CN103465154A - Soft grinding and polishing disc - Google Patents
Soft grinding and polishing disc Download PDFInfo
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- CN103465154A CN103465154A CN2013104026133A CN201310402613A CN103465154A CN 103465154 A CN103465154 A CN 103465154A CN 2013104026133 A CN2013104026133 A CN 2013104026133A CN 201310402613 A CN201310402613 A CN 201310402613A CN 103465154 A CN103465154 A CN 103465154A
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Abstract
A soft grinding and polishing disc is in a round disc structure. A through hole is formed in the middle of the soft grinding and polishing disc. The soft grinding and polishing disc at least comprises a grinding layer which is formed by tin-lead alloy; the tin-lead alloy is formed by, by mass percent, 65 to 75 percent of tin and 25 to 35 percent of lead; an intensified layer is arranged on the rear of the grinding layer; the intensified layer is formed by materials with intensity and melting point higher than the grinding layer. The soft grinding and polishing layer has the advantages of being simple in structure and capable of overcoming the deformation problem during the grinding, meanwhile avoiding the scrap adhering problem during the grinding, improving the machining accuracy and the efficiency and being practical.
Description
Technical field
The present invention relates to the accessory technology of grinding machinery, relate in particular to a kind of soft grinding and polishing dish that can effectively raise the efficiency, increase the service life.
Background technology
In the past, abrasive disk is to take abrasive material to be applied in the important grinding tool on grinding machine as what main manufacture formed, whether the performance of abrasive disk, directly affects the performance of whole grinding process and the precision of processed finished products, so abrasive disk is a key factor of performance performance of grinding machine.The kind of abrasive disk is a lot, and various shape and size are arranged, and the different choice by material, bond and technique to manufacturing abrasive disk, can realize different service behaviours.Each abrasive disk is according to the characteristic of itself, all there is certain scope of application, therefore, during grinding, must select as the case may be suitable emery wheel, otherwise can be because of improper machining accuracy, surface roughness and the production efficiency of directly affecting of selection of grinding.
At present, when CD to the silicon material etc. carries out surfacing, because its required precision is high, usually use soft grinding and polishing dish to carry out grinding, but domestic this grinding and polishing dish does not solve sticky bits problem, and the reaction force during due to grinding, cause the shape of dish to deform, and then the precision of grinding is reduced, at this moment can avoid this distortion by the hardness that improves the grinding and polishing dish, but the increase of hardness can make again the grinding and polishing dish too fast to the surfacing of this material, also exists potential safety hazard simultaneously.In sum, for the defect of prior art, need especially a kind of soft grinding and polishing dish, to solve the deficiencies in the prior art.
For this reason, designer of the present invention, by concentrating on studies and designing, comprehensively is engaged in for a long time experience and the achievement of related industry for many years, and research and design goes out a kind of soft grinding and polishing dish, to overcome above-mentioned defect.
Summary of the invention
The object of the present invention is to provide a kind of soft grinding and polishing dish, it is simple in structure, the problem on deformation in the time of overcoming grinding, and the sticky bits problem while simultaneously avoiding grinding, improved machining accuracy and efficiency, has practicality.
For achieving the above object, the invention discloses a kind of soft grinding and polishing dish, is circular disk configuration, and middle part is provided with through hole, it is characterized in that:
This soft grinding and polishing dish at least includes grinding layer, and described grinding layer is made by leypewter, and each composition quality degree of described leypewter is as follows: tin is 65-75%, and lead is 25-35%;
Described grinding layer rear is provided with strengthening layer, and this strengthening layer is all made higher than the material of grinding layer by intensity and fusing point.
Wherein: each composition quality degree of leypewter is as follows: tin is 68-70%, and lead is 32-30%.
Wherein: leypewter also comprises the antimony of 0.1-0.5%.
Wherein: this strengthening layer is made of cast iron.
Wherein: be provided with a plurality of reinforcements in strengthening layer, described reinforcement is for embedding the cylinder of described strengthening layer, and spaced arrangement is in the periphery of described strengthening layer.
By said structure, soft grinding and polishing dish of the present invention has been realized following technique effect:
1, grinding polishing effect is good, is difficult for producing chip, has effectively improved the rate of pass;
2, distortion is few, and anti-wear performance is better, has extended service life, has reduced maintenance cost;
3, manufacture simply, good forming effect, manufacturing cost is lower.
The present invention will be further described in detail by the following specific embodiments, and will be more apparent and obvious to understand further combined with the description of the drawings.
The accompanying drawing explanation
Fig. 1 has shown the front view of the soft grinding and polishing dish of the present invention.
Fig. 2 has shown the structural representation of a kind of embodiment of the soft grinding and polishing dish of the present invention.
Fig. 3 has shown the structural representation of the another kind of embodiment of the soft grinding and polishing dish of the present invention.
Fig. 4 has shown the rearview that the present invention is embodiment illustrated in fig. 3.
Reference numeral:
1: soft grinding and polishing dish;
11: grinding layer;
12: strengthening layer;
13: reinforcement.
The specific embodiment
Referring to Fig. 1, shown soft grinding and polishing dish of the present invention.
This soft grinding and polishing dish 1 is circular disk configuration, and middle part is provided with through hole, can be fixed on grinding tool by fixture, by 1 pair, soft grinding and polishing dish, such as surface accuracies such as silicone discs, requires high workpiece to carry out process operation.
Referring to Fig. 2, shown the structural representation of a kind of embodiment of the soft grinding and polishing dish of the present invention.
This soft grinding and polishing dish 1 at least includes grinding layer 11, and by comparative analysis, described grinding layer 11 is made by the material that is selected from soft metal, because soft metal is softer, when workpiece is carried out to polishing, in last polishing process, can realize the high finishing polish of effects on surface.
And optionally, by selecting, find that tin is as the material in soft metal, be ductile, the advantage that moulding condition is good, but fusing point is lower, and can effectively overcome its defect by the certain lead of doping in tin, therefore by certain comparative analysis, described grinding layer 11 is made by leypewter, each composition quality degree of described leypewter is as follows: tin is 65-75%, lead is 25-35%, preferably, tin is 68-70%, lead is 32-30%, the leypewter of this composition, it has not only retained the intensity of soft metal, also improved the fusing point of soft metal simultaneously, avoided the separation of chip in the grinding process and come off, cause machined surface is produced to cut.
Simultaneously, the present inventor is by increasing antimony, especially 0.3% the antimony of 0.1-0.5% in alloy, and performance that in use can better balanced alloy, obviously improve the effect of grinding.
Because the selection of alloy material can not significantly improve intensity and the fusing point of grinding layer, and when grinding, raising due to the process temperature, cause grinding layer to deform, especially on periphery, be out of shape more obvious, for avoiding occurring this situation, soft grinding and polishing dish 1 of the present invention is provided with strengthening layer 12 at grinding layer 11 rears, this strengthening layer 12 is all made higher than the material of grinding layer 11 by intensity and fusing point, to avoid the grinding layer distortion in process, setting by this strengthening layer, make to add man-hour, the distortion of grinding layer 11 is reinforced layer 12 and absorbs, can effectively keep the uniformity on grinding layer 11 surfaces.
Optionally, this strengthening layer 12 is made of cast iron.
Referring to Fig. 3 and Fig. 4, shown the another kind of embodiment of the soft grinding and polishing dish of the present invention.
In this embodiment, be provided with a plurality of reinforcements 13 in strengthening layer 12, described reinforcement 13 is for embedding the cylinder of described strengthening layer 12, and spaced arrangement is in the periphery of described strengthening layer 12.
Below by recently describing effect of the present invention:
Choose respectively five groups of experimental subjects, first group of soft grinding head for commonly using, made by tin, and thickness is 24mm; Second group is structure of the present invention, and the leypewter layer is 12mm, and percentage is: tin is 65%, and lead is 35%; Strengthening layer thickness is 12mm, and material is cast iron, without reinforcement; The 3rd group is structure of the present invention, and the leypewter layer is 12mm, and percentage is: tin is 66%, and lead is 33.8%, and antimony is 0.2%; Strengthening layer thickness is 12mm, and material is cast iron, and reinforcement is arranged; The 4th group is structure of the present invention, and the leypewter layer is 12mm, and percentage is: tin is 70%, and lead is 30%; Strengthening layer thickness is 12mm, and material is cast iron, without reinforcement; The 5th group is structure of the present invention, and the leypewter layer is 12mm, and percentage is: tin is 68%, and lead is 31.7%, and antimony is 0.3%; Strengthening layer thickness is 12mm, and material is cast iron, and reinforcement is arranged, and five groups are carried out last polishing process to 2000 CDs respectively, estimates five groups of experimental subjects by the minimizing thickness of the rate of pass, dish and the degree of deformation of dish respectively.
In another group contrast experiment, by four groups of removing materials, the grinding layer of first group is 10mm, and percentage is: tin is 65%, and lead is 35%, does not wherein add any antimony; Strengthening layer thickness is 10mm, and material is cast iron; Second group grinding layer be 10mm, percentage is: tin is 65%, and lead is 34.9%, adds 0.1% antimony; Strengthening layer thickness is 10mm, and material is cast iron; Second group grinding layer be 10mm, percentage is: tin is 65%, and lead is 34.6%, adds 0.4% antimony; Strengthening layer thickness is 10mm, and material is cast iron; Second group grinding layer be 10mm, percentage is: tin is 65%, and lead is 34.7%, adds 0.3% antimony; Strengthening layer thickness is 10mm, and material is cast iron; Four groups are carried out last polishing process to 2000 CDs respectively, estimate four groups of experimental subjects by the minimizing thickness of the rate of pass, dish and the degree of deformation of dish respectively.
More known, by the difference of antimony, add, also can effectively improve Grinding Quality.
Known by above-mentioned experiment, soft grinding and polishing dish of the present invention has following advantage:
1, grinding polishing effect is good, is difficult for producing chip, has effectively improved the rate of pass;
2, distortion is few, and anti-wear performance is better, has extended service life, has reduced maintenance cost;
3, manufacture simply, good forming effect, manufacturing cost is lower.
It is evident that, above description and record are only for example rather than in order to limit disclosure of the present invention, application or use.Although described in an embodiment and be described in the drawings embodiment, but the optimal mode that the present invention does not limit by the accompanying drawing example and the conduct of describing is in an embodiment thought at present to be to implement the specific examples of instruction of the present invention, scope of the present invention will comprise any embodiment of the specification that falls into front and appended claim.
Claims (5)
1. a soft grinding and polishing dish, be circular disk configuration, and middle part is provided with through hole, it is characterized in that:
This soft grinding and polishing dish at least includes grinding layer, and described grinding layer is made by leypewter, and each composition quality degree of described leypewter is as follows: tin is 65-75%, and lead is 25-35%;
Described grinding layer rear is provided with strengthening layer, and this strengthening layer is all made higher than the material of grinding layer by intensity and fusing point.
2. soft grinding and polishing dish as claimed in claim 1, it is characterized in that: each composition quality degree of leypewter is as follows: tin is 68-70%, lead is 32-30%.
3. soft grinding and polishing dish as claimed in claim 2, it is characterized in that: leypewter also comprises the antimony of 0.1-0.5%.
4. soft grinding and polishing dish as claimed in claim 1, it is characterized in that: this strengthening layer is made of cast iron.
5. soft grinding and polishing dish as claimed in claim 1 is characterized in that: be provided with a plurality of reinforcements in strengthening layer, described reinforcement is for embedding the cylinder of described strengthening layer, and spaced arrangement is in the periphery of described strengthening layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310402613.3A CN103465154B (en) | 2013-09-07 | 2013-09-07 | Soft grinding and polishing dish |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310402613.3A CN103465154B (en) | 2013-09-07 | 2013-09-07 | Soft grinding and polishing dish |
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| CN103465154A true CN103465154A (en) | 2013-12-25 |
| CN103465154B CN103465154B (en) | 2016-05-25 |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2340384A (en) * | 1939-04-10 | 1944-02-01 | American Steel & Wire Co | Lapping tool |
| JPH11239962A (en) * | 1998-02-26 | 1999-09-07 | Toshiba Corp | Lapping surface plate and lapping device using thereof |
| CN1294543A (en) * | 1998-03-27 | 2001-05-09 | 诺顿公司 | Abrasive tools |
| JP2003225866A (en) * | 2002-01-31 | 2003-08-12 | Allied Material Corp | Metal bond diamond lapping surface plate for processing thin sheet |
| CN1543387A (en) * | 2001-03-30 | 2004-11-03 | ��ķ�о�����˾ | Reinforced polishing pad with a shaped or flexible window structure |
| CN101412902A (en) * | 2007-10-16 | 2009-04-22 | 研磨剂与耐火品研究与开发中心C.A.R.R.D.有限公司 | Coated abrasive grains, method and for the production thereof as well as the use thereof for producing abrasives |
| CN101875185A (en) * | 2009-04-29 | 2010-11-03 | 重庆川仪自动化股份有限公司 | Manufacturing method of polishing disk for gem plane and material for preparing polishing layer |
-
2013
- 2013-09-07 CN CN201310402613.3A patent/CN103465154B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2340384A (en) * | 1939-04-10 | 1944-02-01 | American Steel & Wire Co | Lapping tool |
| JPH11239962A (en) * | 1998-02-26 | 1999-09-07 | Toshiba Corp | Lapping surface plate and lapping device using thereof |
| CN1294543A (en) * | 1998-03-27 | 2001-05-09 | 诺顿公司 | Abrasive tools |
| CN1543387A (en) * | 2001-03-30 | 2004-11-03 | ��ķ�о�����˾ | Reinforced polishing pad with a shaped or flexible window structure |
| JP2003225866A (en) * | 2002-01-31 | 2003-08-12 | Allied Material Corp | Metal bond diamond lapping surface plate for processing thin sheet |
| CN101412902A (en) * | 2007-10-16 | 2009-04-22 | 研磨剂与耐火品研究与开发中心C.A.R.R.D.有限公司 | Coated abrasive grains, method and for the production thereof as well as the use thereof for producing abrasives |
| CN101875185A (en) * | 2009-04-29 | 2010-11-03 | 重庆川仪自动化股份有限公司 | Manufacturing method of polishing disk for gem plane and material for preparing polishing layer |
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|---|---|
| CN103465154B (en) | 2016-05-25 |
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