JP2003225866A - Metal bond diamond lapping surface plate for processing thin sheet - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a metal bond diamond lapping surface plate capable of processing a thin sheet of hard and fragile material of thickness of 1 mm or less, especially a thin sheet of crystal of thickness of 1 mm or less efficiently and with high precision in low pressure processing conditions. <P>SOLUTION: In this metal bond diamond lapping surface plate, metal bond comprising a soft metal phase of Cu-Sn alloy, comprising 45-65 wt.% of Cu, and Sn for the rest, and soft particles of 1 or 2 kinds of more selected from MoS<SB>2</SB>, Cr<SB>2</SB>O<SB>3</SB>, h-BN, graphite, etc., dispersed in the soft metal phase is used. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal-bonded diamond lap surface plate for flat surface processing of a thin plate made of a hard and brittle material such as quartz, glass, ceramics, etc.
The present invention relates to a metal bond diamond lap surface plate for flat processing of a quartz thin plate.

[0002]

2. Description of the Related Art The demand for crystal devices has been on the rise, though it has fluctuated, due to the significant expansion of the digital equipment market such as mobile phones and personal computers. In most cases, the lapping process using loose abrasive grains has been used for a long time in the process of processing a crystal device. On the other hand, attempts are being made for fixed abrasive grain processing aiming at higher efficiency and lower cost processing, as well as improvements in the environmental hygiene of the earth and a comfortable working environment. For fixed abrasive processing, a diamond lap surface plate having an abrasive particle layer in which diamond abrasive particles are dispersed in various bonds such as resin bond, metal bond, and vitrified bond is used. There are advantages like. 1) No need to monitor and control the supply of loose abrasive grains, which can be expected to reduce costs by manpower saving and unmanned operation. 2) In addition to prolonging the service life of work carriers and gears, the surface plate can be reused, which can be expected to reduce running costs. 3) Since the rough lapping and the intermediate lapping are completed at the same time due to the high machining efficiency, it is possible to reduce one process compared to the conventional machining method, and it is expected that the machining cost will be reduced. 4) Processing efficiency is 10 to 100 times higher than the lapping method using free abrasive grains, and the amount of sludge generated is small, which is environmentally friendly.

The diamond lap surface plate has a superabrasive grain layer in which diamond abrasive grains are dispersed in various bonds such as resin bond, metal bond and vitrified bond. The form of the superabrasive grain layer is mainly determined by the type of work piece, the size of the work piece, the required processing accuracy, etc., but what is called a pellet formed in a cylindrical or disc shape is used as a lapping plate. There are those fixed to the entire surface, and those in which the entire surface of the lapping plate is made into a superabrasive grain layer and then grooves are provided on the surface of the superabrasive grain layer in a radial shape, a grid shape, a concentric circle shape, or a spiral shape. The diamond lap platen is used by being attached to a grinding machine called a lapping machine, a double-sided lapping machine, a single-sided lapping machine, or a parallel plane honing machine. The most commonly used is a double-sided lapping machine, in which two diamond lap surface plates are attached vertically opposite to the rotary shaft of the grinder, and the workpiece is put in a hole on the lower diamond surface plate. The work carrier held by the above is engaged with the sun gear and the internal gear, the upper diamond lap platen is pressed against the lower diamond lap platen with a certain pressure, and the work carrier revolves while revolving to rotate the workpiece. The lower surface is processed with upper and lower diamond lap surface plates. At this time, there are cases where the upper and lower diamond lap surface plates are machined while swinging in a small width in the surface direction, and a single-sided lapping surface plate is machined on one side only with the lower diamond lap surface plate.

However, in the case of a thin plate having a thickness of 1 mm or less, it is very difficult to set the specifications and processing conditions of the diamond lap surface plate because they are easily broken during processing.
In particular, since a quartz thin plate is easily broken, it has to be processed at a low pressure, and a diamond lap surface plate to which a conventional bond is applied has a problem that the processing speed is extremely low.

[0005]

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems. That is, it is an object of the present invention to provide a diamond lap platen capable of efficiently processing a thin plate having a thickness of 1 mm or less, particularly a crystal thin plate having a thickness of 1 mm or less, with high accuracy.

[0006]

In order to solve the above problems, the present invention provides a superabrasive grain having diamond abrasive grains dispersed in a metal bond, which is used for flattening a thin plate made of a hard and brittle material. A metal bond diamond lap surface plate having a layer, wherein the metal bond is mainly Cu.
Consists -Sn based alloy, Cu is 45 to 65 wt%, and the soft metal phase remaining amount consisting Sn, are dispersed in the soft metal _layer, from _{MoS 2, Cr 2 O 3,} h-BN and graphite It is characterized by comprising one or more selected soft particles. By using a metal bond having such a composition, it has sufficient abrasive grain holding power and good truing / dressing properties, and in particular, extremely good sharpness and long life can be obtained even under low pressure grinding conditions. .

More specifically, the content of the soft particles is characterized by being 1 to 60% by volume with respect to the metal bond. Content of soft particles is 1% by volume
If it is less than 60% by weight, the desired effect cannot be obtained, and if it exceeds 60% by volume, the metal bond is significantly embrittled, which is not suitable. The soft particle content is more preferably 3 to 55% by volume.

More specifically, the thin plate made of a hard and brittle material is crystal, and the thickness thereof is 0.01 mm to 1 mm. The metal-bonded diamond lap surface plate of the present invention is suitable for a thin plate of a hard and brittle material such as glass, ceramics, ferrite, and silicon, which is easily broken during processing, and is most suitable for a thin plate of quartz.

The flow rate of the grinding fluid supplied to the metal bond diamond lap surface plate is 10 to 900 ml / min, and the processing pressure applied to the thin plate is 2 to 80 KP.
a, the revolution speed of the work carrier is 5 to 100 rpm.
p. m. It is a diamond lap surface plate that is used for processing a thin plate under the processing conditions of.
Here, the reason for limiting the numerical values of the above conditions will be described. This is because if the flow rate of the grinding fluid is less than 10 ml / min, the discharge of the cutting chips will be insufficient during machining, which will cause clogging, and if the flow rate exceeds 900 ml / min, the machining speed will decrease. The flow rate of the grinding fluid is 30 to 70
More preferably, it is 0 ml / min. Further, if the working pressure applied to the thin plate is less than 2 KPa, the working speed is remarkably reduced, and if it exceeds 80 KPa, the thin plate is broken. The processing pressure is more preferably 5 to 70 KPa. Further, the revolution speed of the work carrier is 5 r. p. m. Is less than 100 r.p.m. p. m. This is because the ratio at which the thin plate is destroyed increases sharply when it exceeds. The revolution speed of the work carrier is 10 to 90 rpm. p. m. Is more preferable.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the invention will be described in detail in the section of Examples below.

(Example 1) Prepare Cu powder and Sn powder,
After Cu powder and Sn powder were made into a uniform mixed powder by a ball mill so that Cu content was 55% by weight and Sn content was 45% by weight, 30% by volume of graphite powder was added to the mixed powder to form a metal bond. Diamond abrasive grains # 3000 (particle size 2 to 6 μm) were added to this metal bond so that the concentration was 50, and well mixed using a ball mill until uniform. This mixed powder was filled in a mold and sintered in a donut shape with an outer diameter of 300 mm by a hot pressing method to form a superabrasive grain layer. This abrasive grain layer was fixed to a cast iron lapping plate with an adhesive, and the surface of the superabrasive grain layer was trued and dressed to produce a metal bond diamond lapping plate of the present invention. Next, this metal bond diamond lap surface plate was attached to a double-sided lapping plate of a type in which a workpiece is held by a work carrier, and flat processing of a thin crystal plate was performed to confirm the effect of the present invention. A thin crystal plate having a disk shape with a thickness of 0.3 mm and a diameter of 30 mm was used. The processing condition is that the revolution speed of the work carrier is 20.
r. p. m. The processing pressure was 12 KPa, and the flow rate of the grinding fluid was 150 ml / min. Using a dress carrier, after truing and dressing the working surface of the superabrasive grain layer, when setting a thin crystal plate on the work carrier and starting planar processing, the sharpness is good, without dressing during processing, The desired surface roughness was obtained.

(Example 2) The effect of the present invention was confirmed by changing the composition of the metal bond from Example 1 and performing radial grooving on the working surface of the superabrasive grain layer. Cu 55% by weight,
Cu powder and Sn powder were made into a uniform mixed powder by a ball mill so that the Sn content was 45% by weight, and then 35% by volume of graphite powder was added to the mixed powder to form a metal bond. For this metal bond, diamond abrasive grain # 3
000 (particle size 2 to 6 μm) was added so that the degree of concentration would be 50, and well mixed using a ball mill until uniform. This mixed powder was filled in a mold and sintered in a donut shape with an outer diameter of 300 mm by a hot pressing method to form a superabrasive grain layer. This abrasive grain layer was fixed to a cast iron lapping plate with an adhesive, and three grooves each having a groove width of 2 mm and a depth of 1 mm were formed on the surface of the superabrasive grain layer.
The metal-bonded diamond lap surface plate of the present invention was manufactured by providing 6 parts in a radial pattern. Next, it was attached to the same double-sided lapping machine as in Example 1, and the flatness processing of the thin crystal plate was performed to confirm the effect of the present invention. A thin crystal plate having a disk shape with a thickness of 0.3 mm and a diameter of 30 mm was used. The processing condition is that the revolution speed of the work carrier is 20 r. p.
m. The processing pressure was 12 KPa, and the flow rate of the grinding fluid was 150 ml / min. After truing and dressing the working surface of the superabrasive grain layer using the dress carrier, the thin plate of quartz was set on the work carrier and the planar processing was started. The sharpness was improved by about 20% compared with Example 1, and it is extremely good. Met. Also, stable sharpness was maintained for a long time without dressing in the middle.

As described in detail above, by using the metal-bonded diamond lap surface plate of the present invention, a thin plate of a hard and brittle material such as quartz can be machined with high precision without breaking. .

[Brief description of drawings]

FIG. 1 shows a metal bond diamond lap surface plate of the present invention.

[Explanation of symbols]

P metal bond diamond lap surface plate 1 Superabrasive layer 2 work carrier 3 work 4 surface plate R Work carrier revolution speed

   ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 3C058 AA07 AA09 CA06 CB01 CB02                       DA02                 3C063 AA02 AB05 BB02 BC02 BD01                       BG07 CC02 CC19 EE01 FF22

Claims (4)

[Claims] 1. A metal bond diamond lap platen for use in flat processing of a thin plate made of a hard and brittle material, the metal bond diamond lap plate having a superabrasive grain layer in which diamond abrasive grains are dispersed in a metal bond. Is mainly composed of Cu—Sn alloy, Cu is 45 to 65 wt%, and the remaining amount is a soft metal phase consisting of Sn, and MoS ₂ , Cr ₂ O dispersed in the soft metal phase.
₃ , 1 type or 2 selected from h-BN and graphite
A metal bond diamond lap surface plate that is made up of more than one kind of soft particles. 2. The content of the soft particles is 1 to 60% by volume with respect to the metal bond.
Metal bond diamond lap surface plate described. 3. The metal bond diamond lap surface plate according to claim 1, wherein the thin plate made of the hard and brittle material is quartz, and the thickness thereof is 0.01 mm to 1 mm. 4. The flow rate of the grinding fluid supplied to the metal bond diamond lap surface plate is 10 to 900 ml /
Min., The processing pressure applied to the thin plate is 2 to 80 KPa, and the revolution speed of the work carrier is 5 to 100 r.p.m. p.
m. The metal bond diamond lap surface plate according to claim 1, which is used for processing a thin plate under the processing conditions of.