CN102280239A

CN102280239A - Method for positioning and processing chip resistor ceramic substrate

Info

Publication number: CN102280239A
Application number: CN 201110131806
Authority: CN
Inventors: 王纯
Original assignee: ZHUHAI MY-LASER TECHNOLOGY Co Ltd
Current assignee: ZHUHAI MY-LASER TECHNOLOGY Co Ltd
Priority date: 2011-05-20
Filing date: 2011-05-20
Publication date: 2011-12-14
Anticipated expiration: 2031-05-20
Also published as: CN102280239B

Abstract

The invention discloses a method for positioning and processing a chip resistor ceramic substrate. The method comprises the following steps of: (1) arranging an illumination system and a charge coupled device (CCD) image acquisition device on the two sides of the chip resistor ceramic substrate respectively; (2) irradiating light emitted by the illumination system to one lateral surface of the chip resistor ceramic substrate, so that a part through which light cannot penetrate is formed at the corresponding position of the reverse side of a metal part on the chip resistor ceramic substrate, and a part through which light penetrates is formed at the corresponding position of the reverse side of a nonmetal part on the chip resistor ceramic substrate; and (3) capturing the juncture of the part through which light cannot penetrate and the part through which light penetrates by using the CCD image acquisition device, positioning and processing. In the method, the juncture of the part through which light cannot penetrate and the part through which light penetrates is captured by the CCD image acquisition device to recognize the position of each ceramic chip on the ceramic substrate, so that the ceramic chips on the ceramic substrate can be positioned individually, accurately and reliably, and an accurate subsequent segmentation process is ensured.

Description

A kind of Chip-R ceramic substrate positioning and processing method

Technical field

The present invention relates to the processing technology of Chip-R ceramic substrate, particularly a kind of Chip-R ceramic substrate positioning and processing method.

Background technology

The Chip-R potsherd is a kind of chip microelectronic element commonly used, and it has thin thickness, characteristics that volume is little.The Chip-R potsherd generally is to make earlier that to contain numbers of poles many and by the ceramic substrate of regularly arranged Chip-R potsherd when producing, and then this ceramic substrate is carried out separation cuts along cut-off rule and obtains required Chip-R potsherd.Along with progress of productivity, present ceramic substrate cutting process is generally finished by laser cutting, compare with traditional machine cuts, the process of laser cutting is accurate more, efficient, and the Chip-R potsherd that obtains of processing has better consistency.

For accuracy and the high efficiency requirement of satisfying laser cutting, must realize fast accurately location to potsherd in the course of processing.The location of current part cutting machine potsherd is to realize by the position of control potsherd, the part cutting machine then is to realize by catching the anchor point of being located on the potsherd, said method all exists the location to be forbidden, locate insecure problem, it can not be located separately the potsherd in the ceramic substrate, so there is defective in the course of processing.

Summary of the invention

At the problems referred to above, the invention provides the Chip-R ceramic substrate positioning and processing method that a kind of accurate positioning is reliable, can locate separately the potsherd of ceramic substrate.

The technical scheme that the present invention is adopted for its technical problem of solution is:

A kind of Chip-R ceramic substrate positioning and processing method may further comprise the steps: an illumination system is set (1) and CCD adopts the picture device, and illumination system and CCD adopt two side positions that are arranged at the Chip-R ceramic substrate as device respectively; (2) illumination that illumination system sent is mapped on the side of Chip-R ceramic substrate, the relevant position, the back side of metal part forms the unglazed part that appears on the Chip-R ceramic substrate, and the relevant position, the back side of non-metallic part is formed with light and appears part on the Chip-R ceramic substrate; (3) CCD adopt as device catch unglazed appear the part with have light appear the part the limit, boundary, position processing.

Preferably, the light vertical irradiation that illumination system is sent in the step (2) is to a side of Chip-R ceramic substrate.

Preferably, described illumination system is arranged at the top of Chip-R ceramic substrate, and CCD adopts the below that is arranged at the Chip-R ceramic substrate as device.

The invention has the beneficial effects as follows: when the illumination that illumination system of the present invention sent is mapped on the Chip-R ceramic substrate, has the metal covering owing to be distributed with the place of Chip-R potsherd on the ceramic substrate, these plated parts can be with light blocking, light can not appear from the another side of substrate, and the place that is not distributed with the Chip-R potsherd is for having only ceramic covering place, can pass and appear when illumination is mapped in this ceramic covering place from the another side of ceramic substrate, therefore the unglazed position distribution that appears part and have light to appear potsherd on distribution partly and the substrate is one to one, by CCD adopt as device to unglazed appear the part and have light appear the part the limit, boundary catch, just can tell the position of each potsherd on the ceramic substrate, thereby realize accurately and reliably on-chip potsherd being located separately, guarantee that follow-up division processing process accurately carries out.

Description of drawings

Be further detailed below in conjunction with the drawings and specific embodiments:

Fig. 1 forms schematic diagram for realizing a kind of system of the present invention;

Fig. 2 is for realizing the overall structure schematic diagram of a kind of embodiment of the present invention.

Embodiment

Fig. 1 forms schematic diagram for a kind of system that realizes Chip-R ceramic substrate positioning and processing method of the present invention, and wherein label 10 parts are illumination system, and label 20 is the Chip-R ceramic substrate, and label 30 is adopted the picture device for CCD.Illumination system 10 and CCD adopt two side positions that are arranged at Chip-R ceramic substrate 20 as device 30 respectively.When positioning, illumination system 10 is luminous, the illumination that it sent is mapped on the side of Chip-R ceramic substrate 20, the relevant position, the back side of metal part forms the unglazed part that appears on the Chip-R ceramic substrate 20, and the relevant position, the back side of non-metallic part is formed with light and appears part on the Chip-R ceramic substrate 20.CCD adopt as device 30 catch unglazed appear the part with have light appear the part the limit, boundary, position processing.In order to access better resolving effect, avoid the variation of illumination irradiating angle that positioning result is exerted an influence, the light that illumination system 10 is sent is preferably in vertical mode and shines on the side of Chip-R ceramic substrate 20, this vertical irradiation mode at the back side of ceramic substrate formed unglazed appear part and have light to appear the limit, boundary of part more clear, its with metal partly and the corresponding relation of non-metallic part more reliable.Certainly, in the product of reality, illumination system 10, Chip-R ceramic substrate 20 and CCD adopt as can relative motion between the device 30, guarantee that illumination system 10 can realize that above-mentioned vertical irradiation and CCD adopt the picture function.In the embodiment of Fig. 2, Chip-R ceramic substrate 20 is fixed on the motion platform 40, and Chip-R ceramic substrate 20 can be implemented on the horizontal plane mobile by the control of this motion platform 40.Cooperate above-mentioned shift action system just can realize the position fixing process of monoblock Chip-R ceramic substrate in the mode of cruising.

Illumination system 10 of the present invention, Chip-R ceramic substrate 20 and CCD adopt as device 30 and can adopt various suitable manner to place, for example illumination system 10 can be distributed in the horizontal leftward position of substrate 20, CCD adopts the horizontal right positions that can be placed on substrate 20 as 30 in device, but consider that substrate 20 generally is to fix processing in the mode of level, so illumination system 10, Chip-R ceramic substrate 20 and CCD adopt as device 30 and preferably place in vertically opposite mode, more preferably illumination system 10 is arranged at the top of Chip-R ceramic substrate 20, and CCD adopts the below that is arranged at Chip-R ceramic substrate 20 as device 30.Embodiment adopted among Fig. 2 is above-mentioned preferred construction.

Positioning and processing method of the present invention can be realized the accurate location to the Chip-R ceramic substrate, and particularly it can carry out separately accurately location to the potsherd in the substrate.Cooperate positioning and processing method of the present invention that ceramic substrate is cut etc. and add man-hour, it generally is the position fixing process of finishing whole ceramic substrate earlier, then the data of location gained are stored, whole cutter system is processed (as ceramic substrate is cut) according to locator data control processing component (as laser cutting head) to ceramic substrate again, and this elder generation locatees the mode of afterwards processing and has high working (machining) efficiency and reliability.

Embodiments of the present invention are not restricted to the described embodiments, as long as it reaches technique effect of the present invention with essentially identical means, all should belong to protection scope of the present invention.

Claims

1. Chip-R ceramic substrate positioning and processing method is characterized in that may further comprise the steps:

(1) illumination system and CCD are set and adopt the picture device, illumination system and CCD adopt two side positions that are arranged at the Chip-R ceramic substrate as device respectively;

(2) illumination that illumination system sent is mapped on the side of Chip-R ceramic substrate, the relevant position, the back side of metal part forms the unglazed part that appears on the Chip-R ceramic substrate, and the relevant position, the back side of non-metallic part is formed with light and appears part on the Chip-R ceramic substrate;

(3) CCD adopt as device catch unglazed appear the part with have light appear the part the limit, boundary, position processing.

2. a kind of Chip-R ceramic substrate positioning and processing method according to claim 1 is characterized in that illumination system is sent in the step (2) light vertical irradiation is to a side of Chip-R ceramic substrate.

3. a kind of Chip-R ceramic substrate positioning and processing method according to claim 1 is characterized in that described illumination system is arranged at the top of Chip-R ceramic substrate, and CCD adopts the below that is arranged at the Chip-R ceramic substrate as device.