CN106717119B - The manufacturing method of organic EL display panel - Google Patents
The manufacturing method of organic EL display panel Download PDFInfo
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- CN106717119B CN106717119B CN201580052131.7A CN201580052131A CN106717119B CN 106717119 B CN106717119 B CN 106717119B CN 201580052131 A CN201580052131 A CN 201580052131A CN 106717119 B CN106717119 B CN 106717119B
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- OKYDCMQQLGECPI-UHFFFAOYSA-N thiopyrylium Chemical compound C1=CC=[S+]C=C1 OKYDCMQQLGECPI-UHFFFAOYSA-N 0.000 description 1
- 150000005075 thioxanthenes Chemical class 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 150000004961 triphenylmethanes Chemical class 0.000 description 1
- 229910001930 tungsten oxide Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- 238000013316 zoning Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
- B41J2/0451—Control methods or devices therefor, e.g. driver circuits, control circuits for detecting failure, e.g. clogging, malfunctioning actuator
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
- B41J2/04586—Control methods or devices therefor, e.g. driver circuits, control circuits controlling heads of a type not covered by groups B41J2/04575 - B41J2/04585, or of an undefined type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/21—Ink jet for multi-colour printing
- B41J2/2132—Print quality control characterised by dot disposition, e.g. for reducing white stripes or banding
- B41J2/2139—Compensation for malfunctioning nozzles creating dot place or dot size errors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/485—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by the process of building-up characters or image elements applicable to two or more kinds of printing or marking processes
- B41J2/505—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by the process of building-up characters or image elements applicable to two or more kinds of printing or marking processes from an assembly of identical printing elements
- B41J2/51—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by the process of building-up characters or image elements applicable to two or more kinds of printing or marking processes from an assembly of identical printing elements serial printer type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Quality & Reliability (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Make to arrange in the top of substrate in column-shaped by side, and the multiple nozzles for being selected bad nozzle in advance relatively scan substrate, what side was not only selected bad nozzle from multiple nozzles includes the ink of functional material using nozzle discharge, to apply ink to the area of application on substrate, by making coated ink setting, the functional layer comprising functional material is formed in the area of application.In multiple nozzles, when applying ink, at least it is not chosen to be bad nozzle and by the top of the area of application there are one different from the use of nozzle, the preparation nozzle for the ink that do not spue.
Description
Technical field
The present invention relates to the manufacturing methods for the organic EL display panel for being arranged with organic EL element, spray more particularly to using
The manufacturing method of the organic EL display panel of the method for the use of ink and water.
Background technique
The organic of organic EL (electroluminescence: electroluminescent) element is being arranged on substrate with ranks shape
On EL display panel, shining for each organic EL element is used for pixel and shows image.
Organic EL element, which has, clips the functional layer comprising functional material using a pair of electrodes, such as includes organic light emission
The construction of the organic luminous layer of material etc..Functional layer has hole/electron injecting layer, hole/electronics other than organic luminous layer
Transport layer, hole/electronic barrier layer, buffer layer etc., function is by contained functional material and between adjacent layer
Relationship determines.
The forming method of these functional layers can substantially separate are as follows: the wet types such as the dry methods such as vacuum vapour deposition and ink-jet method
Method.Damp process be using the method that functional material is contained to the ink after organic solvent, from the formation precision of functional layer and
From the aspect of cost, it is considered to be a technique for high resolution and enlargement suitable for organic EL display panel.Especially wet
In formula method, the exploitation of following ink-jet methods is being promoted, it may be assumed that the nozzle edge for the ink that allows to spue in a manner of fine droplet on one side
The surface of substrate is relatively scanned, on one side to the area of application discharge ink for forming functional layer (for example, referring to patent document 1).
Ink-jet method, from the viewpoint of manufacture efficiency, using multiple nozzles in column-shaped arrangement, but with display panel
High resolution and enlargement, the number of nozzle used have reached tens of thousands of a units.Sometimes, drying is had in numerous nozzle
Ink or the attachment such as foreign matter, cause the coating position of ink or coating amount to greatly deviate from design value, so that generating cannot correct
Bad nozzle.When producing bad nozzle, the discharge of ink can not be carried out from bad nozzle, just using by close its
His nozzle alternatively, the coating amount of supplement ink method.For example, there is a kind of in the nozzle of the bad nozzle of adjoining, increase
To the method for the coating number of the ink of identical the area of application (for example, referring to patent document 2).
Citation
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2004-362818 bulletin
Patent document 2: Japanese Unexamined Patent Publication 2011-18632 bulletin.
Summary of the invention
Subject to be solved by the invention
Due to the development of the high resolution of display panel, the number that each nozzle can apply identical the area of application,
It is restricted in developing direction.Therefore, as documented by patent document 2, the nozzle increased to the bad nozzle of adjoining is used
The area of application coating number method, there are limitations in reply.
Wherein it is possible to the most short discharge interval by shortening nozzle be considered, to increase a coating of the ink to each nozzle
The method that number can be applied in region, but this method will lead to the decline of manufacture efficiency and the significantly change of manufacturing process
More.In addition it is also possible to consider to be made a discharge-amount of the nozzle other than bad nozzle increased according to the generation number of bad nozzle
Method, but this method can make the control of nozzle complicate.
Therefore, the purpose of the present invention is to provide a kind of manufacturing methods of organic EL display panel, can inhibit to make
While making the reduction of efficiency, according to simple method, the reduction of ink coating amount caused by the generation because of bad nozzle is augmented.
The means to solve the problem
The manufacturing method for the organic EL display panel that an aspect of of the present present invention is related to is: prepared substrate is formed on substrate
The multiple first electrodes in ranks shape for having provided line direction and column direction multiple will be arranged in column side by being formed on substrate
To the column of first electrode arrange the next door that separates according to each, form the area of application of multiple arrangements as adjoining along line direction
Region between next door is selected multiple nozzles of bad nozzle in the top of substrate, while making it on edge in advance in column-shaped arrangement
Line direction relatively scans substrate, and side is not only selected spuing using nozzle comprising function for bad nozzle from multiple nozzles
The ink of energy property material, so that the ink coating that ink is applied to the area of application is carried out, by making coated ink setting,
The area of application forms the functional layer comprising functional material, to form organic EL display surface of the second electrode of covering function layer
The manufacturing method of plate in multiple nozzles, at least has one and is not chosen to be bad nozzle and passes through coating in ink coating
The nozzle of the top in region, it is the preparation nozzle different from the use of the ink that do not spue of nozzle.
Invention effect
According to the manufacturing method for the organic EL display panel that aforesaid way is related to, even if being produced in multiple nozzles bad
In the case where nozzle, also it can be changed to be supplemented the reduction of ink coating amount using nozzle by the way that nozzle will be prepared.?
That is can be augmented using simple method because bad while inhibiting the decline of manufacture efficiency according to the manufacturing method
The decline of ink coating amount caused by the generation of nozzle.
Detailed description of the invention
Fig. 1 is the block diagram for showing the overall structure of organic EL display device 1.
Fig. 2 is the diagrammatic top view after a part amplification by the picture display face of organic EL display panel 10.
(a) of Fig. 3 is the schematic section of the X-X line along Fig. 2, is (b) schematic section of the Y-Y line along Fig. 2.
Fig. 4 is the schematic section for showing the manufacturing process of organic EL display panel 10, and (a) is to show first electrode and sky
The figure of cave implanted layer formation process is (b) figure for showing pixel limiting layer formation process, (c) shows next door formation process
Figure.
Fig. 5 is the schematic section for showing the manufacturing process of organic EL display panel 10, and (a) is to show hole transmission layer shape
The figure of ink working procedure of coating in, (b) be show hole transmission layer formed in ink setting process figure, be (c) to show
The figure of organic luminous layer formation process.
Fig. 6 shows the schematic section of the manufacturing process of organic EL display panel 10, and (a) is to show electron transfer layer to be formed
The figure of process is (b) figure for showing second electrode formation process, is (c) figure for showing thin film encapsulation layers formation process.
Fig. 7 is the schematic isometric for showing ink discharge device 100.
Fig. 8 is the diagrammatic bottom view of nozzle head 122.
Fig. 9 is the schematic section of auxiliary jet head 124.
Figure 10 is the diagrammatic top view for illustrating ink coating, and (a) is the figure for illustrating the state before bad nozzle generation, (b)
It is the figure for illustrating the state after bad nozzle generation.
Figure 11 is the diagrammatic top view for illustrating the inspection of nozzle.
Figure 12 is the diagrammatic top view for illustrating nozzle supplement setting.
Figure 13 is the diagrammatic top view for illustrating the initial nozzle setting of variation.
Figure 14 is the diagrammatic top view for illustrating the initial nozzle setting of variation.
Figure 15 is the diagrammatic top view after a part amplification by the picture display face of organic EL display panel 30.
Figure 16 is the diagrammatic top view after a part amplification by the picture display face of organic EL display panel 40.
Figure 17 is the diagrammatic top view for illustrating ink coating, and (a) is the figure for illustrating the state before bad nozzle generation, (b)
It is the figure for illustrating the state after bad nozzle generation.
Figure 18 is the diagrammatic top view for illustrating ink coating, and (a) is the figure for illustrating the state before bad nozzle generation, (b)
It is the figure for illustrating the state after bad nozzle generation.
Specific embodiment
< to the whole story > for completing a mode of the invention
As described above, according to ink-jet method, ink coating is carried out to substrate using the nozzle of tens of thousands of a units.This feelings
Under condition, whenever generating small-scale bad nozzle to a certain extent, if the maintenance for carrying out nozzle (cleans nozzle, replacement
Ink etc.), then it will increase maintenance time, manufacture efficiency reduces.Therefore, it is generally the case that if the generation of bad nozzle is small
Scale, then it can stop starting from after the ink of bad nozzle spues, continue the ink coating to substrate at that.But
That, if only stopping spuing from the ink of bad nozzle, the coating amount of ink can reduce, it may appear that the coating of ink it is irregular and
It soaks bad.Therefore, in this case, need to augment the reduction of coating amount caused by the generation of bad nozzle.By Figure 17,
An example of this supplement method is illustrated.Figure 17 is the diagrammatic top view for illustrating ink coating, and (a) is to illustrate bad nozzle
The figure of state before generation is (b) figure for illustrating the state after bad nozzle generation.
In Figure 17, the area of application 95a is formed with as the region between the adjoining next door 95 on substrate, there is electrical isolation
Property, it is formed in the area of application 95a than the lower insulating layer in next door 95 (pixel limiting layer) 94.Then, along paper right and left
To by multiple (being 10 in the figure) nozzles 925 for the ink that spues it is arranged in column-shaped, is scanning it along paper up and down direction
Meanwhile from 925 discharge ink of nozzle, to apply ink to the area of application 95a.At this moment, pass through the smearing in the area of application 95a
The circle of shade indicates the coating position 96b of the i.e. ink of discharge result of each nozzle 925.Coating position 96b does not indicate to apply
Ink afterwards soaks state, only indicates the position of coating.That is, the ink for being applied to coating position 96b is subsequent
It can flow, will similarly be soaked in the area of application 95a as filling in the area of application 95a.
Assuming that each nozzle 925 can to one the area of application 95a discharge ink 3 times.That is being applied shown in Figure 17
In the range of the 95a of region, there are the positions that 30 nozzles 925 can apply ink.In addition, each nozzle 925, can be to coating
The number of region 95a discharge ink depends on the pass between the most short discharge interval of nozzle 925 and the interval in adjacent next door 95
System.
In 30 positions that can apply ink, each nozzle 925 is only to prior defined a part of coating position 96b
Discharge ink.Although not spued the non-painting of ink there is also nozzle 925 that is, can be applied on the area of application 95a
Position 96c is applied, it is indicated with no dashed circle for smearing shade.
Herein, bad nozzle 925B (nozzle 925 of band × mark), a part of coating position 96b are generated to nozzle 925
The case where becoming additional uncoated position 96d (band × uncoated position) takes in.Specifically, being produced in Figure 17 (b)
Two bad nozzle 925B are given birth to, four coating position 96b become to add uncoated position 96d.Like this, if generated bad
Nozzle 925B, additional uncoated position 96d increase, then ink can reduce the coating amount of the area of application 95a.
In this regard, by increasing the coating number of other nozzles 925, four uncoated position 96c are augmented in Figure 17 (b)
It is set as replacing discharge position 96e, and supplements the reduction of ink coating amount.As described above, ink is due to applying
Flowing in the 95a of region, even so additional uncoated position 96d and the position for replacing discharge position 96e different, can also press down
System coating unevenness, non-wetting.
On the other hand, using organic EL display panel, high resolution is being promoted, and the area of application becomes smaller therewith.Figure
18 be the diagrammatic top view for illustrating the ink coating of high-resolution organic EL display panel, and (a) is to illustrate that bad nozzle generates
The figure of preceding state is (b) figure for illustrating the state after bad nozzle generation.
Figure 18 and Figure 17 are same, are formed with the area of application 951a as the region between adjacent next door 951, in coating region
Insulating layer (pixel limiting layer) 941 is formed in the 951a of domain.On the other hand, in Figure 18, compared with Figure 17, adjacent next door 951
Narrower intervals, each nozzle 925 is primary to the area of application 95a ink that can only spue.Therefore, using oil illustrated by Figure 17
The method of ink coating, can be as shown in Figure 18 (a), and each nozzle 925 cannot ensure uncoated position 96c.
It therefore,, cannot position 96d setting generation uncoated to addition as shown in Figure 18 (b) when generating bad nozzle 925B
For discharge position 96e.It is thus impossible to supplement the reduction of ink coating amount caused by the generation of bad nozzle 925B.
For such problems, it may be considered that the most short discharge for shortening nozzle according to the interval in next door is spaced, to increase
Add the ink of each nozzle to the method that can apply number an of the area of application.The most short discharge interval of nozzle depends on nozzle
The scanning speed and nozzle to substrate the ink that can spue maximum discharge frequency.
But the time that the scanning speed for reducing nozzle is equivalent to ink coating needs is elongated, from the angle of manufacture efficiency
It sees, not preferably.Also, the maximum discharge frequency for improving nozzle will lead to the bad luck that coating precision reduces and ink is used up
State, therefore, it is necessary to the significantly changes of this manufacturing process of the improvement of the high performance of ink discharge device and ink.
Moreover, other than the method at most short discharge interval for shortening nozzle, it is also contemplated that making other than bad nozzle
Method of the discharge-amount than usually increasing of nozzle.But if all change discharge-amount using bad nozzle is generated every time
Method, then the management project of each nozzle will increase, and become desirable for carrying out coating position and most short discharge interval according to discharge-amount
Adjustment etc., the control of nozzle can complicate.
Therefore, present inventor is to make by simple method bad while inhibiting the reduction of manufacture efficiency
The reduction of ink coating amount caused by the generation of nozzle is supplemented, and has finally found of the invention one described below
The manufacturing method of the organic EL display panel of mode.
The summary > of mode < of the invention
The manufacturing method for the organic EL display panel that an aspect of of the present present invention is related to is: prepared substrate is formed on substrate
The multiple first electrodes in ranks shape for having provided line direction and column direction will be arranged in column side by formation multiple on substrate
To the column of first electrode arrange the next door that separates according to each, form the area of application of multiple arrangements as adjoining along line direction
Region between next door is selected multiple nozzles of bad nozzle in advance in column-shaped arrangement in the top of substrate, makes it along row
While substrate is relatively scanned in direction, bad nozzle is not only selected from multiple nozzles includes using nozzle discharge
The ink of functional material, so that the ink coating that ink is applied to the area of application is carried out, by making coated ink setting,
The functional layer comprising functional material is formed in the area of application, so that the organic EL for forming the second electrode of covering function layer is shown
The manufacturing method of panel in multiple nozzles, at least has one and is not chosen to be bad nozzle and passes through painting in ink coating
The nozzle of the top in region is applied, it is the preparation nozzle different from the use of the ink that do not spue of nozzle.
It, also can be by will be pre- even if produce bad nozzle in multiple nozzles according to the manufacturing method
Standby nozzle is changed to be supplemented the reduction of ink coating amount using nozzle.That is, according to the manufacturing method, it can
While inhibiting the decline of manufacture efficiency, the ink coating caused by the generation because of bad nozzle is augmented by simple method
The decline of amount.
Moreover, the manufacturing method for the organic EL display panel that other modes according to the present invention are related to, in aforesaid way,
When ink applies, each using discharge number of the nozzle to the ink of each the area of application is at most primary.According to the manufacturing method,
Even high-resolution organic EL display panel, can also be manufactured with high manufacture efficiency and high-quality.
Moreover, the manufacturing method for the organic EL display panel that other modes according to the present invention are related to, in aforesaid way,
When forming the area of application, by making the column for the first electrode for being arranged in column direction are multiple to form the countermure being equally spaced, along row
Direction and column direction form multiple the area of application arranged side by side as the region surrounded by adjacent next door and subplate.According to the manufacture
Method, by forming countermure, in ink coating process, even if ink is more than that next door flow to coating region adjacent on line direction
Domain, the ink are also to be more than countermure without flowing, and therefore, can reduce the range that colour mixture occurs.
Moreover, the manufacturing method for the organic EL display panel that other modes according to the present invention are related to, in aforesaid way,
When ink applies, for each of multiple the area of application for being arranged along column direction, all at least there is one and pass through the coating region
The preparation nozzle of the top in domain.According to the manufacturing method, because each there is preparation spray in the area of application separated by countermure
Therefore mouth even if producing bad nozzle above which the area of application, also can be realized the increasing of ink coating amount decline
It mends.
It is more in aforesaid way moreover, the manufacturing method for the organic EL display panel that other modes according to the present invention are related to
A nozzle is arranged on multiple auxiliary jet heads of the long ruler shape upwardly extended with the side that line direction intersects, multiple auxiliary jet heads
It is arranged on the nozzle head of the long ruler shape extended in a column direction, it can be right on line direction and the plane parallel with column direction
Nozzle head relative rotation.It can adjust and be applied along ink by auxiliary jet head to nozzle head relative rotation according to the manufacturing method
The interval (spacing) of the nozzle of column direction when applying.
Moreover, the manufacturing method for the organic EL display panel that other modes according to the present invention are related to is: will by one side
Multiple nozzles formed the area of application substrate above line up column-shaped, scan it relatively along the surface of substrate, on one side from
Multiple nozzles discharges include the ink of functional material, successively apply on the area of application to multiple substrates using ink-jet method
The ink of ink applies, to form the system of the organic EL display panel of the functional layer including functional material on the area of application
Method is made, in ink-jet method, initial nozzle setting is carried out before starting ink coating respectively, every time to a certain number of substrate knots
Nozzle supplement setting is carried out when beam ink applies；In initial nozzle setting, multiple nozzles are checked, which is regarded as
Nozzle outside using benchmark is chosen to be bad nozzle, and is not selected from multiple nozzles bad nozzle and when ink applies is logical
Cross in the nozzle of the top of the area of application, be set separately more than one be ink coating when discharge ink using nozzle, with
And more than one is set as the preparation nozzle for the ink that do not spue in ink coating；In nozzle supplement setting, multiple sprays are checked
Mouth regards as the inspection result to be changed to bad nozzle using nozzle outside using benchmark, according to by using nozzle to be changed
For the number of the nozzle of bad nozzle, preparation nozzle is changed to using nozzle, to be kept before and after nozzle supplement setting
Certain number using nozzle.
According to the manufacturing method, bad spray can be made by simple method while inhibiting the reduction of manufacture efficiency
The reduction of ink coating amount caused by the generation of mouth is supplemented.
Moreover, the manufacturing method for the organic EL display panel that other modes according to the present invention are related to, in aforesaid way
In the inspection of initial nozzle setting and multiple nozzles in nozzle supplement setting, in the inspection of the lower section of multiple nozzles configuration planar
It looks into and uses region, scan multiple nozzles relatively along the surface in inspection region, on one side from multiple nozzles to inspection area
Domain discharge ink checks the coating state in the inspection region of the ink to be spued.It, can be by multiple according to the manufacturing method
The coating state of nozzle evaluates the discharge precision of each nozzle.
Moreover, the manufacturing method for the organic EL display panel that other modes according to the present invention are related to, in aforesaid way
In initial nozzle setting, multiple prepared nozzles are set every certain interval.According to the manufacturing method, it is able to suppress based on initial
The deviation of the shortest distance to preparation nozzle of the position of generated bad nozzle after nozzle setting, and inhibit in the area of application
Ink applied thickness deviation.
Moreover, the manufacturing method for the organic EL display panel that other modes according to the present invention are related to, in aforesaid way,
On the area of application, multiple electrodes form a line, and fixed is spaced in the distance between adjacent center of electrode or less.According to this
Manufacturing method at least has one by the preparation nozzle above it for each of first electrode.Therefore, even if first
In the case where producing bad nozzle after beginning nozzle setting, due to being deposited on multiple nozzles of the identical top by first electrode
There is prepared nozzle, thus, it is also possible to further suppress the deviation of ink applied thickness.
Moreover, the manufacturing method for the organic EL display panel that other modes according to the present invention are related to, in aforesaid way
In nozzle supplement setting, distance is changed to use by the nearest preparation nozzle of nozzle for using nozzle to be changed to bad nozzle
Nozzle.According to the manufacturing method, it is able to suppress the deviation of the ink applied thickness in the area of application.
Moreover, the manufacturing method for the organic EL display panel that other modes according to the present invention are related to, in aforesaid way
In nozzle supplement setting, inspection result is regarded as into the preparation nozzle outside using benchmark and is changed to bad nozzle.According to the manufacture
Method after initial nozzle setting, can exclude the preparation nozzle that the discharge precision of ink reduces from the candidate for use nozzle.
Moreover, the manufacturing method for the organic EL display panel that other modes according to the present invention are related to, in aforesaid way
In nozzle supplement setting, according to inspection result, to preparation nozzle layout priority, from close to by using nozzle to be changed to not
In 2 or more preparation nozzles of the nozzle of good nozzle, the highest prepared nozzle of priority is changed to using nozzle.According to
The manufacturing method is able to use the higher nozzle of discharge precision, inhibits ink in the ink coating after nozzle supplement setting
Apply generation bad, that coating is irregular.
Moreover, the manufacturing method for the organic EL display panel that other modes according to the present invention are related to, in aforesaid way
In nozzle supplement setting, inspection result is regarded as to be changed to prepared nozzle using the bad nozzle in benchmark.According to the manufacture
The number of method, preparation nozzle increases, during extending before lacking preparation nozzle.
Moreover, the manufacturing method for the organic EL display panel that other modes according to the present invention are related to, in aforesaid way
In nozzle supplement setting, when the number of preparation nozzle is inadequate, the maintenance of multiple nozzles is carried out, carries out initial nozzle after maintenance
Setting.According to the manufacturing method, the discharge precision of bad nozzle can be improved, if it is possible to ensure prepared nozzle, it will be able to weight
It is new to start ink coating.
In addition, the "upper" in the application, does not refer to the upper direction (vertical direction) in absolute space understanding, but organic
On the basis of stacking order in the lit-par-lit structure of EL display panel, limited by relative positional relationship.Specifically, organic
The vertical direction to the interarea of substrate in EL display panel, using from substrate towards the side of sandwich side as upper direction.
In addition, being not the area for only referring to the top directly connecting with substrate in the case where being for example expressed as " on substrate "
Domain also includes the upper area via the substrate of sandwich.
< embodiment >
Hereinafter, being illustrated referring to attached drawing to the manufacturing method for the organic EL display panel that a mode of the invention is related to.
In addition, attached drawing includes exemplary content, the scale bar of each component and aspect rate etc. and practical difference sometimes.Moreover, in this Shen
Please in, top view, top view photograph be in terms of vertical direction seen in object figure, photo, in organic EL display panel, be from
The vertical direction of substrate surface sees the seen figure of the panel, photo.Moreover, plan view shape refers on top view, top view photograph
The shape of appearance.
1. the overall structure of organic EL display device 1
Fig. 1 is the block diagram for indicating the overall structure of organic EL display device 1.Organic EL display device 1 is for for example electric
Depending on, personal computer, portable terminal, for display (the large-scale screen that supplied for electronic signboard, commercial facility use) of business etc.
Display device.Organic EL display device 1 has organic EL display panel 10 and the drive control part being connected electrically 20.
Organic EL display panel 10 (hereinafter referred to as " panel 10 ") is that such as surface is that rectangular picture display face pushes up
The display panel of surface emitting type.As shown in Figure 1, hereinafter, for purposes of illustration only, by along the direction of the long side on the surface of panel 10
As X-direction, using along the direction of the short side on the surface of panel 10 as Y-direction.In panel 10, arranged along picture display face multiple
Organic EL element (not shown in FIG.) combines the luminescence display image of each organic EL element.In addition, panel 10 for example, by using
Active matrix mode.
Drive control part 20, which includes, to be connected to the driving circuit 21 of panel 10, is connected to the external device (ED)s such as computer or day
The control circuit 22 of the reception devices such as line.Driving circuit 21 includes the power circuit to each organic EL element supply electric power, applies
For controlling the signal circuit of the voltage signal to each organic EL element supply electric power, applying voltage every certain interval conversion
The scanning circuit etc. in the place of signal.Control circuit 22 is according to the image information inputted comprising external device (ED) or reception device
Data control the movement of driving circuit 21.
In addition, in Fig. 1, as an example, the driving circuit 21 there are four configurations around panel 10, but drive control part 20
Constitute without being limited thereto, the number of driving circuit 21 and position can suitably change.
2. the composition of panel 10
(1) it overlooks and constitutes
Fig. 2 is by a part of amplified diagrammatic top view of the picture display face of panel 10.On the faceplate 10, one is lifted
Example issues red, green respectively, sub-pixel SPR, SPG, SPB of blue light are aligned to ranks shape.Sub-pixel SPR, SPG,
SPB is arranged alternately in the X-direction of the long side along panel 10, and one group of sub-pixel SPR, SPG, SPB constitute a pixel P.In pixel P
In, by combining the light emission luminance of sub-pixel SPR, SPG, SPB for being controlled by color range, to show full color.
Moreover, in the Y-direction along the short side of panel 10, by only arranging sub-pixel SPR, sub-pixel SPG, sub-pixel
Any one of SPB, and respectively constitute sub-pixel column LR, sub-pixel column LG, sub-pixel column LB.Pixel P is as panel 10 as a result,
It is whole and be arranged in X direction and the ranks shape of Y-direction, it is aligned to the colour developing of the pixel P of the ranks shape by combining, and
Image is shown on picture display face.
It is formed on sub-pixel SPR, SPG, SPB and issues red, green, the organic EL element of blue light, sub-pixel respectively
SPR, SPG, SPB by from picture display face side extract the organic EL element it is luminous and shine.Sub-pixel SPR, SPG, SPB's
Luminescent color can be luminescent color of organic EL element itself, be also possible to shine to organic EL element by colored filter
Luminescent color after color correction.
Panel 10 is for example, by using line dike (line bank) formula.That is, separating sub-pixel column according to each column by multiple formed
The next door 15 of LR, LG, LB, and the area of application 15a of multiple arrangements in X direction is formed as the area between adjacent next door 15
Domain.When forming functional layer according to aftermentioned ink-jet method, each the area of application 15a is the region for applying ink.According to line dike (line
Bank) formula, continuous since the area of application 15a crosses over sub-pixel column LR, LG, LB, the ink being coated can be along Y-direction stream
It is dynamic, it is irregular so as to the film thickness that reduces functional layer.
In addition, in panel 10, is formed in each the area of application 15a and insulated to each sub-pixel SPR, SPG, SPB
Insulating layer (pixel limiting layer) 14, sub-pixel SPR, SPG, SPB can shine each independently.In Fig. 2, pixel limiting layer 14 makes
It is represented by dashed line, this indicates that pixel limiting layer 14 is covered by functional layer, is not directly visible on top view.
(2) section constitution
(a) of Fig. 3 is the schematic section of the X-X line along Fig. 2, and (b) of Fig. 3 is the schematic cross-section of the Y-Y line along Fig. 2
Figure.In addition, centered on the section constitution of sub-pixel SPG, in (b) of Fig. 3, only describing sub-pixel in (a) of Fig. 3
The section constitution of LG, but sub-pixel SPR, SPB and sub-pixel column LR, LB are arranged, and is similarly constituted with (a) of Fig. 3, (b).
In addition, in Fig. 3, using the direction on paper as Z-direction.
Panel 10 has: substrate 11, first electrode 12, hole injection layer 13, pixel limiting layer 14, next door 15, hole pass
Defeated layer 16A, organic luminous layer 16B, electron transfer layer 17, second electrode 18 and thin film encapsulation layers 19.Wherein, hole transmission layer
16A and organic luminous layer 16B are formed by aftermentioned ink-jet method.In addition, the stacking constitutes an only example, except this it
Outside, electron injecting layer, barrier layer, buffer layer etc. can also be laminated, a part of above layers also can be omitted.In addition, as electricity
Sub- implanted layer is such, and physically a layer also can have multiple functions.
A. substrate 11
Substrate 11 is the bearing part of panel 10.Diagram is omitted, but in substrate 11, in the substrate master of rectangular flat plate shape
TFT (thin film transistor (TFT)) layer is formed on body.
Base main body coated by the material with electrical insulating property or to the material with electrical insulating property after aluminium or
Stainless steel and other metal materials are formed.As the material with electrical insulating property, e.g.: alkali-free glass, soda-lime glass, unstressed configuration glass
The glass materials such as glass, phosphate glass, boric acid system glass, quartz glass.Also, the material can be for example: acrylic acid series tree
Rouge, phenylethylene resin series, polycarbonate-based resin, epoxy system resin, polyethylene-based resin, polyester based resin, polyimides system
The resin materials such as resin, silicone-based resin.Also, the material is also possible to the metal oxide materials such as aluminium oxide.
Since organic EL element reacts with moisture or oxygen etc. sometimes and deteriorate, base main body it is preferable to use
The low material of moisture penetration degree, such as glass or metal etc. inhibit moisture or oxygen to penetrate into from organic EL element lower part.Also,
When resin material is used for base main body, preferably to moisture such as the surface coating silicon nitride of resin material, silicon oxynitride, aluminium oxide
The low film of permeability.
TFT layer is formed in the layer of the electronic circuit in base main body, configured with the power supply electricity to organic EL element
Road and the control circuit etc. for supplying electric power.Specifically, TFT layer is by configuring the layer of the semiconductor in base main body, conductor
Layer and electrical insulator layer constitute layer laminate, by this stacking composition, constitute TFT element, capacitor element, wiring
Equal electronic circuit components.In addition, the topmost in TFT layer forms interlayer insulating film (not shown in FIG.), the surface of substrate 11
It is flattened.
The layer of semiconductor is by for example: the oxide semiconductors such as the general semiconductor material such as silicon, indium-zinc-gallium oxide
Material, polycyclc aromatic compound etc. have the organic semiconducting materials etc. of the pi-electron conjugated system extended in the in-plane direction
It is formed.The layer of conductor is by for example: the carbon materials, oxidation such as metal materials, graphite, the carbon nanotube such as aluminium (Al), copper (Cu), golden (Au)
The formation such as conductive oxide materials such as indium tin (ITO) and indium zinc oxide (IZO).The layer of electrical insulator is by for example: silicon nitride,
The inorganic material such as silica, silicon oxynitride, aluminium oxide, acrylic resin, polyimides system resins, silicone-based resin, phenolic aldehyde
It is the formation such as organic materials such as resin.Interlayer insulating film be by with electrical insulating property can patterned material constitute, such as:
The organic materials such as acrylic resin, polyimides system resins, silicone-based resin, phenolic aldehyde system resin.
In addition, on TFT layer, can also to be formed be material with silicon nitride or aluminium oxide etc., the electronic circuit of covering TFT layer
The layer of element entirety, as the passivation layer for being different from interlayer insulating film.
B. first electrode 12
First electrode 12 is on the substrate 11, to be prescribed respectively using line direction as X-direction, the shape by Y-direction of column direction
At ranks shape multiple electrodes, have the function of to organic luminous layer 16B supply hole as anode.First electrode 12 is divided
The position for not providing each organic EL element is formed the forming position corresponding to each sub-pixel SPR, SPG, SPB.
First electrode 12 is by such as aluminium, silver (Ag), molybdenum (Mo), tungsten (W), titanium (Ti), chromium (Cr), nickel (Ni), zinc (Zn) etc.
Metal material is formed.Also, it can also be by combining the alloy material and laminated metal materials/alloys material of these metal materials
Multi-ply construction after material is formed.Moreover, for the zygosity improved between first electrode 12 and hole injection layer 13 and preventing
The purpose that first electrode 12 aoxidizes, can also be by being laminated the transparent conductive oxides material institute structures such as ITO, IZO on above-mentioned layer
At the multi-ply construction of layer formed.Also, in the lowest level of first electrode 12, for inhibit burn into caused by wet etching and
Diffusion from hydrogen to lower layer the purpose of, the barrier metal layer being made of metal oxide materials such as tungsten oxides can also be formed.
In addition, from the angle in supply hole, material preferably high using work function to first electrode 12.In addition,
In the panel 10 of top surface emission type, light reflective preferably is assigned to first electrode 12.
C. hole injection layer 13
Hole injection layer 13 is one kind of functional layer, and the layer being formed in first electrode 12, having makes from first electrode
12 energy barrier into the supply (hole injection) in the hole of organic luminous layer 16B reduces, and becomes easy hole injection
Effect.In panel 10, hole injection layer 13 is separately formed according to each first electrode 12, is arranged in ranks on the substrate 11
Shape.As functional material, hole injection layer 13 is formed using the material with ionization energy appropriate.As such material
Material, e.g.: the oxide, that is, metal oxide materials and PEDOT of silver, molybdenum, chromium, tungsten, nickel, vanadium (V), iridium (Ir) etc. are (poly-
The mixture of thiophene, polystyrolsulfon acid) etc..
D. pixel limiting layer 14
As shown in (b) of Fig. 3, pixel limiting layer 14 is the side to cover the end of first electrode 12 and hole injection layer 13
Formula is formed, and with electrical insulating property layer, relative to the height (along the height of Z-direction) from 11 surface of substrate, formed than every
Wall 15 is low.Pixel limiting layer 14, which has, improves sub-pixel SPR, SPG, SPB (first electrode 12) adjacent in each the area of application 15a
The effect of electrical insulating property each other.Also, by the end of covering first electrode 12, pixel limiting layer 14 also can inhibit the
One electrode 12 and short circuit caused by the contact of second electrode 18.
In addition, as shown in Figure 2, covering the first electrode 12 and hole injection layer of pixel limiting layer 14 in panel 10
The flat shape of 13 end is formed curve-like.So, by forming pixel limiting layer 14, hole transmission layer is being formed
When 16A, ink is easy to soak the edge for diffusing to the region surrounded by hole injection layer 13, pixel limiting layer 14 and next door 15,
It is bad so as to inhibit to soak.
The material of pixel limiting layer 14 is by for example: the inorganic material such as silicon nitride, silica, silicon oxynitride, aluminium oxide；Propylene
The formation such as organic materials such as acid system resin, polyimides system resins, novolak type phenol system resin.Moreover, forming hole
When transport layer 16A, to make the ink in the area of application 15a comprising functional material be easy to soak diffusion, preferred pixel limiting layer
14 surface has the lyophily to ink.
E. next door 15
Next door 15 by according to it is each column separate along Y-direction arrangement first electrode 12 and hole injection layer 13 column, and
The area of application 15a of multiple arrangements in X direction is formed as the region between adjacent next door 15.At this moment, as shown in Fig. 2, next door
15 become the linear shape extended in the Y direction, i.e., so-called line dike (line bank).
Specifically, next door 15 when forming hole transmission layer 16A and organic luminous layer 16B, inhibits comprising functional material
The ink of material flows out to the outside of each the area of application 15a.Also, next door 15 have zoning formed after hole transmission layer 16A and
The effect of organic light emission side 16B and electrical insulating property.
It next door 15, being capable of patterned photonasty erosion resistant shape by passing through photolithograph method for example with electrical insulating property
At.As the example of photonasty erosion resistant, there are acrylic resin, polyimides system resins, novolak type phenol system tree
Rouge etc..In addition, next door 15 can contain the material other than photonasty erosion resistant.Moreover, the photonasty of photonasty erosion resistant
Can be and cause the minus reduced to the dissolubility of developer solution because photosensitive, caused because photosensitive it is increased to the dissolubility of developer solution just
Any one of type, preferably minus.In general, it is wide above the photosensitive region of photoresist when being exposed from top, under
Narrow, the back taper easy to form in side.Therefore, the photonasty erosion resistant if it is the minus of residual photosensitive region, after development treatment
As the shape of approximate back taper, being able to suppress ink is more than to be formed by the outflow of next door 15.
In addition, preferably next door 15 has the patience to organic solvent or heat from the point of view of the manufacturing method of aftermentioned panel 10.
It also, is the outflow for inhibiting ink, the preferably surface in next door 15 has lyophobicity, for example, it is preferable to which 15 use of counter septum is comprising hating
The material or counter septum 15 of fluidity ingredient assign the surface treatment of lyophobicity.As lyophobicity ingredient, such as there is fluorine system
Close object, siloxane-based compound.The lyophobicity ingredient, such as independent material, may be combined in photonasty erosion resistant
In 15P, for example, it is also possible to contain in the copolymer of photonasty erosion resistant 15P.In addition, as the surface for assigning lyophobicity
Processing, can be used such as the plasma treatment under fluorine gas atmosphere.
F. hole transmission layer 16A
Hole transmission layer 16A is one kind of functional layer, is by being made using aftermentioned ink-jet method coated in each the area of application
The ink setting of 15a and the layer formed have the transmission for the organic luminous layer 16B for improving the hole supplied to first electrode 12
The effect of property.In addition, hole transmission layer 16A is along each the area of application in the panel 10 using line dike (line bank) formula
The shape that 15a extends in the Y direction, to cover all first electrodes 12, hole injection layer 13 and the picture in each the area of application 15a
The mode of plain limiting layer 14 is continuous.That is, each sub-pixel SPR, SPG, SPB are shared in each sub-pixel column LR, LG, LB
Hole transmission layer 16A.
As functional material, hole transmission layer 16A is formed using the relatively high organic material of hole mobility.As this
Kind material, for instance that triazole derivative, oxadiazole derivatives, imdazole derivatives, poly- aromatic yl paraffin derivative, pyrazoline are derivative
Object, pyrazolone derivative, phenylenediamine derivative, arylamine derivatives, amino chalcones derivative, oxazole are derivative
Object, styrylanthracene derivatives, fluorenone derivatives, hydazone derivative, stilbene derivatives, porphyrin compound, aromatic series three-level amine compounds
Object, styrylamine compounds, adiene cpd, polystyrene derivative, triphenylmethane derivatives, tetraphenyl benzidine
(tetraphenyl benzidine) derivative (on the books in Japanese Unexamined Patent Publication 5-163488 bulletin) etc..
G. organic luminous layer 16B
One kind and hole transmission layer 16A that organic luminous layer 16B is functional layer are again it is by utilizing aftermentioned ink-jet
Method makes the ink setting for being coated in each the area of application 15a and the layer formed.In organic luminous layer 16B, pass through first electrode 12
And the hole supplied of second electrode 18 and electronics in conjunction with shone (electroluminescence phenomenon).
In the panel 10 using line dike (line bank), organic luminous layer 16B and hole transmission layer 16A are again it is edge
The shape that each the area of application 15a extends in the Y direction is prolonged to cover the hole transmission layer 16A entire surface in each the area of application 15a
It is continuous.That is, each sub-pixel SPR, SPG, SPB share organic luminous layer 16B in each sub-pixel column LR, LG, LB.But
The part that organic luminous layer 16B is only located at the top of first electrode 12 shines, independent according to each sub-pixel SPR, SPG, SPB
Ground shines.
As functional material, organic luminous layer 16B use according to the luminous organic material that electroluminescence phenomenon shines and
It is formed.As luminous organic material, for instance that oxine (oxinoid) compound, compound, coumarin compound, azepine are fragrant
Legumin compound, oxazoline compound, oxadiazole compound, pyrene ketone compound, pyrrolopyrrole compound, naphthalene compound, anthracene
Close object, fluorene compound, firefly anthracene compound, aphthacene compound, pyrene compound, coronene compound, quinolone compounds, azepine quinoline
Promise ketone compound, pyrazoline derivative, pyrazolone derivative, rhodamine compound,(chrysene) compound, phenanthreneization
Close object, cyclopentadiene compound, stilbene compounds, diphenyl naphtoquinone compounds, compound of styryl, adiene cpd, dicyan
Methylene pyrylium compound, methylene dicyanoethyl thiapyrilium compounds, Fluorescein compound, pyrylium compounds, thio-pyrylium salinization
It closes object, cycolin and receives pyralium salt (selenapyrylium) compound, telluro pyrylium compounds, aromatic series canrenone chemical combination
Object, oligophenylenes compound, thioxanthene compounds, cyanine compound, acridine compounds, 8-hydroxyquinoline compound metal network
Compound, the metal fluor-complex of bis- pyridine compounds of 2-, the fluor-complex of Schiff salt and III group metal, 8-hydroxyquinoline (oxine) gold
Well known to fluorescent materials such as metal complex, terres rares fluor-complex (on the books on Japanese Unexamined Patent Publication 5-163488 bulletin) etc.
Fluorescent material, phosphorus.Moreover, for example, it can be organise using above-mentioned fluorescent material, phosphorus as dopant
Close the mixed layer of object.In addition, in panel 10, red, green comprising sending respectively using pair of sub-pixel columns LR, LG, LB formation,
Three colors of the organic luminous layer 16B of the luminous organic material of blue light divide painting mode, full color reply.
H. electron transfer layer 17
Electron transfer layer 17 is one kind of functional layer, is formed to cover and be formed with next door 15 and organic luminous layer 16B
The whole layer of substrate 11, there is the work of the transporting for the organic luminous layer 16B for improving the electronics supplied to second electrode 18
With.
As functional material, electron transfer layer 17 is formed using the relatively high organic material of electron mobility.As
Such material, for instance that nitro-substituted fluorene ketone derivatives, thiopyrandioxide derivatives, diphenoquinone, tetracarboxylic
Derivative, anthraquinone diformazan alkane derivatives, fluorenylidenemethane derivatives, anthracyclinone derivatives, oxadiazole derivatives, pyrene ketone derivatives,
Quinoline fluor-complex derivative (on the books on Japanese Unexamined Patent Publication 5-163488 bulletin), phosphinoxide, triazole are derivative
Object, diazine (todiazine) derivative, thiophene cough up derivative, two (trimethylphenyl) boron (dimesitylboron) derivatives, three virtues
Base boron derivative etc..
I. second electrode 18
Second electrode 18 is the electrode of covering function layer, in panel 10, in a manner of overlay electronic transport layer 17 across
Substrate 11 is whole and is formed.Second electrode 18 has the function of as the cathode to organic luminous layer 16B supply electronics.
Second electrode 18 is for example, aoxidizing to the transparent conductive oxides such as ITO or IZO material or by transparent conductivity
The layer of the metal materials such as layer stackup silver, gold, nickel, copper, aluminium, platinum (Pt), palladium (Pd) that object material is constituted or these alloy materials
And formed.
In addition, from the angle of supply electronics, material preferably low using work function to second electrode 18.Moreover,
In the panel 10 of top surface emission type, preferably there is high light transmission using such as 80% or more light transmission to second electrode 18
The material of rate.
J. thin film encapsulation layers 19
Thin film encapsulation layers 19 be to be formed with cover be formed with above-mentioned first electrode 12 to second electrode 18 each component base
The whole layer of plate 11 has the function of that each component is inhibited to be exposed in moisture or oxygen etc..Thin film encapsulation layers 19 are penetrated by moisture
The inorganic material such as rate low material, such as silicon nitride, silicon oxynitride, oxycarbide, carbonitride, aluminium oxide are formed.Moreover, pushing up
In the panel 10 of surface emitting type, preferably using thin film encapsulation layers 19 has high transmitance, and the folding with second electrode 18
Penetrate the small material of the difference of rate.
K. other
It, can also be low by the moisture permeability such as glass material with configuration on the substrate 11 of upper-part in formation in panel 10
The sealing plate that material is formed.At this moment, the adhesive layer between substrate 11 and sealing plate by being made of such as curable resin material
Deng engagement.Thereby, it is possible to further suppress the infiltration to each organic EL element on substrate 11 such as moisture or oxygen.
Furthermore it is possible to configure colored filter on the position of sub-pixel SPR, SPG, SPB for corresponding to sealing plate.By
This, can correct the luminescent color of sub-pixel SPR, SPG, SPB.Furthermore, it is also possible to correspond to sealing plate sub-pixel SPR,
The fringe region of position and sealing plate between SPG, SPB configures black matrix".Thereby, it is possible to inhibit the image of panel 10 aobvious
Show the reflection of the outer light on face, also, improves the pixel P on picture display face with it with the contrast of outer portion.
In addition, an above-mentioned section constitution only example, for example, at (a) of Fig. 3, electron transfer layer 17 and
Two electrodes 18 are formed across multiple the area of application 15a, but these all or part of can also be to each the area of application 15a
Or each sub-pixel SPR, SPG, SPB are formed.Also, for example, (a), (b) in Fig. 3, hole injection layer 13 is to each sub-pixel
SPR, SPG, SPB are formed, but can also be formed across each the area of application 15a or multiple the area of application 15a.
3. the manufacturing method of panel 10
(1) whole process
For the manufacturing method of the panel 10 of a mode of the invention, firstly, being illustrated to whole process.Fig. 4, Fig. 5
And Fig. 6 is the schematic section for indicating the manufacturing process of panel 10.In addition, Fig. 4, Fig. 5 and section shown in fig. 6 are equivalent to Fig. 3
(a) sub-pixel SPG section.In addition, there is no the pixel limiting layer 14 for smearing shade to show shown in (b) of Fig. 4, (c)
The thing being not present on the section, but be present in the surface of the pixel limiting layer 14 of the paper inboard in the section.
A. substrate prepares
Firstly, prepared substrate 11.Specifically, prepare to make the flat base main body of electrical insulating property material forming,
TFT layer is formed in base main body.The formation of TFT layer, such as can be according to as follows.
Firstly, forming the layer, semiconductor material for being patterned into the semiconductor material of regulation shape in base main body
The layer of layer or electrical insulator material, repetitive operation, thus electronic circuit as defined in being formed.The formation of each layer, according to the material of each layer
Material, can be used for example: the dry methods such as vacuum vapour deposition, e-beam evaporation, ion plating, chemical vapour deposition and
The wet methods such as print process, spin coating method, ink-jet method, spot printing (dispense) method, dispensing coating (die coating) method.
To the patterning of each layer, it is, for example, possible to use photolithograph method, shadow mask method, metal mask methods etc., and damp process also can be used
Directly form regulation shape.In addition it is also possible to as needed, carry out Plasma inpouring, ion implanting, baking to each layer is formed by
The processing such as dry method.
Next, sequentially forming passivation layer, interlayer insulating film to cover the electronic circuit.Form passivation layer and interlayer
Insulating layer can use above-mentioned dry method, damp process according to the material of each layer.In addition, to make the TFT element in electronic circuit
It is electrically connected with first electrode 12, to passivation layer and interlayer insulating film, forms opening (contact hole) on specified position.Contact hole
Formation, above-mentioned pattern method can be used.
B. first electrode and hole injection layer are formed
Next, on the substrate 11, form line direction and column direction be defined as x-direction and y-direction in ranks shape
Multiple first electrodes 12 and multiple hole injection layers 13.For example, firstly, formed on the substrate 11 using sputtering method metallic film it
Afterwards, the film that reactive sputtering method forms metal oxide on metallic film is continued with.Next, in metal oxide
It is coated with after photo anti-corrosion agent material on film, photoresist is patterned using photolithograph method, only arranging
At the forming region residual material of sub-pixel SPR, SPG, SPB of the ranks shape being made of x-direction and y-direction.
Then, dry ecthing method, wet etch method are successively continued to use, in the place of no configuration photo-induced corrosion resistant material to metal oxide
Film, metallic film are etched.Finally, removing the photo-induced corrosion resistant material and residue on the film of metal oxide.As a result,
Formed by X direction and Y-direction be arranged in rows column-shaped the first electrode 12 that constitutes of metallic film and by being layered in the metal foil
The hole injection layer 13 (Fig. 4 (a)) that the film of metal oxide above film is constituted.So, pass through the first electricity of etching simultaneously
Pole 12 and hole injection layer 13, can be improved the efficiency of manufacturing process.In addition, by carrying out figure using identical photoresist
Case improves the identical precision in position of first electrode 12 and hole injection layer 13.
In addition, first electrode 12 and the forming method of hole injection layer 13 are not limited to above-mentioned sputtering method, reactive sputtering method
And the combination of photolithograph method, it can be according to material, the dry method illustrated using the example above, damp process, pattern method.Moreover,
When the lowest level of first electrode 12 configures barrier metal, the thin of metal oxide is first formed before the formation of metallic film
Film after carrying out wet etching to metallic film, further carries out dry ecthing to the film of metal oxide.In addition, in face
In the manufacturing method of plate 10, it is not limited to the method as described above for continuously etching first electrode 12 and hole injection layer 13,
It can form the film of metal oxide after forming first electrode 12 and be patterned and form hole injection layer 13.
C. pixel limiting layer is formed
Next, forming pixel limiting layer 14 on the substrate 11 for foring first electrode 12 and hole injection layer 13.Tool
For body, for example, forming the film of the inorganic material of the entire surface on covering substrate 11 using vacuum vapour deposition, photocopy stone is utilized
Version method is formed in the side X with curvilinear flat shape covering first electrode 12 shown in Fig. 2 and the end of hole injection layer 13
To the shape of extension.Form pixel limiting layer 14 (Fig. 4 (b)) as a result,.In addition, organic material can be used in pixel limiting layer 14
It is formed, also, other dry methods, damp process, pattern method that the example above illustrates also can be used and formed.
D. next door is formed
Next, multiple formed separates first electrode 12 and the hole arranged in the Y direction according to each column on the substrate 11
The next door 15 of the column of implanted layer 13.Formed as a result, the area of application 15a of multiple arrangements in X direction as adjacent next door 15 it
Between region.That is, in the present embodiment, X-direction is equivalent to line direction, Y-direction is equivalent to column direction.It is specific and
Speech, for example, photonasty erosion resistant is applied using the entire surface of dispensing coating process on the substrate 11, so that film thickness is limited than pixel
Layer 14 is bigger, patterns photonasty erosion resistant using photolithograph method and forms the shape extended in the Y direction, multiple formation
According to the next door 15 (Fig. 4 (c)) of the column of each first electrode 12, hole injection layer 13 for arranging and separating arrangement in the Y direction.Separately
Outside, next door 15 also can be used other dry methods, damp process, pattern method and be formed.
E. ink applies
It is comprising hole transmission layer here next, including functional material by spuing using aftermentioned ink-jet method
The ink 16a of the material of 16A carries out the ink coating (Fig. 5 (a)) that ink 16a is applied to the area of application 15a.In addition, ink
16a is spued in a manner of exceeding pixel limiting layer 14 in the area of application 15a and is continuous.As a result, in the area of application 15a,
Ink 16a becomes able to flow in the Y direction, the irregular reduction of coating of the ink 16a in the area of application 15a.That is, at it
In drying afterwards, it will the film thickness of the hole transmission layer 16A in reduction the area of application 15a is irregular and forms undesirable generation.
F. it dries
Next, being formed on the area of application 15a comprising functional material by keeping coated ink 16a dry
Functional layer, that is, hole transmission layer 16A.Specifically, for example, by the way that the substrate 11 after coating ink 16a is placed on vacuum chamber etc.
In vacuum environment, evaporate the solvent of ink 16a.Thereby, it is possible to form hole transmission layer 16A (Fig. 5 in each the area of application 15a
(b))。
G. organic luminous layer is formed
Next, it is same with the forming method of hole transmission layer 16A, it include function by spuing using aftermentioned ink-jet method
Energy property material, is herein the ink of luminous organic material, carries out the ink coating that ink is applied to the area of application 15a.Then, lead to
Crossing makes coated ink setting, forms the functional layer comprising luminous organic material, i.e. organic luminous layer in the area of application 15a
16B (Fig. 5 (c)).In addition, ink makes coated in the hole transmission layer 16A entire surface in the area of application 15a in ink coating
Obtaining the ink in the area of application 15a can flow in the Y direction of Fig. 2.The ink in the area of application 15a can be reduced as a result,
Apply it is irregular, reduce it is dry after, the film thickness of organic luminous layer 16B in the area of application 15a is irregular and forms undesirable generation.
H. electron transfer layer is formed
Next, forming electron transfer layer 17 for all next door 15 and organic luminous layer 16B on covering substrate 11
(Fig. 6 (a)).The formation of electron transfer layer 17, can according to the material of electron transfer layer 17, for example above-mentioned illustration of use
Dry method or damp process.
I. second electrode is formed
It is herein the second electrode 18 (Fig. 6 (b)) of electron transfer layer 17 next, forming covering function layer.For example, root
The dry method illustrated according to the example above forms a film to the film of transparent conductive oxides material on electron transfer layer 17,
Form second electrode 18.
J. it seals
Next, being sealed to the substrate 11 formed from first electrode 12 to second electrode 18.Specifically, example
Such as, the dry method illustrated using the example above forms until second electrode 18 forming thin film of inorganic material with covering
Electrode substrate 11 surface, to form thin film encapsulation layers 19 (Fig. 6 (c)).
According to above method, the panel 10 with cross-sectional configuration shown in Fig. 2 is completed.
(2) the ink coating based on ink-jet method
Next, to the ink based on ink-jet method in the formation of hole transmission layer 16A and organic luminous layer 16B apply into
Row explanation.
A. the composition of ink discharge device 100
Firstly, being illustrated to the composition of the ink discharge device 100 for ink coating based on ink-jet method.Fig. 7 is to show
The schematic isometric of ink discharge device 100.Ink discharge device 100 has workbench 110, head 120 as main constituent element.
(a) workbench 110
Workbench 110 is the workbench of so-called gantry formula, is had: the i.e. substrate 200 of object of mounting ink coating
The mobile stand 112 of base station 111, the long ruler-like configured in the top of base station 111.In addition, substrate 200 is the system of such as panel 10
Make the substrate 11 and the aftermentioned inspection substrate for nozzle check on the way (before ink coating).Also, for example, substrate
200 aggregates for being also possible to the substrate 11 for becoming multiple substrates 11 after segmentation are formed in upper surface of base plate in this case
210 each the area of application 15a becomes the shape extended along the short side direction i.e. Y-direction of upper surface of base plate 210.
Base station 111 is plate, and the surface of mounting substrate 200 is rectangle.It wherein, will be along the long side on 111 surface of base station
Direction as the longitudinal direction of base station 111, using the direction along the short side on 111 surface of base station as the short side side of base station 111
To.
Mobile stand 112 be erected at a pair of of guide shaft 113a, 113b for being configured in parallel along the length direction of base station 111 it
Between, it is configured such that the length direction of mobile stand 112 along the short side direction of base station 111.A pair of of guide shaft 113a, 113b by
To the bearing for columnar pedestal 114a, 114b, 114c, the 114d configured at four angles on 111 surface of base station.
Mobile stand 112 respectively by the linear motor portion 115a that is fixed on the length direction end of mobile stand 112,
115b is mounted on guide shaft 113a, 113b.Therefore, mobile stand 112 passes through the driving of linear motor portion 115a, 115b, can
Length direction along base station 111 moves.
Moreover, be formed in the surface of mobile stand 112 and length direction extend guide-track groove 118 on, pass through servo
Motor part 117 is equipped with the pedestal 116 of L-shaped.Therefore, pedestal 116 can be along the short of base station 111 by servo motor portion 117
Edge direction is mobile.
In addition, linear motor portion 115a, 115b, servo motor portion 117 connect and via the communications cable 101,102 respectively
The control device (not shown in FIG.) driving connect.
(b) head 120
Head 120 has main part 121, nozzle head 122 and photographic device 123.Main part 121 is fixed on workbench
On 110 pedestal 116, nozzle head 122 and photographic device 123 are mounted on main part 121.Therefore, head 120 can be with movement
The mobile linkage of pallet 112 and pedestal 116, and it is mobile in the length direction of base station 111 and short side direction.Also, main part 121
In be built-in with control nozzle head 122 movement driving circuit, the driving device by the communications cable 103 be connected to control dress
It sets.
Nozzle head 122 is the component in the long ruler-like of the short side direction extension of base station 111.Fig. 8 is the signal of nozzle head 122
Bottom view.In the bottom surface side of nozzle head 122, the subheader 124 of long ruler-like is arranged in the length direction of nozzle head 122 (that is, base station
111 short side direction).Moreover, multiple nozzles 125 are arranged in shape at equal intervals along the length direction of subheader 124 in subheader 124.
Each subheader 124 is fixed on the length direction middle section of itself with nozzle head 122 together, and for nozzle head 122, can be with
Centered on the middle section, the relative rotation in the plane parallel with the upper surface of base station 111.In ink discharge device 100, by making
Subheader 124 can adjust the length direction (Y-direction) of the nozzle head 122 when applying along ink to 122 relative rotation of nozzle head
The interval (spacing) of nozzle 125.The rotation of the subheader 124 is controlled by the driving circuit controlled device of main part 121.
Fig. 9 is the schematic section of subheader 124.It is multiple to be arranged with from the opening of its bottom surface side discharge oil on subheader 124
The nozzle 125 of ink.Moreover, piezoelectric element 125a is configured on the position for corresponding to each nozzle 125 in the surface side of subheader 124,
Liquid chamber 125c is configured with by oscillating plate 125b in the lower section of each piezoelectric element 125a.
Each piezoelectric element 125a is connected to control device by the driving circuit of main part 121, according to carrying out self-control device
Signal, make oscillating plate 125b deform.Oscillating plate 125b is the component of the shared plate of each nozzle, is become by piezoelectric element 125a
Shape applies pressure to the liquid chamber 125c of the lower section of piezoelectric element 125a.Liquid chamber 125c is via 104 quilt of perfusion tube shown in Fig. 7
The ink that ink tank (not shown in FIG.) is supplied is full of, the opening from nozzle 125 and by oscillating plate 125b application pressure
Mouth discharge ink.That is, ink discharge device 100 can independently control spitting for the ink of each nozzle 125 by control device
Output and discharge opportunity.
Photographic device 123 is, for example, CCD camera, is connect by the communications cable 105 with control device.Photographic device 123 is clapped
Upper surface of base plate 210 is taken the photograph, sends the camera data to control device.Control device is able to detect to (each spray of head 120 as a result,
Mouth 125) upper surface of base plate 210 position, from each nozzle 125 accurately upper surface of base plate 210 specified position apply unction
Ink.In addition, control device can be checked from the painting on the substrate 200 for the ink that each nozzle 125 spues according to above-mentioned camera data
Apply position and coating amount.
B. the application method of ink discharge device 100
Hereinafter, giving one example, illustrate the application method of the ink discharge device 100 when substrate 200 is substrate 11.
Firstly, mounting is formed with the substrate 11 of the area of application 15a on base station 111.At this moment, substrate 11 is loaded as difference
So that longitudinal direction, that is, X-direction of substrate 11 is parallel with the length direction of base station 111, short side direction, that is, Y-direction of substrate 11 with
The width direction of base station 111 is parallel.That is, configuration substrate 11 so that extending direction, that is, Y-direction of the area of application 15a with
The extending direction of nozzle head 122 is consistent.Therefore, hereinafter, as shown in Figure 7, respectively by the length direction of base station 111, width
Degree direction is also used as X-direction, Y-direction.In addition, at this moment, make the area of application 15a of substrate 11, i.e., 11 surface of substrate towards upper and
Configuration is on base station 111.That is, as shown in Figure 7, surface perpendicular to base station 111 and from base station 111 towards nozzle
125 direction becomes Z-direction.
Next, making each subheader 124 to 122 relative rotation of nozzle head, by the length direction of each subheader 124 to nozzle head
The angle of 122 length direction is fixed as the certain angle designed in advance.By suitably setting the angle, can make along
The interval of the nozzle 125 of the length direction (Y-direction) of nozzle head 122 becomes fixation at equal intervals.At this moment, in each subheader 124, spray
Mouth 125 is arranged in column-shaped at equal intervals along the length direction of the subheader, also, the column of such nozzle 125 are along the multiple rows of Y-direction
Column.
Next, driving servo motor portion 117 based on the camera data of photographic device 123, making head 120 along the side Y
To movement, nozzle head 122 is adjusted to the position along Y-direction of substrate 11.Then, linear motor portion 115a, 115b are driven, head is made
Portion 120 is mobile, so that nozzle head 122 moves to the end of a side of the X-direction of substrate 11.Thereby, it is possible in the top of substrate 11,
Each nozzle 125 is set to be arranged in multiple column-shaped along Y-direction (column direction).
Next, driving linear motor portion 115a, 115b, make head 120 be moved to the X-direction of substrate 11 in X direction
Other ends.In the movement, based on the camera data of photographic device 123, pass through the area of application 15a in each nozzle 125
Top opportunity, from the 125 discharge ink of nozzle.That is, making X-direction (line direction) of the nozzle 125 along 11 surface of substrate on one side
Substrate 11 is scanned, on one side to the area of application 15a discharge ink.Ink is applied to the area of application 15a as a result,.
Ink coating is able to carry out using ink discharge device 100 according to the above.Wherein, in the manufacturing method of panel 10
In, the nozzle 125 with ink discharge device 100 according to being classified as follows.
C. the classification of nozzle 125
In the manufacturing method of panel 10, before carrying out above-mentioned ink coating, bad spray is selected in advance from nozzle 125
Mouth.In addition, so-called bad nozzle, is that aftermentioned inspection result is regarded as using the nozzle 125 other than benchmark.Then, in ink
When coating, in nozzle 125, be only never selected bad nozzle uses nozzle discharge ink.Due to will not from bad nozzle
Therefore discharge ink can be improved the coating precision of ink, reduction causes because the formation of the colour mixture of ink, functional layer is bad
Short circuit or sew, reduce functional layer film thickness it is irregular caused by luminance deviation generation etc..
Moreover, in the manufacturing method of panel 10, in ink coating, in multiple nozzles 125, at least exist one not by
It is chosen to be the nozzle of bad nozzle and the top by the area of application 15a, it is to be different from the oil that do not spue using nozzle
The preparation nozzle of ink.The effect is carried out as described below.
Figure 10 is the diagrammatic top view of the ink coating in the manufacturing method for illustrate panel 10.Herein, as an example
Son, in the area of application 15a, to only being carried out the case where the area of application 15a (LR) for forming sub-pixel column LR carries out ink coating
Explanation.In addition, nozzle 125 shown in figure all passes through the area of application 15a.
Figure 10 (a) is the figure of the state before illustrating bad nozzle generation, and each nozzle 125 is the use indicated with single circle
One in the nozzle 125A or preparation nozzle 125S indicated with double circles.Wherein, when ink applies, preparation nozzle 125S is different
In at least having one using nozzle 125A, specifically, in 20 nozzles 125, there are 17 to use spray in Figure 10 (a)
Mouth 125A, 3 prepared nozzle 125S.
Each nozzle 125 scans in X direction on one side, on one side only from using in nozzle 125A respectively to the area of application 15a (LR)
Each ink that gradually spues.At this moment, the range shown in Figure 10 (a) uses nozzle for each the area of application 15a (LR)
The coating position 16b for the ink that 125A is scanned is 17, and the uncoated position 16c that preparation nozzle 125S is scanned is 3.
Next, considering to generate bad since the state from Figure 10 (a) successively carries out ink coating to multiple substrates 11
The case where nozzle.Figure 10 (b) is the figure for illustrating the state after bad nozzle generation, will be with × mark before ink coating
2 bad nozzle 125B as newly chosen nozzle.
In this case, the range shown in Figure 10 (b), for each the area of application 15a (LR), 2 coating position 16b at
By above-mentioned bad nozzle 125B scan can not coating position 16d.Respectively using the discharge-amount of nozzle 125A not from Figure 10's (a)
When state changes, if coating position 16b is reduced, the ink coating amount of the area of application 15a (LR) will be reduced.
Wherein, according to the manufacturing method of panel 10, in existing 3 prepared nozzle 125S, if 2 are changed to make
With nozzle 125SA, enable to equally be maintained at 17 using the number and Figure 10 (a) of nozzle 125A, 125SA.Even if as a result,
The range shown in Figure 10 (b) also can add 2 to each the area of application 15a (LR) and replace coating position 16e, make to apply position
It sets 16b and replaces coating position 16e's to add up to 17, so that the reduction of ink coating amount is supplemented.In addition,
According to this method, both it is spaced without shortening the most short discharge of nozzle 125, without the discharge increased using nozzle 125A, 125SA
Amount.
That is, according to the manufacturing method of panel 10, since preparation nozzle 125S is ensured, even if multiple
In the case where producing bad nozzle 125B in nozzle 125, it is changed to by the way that nozzle 125S will be prepared using nozzle 125SA,
The reduction of ink coating amount can be made to be supplemented.Therefore, according to the manufacturing method of panel 10, manufacture efficiency can inhibited
While reduction, by simple method supplemented the decline of ink coating amount caused by the generation of bad nozzle 125B.
Moreover, according to the above, as Figure 10 (a), (b), even if in each nozzle 125 to the oil of each the area of application 15a
In the case that the discharge number of ink is at most primary, it can also make the drop of ink coating amount caused by the generation of bad nozzle 125B
It is low to be supplemented.That is, according to the manufacturing method of panel 10, even the interval in adjacent next door 15 is more each than ink discharge device 100
The small such high-resolution panel 10 in the most short discharge interval of the ink of nozzle 125, also can be with high manufacture efficiency and Gao Pin
Matter manufacture.
D. the setting of nozzle 125
Setting including above-mentioned preparation nozzle 125S and from preparation nozzle 125S to using the change of nozzle 125SA to exist
It is interior, the setting method of specific each nozzle 125 is described as follows.Firstly, in the ink-jet method of the manufacturing method for each nozzle 10
In, ink coating successively is carried out to multiple substrates 11.Moreover, being carried out before starting ink coating respectively in the ink-jet method
Nozzle supplement setting is carried out to a certain number of substrates 11 at the end of initial nozzle setting and every time ink coating.
(a) initial nozzle setting
In initial nozzle setting, start to check each nozzle 125.Figure 11 is the diagrammatic top view for illustrating the inspection of nozzle.
In the inspection, firstly, preparing the inspection substrate 51 for being configured with target position 51T on surface.Wherein, it checks with substrate 51
Surface is equivalent to the inspection region of the planar of present embodiment.In addition, the detection of planar is not limited to inspection substrate with region
51 surface, for example, it may be the so-called architrave region of panel 10, is also possible to be positioned in the paper on 111 surface of base station
Surface etc..
Target position 51T, flat shape is × mark of shape, for example, in the X-direction along surface between certain
It is multiple every being configured to.In addition, the column (L1 to L11 of Figure 11 etc.) of such target position 51T are along surface vertical with X-direction
Each certain interval is configured to multiple in Y-direction.In addition, adjacent target position 51T between the column and the column, target position
51T is staggered in X direction and configures.
In addition, there is also many target position 51T's other than column L1 to L11 shown in Figure 11 in inspection on substrate 51
Column.Shape or material etc. are not particularly limited moreover, what as long as target position 51T photographic device 123 etc. can identify,
For example, the shapes such as circle, polygonal, straight line can be formed with the surface of substrate 51 in inspection by etching, coating, ink coating etc.
Shape.
Above-mentioned this inspection substrate 51 is positioned on the base station 111 of ink discharge device 100, in the lower section of each nozzle 125
Configure the surface of the substrate 51 for inspection.At this moment, the substrate 51 for inspection is configured, to make the length of nozzle head 122 respectively
Direction (width direction of base station 111) and the inspection X-direction of substrate 51, the scanning direction (length of base station 111 of nozzle 125
Direction) it is parallel with the Y-direction of substrate 51 with inspection.
Next, keep nozzle head 122 mobile in x-direction and y-direction, the X-direction end configured in covering detection substrate 51
Portion (in the end that Figure 11 is literal upside).Further rotate subheader 124, being adjusted to, which comes each nozzle 125 respectively, passes through
On the position of the column of target position 51T.At this moment, the target position 51T that each nozzle 125 passes through can be checked each there are multiple
Therefore the multiple discharge of nozzle 125 is as a result, can be improved inspection precision.Further, since adjacent nozzle 125 spues in the Y direction
The coating position of ink be staggered in X-direction, therefore, be able to suppress ink connection, reduce and check mistake.
Next, by moving nozzle head 122 in X direction, and make the table of each 125 1 edge inspection substrate 51 of nozzle
Surface scan, on one side from each target position 51T discharge ink of each nozzle 125 pairs of inspections substrate 51.At this moment, it checks from each nozzle
Coating state on the inspection substrate 51 of 125 ink to spue.Specifically, passing through camera shooting according to the ink to spue every time
Device 123 is obtained to the deviation of the coating position 16b of each target position 51T and the data of surface covered as coating state.Separately
Outside, at this moment, as such to the ink of third target position 51T discharge from the column L11 of Figure 11, sometimes in primary discharge
In, ink separation can have 2 or more coating position 16b.Therefore, on a target position 51T whether there is second it
Coating position 16bs afterwards is also used as coating state inspection.Thereby, it is possible to evaluate the nozzle from the coating state of each nozzle 125
125 discharge precision.Also, check coating state be not limited to above-mentioned given example, for example, it is also possible to check coating volume or
Apply shape etc..
After above-mentioned inspection, based on using benchmark as defined in advance, inspection result is regarded as only with other than benchmark
Nozzle 125 be chosen to be bad nozzle 125B.In addition, using benchmark according to the performance and substrate of used ink discharge device 100
Quality required by the shape of 11 the area of application 15a, panel 10 etc. determines.For example, it is also possible to will be set to using benchmark: from
In the multiple discharge of nozzle 125, the coating position 16b of all ink (does not have with a part contact of target position 51T at least
It is staggered completely).In this case, in Figure 11, the nozzle 125 to be spued to column L4, L6, L10 is due to a part of coating
Position 16b (for example, from column L4 third, first from column L6, the 2nd to 4 from column L10) completely from target
Position 51T is staggered, and therefore, these nozzles 125 are selected bad nozzle 125B.Moreover, the nozzle to be spued to column L11
125, also due to being selected bad nozzle 125B in the presence of the coating position 16bs that 51T is staggered from target position completely.
In addition, can also be as described above based on depending on the coating position 16b of ink, in addition to the painting of ink using benchmark
It applies other than the 16b of position, it is also contemplated that the reproducibility (deviation) of ink surface covered (coating amount).Furthermore, it is also possible to be following
Use benchmark, it may be assumed that a target position 51T, for there are the nozzle 125 of the coating position 16bs after second, no matter
How are the positional relationship of target position 51T and coating position 16bs, are chosen to be bad nozzle 125B without exception.In addition, scheming
11, it can also be set to following using benchmark, it may be assumed that when coating position 16bs is only staggered to target position 51 in the Y direction, should not
Nozzle 125 is chosen to be bad nozzle 125B.
Next, not being chosen to be bad nozzle 125B from nozzle 125, and pass through the area of application when ink coating
In the nozzle of the top of 15a, it is set separately more than one using nozzle 125A and preparation nozzle 125S.For example, making above-mentioned
With in the example of benchmark, in Figure 11, the column L1 nozzle 125 to be spued to L3, L5, L7 to L9 is not chosen to be bad
Nozzle 125B.Moreover, when carrying out ink coating, it is assumed that be to the column L2 nozzle 125 to be spued to L3, L5, L1 to L9
Pass through the nozzle of the top of the area of application 15a.In this case, for example, the spray that can will be spued to L2, L5, L7, L9
Mouth 125 is set as using nozzle 125A, is preparation nozzle 125S by the nozzle setting to be spued to L3, L8.
According to above initial nozzle setting, when ink behind applies, in multiple nozzles 125, at least there is one
It is not chosen to be the nozzle of bad nozzle 125B and the top by the area of application 15a, it is different from the use of nozzle 125A
Do not spue the preparation nozzle 125S of ink.
In addition, in initial nozzle setting, preferably every certain multiple setting preparation nozzle 125S in interval.For example,
Figure 10 (a) sets preparation nozzle 125S every interval D 1.It is multiple bad producing by multiple settings preparation nozzle 125S
In the case where nozzle 125B, a possibility that appearance preparation nozzle 125S is insufficient can reduce.Also, by every certain interval
Preparation nozzle 125S is set, the extremely preparation of the position based on bad nozzle 125B generated after initial nozzle setting is able to suppress
The deviation of the shortest distance of nozzle 125S.For example, when newly producing a bad nozzle 125B, can make in Figure 10 (a)
The shortest distance until preparation nozzle 12S is in D1/2 or less.Flowing along the area of application 15a of coated ink has boundary,
By inhibiting the deviation of the above-mentioned shortest distance, it is able to suppress the deviation of the ink applied thickness in the area of application 15a.
In addition, in initial nozzle setting, when the multiple settings preparation nozzle 125S in certain interval, preferably this one
Be divided between fixed first electrodes 12 in multiple first electrodes 12 that the area of application 15a forms a line, adjacent center it
Between distance below.For example, the distance between the center of adjacent first electrode 12 is indicated in Figure 10 (a) with D2, setting preparation
Certain interval D 1 of nozzle 125S is equal with D2.As a result, to first electrode 12, i.e. each shape of sub-pixel SPR, SPG, SPB
At position, at least there is one by the preparation nozzle 125S above it.Therefore, even if being produced not after initial nozzle setting
In the case where good nozzle 125B, due to there is the preparation of the top of the forming position by identical sub-pixel SPR, SPG, SPB
Therefore nozzle 125S can further suppress the deviation of ink applied thickness.
(b) nozzle supplement setting
In nozzle supplement setting, firstly, similarly with initial nozzle setting, checking each nozzle 125.The inspection it is interior
Appearance, method are identical with initial nozzle setting.
Next, inspection result is regarded as to be changed to bad nozzle using nozzle 125A, 125SA outside using benchmark
125B.For example, to the inspection result of Figure 11, it is assumed that before nozzle supplement setting, be to the column L11 nozzle 125 to be spued
Bad nozzle 125B is prepared nozzle 125S to column L3, L6, L9 nozzle 125 to be spued, other seven nozzles 125
Entirely use nozzle 125A.Furthermore, it is assumed that identical with above-mentioned example using benchmark.It in this case, will be to column L4, L10
What is spued is changed to bad nozzle 125B using nozzle 125A.
Next, according to by use nozzle 125A, 125SA be changed to bad nozzle 125B nozzle number, will prepare
Nozzle 125S is changed to using nozzle 125SA.For example, in above-mentioned example, by using nozzle 125A to be changed to bad nozzle 125B
The number of nozzle be 2.Therefore, the preparation nozzle 125S to be spued to column L3, L9 is changed to using nozzle
125SA.As a result, before and after nozzle supplement setting, it can allow and keep certain using the number of nozzle.Therefore, according to the manufacture
Method can make by simple method oil caused by the generation of bad nozzle while inhibiting the reduction of manufacture efficiency
The reduction of black coating amount is supplemented.
In addition, the preparation nozzle 125S outside using benchmark is regarded as inspection result when nozzle is augmented and set, it is also excellent
Choosing changes it to bad nozzle 125B.For example, in the above example, the preparation nozzle 125S to be spued to L6 is become
More bad nozzle 125B.Even not being chosen to be bad nozzle in initial nozzle setting as preparation nozzle 125S
125B, thereafter without the nozzle of discharge, due to time going by, the opening portion of nozzle 125 and the ink of liquid chamber 125c
State can change, and therefore, the discharge precision of ink can reduce sometimes.Therefore, by the way that such prepared nozzle 125S to be changed to
Bad nozzle 125B can be removed after initial nozzle setting from the candidate for using nozzle 125SA, and the discharge precision of ink drops
Low preparation nozzle 125S.
In addition, being changed to the selecting party of the above-mentioned preparation nozzle 125S using nozzle 125SA in nozzle supplement setting
Method, it may be considered that various methods.For example, in nozzle supplement setting, it can be by distance by using nozzle 125A, 125SA to change
It is changed to for the nearest preparation nozzle 125S of the nozzle of bad nozzle 125B using nozzle 125SA.Specifically, such as Figure 10 (b)
It is shown like that, in two band × mark nozzles for being changed to bad nozzle 125B, for the bad nozzle 125B on right side,
In the preparation nozzle 125S for being located at its left and right, the preparation nozzle 125S in closer left side is changed to using nozzle 125SA.
As described above, the flowing along the area of application 15a of coated ink has boundary, according to the above method, Neng Gou
Distance can not coating position 16d it is nearest position setting replace coating position 16e, so as to inhibit in the area of application 15a
The deviation of ink applied thickness.In addition, when the position of the bad nozzle 125B by using nozzle 125A, 125SA to change is in sub- picture
It, preferably will be pre- in the forming position of identical sub-pixel SPR, SPG, SPB when in the forming position of plain SPR, SPG, SPB
Standby nozzle 125S is changed to using nozzle 125SA.Thereby, it is possible to further suppress the deviation of ink applied thickness.In addition, working as
When preparation nozzle 125S being not present in the forming position of identical sub-pixel SPR, SPG, SPB, by nearest preparation nozzle 125S
It is changed to using nozzle 125SA.
In addition, in nozzle supplement setting it is preferentially suitable that preparation nozzle 125S can be assigned according to the inspection result carried out
Sequence, close by the more than two prepared nozzle 125S for the nozzle for using nozzle 125A, 125SA to be changed to bad nozzle 125B
In, the highest prepared nozzle 125S of priority is changed to using nozzle 125SA.In Figure 11, to use benchmark and upper
State example it is identical after, the nozzle used in benchmark is become to the nozzle 125 that is spued to L3, L5, L7 to L9 of column L1, but
Even these nozzles 125, there is also deviations for discharge precision.
Firstly, the deviation in column L1, all coating position 16b and target position 51T is all small.Also, column L9, L3,
L2, have respectively one, two, three coating position 16b and target position 51T generate deviation.Also, in column L5, L7, L8,
Four coating position 16b and target position 51T generate deviation.But in column L5, L8, the direction of the deviation all has identical
Tendency, in column L7, the direction of the deviation is every time different.
It at this moment, for example can be using the column to be spued as benchmark, according to discharge precision using each nozzle 125 in benchmark
Sequence from high to low is evaluated as L1 > L8 > L5 > L9 > L3 > L2 > L7.Wherein, if since L8 adjusts the discharge of ink
Opportunity can be obtained same with L1 as a result, therefore, evaluation is only second to L1.Also, for L5, from the shape of the area of application 15a
In view of its influence to the deviation of Y-direction is small, therefore, its evaluation is higher than L9, L3, the L2 for generating deviation to X-direction.It is logical
This mode is crossed, the priority of preparation nozzle 125S can be assigned on the basis of above-mentioned discharge precision.For example, when L1,
When L5, L9 are prepared nozzle 125S, priority is assigned according to the sequence of L1 > L5 > L9.
Figure 12 is the diagrammatic top view for illustrating the nozzle supplement setting using above-mentioned priority.In Figure 12, it is assumed that spraying
It is with Figure 10 (a) similarly using the configuration of nozzle 125A, preparation nozzle 125S before mouth supplement setting.Then, in Figure 12,
In nozzle supplement setting, it is assumed that one has been changed to bad nozzle 125B using nozzle 125A (from the 6th, the right nozzle).
At this moment, respectively there is one close to preparation nozzle 125S of the bad nozzle 125B or so, if the preparation nozzle 125S on the left side
Priority is high, then the distance of unrelated to bad nozzle 125B, the preparation nozzle 125S on the left side is changed to using nozzle
125SA.As a result, in the ink coating after nozzle supplement setting, it is able to use the higher nozzle 125 of discharge precision, inhibits oil
The generation that the coating of ink is bad, coating is irregular.
In addition, being preferably using the bad spray in benchmark by the inspection result identification carried out in nozzle supplement setting
Mouth 125B is changed to prepared nozzle 125S.In initial nozzle setting and nozzle supplement setting, even being selected bad nozzle
The nozzle of 125B, with time going by, the opening portion of nozzle 125 and the state of liquid chamber 125c can also change, therefore, sometimes oily
The discharge precision of ink can also improve.
For example, above-mentioned using in benchmark example, the nozzle 125 to be spued to column L4, L6, L10, L11 is selected in Figure 11
Fixed bad nozzle 125B.But compared with whole coating position 16b completely offset from the column L10 of target position 51T, column L4,
It is completely offset from L6, L11 or what ink separated only has at one.If the bad main cause that spues at this is not nozzle 125, and
When main cause can pass through at any time and solve, the discharge precision of the nozzle 125 is likely to improve later.As it is above-mentioned will be because
Specific example, it may be considered that for example, causing the deviation of coating position 16b to become due to the foreign matter being attached on inspection substrate 51
Ink after big situation and solid is attached on nozzle 125 and the deviation of coating position 16b is caused to become larger, but the solid
The case where carburetion ink is also spued simultaneously when ink spues etc..L6 column such case of especially Figure 11, from target position 51T
It completely offsets from and first coating position 16b from top to bottom, the surface covered of ink will be big than others, therefore, false
If having the presence of above-mentioned foreign matter and the discharge of solid carburetion ink.Therefore, exist to the column L6 bad nozzle 125B to be spued
Discharge precision may improve later.
Therefore, for such bad nozzle 125B, in the case where being able to confirm that discharge precision has improved by checking,
It is preferred that changing it to prepared nozzle 125S, remedy in the candidate for using nozzle 125SA.The number of nozzle 125S is prepared as a result,
Mesh increases, during being able to extend until preparation nozzle 125S is insufficient.
In addition, in nozzle supplement setting, when the number deficiency of preparation nozzle 125S, i.e., according to inspection result by making
When being changed to nozzle 125A more than number of the number than existing prepared nozzle 125S of the nozzle of bad nozzle 125B, sprayed
The maintenance of mouth 125.The discharge precision of bad nozzle 125B can be improved as a result, it is ensured that the candidate of preparation nozzle 125S.Also,
After maintenance, if the candidate can be changed to prepared nozzle 125S, then can be weighed by carrying out initial nozzle setting again
It is new to carry out ink coating.But above-mentioned maintenance can also regularly carry out before preparation nozzle 125S generates deficiency.
4. variation
More than, as a mode of the invention, the manufacturing method of panel 10 is illustrated, the present invention is in addition to substantially
Other than characteristic constituent element, not by any restriction described above.Hereinafter, the example as other modes of the invention
Son is illustrated the variation in the manufacturing method of organic EL display panel.In the following, being remembered to above description
The identical content carried using identical symbol, and simplifies or omits its description.
(1) initial nozzle setting
In Figure 10 (a), in initial nozzle setting, so that setting the certain interval D 1 and adjoining of preparation nozzle 125S
The distance between the center of first electrode 12 D2 is equal, but not limited to this, it is also possible to D1 > D2, D1 < D2.Figure 13 is explanation
The diagrammatic top view of the initial nozzle setting of the variation of D1 < D2.In Figure 13, between pixel limiting layer 14 (sub-pixel SPR,
The forming position of SPG, SPB) each set so that preparation nozzle 125S exist it is more than two.It is producing as a result,
When bad nozzle 125B, it can select to be changed to the preparation nozzle 125S using nozzle 125SA from nearest position, thus into
One step inhibits the deviation of the ink applied thickness in the area of application 15a.In addition, in the initial nozzle setting of Figure 13, with Figure 10
(a) initial nozzle setting is compared, and the ink coating number of each the area of application tails off, in this regard, if increasing the one of each nozzle 125
Secondary ink discharge-amount, or increase the concentration of the functional material in ink, then it can make the film thickness phase for being formed by functional layer
Deng.
Moreover, preparation nozzle 125S is set every certain interval D more than 1 in Figure 10 (a) in initial nozzle setting,
But not limited to this, interval can also be indefinite.Figure 14 is the diagrammatic top view for illustrating the initial nozzle setting of the variation.Scheming
14, the interval of preparation nozzle 125S becomes indefinite.In addition, being to limit scanning element in initial nozzle setting in Figure 10 (a)
The nozzle 125 of the top of preparative layer 14 is set as using nozzle 125A, but as shown in figure 14, which can also be set as
Preparation nozzle 125S.Especially be on pixel limiting layer 14 be difficult to happen because the formation of functional layer it is bad caused by short circuit or sew
Place, pass through the generation that above-mentioned short circuit as uncoated position 16c, can be reduced or sewed.
(2) shape in next door
Panel 10 uses so-called line dike (line bank) mode as shown in Figure 2, a mode of the invention it is organic
The manufacturing method of EL display panel is effective, is not limited in such construction.
A. the configuration of countermure
Figure 15 is by organic EL display panel 30 (hereinafter referred to as " panel 30 ".) picture display face a part amplification
Diagrammatic top view afterwards.Panel 30 has and the insulating layer of different shapes of panel 10 (pixel limiting layer) 34 and next door layer 35.
34 surface shape of pixel limiting layer is different from pixel limiting layer 14, is rectangle.Pixel limiting layer 34 becomes as a result,
Simple shape, formation become easy.
Next door layer 35 and next door 15 are same, are formed: the first electrode for arranging (column direction) in the Y direction is separated according to each column
Multiple next door 35b of 12 column and the column of the first electrode 12 by arrangement in the Y direction are equally spaced, and are specifically pressed
It is constituted according to multiple countermure 35c that every two first electrode 12 separates.By forming countermure 35c, organic luminous layer 16B is being formed
When ink coating in, even if ink is more than the area of application 35a that next door 35b flows out to adjacent X-direction, since the ink is more than
Countermure 35c cannot flow, and therefore, can reduce the range for generating secondary colour.In panel 30, by above-mentioned next door layer 35,
The area of application 35a is as the region surrounded by next door 35b and countermure 35c, in X direction (line direction) and the multiple arrangements of Y-direction.
In addition, for example, in photolithograph method, by the transmittance section and the light shielding part that suitably set photomask used
Shape is capable of forming pixel limiting layer 34 and next door layer 35.
Manufacturing method in relation to panel 30, and in ink coating, at least there is the ink that do not spue in nozzle 125
Preparation nozzle 125S, it is not chosen bad nozzle 125B and the nozzle by the top of the area of application 35a.In addition, making
With the ink-jet method that multiple substrates 11 are successively carried out with the ink coating, in the ink-jet method, respectively before starting ink coating
Initial nozzle setting is carried out, nozzle supplement setting is carried out when completing ink coating to the substrate of certain amount 11 every time.
According to above-mentioned manufacturing method, as it ensure that prepared nozzle 125S, therefore, even if being generated in multiple nozzles 125
In the case where bad nozzle 125B, by the way that nozzle 125S will be prepared it is changed to that ink coating amount can be made using nozzle 125SA
Reduction supplemented.That is, according to the manufacturing method letter can be passed through while inhibiting the reduction of manufacture efficiency
Single method supplements the reduction of ink coating amount caused by the generation because of bad nozzle 125B.
In addition, in the manufacturing method of panel 30, when ink applies, to the multiple the area of application 35a arranged along the Y direction
Each, preferably at least there is the preparation nozzle 125S by the top of the area of application 35a.In ink coating,
The ink being coated is more than that countermure 35c cannot then flow, but according to above-mentioned, due to each the area of application separated by countermure 35c
There is preparation nozzle 125S in 35a, therefore, whichsoever the top of the area of application 35a generates bad nozzle 125B, can
Realize the supplement of ink coating amount decline.
B. pixel dike (Pixel bank) mode
Figure 16 is by organic EL display panel 40 (hereinafter referred to as " panel 40 ".) picture display face a part amplification
Diagrammatic top view afterwards.Panel 40 has the next door layer 45 of clathrate, using so-called pixel dike (Pixel bank) mode.
Next door 45b and countermure 45c of the next door layer 45 by separating first electrode 12 one by one are formed, and the area of application 45a is as packet
The region of enclosure wall 45b and countermure 45c, in X direction (line direction) and Y-direction (column direction) multiple arrangements.In addition, next door layer 45
It is equivalent on next door layer 35, the column of first electrode 12 of the countermure 35c by arrangement in the Y direction are according between each first electrode etc.
Every ground separates the case where.For example, using photolithograph method, by the transmittance section and the light shielding part that suitably set photomask used
Shape, be capable of forming next door layer 45.
In the manufacturing method of panel 40, when ink applies, at least there is the preparation nozzle 125S of the ink that do not spue,
It is the nozzle for not being chosen to be bad nozzle 125B and the top by the area of application 45a in nozzle 125.In addition, using to more
A substrate 11 successively carries out the ink-jet method of the ink coating, in the ink-jet method, carries out just before starting ink coating respectively
Beginning nozzle setting carries out nozzle supplement setting when completing ink coating to the substrate of certain amount 11 every time.
According to above-mentioned manufacturing method, as it ensure that prepared nozzle 125S, therefore, even if being generated in multiple nozzles 125
In the case where bad nozzle 125B, by the way that nozzle 125S will be prepared it is changed to that ink coating amount can be made using nozzle 125SA
Reduction supplemented.That is, according to the manufacturing method letter can be passed through while inhibiting the reduction of manufacture efficiency
Single method supplements the reduction of ink coating amount caused by the generation because of bad nozzle 125B.
In addition, in the manufacturing method of panel 40, and in ink coating, to the multiple coating regions arranged along Y-direction
Preferably at least there is the preparation nozzle 125S of a top by the area of application 45a in each of domain 45a.
(3) other
In ink discharge device 100 nozzle head 122 only one, but an ink discharge device 100 can also have multiple nozzles
First 122.At this moment, by the ink according to the change coating of each nozzle head 122, in having for hole transmission layer 16A and each color
In the formation process of machine luminescent layer 16B, ink can be changed without and use identical ink discharge device 100.
In addition, in ink discharge device 100, by making head 120 and the top for the substrate 200 for being positioned in base station 111 is mobile
Scan nozzle 125, but the scan method of nozzle is without being limited thereto.Can be mobile to fixed head it is, for example, possible to use base station
Ink discharge device scans nozzle relatively to substrate by the movement of the base station.
In Figure 10 to Figure 14, to simplify explanation, the figure that 3 nozzles 125 are configured to each subheader 124, but each subheader have been used
The not limited to of 124 nozzle 125 is in this, for example, it may be numerous numbers such as several hundred, are also possible to one.In addition, nozzle
125 can directly configure on nozzle head 122 without subheader 124.
In addition, in Figure 10 to Figure 14, by tilting the length direction of each subheader 124 to X-direction (scanning direction), and edge
The multiple configurations of Y-direction (column direction) are arranged in the nozzle 125 (nozzle rows) of the top of substrate 11 or inspection substrate 51 with column-shaped,
But such nozzle rows are also possible to one.In addition, nozzle 125 lines up the direction of column-shaped, as long as parallel with X/Y plane
To X-direction (scanning direction) inclined direction in face.
Moreover, next door is by the shape in a manner of the column for separating the first electrode 12 arranged along the Y direction in panel 10,30,40
At, but next door can also be by separate along the X direction, i.e. the mode shape of the column of the first electrode 12 of the length direction arrangement of substrate 11
At.In this case, it when ink applies, in Fig. 7, is rotated by 90 ° substrate 200 on base station 111, makes the length of nozzle head 122
Direction is parallel with X-direction, keeps the scanning direction of each nozzle 125 parallel with Y-direction.
Moreover, arranging the line direction of first electrode 12 and the length of column direction and 11 surface of substrate on panel 10,30,40
Edge direction (X-direction) and short side direction (Y-direction) in parallel, but not limited to this, the shape of ranks for arranging first electrode 12 also can
It is enough independently of being formed except 11 surface shape of substrate.
In addition, in panel 10, according to ink-jet method, i.e., by being applied based on ink of multiple nozzles 125 to the area of application 15a
And the functional layer formed is hole transmission layer 16A, organic luminous layer 16B, but the functional layer is without being limited thereto.In the manufacture of panel 10
In method, at least one functional layer is formed according to ink-jet method, which can be organic luminous layer, hole/electronics note
Enter any one of layer, hole/electron transfer layer, hole/electronic barrier layer, buffer layer etc..Also, it is formed according to ink-jet method
Functional layer can be one according to each sub-pixel SPR, SPG, SPB, be also possible to three or more.For example, it is also possible to should
Functional layer is only used as a side of hole transmission layer and organic luminous layer, and another party is formed using dry method.At this moment, dry type is utilized
The shape for the functional layer that method is formed is arbitrary shape, for example, each sub-pixel or each the area of application can be individually formed, it can also
It is formed in such a way that multiple sub-pixels or multiple the area of application are shared.Also, for example, it can be only using the functional layer as having
Machine luminescent layer 16B, does not form the composition of hole transmission layer 16A.In addition, for example, it is also possible to being using damp process in the area of application
The composition of hole injection layer 13 and electron transfer layer 17 is formed on 15a.
In addition, it includes that sending is red, green that the manufacturing method of panel 10, which uses pair of sub-pixel columns LR, LG, LB, which to be respectively formed,
Color, blue light three colors of organic luminous layer 16B of luminous organic material divide painting mode, but the corresponding method of full color is not limited to
This.For example, wavelength convert mode can be used, it may be assumed that pair of sub-pixel columns LR, LG and LB form organic hair comprising issuing blue light
The organic luminous layer of luminescent material, above it configure fluorescence coating equiwavelength conversion layer, sub-pixel column LR by blue illuminating rotary
Layer red is changed, in sub-pixel column LG by the luminescent conversion of blue at green.In addition, for example, can be in above-mentioned configuration colorized optical filtering
Lamella substitutes wavelength conversion layer.
In addition, the surface of substrate 11 and inspection substrate 51 is formed as oblong-shaped, but not limited to this, for example, it may be
The polygonals such as triangle, square, pentagon, circle, the combined shaped of ellipse or these shapes.
In addition, it is arranged with sub-pixel SPR, SPG, the SPB for issuing red, green, blue light respectively in panel 10,30,40,
But the combination of sub-pixel is without being limited thereto, and for example, it can be single kind red or red, green, blue and four kinds of yellow.
In addition, sub-pixel is not limited to one, each color about a pixel P, for example, it can be the sub-pixel SPB two of blue
Kind etc., the sub-pixel of each color is by various configurations.In addition, the arrangement of the sub-pixel of pixel P is not limited to red, green, blue
Sequentially, the sequence that can also be replaced in turn with these colors.
Moreover, regarding first electrode 12 as anode in panel 10, it regard second electrode 18 as cathode, but not limited to this,
It can be using first electrode as cathode, using second electrode as the reverse configuration of anode.
Moreover, foring organic EL element in the area of application, but can also be formed in a part in panel 10,30,40
For reducing the busbar (auxiliary electrode) of the influence of the decline of voltage caused by resistance components possessed by second electrode 18.
Moreover, in panel 10, using top surface emission type and the organic EL display panel of active matrix mode, but it is unlimited
In this, such as bottom-emissive type or passive matrix mode can also be used.
Moreover, in panel 30, to be equally spaced the first electrode of arrangement in the Y direction according to every two first electrode 12
The mode of 12 column configures countermure 35c, but the interval of the Y-direction of countermure 35c is without being limited thereto, is also possible to every three or more first
Electrode is at equal intervals.
In addition, composition, the manufacturing method of panel can also suitably change in above-mentioned change.
Industrial utilizability
The manufacturing method of organic EL display panel of the invention can be as television set, personal computer, portable end
The manufacturing methods of the display panel of various electronic equipments such as end, business display and utilize extensively.
Symbol description
10,30,40, organic EL display panel 11, substrate
12, first electrode (electrode) 15,35b, 45b, 95, next door
15a, 35a, 45a, 95a, the area of application 35c, 45c, countermure
16A, hole transmission layer (functional layer) 16B, organic luminous layer (functional layer)
16a, ink 18, second electrode
122, nozzle head 124, subheader
125, nozzle 125A, 125SA, use nozzle
125B, bad nozzle 125S, preparation nozzle.
Claims (9)
1. a kind of manufacturing method of organic EL display panel,
Make the multiple nozzles being arranged in above the substrate for being formed with the area of application in column-shaped along the upper surface of the substrate by side
Relatively scan, while from the multiple nozzle spue include functional material ink, using successively to multiple substrates into
Row applies the ink-jet method of the ink coating of the ink to described the area of application, and being formed in described the area of application includes the function
The functional layer of property material,
In the ink-jet method, initial nozzle setting is carried out before starting the ink coating respectively, is completed each to one
Nozzle supplement setting is carried out when the ink coating of substrate described in fixed number purpose,
In the initial nozzle setting,
It checks the multiple nozzle, the nozzle regarded as outside using benchmark by the inspection result is chosen to be bad nozzle,
The bad nozzle is not chosen to be from the multiple nozzle and in ink coating by the coating region
In the nozzle of the top in domain, be set separately more than one ink that spues when the ink applies using nozzle and
Do not spue the preparation nozzle of the ink in ink coating,
In nozzle supplement setting,
Check the multiple nozzle, by by the inspection result regard as outside using benchmark it is described using nozzle be changed to it is described not
Good nozzle,
According to by the number of nozzle for being changed to the bad nozzle using nozzle, the prepared nozzle is changed to described make
With nozzle, so that the number using nozzle be remained centainly before and after nozzle supplement setting.
2. the manufacturing method of organic EL display panel according to claim 1,
In the inspection of the initial nozzle setting and the multiple nozzle of nozzle supplement setting,
The inspection region of planar is configured in the lower section of the multiple nozzle,
While making the multiple nozzle relatively along the inspection sector scanning, while from the multiple nozzle to the inspection area
The domain discharge ink,
Check the coating state in the inspection region of the ink to be spued.
3. the manufacturing method of organic EL display panel according to claim 2,
In the initial nozzle setting, multiple prepared nozzles are set in certain intervals.
4. the manufacturing method of organic EL display panel according to claim 3,
In described the area of application, multiple electrodes form a line,
It is described that certain to be spaced in the distance between adjacent center of the electrode following.
5. the manufacturing method of organic EL display panel according to claim 1,
It, will be from the institute nearest by the nozzle for being changed to the bad nozzle using nozzle in nozzle supplement setting
State prepared nozzle be changed to it is described using nozzle.
6. the manufacturing method of organic EL display panel according to claim 1,
In nozzle supplement setting, it is changed to the prepared nozzle outside using benchmark is regarded as by the inspection result
The bad nozzle.
7. the manufacturing method of organic EL display panel according to claim 6,
In nozzle supplement setting,
According to the inspection result, priority is assigned to the prepared nozzle,
In close more than two prepared nozzles by the nozzle for being changed to the bad nozzle using nozzle,
The highest prepared nozzle of the priority is changed to described using nozzle.
8. the manufacturing method of organic EL display panel according to claim 1,
In nozzle supplement setting, it will regard as being changed to using the bad nozzle in benchmark by the inspection result
The prepared nozzle.
9. the manufacturing method of organic EL display panel according to claim 1,
In nozzle supplement setting, when the number deficiency of the prepared nozzle, the maintenance of the multiple nozzle is carried out,
After the maintenance, the initial nozzle setting is carried out.
Applications Claiming Priority (3)
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| JP2014195284 | 2014-09-25 | ||
| JP2014-195284 | 2014-09-25 | ||
| PCT/JP2015/004865 WO2016047144A1 (en) | 2014-09-25 | 2015-09-25 | Method for manufacturing organic el display panel |
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| CN106717119A CN106717119A (en) | 2017-05-24 |
| CN106717119B true CN106717119B (en) | 2018-12-04 |
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| US (1) | US10418427B2 (en) |
| JP (1) | JP6387580B2 (en) |
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- 2015-09-25 CN CN201580052131.7A patent/CN106717119B/en not_active Expired - Fee Related
- 2015-09-25 WO PCT/JP2015/004865 patent/WO2016047144A1/en active Application Filing
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Also Published As
| Publication number | Publication date |
|---|---|
| US20170301740A1 (en) | 2017-10-19 |
| CN106717119A (en) | 2017-05-24 |
| JP6387580B2 (en) | 2018-09-12 |
| JPWO2016047144A1 (en) | 2017-06-29 |
| US10418427B2 (en) | 2019-09-17 |
| WO2016047144A1 (en) | 2016-03-31 |
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