CN106711163A - Method for mounting large-size CCD (Charge Coupled Device) chip on ceramic envelope in surface-mount manner - Google Patents
Method for mounting large-size CCD (Charge Coupled Device) chip on ceramic envelope in surface-mount manner Download PDFInfo
- Publication number
- CN106711163A CN106711163A CN201710020892.5A CN201710020892A CN106711163A CN 106711163 A CN106711163 A CN 106711163A CN 201710020892 A CN201710020892 A CN 201710020892A CN 106711163 A CN106711163 A CN 106711163A
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- Prior art keywords
- large scale
- ccd chip
- chip
- scale ccd
- master slice
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000919 ceramic Substances 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 title claims abstract description 23
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 14
- 239000003292 glue Substances 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 229920002120 photoresistant polymer Polymers 0.000 claims description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- 238000007711 solidification Methods 0.000 claims description 4
- 230000008023 solidification Effects 0.000 claims description 4
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- 229910052571 earthenware Inorganic materials 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000001259 photo etching Methods 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 230000002269 spontaneous effect Effects 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 abstract 2
- 238000005516 engineering process Methods 0.000 description 3
- 206010068052 Mosaicism Diseases 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 210000004027 cell Anatomy 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 210000003765 sex chromosome Anatomy 0.000 description 2
- 208000035126 Facies Diseases 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/148—Charge coupled imagers
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The invention discloses a method for mounting a large-sized CCD (Charge Coupled Device) chip on a ceramic envelope in a surface-mount manner. According to the method, in operation, a protective film layer which is easy to remove is arranged on the chip so as to protect the chip, after the chip is mounted in a surface-mount manner, the protective film layer can be removed conveniently; and when the chip is connected with the envelope, the chip is flattened by vacuum negative pressure, so that the chip can be effectively prevented from being damaged. The method for mounting the large-sized CCD chip on the ceramic envelope in a surface-mount manner of the present invention is easy to operate and can effectively ensure the patch flatness of the large-size CCD chip and improve product yield.
Description
Technical field
Pasted on ceramic cartridge the present invention relates to a kind of technique being mounted on CCD chip on shell, more particularly to one kind
The method for filling large scale CCD chip.
Background technology
CCD（Charge-coupled image sensor）It is a kind of widely used semiconductor devices, under prior art conditions, in order to improve
The resolution ratio of CCD chip, is typically only possible by increasing pixel cell quantity realizing, with the increase of pixel cell quantity, CCD
The size of chip also increases therewith, current hundred million grades of CCD chips of pixel scale（Such as 10240x10240）, its size be 100 ×
100mm or so；Large scale CCD chip in the fabrication process, is processed by high temperature and the operation such as thinning, there is very big warpage
Degree, the CCD chip of the smaller size of surfacing sex chromosome mosaicism of large scale CCD chip is even more serious, therefore, using large scale
The device of CCD chip, it is higher to the flatness requirement of chip attachment in assembling, and existing chip mounter is difficult to meet and requires,
Causing the main cause of this present situation has two aspects, on the one hand, relative with " large scale ", " miniaturization " is also electronic component
Important development direction, the dimensions of the chip that current main flow chip mounter is applicable is often smaller, such as U.S. BESI
The chip mounter of company's production, its maximum patch size only has 50 × 50mm, on the other hand, in order to adapt to the demand of " miniaturization ",
The main smooth sex chromosome mosaicism for developing in terms of paster speed is improved, paster not being paid special attention to of the performance of main flow chip mounter, because
This, being difficult to find that can carry out paster operation in the prior art to the large scale CCD chip of 100 × 100mm and dimensions above
Equipment.
At present, the paster operation of large scale CCD chip is generally by manually completing；Manual pasting chip is it is difficult to ensure that core
The planarization of piece surface course of exerting pressure, the problems such as easily causing chip surface and abrade, along with the warpage issues that chip exists in itself,
And surface smoothness also is difficult to be guaranteed during ceramic cartridge making, flatness is unsatisfactory for using and wants after causing device to encapsulate
Ask, cause finished product rate relatively low.
The content of the invention
For the problem in background technology, the present invention proposes a kind of attachment large scale CCD chip on ceramic cartridge
Method；The large scale CCD chip is obtained by master slice scribing, and the end surface shape of the large scale CCD chip is square, square
The length of side of shape is 100mm or more, and the thickness of large scale CCD chip is 400 ~ 500 μm；The front of large scale CCD chip is light
Quick face, the back side of large scale CCD chip is joint face, and the joint face of large scale CCD chip is bonded in the installation on ceramic cartridge
Trench bottom；End face corresponding with the photosurface is designated as A faces on the master slice, end face note corresponding with the joint face on master slice
It is B faces, its innovation is：The step of methods described is：
1）Using glue spreader, certain thickness photoresist is smeared in the A faces of master slice, heating makes photoetching adhesive curing, the light after solidification
Photoresist forms diaphragm on the A faces of master slice；
2）Using laminator in one layer of ultra-violet curing film of diaphragm surface mount；
3）Scribing film is set on the B faces of master slice, then the A of master slice faces up, the is carried out to the A faces of master slice using scribing machine
Dicing operation, during first time dicing operation, the distance of grooving bottom to master slice A faces is the 50% of master slice thickness；
4）Second dicing operation is carried out to the A faces of master slice using scribing machine, during second dicing operation, grooving is deep into scribing
Film middle part；
5）By after dicing operation twice, master slice is cut into large scale CCD chip；Then by fixture to large scale CCD cores
Piece carries out mounting operation：
The fixture is made up of operating desk, base and Duo Gen connecting poles, the circumferential profile of the base and the circumference of ceramic cartridge
Outline, the operating desk is arranged on the middle part of base upper surface, and the upper surface of operating desk forms operating surface, operating surface it is big
The small size with large scale CCD chip is matched；Operating desk is internally provided with negative pressure cavity, and negative pressure cavity provided by pipeline with negative pressure
Device is connected；Multiple through holes are provided with the upper surface of operating desk, multiple through holes are uniformly distributed, through hole is by negative pressure cavity and operating surface
Connection；Connecting pole is arranged on base upper surface, and many connecting poles are located at the periphery of operating desk, and connecting pole is provided with upper surface
Screwed hole；
During mounting operation, first large scale CCD chip is placed on operating surface, the photosurface and operating surface of large scale CCD chip
Relatively, negative pressure offer device is then started, after large scale CCD chip is attracted on operating surface, in large scale CCD chip
Adhesive glue is smeared on joint face, then ceramic cartridge is placed in large scale CCD chip, the mounting groove on ceramic cartridge with it is big
Size CCD chip is aligned, and multiple connecting holes are provided with ceramic cartridge, and multiple connecting holes are corresponded with multiple screwed holes, so
Clamping nut is set in connecting hole afterwards, and the lower end of clamping nut is threadedly coupled with screwed hole, by clamping nut by earthenware
Shell is pushed against in large scale CCD chip；The adhesive glue using under normal temperature condition with regard to curable conducting resinl；
6）The structure that ceramic cartridge and large scale CCD chip are constituted is designated as detector assembly, after glue spontaneous curing to be bonded,
Detector assembly is removed from fixture, the photosurface of large scale CCD chip is irradiated with ultraviolet light then, treat ultraviolet solid
After change film loses viscosity, ultra-violet curing film is thrown off, the diaphragm on photosurface surface is then removed with acetone, then gone with ethanol
Except the acetone of residual, then photosurface is cleaned and dried with deionized water.
Principle of the invention is：
Ultra-violet curing film is a kind of common materials, and in the present invention, ultra-violet curing film is used to carry out photosurface during mounting
Protection, it is to avoid photosurface is scratched, and by ultraviolet light ultra-violet curing film can be made to lose viscosity in subsequent process, holds very much
Easily it can just be peeled off from chip, the convenience of operation can be effectively improved；At the beginning of this technology is researched and developed, inventor is only photosensitive
Ultra-violet curing film is provided with face（It is not provided with photoresist）, but found in process of the test, in scribing processes, dicing lane edge
Ultra-violet curing film the situation of sticky matter and UF membrane can occur under mechanical stress effect, cause subsequently to remove ultra-violet curing film
Shi Huiyou is remained, and because the residue scale of construction is smaller, the difficulty of cleaning is very big, and to solve this problem, inventor is again in ultra-violet curing
Photoresist is provided between film and photosurface, the photoresist after solidification can be removed by acetone, so that ultra-violet curing film is residual
Stay thing to lose facies posterior hepatis to be removed in the lump；In addition, in order to solve the problems, such as flatness, before the present invention is also introduced in the mounting operation
The fixture stated, in the prior art, typically improves the flatness of chip by press-fiting weight on chip, press-fits the mode of weight
Operation difficulty is larger, and the uniformity of chip stress is difficult to control, and easily damages chip, and after using fixture of the invention, chip
It is close on operating surface under suction function, chip stress is more uniformly distributed, is forced chip by the flatness of operating surface
Flattening, coordinates foregoing ultra-violet curing film, can accomplish to hinder chip without any damage；In addition to two foregoing outstanding advantages, this hair
It is bright to additionally use secondary dicing methods common in the art, when secondary dicing methods can effectively reduce single dicing operation
Stress, reduce chip chipping possibility；
The method have the benefit that：There is provided a kind of method that large scale CCD chip is mounted on ceramic cartridge, the party
Method is easy to operate, can effectively ensure that the paster flatness of large scale CCD chip, improves the yield rate of product.
Brief description of the drawings
Fig. 1, clamp structure schematic diagram（Base and ceramic cartridge are in released state in figure）；
The corresponding title of each mark is respectively in figure：Operating desk 1, base 2, ceramic cartridge 3, connecting pole 4.
Specific embodiment
A kind of method that large scale CCD chip is mounted on ceramic cartridge；The large scale CCD chip is by master slice scribing
, the end surface shape of the large scale CCD chip is square, and the foursquare length of side is 100mm or more, large scale CCD cores
The thickness of piece is 400 ~ 500 μm；The front of large scale CCD chip is photosurface, and the back side of large scale CCD chip is joint face,
The joint face of large scale CCD chip is bonded in the installation trench bottom on ceramic cartridge；It is corresponding with the photosurface on the master slice
End face be designated as A faces, end face corresponding with the joint face is designated as B faces on master slice, and its innovation is：The step of methods described
For：
1）Using glue spreader, certain thickness photoresist is smeared in the A faces of master slice, heating makes photoetching adhesive curing, the light after solidification
Photoresist forms diaphragm on the A faces of master slice；
2）Using laminator in one layer of ultra-violet curing film of diaphragm surface mount；
3）Scribing film is set on the B faces of master slice, then the A of master slice faces up, the is carried out to the A faces of master slice using scribing machine
Dicing operation, during first time dicing operation, the distance of grooving bottom to master slice A faces is the 50% of master slice thickness；
4）Second dicing operation is carried out to the A faces of master slice using scribing machine, during second dicing operation, grooving is deep into scribing
Film middle part；
5）By after dicing operation twice, master slice is cut into large scale CCD chip；Then by fixture to large scale CCD cores
Piece carries out mounting operation：
The fixture is made up of operating desk, base and Duo Gen connecting poles, the circumferential profile of the base and the circumference of ceramic cartridge
Outline, the operating desk is arranged on the middle part of base upper surface, and the upper surface of operating desk forms operating surface, operating surface it is big
The small size with large scale CCD chip is matched；Operating desk is internally provided with negative pressure cavity, and negative pressure cavity provided by pipeline with negative pressure
Device is connected；Multiple through holes are provided with the upper surface of operating desk, multiple through holes are uniformly distributed, through hole is by negative pressure cavity and operating surface
Connection；Connecting pole is arranged on base upper surface, and many connecting poles are located at the periphery of operating desk, and connecting pole is provided with upper surface
Screwed hole；
During mounting operation, first large scale CCD chip is placed on operating surface, the photosurface and operating surface of large scale CCD chip
Relatively, negative pressure offer device is then started, after large scale CCD chip is attracted on operating surface, in large scale CCD chip
Adhesive glue is smeared on joint face, then ceramic cartridge is placed in large scale CCD chip, the mounting groove on ceramic cartridge with it is big
Size CCD chip is aligned, and multiple connecting holes are provided with ceramic cartridge, and multiple connecting holes are corresponded with multiple screwed holes, so
Clamping nut is set in connecting hole afterwards, and the lower end of clamping nut is threadedly coupled with screwed hole, by clamping nut by earthenware
Shell is pushed against in large scale CCD chip；The adhesive glue using under normal temperature condition with regard to curable conducting resinl；
6）The structure that ceramic cartridge and large scale CCD chip are constituted is designated as detector assembly, after glue spontaneous curing to be bonded,
Detector assembly is removed from fixture, the photosurface of large scale CCD chip is irradiated with ultraviolet light then, treat ultraviolet solid
After change film loses viscosity, ultra-violet curing film is thrown off, the diaphragm on photosurface surface is then removed with acetone, then gone with ethanol
Except the acetone of residual, then photosurface is cleaned and dried with deionized water.
In subsequent process, the mounting groove port closed on ceramic cartridge can be completed by encapsulation by light window.
Claims (1)
1. it is a kind of on ceramic cartridge mount large scale CCD chip method；The large scale CCD chip is by master slice scribing
, the end surface shape of the large scale CCD chip is square, and the foursquare length of side is 100mm or more, large scale CCD cores
The thickness of piece is 400 ~ 500 μm；The front of large scale CCD chip is photosurface, and the back side of large scale CCD chip is joint face,
The joint face of large scale CCD chip is bonded in the attachment trench bottom on ceramic cartridge；It is corresponding with the photosurface on the master slice
End face be designated as A faces, end face corresponding with the joint face is designated as B faces on master slice, it is characterised in that：The step of methods described
For：
1）Using glue spreader, certain thickness photoresist is smeared in the A faces of master slice, heating makes photoetching adhesive curing, the light after solidification
Photoresist forms diaphragm on the A faces of master slice；
2）Using laminator in one layer of ultra-violet curing film of diaphragm surface mount；
3）Scribing film is mounted on the B faces of master slice, then the A of master slice faces up, the is carried out to the A faces of master slice using scribing machine
Dicing operation, during first time dicing operation, the distance of grooving bottom to master slice A faces is the 50% of master slice thickness；
4）Second dicing operation is carried out to the A faces of master slice using scribing machine, during second dicing operation, grooving is deep into scribing
Film middle part；
5）By after dicing operation twice, master slice is cut into large scale CCD chip；Then by fixture to large scale CCD cores
Piece carries out mounting operation：
The fixture is made up of operating desk, base and Duo Gen connecting poles, the circumferential profile of the base and the circumference of ceramic cartridge
Outline, the operating desk is arranged on the middle part of base upper surface, and the upper surface of operating desk forms operating surface, operating surface it is big
The small size with large scale CCD chip is matched；Operating desk is internally provided with negative pressure cavity, and negative pressure cavity provided by pipeline with negative pressure
Device is connected；Multiple through holes are provided with the upper surface of operating desk, multiple through holes are uniformly distributed, through hole is by negative pressure cavity and operating surface
Connection；Connecting pole is arranged on base upper surface, and many connecting poles are located at the periphery of operating desk, and connecting pole is provided with upper surface
Screwed hole；
During mounting operation, first large scale CCD chip is placed on operating surface, the photosurface and operating surface of large scale CCD chip
Relatively, negative pressure offer device is then started, after large scale CCD chip is attracted on operating surface, in large scale CCD chip
Adhesive glue is smeared on joint face, then ceramic cartridge is placed in large scale CCD chip, the mounting groove on ceramic cartridge with it is big
Size CCD chip is aligned, and multiple connecting holes are provided with ceramic cartridge, and multiple connecting holes are corresponded with multiple screwed holes, so
Clamping nut is set in connecting hole afterwards, and the lower end of clamping nut is threadedly coupled with screwed hole, by clamping nut by earthenware
Shell is pushed against in large scale CCD chip；The adhesive glue using under normal temperature condition with regard to curable conducting resinl；
6）The structure that ceramic cartridge and large scale CCD chip are constituted is designated as detector assembly, after glue spontaneous curing to be bonded,
Detector assembly is removed from fixture, the photosurface of large scale CCD chip is irradiated with ultraviolet light then, treat ultraviolet solid
After change film loses viscosity, ultra-violet curing film is thrown off, the diaphragm on photosurface surface is then removed with acetone, then gone with ethanol
Except the acetone of residual, then photosurface is cleaned and dried with deionized water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710020892.5A CN106711163B (en) | 2017-01-12 | 2017-01-12 | The method of large scale CCD chip is mounted on ceramic cartridge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710020892.5A CN106711163B (en) | 2017-01-12 | 2017-01-12 | The method of large scale CCD chip is mounted on ceramic cartridge |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106711163A true CN106711163A (en) | 2017-05-24 |
| CN106711163B CN106711163B (en) | 2019-06-21 |
Family
ID=58908272
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710020892.5A Active CN106711163B (en) | 2017-01-12 | 2017-01-12 | The method of large scale CCD chip is mounted on ceramic cartridge |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109346534A (en) * | 2018-11-23 | 2019-02-15 | 中国电子科技集团公司第四十四研究所 | A kind of ceramic cartridge structure and its encapsulating structure |
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| CN101714543A (en) * | 2009-11-12 | 2010-05-26 | 美新半导体（无锡）有限公司 | Ceramic substrate for three-dimensional packaging of multi-chip system and packaging method thereof |
| CN102130138A (en) * | 2010-01-12 | 2011-07-20 | 中芯国际集成电路制造(上海)有限公司 | Image sensor and forming method thereof |
| CN102280239A (en) * | 2011-05-20 | 2011-12-14 | 珠海市铭语自动化设备有限公司 | Method for positioning and processing chip resistor ceramic substrate |
| CN103646956A (en) * | 2013-12-25 | 2014-03-19 | 中国电子科技集团公司第四十四研究所 | Process for packaging CCD chip with protective film |
-
2017
- 2017-01-12 CN CN201710020892.5A patent/CN106711163B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101714543A (en) * | 2009-11-12 | 2010-05-26 | 美新半导体（无锡）有限公司 | Ceramic substrate for three-dimensional packaging of multi-chip system and packaging method thereof |
| CN102130138A (en) * | 2010-01-12 | 2011-07-20 | 中芯国际集成电路制造(上海)有限公司 | Image sensor and forming method thereof |
| CN102280239A (en) * | 2011-05-20 | 2011-12-14 | 珠海市铭语自动化设备有限公司 | Method for positioning and processing chip resistor ceramic substrate |
| CN103646956A (en) * | 2013-12-25 | 2014-03-19 | 中国电子科技集团公司第四十四研究所 | Process for packaging CCD chip with protective film |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109346534A (en) * | 2018-11-23 | 2019-02-15 | 中国电子科技集团公司第四十四研究所 | A kind of ceramic cartridge structure and its encapsulating structure |
| CN109346534B (en) * | 2018-11-23 | 2024-05-07 | 中国电子科技集团公司第四十四研究所 | Ceramic tube shell structure and packaging structure thereof |
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| Publication number | Publication date |
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| CN106711163B (en) | 2019-06-21 |
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