN 106738360 B CN106738360 B CN 106738360B
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- quartz
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- pendulous reed
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- substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
Abstract
The invention discloses a kind of quartz pendulous reed substrate and preparation method thereof, belong to optical element field, wherein preparation method comprises the following steps：Draw rod, round as a ball, wire cutting section, chamfering, twin grinding, twin polishing, ring throwing.Quartz pendulous reed substrate of the present invention and preparation method thereof has the advantages that machining accuracy height, efficiency high, saves material.
Description
Technical field
The present invention relates to optical element field, and in particular to a kind of quartz pendulous reed substrate and preparation method thereof.
Background technology
Quartz flexible accelerometer is a kind of high-precision acceleration transducer, is widely used in Aero-Space, ship, stone
The fields such as exploration activity.It is generally made up of quartz pendulous reed and functional circuit, and wherein quartz pendulous reed is in quartz flexible accelerometer
Core parts, play inertia sensitization, its crudy has a major impact to the precision and stability of accelerometer.Quartz pendulum
Piece substrate be make quartz pendulous reed premise, it is the circular quartz glass polishing piece with specific dimensions, subsequently by needle drawing,
The processes such as acid etching, plated film form quartz pendulous reed, therefore, flatness, the depth of parallelism, surface roughness and the Ya Biao of quartz pendulous reed substrate
The indexs such as face quality directly affect the performance of quartz pendulous reed.
Processing for quartz pendulous reed substrate, the processing method mainly used in industry at present are cut for raw material of quartz glass
Side, thick round as a ball, thin round as a ball, inside diameter slicer section, chamfering, one side grinding, single-sided polishing, current methods are primarily present with next
A little shortcomings：1. raw material of quartz glass butt mode causes stock utilization low, cost of material increase；2. inner circle slicing mode is cut
Cutter mouth is wide, causes waste of material；3. grinding and polishing complex procedures, efficiency is low, and when quartz glass disk and substrate sticking, two
The variable thickness of rosin or Chinese wax causes between person, causes the depth of parallelism of quartz glass disk and consistency of thickness poor.It is in addition, quartzy
The thickness of glass wafer is not easy to detect.
The content of the invention
The embodiment of the present invention provides a kind of quartz pendulous reed substrate and preparation method thereof, and the inventive method, which has, saves raw material,
The advantages of process is simply and precision is high.
The purpose of the present invention is achieved by the following technical solution：
On the one hand, the embodiments of the invention provide a kind of preparation method of quartz pendulous reed substrate, comprise the following steps：
(1) rod is drawn：Draw rod to raw material of quartz glass using rod machine is drawn, drill bit used be copper sintered diamond cylinder drill bit or
Electroplated diamond cylinder drill bit, diamond mesh number are 150-1000 mesh, and drill speed is not less than 1000r/min, and feed speed is not
More than 5mm/min, bar diameter is bigger 2-4mm than the quartz pendulous reed substrate diameter that need to be prepared；
(2) it is round as a ball：Cylindricalo grinding is carried out to the bar using cylindrical grinder or centerless grinder, emery wheel used is not small
In #320 resin sintered diamond emery wheel, its medium plain emery wheel feed speed is not more than 0.1mm/min, and described bar diameter is ground
Cut to the size of described quartz pendulous reed substrate；
(3) wire cutting is cut into slices：Described bar is cut into quartz glass plate using wire cutting using multi-line cutting machine, it is used
Wire rod is a diameter of 0.1-0.3mm electroplated diamonds line of cut, the quartz pendulous reed described in the thickness ratio of described quartz glass plate
The big 0.2-0.4mm of thickness of substrate；
(4) chamfering：Chamfering, chamfering angle size 0.2- are carried out to the upper and lower surface and side intersection of quartz glass plate
0.3mm×45°；
(5) twin grinding：Batch grinding is carried out to quartz glass plate using twin grinder, grinds obtained quartz glass
The big 0.05-0.06mm of thickness of quartz pendulous reed substrate described in abrasive sheet thickness ratio；
(6) twin polishing：Batch polishing, the quartzy glass obtained after polishing are carried out to quartz glass plate using Twp-sided polishing machine
The big 0.01-0.02mm of quartz pendulous reed substrate thickness described in glass polished silicon wafer thickness ratio；
(7) ring is thrown：Described quartz glass polished silicon wafer is subjected to ring throwing, makes the two sides point of described quartz glass polished silicon wafer
Not Qu Chu 0.005-0.01mm thickness, to thickness be described quartz pendulous reed substrate thickness, ring throw operating ambient temperature be 21-
23 DEG C, humidity 50-70%.
Further, the twin polishing in the twin grinding of described step (5) and (6) is all using described in planetary piece fixture
Planetary piece fixture be marginal belt tooth internal openings thin rounded flakes, its thickness 0.2-0.3mm small compared with quartz pendulous reed thickness, material
For hard resin, edge teeth can match with sun gear on double-faced grinding and polishing machine with the tooth on planetary gear, perforate point
For station hole and non-station hole, station bore dia 0.1-0.2mm big compared with quartz glass plate diameter, using planetary piece fixture central point as
Center is uniformly distributed in a ring, and perforate center ensures there there is not quartz glass plate in the course of work with planetary piece fixture outward flange distance
Part more than 1/2 can stretch out polishing plate edge, and non-station hole is uniformly distributed within the annulus of station hole formation.
Further, the ground slurry used in the twin grinding in described step (5) is pressed for abrasive micropowder and pure water
Volume ratio 1:20~1:The mixture of 5 compositions, add inorganic base or organic alkali solution regulation ground slurry pH=10-12, institute
The abrasive micropowder particle diameter D (50) stated=3-5 μm, D (90)=5-7 μm.
Further, described abrasive micropowder material be aluminum oxide, carborundum, boron carbide, boron nitride, natural emery or
Diamond.
Further, polishing fluid used in described step (6) is Ludox and cerium oxide polishing slurry is 1 by volume:1~
5:The mixture of 1 composition, inorganic alkali solution regulation pH=10-12 is added, abrasive material mass concentration is 20- wherein in Ludox
40%, contained silica dioxide granule particle diameter is 50-100nm, and abrasive material mass concentration is 10-20% in cerium oxide polishing slurry used,
Contained cerium oxide particle particle diameter is 100-200nm, and filtering accuracy is 0.2 μm.
Further, the polishing medium that described step (7) is selected is for #80 optics pitch with rosin by weight 4:1~
7:The mixture of 1 composition simultaneously pours on aluminum matrix and builds up disk, and square net, cutting width are carved with thickness 10-20mm, surface
For 0.2-0.5mm, depth 0.5-1mm, mesh width 5-20mm.
Further, the fixture used in described step (7) for circular stainless steel disc and hard plastic sheet with holes and
The assembly formed is padded, wherein circular stainless steel disc is substrate, the upper and lower surface depth of parallelism is less than 10 ", flatness is less than 0.3 μ
M, hard plastic sheet are circle, and diameter is consistent with substrate, and the consistency of thickness of thickness and described quartz pendulous reed substrate, there is circle inside
Shape perforate, aperture 0.1-0.2mm big compared with quartz pendulous reed diameter, perforate are uniformly distributed in a ring, and hard plastic sheet is pasted on substrate
Circular surface, band rounded groove substrate is formed, pads and damps cloth for circle, diameter is consistent with rounded groove, thickness 0.1-
0.3mm, it is pasted on fluting bottom.
Further, the polishing medium used in described (6) twin polishing is the polyurethane polishing that Shore hardness is more than 85
Pad, pad interface are provided with the groove for being mutually perpendicular to intersect, and groove width 0.5-2mm, ditch separation is 5-20mm.
Second aspect, the embodiment of the present invention additionally provide a kind of quartz pendulous reed substrate, and described quartz pendulous reed substrate is by upper
The method stated is prepared.
Compared with prior art, quartz pendulous reed substrate of the present invention and preparation method thereof at least has the following advantages that：
The inventive method, which prepares quartz pendulous reed substrate, can save material, reduce processing cost, improve piece rate, protect simultaneously
The precision of substrate is demonstrate,proved；The depth of parallelism of the quartz pendulous reed substrate of processing is less than 3 ", flatness is less than 300nm, and surface roughness is (
Root value) it is less than 1nm.
Rod is drawn in the inventive method can save 5-8% quartz glass raw material compared with butt sawing sheet, save thick round as a ball work
Sequence, simplify technique；And wire cutting mode mechanical stress to caused by quartz glass plate is small, therefore slice thickness can be reduced,
Piece rate is improved, saves material；The depth of parallelism of quartz pendulous reed substrate upper and lower surface can be effectively ensured in twin grinding mode, lifting
Processing efficiency, improve the operability and accuracy of Thickness sensitivity；Twin polishing can fast and effeciently remove grinding to quartz
Surface and sub-surface damage layer caused by pendulum substrate, while ensure the depth of parallelism of quartz pendulous reed substrate；Ring, which is thrown, can eliminate stone
" turned-down edge " phenomenon that English pendulum substrate is formed during twin polishing, improve the flatness of quartz pendulous reed substrate.
Brief description of the drawings
Fig. 1 is the process chart of quartz pendulous reed substrate of the present invention and preparation method thereof；
Fig. 2 is Two sides milling and polishing planetary piece fixture structure and position in quartz pendulous reed substrate of the present invention and preparation method thereof
Schematic diagram；
Fig. 3 is that quartz pendulous reed substrate of the present invention and preparation method thereof middle ring throws fixture structure schematic diagram.
Embodiment
The present invention program is elaborated with reference to preferred embodiment, it will be appreciated that embodiment is in order to facilitate this
The understanding of scheme of the invention, and not as the restriction of the present invention program.
Fig. 1 is the process chart of quartz pendulous reed substrate of the present invention and preparation method thereof, is prepared according to the flow shown in Fig. 1
Quartz pendulous reed substrate.
A kind of preparation method of quartz pendulous reed substrate, comprises the following steps：
(1) rod is drawn：Rod is drawn to raw material of quartz glass using rod machine is drawn, drill bit used is copper sintered diamond cylinder drill bit,
Diamond mesh number is 150-1000 mesh, and drill speed is not less than 1000r/min, and feed speed is not more than 5mm/min, bar diameter
Quartz pendulous reed substrate diameter than that need to prepare is big 2-4mm；
(2) it is round as a ball：Cylindricalo grinding is carried out to the bar using cylindrical grinder, emery wheel used is the resin not less than #320
Sintered diamond emery wheel, its medium plain emery wheel feed speed are not more than 0.1mm/min, and described bar diameter is ground to described stone
The size of English pendulum substrate；
(3) wire cutting is cut into slices：Described bar is cut into quartz glass plate using wire cutting using multi-line cutting machine, it is used
Wire rod is a diameter of 0.1-0.3mm electroplated diamonds line of cut, the quartz pendulous reed described in the thickness ratio of described quartz glass plate
The big 0.2-0.4mm of thickness of substrate；
(4) chamfering：Chamfering, chamfering angle size 0.2- are carried out to the upper and lower surface and side intersection of quartz glass plate
0.3mm×45°；
(5) twin grinding：Batch grinding is carried out to quartz glass plate using twin grinder, grinds obtained quartz glass
The big 0.05-0.06mm of thickness of quartz pendulous reed substrate described in abrasive sheet thickness ratio；
(6) twin polishing：Batch polishing, the quartzy glass obtained after polishing are carried out to quartz glass plate using Twp-sided polishing machine
The big 0.01-0.02mm of quartz pendulous reed substrate thickness described in glass polished silicon wafer thickness ratio；
(7) ring is thrown：Described quartz glass polished silicon wafer is subjected to ring throwing, makes the two sides point of described quartz glass polished silicon wafer
Not Qu Chu 0.005-0.01mm thickness, to thickness be described quartz pendulous reed substrate thickness, ring throw operating ambient temperature be 21-
23 DEG C, humidity 50-70%.
To note here is that：5-8% quartz glass raw material can be saved compared with butt sawing sheet by drawing rod, be saved thick round as a ball
Process, simplify technique；And wire cutting mode mechanical stress to caused by quartz glass plate is small, therefore slice thick can be reduced
Degree, piece rate is improved, save material；The depth of parallelism of quartz pendulous reed substrate upper and lower surface can be effectively ensured in twin grinding mode,
Processing efficiency is lifted, improves the operability and accuracy of Thickness sensitivity；Twin polishing can fast and effeciently remove grinding pair
Surface and sub-surface damage layer caused by quartz pendulous reed substrate, while ensure the depth of parallelism of quartz pendulous reed substrate；Ring, which is thrown, to disappear
Except " turned-down edge " phenomenon that quartz pendulous reed substrate is formed during twin polishing, the flatness of raising quartz pendulous reed substrate.
Above scheme can complete the preparation of quartz pendulous reed substrate, herein below on the basis of provide preferred scheme.
Here it is not specifically limited, preferably #150 copper sintered diamond sleeve drill bit, rolls to drawing the drill bit used in rod motion
Emery wheel used in the process of circle is not specifically limited；It is preferred that #320 resin sintered diamond emery wheel is carried out to quartz glass bar
Cylindricalo grinding；The diameter of line of cut is not specifically limited, it is preferred to use a diameter of 0.1-0.3mm lines of cut are justified to quartz glass
Post is cut into slices；Emery wheel used in chamfering is not specifically limited, and preferably chamfering abrasive wheel is #2000-#3000 electroplated diamond sand
Wheel；
Preferably, the twin polishing in the twin grinding of described step (5) and (6) is all using described in planetary piece fixture
Planetary piece fixture be marginal belt tooth internal openings thin rounded flakes, its thickness 0.2-0.3mm small compared with quartz pendulous reed thickness, material
For hard resin, edge teeth can match with sun gear on double-faced grinding and polishing machine with the tooth on planetary gear, perforate point
For station hole and non-station hole, station bore dia 0.1-0.2mm big compared with quartz glass plate diameter, using planetary piece fixture central point as
Center is uniformly distributed in a ring, and perforate center ensures there there is not quartz glass plate in the course of work with planetary piece fixture outward flange distance
Part more than 1/2 can stretch out polishing plate edge, and non-station hole is uniformly distributed within the annulus of station hole formation.
Preferably, the ground slurry used in twin grinding in described step (5) is pressed for abrasive micropowder and pure water
Volume ratio 1:The mixture of 20 compositions, inorganic base or organic alkali solution regulation ground slurry pH=10-12 are added, described grinds
Mill grain size of micropowder D (50)=3-5 μm, D (90)=5-7 μm.
To note here is that：Twin grinder utilizes upper and lower two parallel cards by the wandering star equipped with quartz pendulous reed substrate
Piece fixture is clipped in the middle, and upper lower burrs do counter rotational movement respectively, passes through the control of ring gear and external toothing, planetary piece clamping stone
English pendulum substrate is cooked rotation and the revolution motion centered on the upper lower burrs center of circle, simultaneously to stone under the abrasive action of ground slurry
English pendulum substrate upper and lower surface is ground, and realizes the reduction of thickness.
Preferably, described abrasive micropowder material be aluminum oxide, carborundum, boron carbide, boron nitride, natural emery or
Diamond.
Preferably, polishing fluid used in described step (6) is Ludox and cerium oxide polishing slurry is 1 by volume:1 group
Into mixture, add inorganic alkali solution regulation pH=10-12, abrasive material mass concentration is 20-40% wherein in Ludox, institute
Particle diameter containing silica dioxide granule is 50-100nm, and abrasive material mass concentration is 10-20% in cerium oxide polishing slurry used, contained oxidation
Cerium grain diameter is 100-200nm, and filtering accuracy is 0.2 μm.
To note here is that：The advantages of polishing fluid, is that polishing speed is fast, the Quartz glass surfaces roughness of polishing
It is small；It is free from foreign meter, avoid causing sub-surface damage to quartz glass.
Preferably, the polishing medium that described step (7) is selected is #80 optics pitch and rosin by weight 4:1 group
Into mixture and poured on aluminum matrix and build up disk, square net is carved with thickness 10-20mm, surface, and cutting width is
0.2-0.5mm, depth 0.5-1mm, mesh width 5-20mm.
To note here is that：The turned-down edge situation of quartz glass disk can be effectively eliminated using the polishing medium.
Preferably, the fixture used in described step (7) for circular stainless steel disc and hard plastic sheet with holes and
The assembly formed is padded, wherein circular stainless steel disc is substrate, the upper and lower surface depth of parallelism is less than 10 ", flatness is less than 0.3 μ
M, hard plastic sheet are circle, and diameter is consistent with substrate, and the quartz pendulous reed substrate thickness described in thickness is consistent, and inside has circle to open
Hole, aperture 0.1-0.2mm big compared with quartz pendulous reed diameter, perforate are uniformly distributed in a ring, and hard plastic sheet is pasted on substrate circle
Surface, band rounded groove substrate being formed, pads and damps cloth for circle, diameter is consistent with rounded groove, thickness 0.1-0.3mm,
It is pasted on fluting bottom.
To note here is that：Non- station hole is uniformly distributed within the annulus of station hole formation, and size and quantity are unlimited,
Its effect is advantageous for polishing fluid and is uniformly distributed in card.
Preferably, the polishing medium used in described (6) twin polishing is more than 85 polyurethane polishing for Shore hardness
Pad, pad interface are provided with the groove for being mutually perpendicular to intersect, and groove width 0.5-2mm, ditch separation is 5-20mm.
To note here is that：The polishing medium possesses higher polish removal rate, can effectively reduce quartz glass
The turned-down edge that disk is formed in polishing process, fluting are advantageous to being evenly distributed for polishing fluid, ensure quartz glass wafer thickness
Uniformity.
Embodiment 1
To process a diameter of 22.200 ± 0.010mm, thickness is to enter exemplified by 0.700 ± 0.005mm quartz pendulous reed substrate
Row processing method illustrates, comprises the following steps：
1. draw rod：Raw material of quartz glass is placed in and draws rod machining area and fixation, uses #150 copper sintered diamond sleeves
Drill bit cuts or polish jade with an emery wheel material select location in quartz glass and drills out bar, and drill speed is 2000r/min in process, and feed speed is
3mm/min, bar diameter 25-26mm.
It is 2. round as a ball：Quartz glass bar is loaded between headstock for cylindrical grinding machine and tailstock, uses #320 resin-diamonds
Emery wheel carries out cylindricalo grinding to quartz glass bar, and process medium plain emery wheel feed speed is 0.1mm/min, quartzy glass after grinding
Glass body diameter is 22.200 ± 0.010mm.
3. wire cutting is cut into slices：Quartz glass cylinder is fixed on wire cutting machine tool processing district, using cutting for a diameter of 0.2mm
Secant is cut into slices to quartz glass cylinder, and quartz glass plate thickness is 0.900 ± 0.005mm after cutting.
4. chamfering：Chamfering, chamfering are carried out with side intersection to the upper and lower surface of quartz glass plate using disc chamfering machine
Size is 0.2-0.3mm × 45 °, and chamfering abrasive wheel used is #3000 plated diamond grinding wheels.
5. twin grinding：Batch grinding is carried out to quartz glass plate using twin grinder, is used in process of lapping specific
Planetary piece fixture and ground slurry, quartz glass plate thickness is 0.760 ± 0.005mm after grinding.Wherein described specific trip
Star piece fixture is the thin rounded flakes 4 of marginal belt tooth internal openings, and its thickness is 0.5-0.6mm, and material is epoxy resin, edge teeth
It can be matched with external tooth wheel rim 1 on twin grinder with the tooth on inner gear ring 2, perforate is divided into station hole 5 and non-station hole
6,5 a diameter of 22.400mm of station hole, it is uniformly distributed in a ring centered on planetary piece central point, outside perforate center and planetary piece
Edge Distance is moderate, ensures that quartz glass plate has the part no more than 1/2 to stretch out the edge of abrasive disk 3 in the course of work.It is non-
Station hole 6 is uniformly distributed within the annulus of station hole formation, and size and quantity are unlimited.Wherein described ground slurry is micro- to grind
Powder and pure water by volume 1:The mixture of 20 compositions, add inorganic base or organic alkali solution regulation ground slurry pH=10-
12, the optional aluminum oxide of abrasive micropowder material, carborundum, boron carbide, boron nitride, natural emery, diamond etc., grain size of micropowder D
(50)=3-5 μm, D (90)=5-7 μm.
6. twin polishing：Fig. 2 is Two sides milling and polishing planetary piece fixture structure and position view；Use Twp-sided polishing machine
Batch polishing is carried out to quartz glass abrasive sheet, in polishing process using specific planetary piece fixture, polishing fluid, polishing medium and
Filter, quartz glass plate thickness is 0.720 ± 0.005mm after polishing.Wherein described specific planetary piece fixture is marginal belt
The thin rounded flakes 4 of tooth internal openings, its thickness are 0.5-0.6mm, and material is epoxy resin, and edge teeth can be with Twp-sided polishing machine
Upper external tooth wheel rim 1 matches with the tooth on inner gear ring 2, and perforate is divided into station hole 5 and non-station hole 6, and station bore dia is
22.400mm, it is uniformly distributed in a ring centered on planetary piece central point, perforate center is with planetary piece outward flange apart from moderate, guarantor
Quartz glass plate has the part no more than 1/2 to stretch out the edge of polishing disk 3 in the card course of work.Non- station hole 6 is uniformly distributed
Within the annulus that station hole is formed, size and quantity are unlimited.Wherein described polishing medium is the polyurethane that Shore hardness is 90
Polishing pad, pad interface are provided with the groove for being mutually perpendicular to intersect, and groove width 1mm, ditch separation is 15mm, polishing used
Liquid is Ludox and cerium oxide polishing slurry is 1 by volume:The mixture of 1 composition, inorganic alkali solution regulation pH=10 is added,
Abrasive material mass concentration is 20% wherein in Ludox, and contained silica dioxide granule particle diameter is 50-100nm, cerium oxide polishing used
Abrasive material mass concentration is 20% in liquid, and contained cerium oxide particle particle diameter is 100-200nm, and the filtering accuracy of filter device therefor is
0.2μm。
7. ring is thrown：Fig. 3 is that ring throws fixture structure schematic diagram, coordinates special fixture successively to quartz glass using glass polishing machine
Polished silicon wafer two sides is polished, and the thickness of quartz pendulous reed substrate is 0.700 ± 0.005mm after polishing, and ring throws operating ambient temperature
For 21-23 DEG C, humidity 60%.Wherein described special fixture is circular stainless steel disc and hard plastic sheet 7 with holes and liner
The assembly that pad 9 is formed, wherein circular stainless steel disc is substrate 8, the upper and lower surface depth of parallelism is less than 10 ", flatness is less than 0.3 μ
M, hard plastic sheet 7 are circle, and diameter is consistent with substrate, and thickness is 0.700 ± 0.005mm, and there is round hole inside, and aperture is
22.400mm, perforate are uniformly distributed in a ring, and hard plastic sheet 7 is pasted on the circular surface of substrate 8, form circular groove, and inner liner 9 is
Circle damping cloth, a diameter of 22.400mm, thickness 0.2mm, is pasted on circular groove bottom.The polishing medium drips for #80 optics
Blue or green and rosin is by weight 4:The mixture of 1 composition is simultaneously poured on aluminum matrix and builds up disk, and thickness 10-20mm, surface is carved with
Square net, cutting width are 0.2-0.5mm, depth 0.5-1mm, mesh width 5-20mm.
Embodiment 2
To process a diameter of 25.000 ± 0.010mm, thickness is to enter exemplified by 0.750 ± 0.005mm quartz pendulous reed substrate
Row processing method illustrates, comprises the following steps：
1. draw rod：Raw material of quartz glass is placed in and draws rod machining area and fixation, is bored using #500 electroplated diamonds sleeve
Head cuts or polish jade with an emery wheel material select location in quartz glass and drills out bar, and drill speed is 3000r/min, feed speed 5mm/ in process
Min, bar diameter 27-28mm.
It is 2. round as a ball：Quartz glass bar is loaded in centerless grinder workspace, using #400 resin diamond grinding wheels to stone
English glass bar carries out cylindricalo grinding, and process medium plain emery wheel feed speed is 0.1mm/min, and quartz glass cylinder is straight after grinding
Footpath is 25.000 ± 0.010mm.
3. wire cutting is cut into slices：Quartz glass cylinder is fixed on wire cutting machine tool processing district, using a diameter of 0.15mm's
Line of cut is cut into slices to quartz glass cylinder, and quartz glass plate thickness is 0.950 ± 0.005mm after cutting.
4. chamfering：Chamfering, chamfering are carried out with side intersection to the upper and lower surface of quartz glass plate using disc chamfering machine
Size is 0.2-0.3mm × 45 °, and chamfering abrasive wheel used is #3000 plated diamond grinding wheels.
5. twin grinding：Batch grinding is carried out to quartz glass plate using twin grinder, is used in process of lapping specific
Planetary piece fixture and ground slurry, quartz glass plate thickness is 0.810 ± 0.005mm after grinding.Wherein described specific trip
Star piece fixture is the thin rounded flakes 4 of marginal belt tooth internal openings, and its thickness is 0.6-0.7mm, and material is epoxy resin, edge teeth
It can be matched with external tooth wheel rim 1 on twin grinder with the tooth on inner gear ring 2, perforate is divided into station hole 5 and non-station hole
6,5 a diameter of 25.200mm of station hole, it is uniformly distributed in a ring centered on planetary piece central point, outside perforate center and planetary piece
Edge Distance is moderate, ensures that quartz glass plate has the part no more than 1/2 to stretch out the edge of abrasive disk 3 in the course of work.It is non-
Station hole 6 is uniformly distributed within the annulus of station hole formation, and size and quantity are unlimited.Wherein described ground slurry is micro- to grind
Powder and pure water by volume 1:The mixture of 20 compositions, add inorganic base or organic alkali solution regulation ground slurry pH=10-
12, the optional aluminum oxide of abrasive micropowder material, carborundum, boron carbide, boron nitride, natural emery, diamond etc., grain size of micropowder D
(50)=3-5 μm, D (90)=5-7 μm.
6. twin polishing：Fig. 2 is Two sides milling and polishing planetary piece fixture structure and position view；Use Twp-sided polishing machine
Batch polishing is carried out to quartz glass abrasive sheet, in polishing process using specific planetary piece fixture, polishing fluid, polishing medium and
Filter, quartz glass plate thickness is 0.770 ± 0.005mm after polishing.Wherein described specific planetary piece fixture is marginal belt
The thin rounded flakes 4 of tooth internal openings, its thickness are 0.6-0.7mm, and material is epoxy resin, and edge teeth can be with Twp-sided polishing machine
Upper external tooth wheel rim 1 matches with the tooth on inner gear ring 2, and perforate is divided into station hole 5 and non-station hole 6, and station bore dia is
25.200mm, it is uniformly distributed in a ring centered on planetary piece central point, perforate center is with planetary piece outward flange apart from moderate, guarantor
Quartz glass plate has the part no more than 1/2 to stretch out the edge of polishing disk 3 in the card course of work.Non- station hole 6 is uniformly distributed
Within the annulus that station hole is formed, size and quantity are unlimited.Wherein described polishing medium is the polyurethane that Shore hardness is 90
Polishing pad, pad interface are provided with the groove for being mutually perpendicular to intersect, and groove width 1mm, ditch separation is 15mm, polishing used
Liquid is Ludox and cerium oxide polishing slurry is 1 by volume:The mixture of 1 composition, inorganic alkali solution regulation pH=10 is added,
Abrasive material mass concentration is 20% wherein in Ludox, and contained silica dioxide granule particle diameter is 50-100nm, cerium oxide polishing used
Abrasive material mass concentration is 20% in liquid, and contained cerium oxide particle particle diameter is 100-200nm, and the filtering accuracy of filter device therefor is
0.2μm。
7. ring is thrown：Fig. 3 is that ring throws fixture structure schematic diagram, coordinates special fixture successively to quartz glass using glass polishing machine
Polished silicon wafer two sides is polished, and the thickness of quartz pendulous reed substrate is 0.750 ± 0.005mm after polishing, and ring throws operating ambient temperature
For 21-23 DEG C, humidity 60%.Wherein described special fixture is circular stainless steel disc and hard plastic sheet 7 with holes and liner
The assembly that pad 9 is formed, wherein circular stainless steel disc is substrate 8, the upper and lower surface depth of parallelism is less than 10 ", flatness is less than 0.3 μ
M, hard plastic sheet 7 are circle, and diameter is consistent with substrate, and thickness is 0.750 ± 0.005mm, and there is round hole inside, and aperture is
25.200mm, perforate are uniformly distributed in a ring, and hard plastic sheet 7 is pasted on the circular surface of substrate 8, form circular groove, and inner liner 9 is
Circle damping cloth, a diameter of 25.200mm, thickness 0.2mm, is pasted on circular groove bottom.The polishing medium drips for #80 optics
Blue or green and rosin is by weight 4:The mixture of 1 composition is simultaneously poured on aluminum matrix and builds up disk, and thickness 10-20mm, surface is carved with
Square net, cutting width are 0.2-0.5mm, depth 0.5-1mm, mesh width 5-20mm.
Substrate two sides has been effectively ensured to quartz pendulous reed substrate grinding and polishing using Two sides milling and polishing method in the present invention
The high depth of parallelism；Substrate thickness can be detected at any time in grinding and polishing process, improve the control essence of thickness
Degree；Twin polishing uses alkaline nano abradant polishing solution, has both improved silica glass material removal rate, and quick removal substrate is original
Sub-surface crackle layer, avoid causing secondary damage to sub-surface again；Technology finishing substrate face type is thrown using ring, ensure that substrate table
The high flatness in face.
The foregoing is only a specific embodiment of the invention, but protection scope of the present invention is not limited thereto, any
Those familiar with the art the invention discloses technical scope in, change or replacement can be readily occurred in, should all be contained
Cover within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (9)
1. a kind of preparation method of quartz pendulous reed substrate, it is characterised in that comprise the following steps：
(1) rod is drawn：Quartz glass raw material are drawn with rod using rod machine is drawn, drill bit used is copper sintered diamond cylinder drill bit or electricity
Diamond cylinder drill bit is plated, diamond mesh number is 150-1000 mesh, and drill speed is not less than 1000r/min, and feed speed is little
It is bigger 2-4mm than the quartz pendulous reed substrate diameter of required preparation in 5mm/min, bar diameter；
(2) it is round as a ball：Cylindricalo grinding is carried out to the bar using cylindrical grinder or centerless grinder, emery wheel used is not less than #320
Resin sintered diamond emery wheel, its medium plain emery wheel feed speed is not more than 0.1mm/min, described bar diameter is ground into institute
The size for the quartz pendulous reed substrate stated；
(3) wire cutting is cut into slices：Described bar is cut into quartz glass plate, wire rod used using wire cutting using multi-line cutting machine
For a diameter of 0.1-0.3mm electroplated diamonds line of cut, the thickness of quartz pendulous reed substrate described in the thickness ratio of the quartz glass plate
Spend big 0.2-0.4mm；
(4) chamfering：Carry out chamfering to the upper and lower surface of quartz glass plate and side intersection, chamfering angle size be 0.2-0.3mm ×
45°；
(5) twin grinding：Batch grinding is carried out to quartz glass plate using twin grinder, grinds obtained quartz glass grinding
The big 0.05-0.06mm of thickness of quartz pendulous reed substrate described in piece thickness ratio；
(6) twin polishing：Batch polishing is carried out to quartz glass plate using Twp-sided polishing machine, the quartz glass obtained after polishing is thrown
The big 0.01-0.02mm of quartz pendulous reed substrate thickness described in mating plate thickness ratio；
(7) ring is thrown：Described quartz glass polished silicon wafer is subjected to ring throwing, the two sides of described quartz glass polished silicon wafer is gone respectively
Except 0.005-0.01mm thickness, to the thickness that thickness is described quartz pendulous reed substrate, it is 21-23 that ring, which throws operating ambient temperature,
DEG C, humidity 50-70%.
2. the preparation method of quartz pendulous reed substrate according to claim 1, it is characterised in that pair of described step (5)
Face is ground all uses planetary piece fixture with the twin polishing in (6), and described planetary piece fixture is marginal belt tooth internal openings
Thin rounded flakes, its thickness 0.2-0.3mm small compared with quartz pendulous reed thickness, material are hard resin, edge teeth can with it is two-sided
Sun gear matches with the tooth on planetary gear on polisher lapper, and perforate is divided into station hole and non-station hole, station bore dia compared with
The big 0.1-0.2mm of quartz glass plate diameter, it is uniformly distributed in a ring centered on planetary piece fixture central point, perforate center and trip
Star piece fixture outward flange distance ensures that quartz glass plate has the part no more than 1/2 to stretch out polishing disk side in the course of work
Edge, non-station hole are uniformly distributed within the annulus of station hole formation.
3. the preparation method of quartz pendulous reed substrate according to claim 1, it is characterised in that in described step (5)
The ground slurry used in twin grinding is abrasive micropowder and pure water by volume 1:20~1:The mixture of 5 compositions, is added
Inorganic base or organic alkali solution regulation ground slurry pH=10-12, D50=3-5 μm described of abrasive micropowder particle diameter, D90=5-7
μm。
4. the preparation method of quartz pendulous reed substrate according to claim 3, it is characterised in that described abrasive micropowder material
For aluminum oxide, carborundum, boron carbide, boron nitride, natural emery or diamond.
5. the preparation method of quartz pendulous reed substrate according to claim 1, it is characterised in that described step (6) is used
Polishing fluid is Ludox and cerium oxide polishing slurry is 1 by volume:1~5:The mixture of 1 composition, add inorganic alkali solution tune
PH=10-12 is saved, abrasive material mass concentration is 20-40% wherein in Ludox, and contained silica dioxide granule particle diameter is 50-100nm,
Abrasive material mass concentration is 10-20% in cerium oxide polishing slurry used, and contained cerium oxide particle particle diameter is 100-200nm, filtering essence
Spend for 0.2 μm.
6. the preparation method of quartz pendulous reed substrate according to claim 1, it is characterised in that described step (7) is selected
Polishing medium be #80 optics pitch and rosin by weight 4:1~7:The mixture and being poured on aluminum matrix of 1 composition is built up
Square net is carved with disk, thickness 10-20mm, surface, and cutting width is 0.2-0.5mm, depth 0.5-1mm, mesh width
For 5-20mm.
7. the preparation method of quartz pendulous reed substrate according to claim 1, it is characterised in that adopted in described step (7)
Fixture is the assembly that circular stainless steel disc is formed with hard plastic sheet with holes and pad, wherein circular stainless steel disc is
Substrate, the upper and lower surface depth of parallelism are less than 10 ", flatness is less than 0.3 μm, and hard plastic sheet is circle, and diameter is consistent with substrate, thick
The consistency of thickness of degree and described quartz pendulous reed substrate, there are round hole, aperture 0.1- big compared with quartz pendulous reed diameter in inside
0.2mm, perforate are uniformly distributed in a ring, and hard plastic sheet is pasted on substrate circular surface, form band rounded groove substrate, pad
Cloth is damped for circle, diameter is consistent with rounded groove, thickness 0.1-0.3mm, is pasted on fluting bottom.
8. the preparation method of quartz pendulous reed substrate according to claim 1, it is characterised in that described step (6) is two-sided
Polishing polishing medium used is more than 85 polyurethane polishing pad for Shore hardness, and pad interface, which is provided with, is mutually perpendicular to what is intersected
Groove, groove width 0.5-2mm, ditch separation are 5-20mm.
9. a kind of quartz pendulous reed substrate, it is characterised in that described quartz pendulous reed substrate is as described in claim any one of 1-8
Method is prepared.
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| CN107529477B (en) * | 2017-08-07 | 2020-02-18 | 清华大学 | Chemical mechanical polishing method for microcrystalline glass and microcrystalline glass |
| CN108148506B (en) * | 2017-11-27 | 2020-08-18 | 东莞富兰地工具股份有限公司 | Polishing medium, preparation method and application thereof |
| CN110238976A (en) * | 2018-02-05 | 2019-09-17 | 浦江金砂工艺有限公司 | A kind of crystal glass round tube pearl, round tube machining process |
| CN111238461B (en) * | 2020-03-09 | 2022-05-06 | 中国建筑材料科学研究总院有限公司 | Harmonic oscillator and preparation method thereof |
| CN111633476B (en) * | 2020-06-09 | 2021-12-07 | 江苏师范大学 | Method for obtaining angstrom-level smooth surface of yttrium oxide transparent ceramic |
| CN112008899B (en) * | 2020-09-04 | 2022-03-01 | 海宁金都新能源有限公司 | Processing method of stone plate wall brick |
| CN113601376A (en) * | 2021-08-10 | 2021-11-05 | 山西烁科晶体有限公司 | Method for measuring single-side polishing rate in silicon carbide double-side polishing |
| CN114227173B (en) * | 2021-12-30 | 2023-06-27 | 中航工业南京伺服控制系统有限公司 | Technological method for improving processing efficiency of jet flow sheet |
| CN116871985B (en) * | 2023-09-05 | 2023-12-01 | 河北远东通信系统工程有限公司 | Polishing process of small-size high-frequency piezoelectric wafer |
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