CN103568059A - Device segmentation and positioning device - Google Patents
Device segmentation and positioning device Download PDFInfo
- Publication number
- CN103568059A CN103568059A CN201210280357.0A CN201210280357A CN103568059A CN 103568059 A CN103568059 A CN 103568059A CN 201210280357 A CN201210280357 A CN 201210280357A CN 103568059 A CN103568059 A CN 103568059A
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- movable bolt
- bolt
- substrate
- light source
- positioning device
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a device segmentation and positioning device, which comprises a carrier table, a transmission light source, a CCD (charge coupled device) image collection system and a bolt positioning device, wherein the transmission light source is arranged below the carrier table, the CCD image collection system is arranged above the carrier table, the CCD image collection system comprises an illumination light source, the bolt positioning device comprises a movable bolt and a slide groove, and the movable bolt comprises a first movable bolt, a second movable bolt and a third movable bolt. The carrier table is provided with the bolt positioning device for fixing and segmenting a substrate, the movable bolt moves inside the slide groove, different to-be-segmented substrates in different sizes are positioned, after the substrate is positioned primarily, the locking of the movable bolt ensures that the positioning parameter is reusable for the to-be-segmented substrates of the same standard, and the efficiency is improved.
Description
Technical field
The present invention relates to a kind of positioner, particularly relate to a kind of device and cut apart positioner.
Background technology
Small-sized microdevice, because of the feature of its size, adopts the regular one-tenth matrix form of numerous individual devices to be distributed on large size substrate or slide glass in its production technology, cut apart after completing certain first order technique again.During element divisions, whether location is accurate, can have influence on performance and the shape of element, and the follow-up use problem of element is increased.At present, some slice component substrates are processed to form dividing grooves in advance, directly adopt the mode fractureing during division process; Some employings are processed to form cut-off rule in advance, during division process, in cut-off rule punishment, cut, and this technique not only needs accurate location, also may occur affecting because of the deviation of first order technique the performance of cutting apart rear product, and, each substrate to be split is needed to position, reduced efficiency.
Therefore, inaccurate for improving the location of slice component before cutting apart, the situation that efficiency is not high, needs a kind of locate mode of cutting apart more efficiently, reliably.
Summary of the invention
The object of the invention is to provide in order to address the above problem a kind of convenient, flexible, accurate, high efficiency positioner of cutting apart.
For achieving the above object, the present invention has adopted following technical scheme:
A kind of device of the present invention is cut apart positioner, comprise microscope carrier, transmitted light source, ccd image acquisition system and bolt positioning device, described transmitted light source is arranged on the below of described microscope carrier, described ccd image acquisition system is arranged on the top of described microscope carrier, described ccd image acquisition system comprises lighting source, described bolt positioning device comprises movable bolt and sliding tray, and described movable bolt comprises the first movable bolt, the second movable bolt and the 3rd movable bolt.
At sliding tray, regulate the position of movable bolt to realize location to the substrate to be split of different size, in conjunction with ccd image acquisition system and transmitted light source, the accurate location of realization to substrate to be split, on application microscope carrier, bolt positioning device makes to be fixed on same position with a series of substrate to be split, the positional parameter that directly use has formed in follow-up cutting apart.
As preferred plan, the described first movable bolt is provided with locking device, and the described second movable bolt is provided with locking device.
Particularly, described sliding tray is arranged on described microscope carrier.
The invention has the beneficial effects as follows:
On microscope carrier of the present invention, be provided with the bolt positioning device of fixedly cutting apart substrate, movable bolt moves in sliding tray, substrate to be split to different size positions, after one-time positioning, to the locking of movable bolt, the file data behind location can be reused to uniform substrate to be split, improved efficiency.
Accompanying drawing explanation
Fig. 1 is stereogram of the present invention;
Fig. 2 is the top view of microscope carrier in the present invention;
Fig. 3 places the top view after substrate to be split on microscope carrier in the present invention;
Fig. 4 is the local structural graph of substrate to be split in the present invention.
In figure: 1-microscope carrier, 2-substrate to be cut, 3-transmitted light source, 4-lighting source, 5-CCD image capturing system, 11-is cut apart substrate placement location, the movable bolt of 12-first, the movable bolt of 13-second, the movable bolt of 14-the 3rd, 15-sliding tray, 21-locating hole, 22-cut-off rule, 23-element gap, 24-metal material cover layer.
The specific embodiment
Below in conjunction with drawings and the specific embodiments, the present invention is described in further detail:
As shown in Figure 1, a kind of device of the present invention is cut apart positioner, comprise microscope carrier 1, substrate 2 to be split is placed on microscope carrier 1, substrate 2 to be split is fixing by first movable bolt the 12, second movable bolt 13 and the 3rd movable bolt 14, transmitted light source 3 is arranged on the below of microscope carrier 1, and ccd image acquisition system 5 is arranged on the top of microscope carrier 1, and lighting source 4 is arranged in ccd image acquisition system 5.As shown in Figure 4, substrate 2 to be split is provided with the longitudinal cut-off rule 22 being processed to form in advance and need to cuts apart but without the element gap, horizontal partition region 23 of cut-off rule.As shown in Figure 2, device of the present invention is cut apart before positioner work, and the first movable bolt 12 is positioned at sliding tray 15 bottom, and the second movable bolt 13 is positioned at the high order end of sliding tray 15, and the 3rd movable bolt 14 lays respectively at the top and the low order end of sliding tray 15.
As shown in Figure 3, according to the actual size of substrate 2 to be split, at the sliding tray 15 movable bolt 12 of interior movement first and the second movable bolt 13 and lock the two position, substrate 2 to be split is positioned over and cuts apart substrate placement location 11 close the first movable bolt 12 and the second movable bolt 13, the 3rd movable bolt 14 is realized the location of substrate 2 to be split is fixed at the interior movement of sliding tray 15 and the first movable bolt 12 and the second movable bolt 13, regulate lighting source 4 to the brightness of needs, the locating hole 21 of cutting apart substrate 2 according to input file data identification, complete after the identification of locating hole 21, the path of realizing cut-off rule 22 according to input file data is cut apart, open transmitted light source 3, ccd image acquisition system 5 gets transmitted light source 3 and forms image by substrate 2 to be split, identify metal cladding 24 and element gap 23, the center in element gap 23 is horizontal partition path.At movable bolt the 12, the second movable bolt 13 of the interior adjusting first of sliding tray 15 and the 3rd movable bolt 14, the stationary positioned of realization to different size substrate to be split, the position of locking the first movable bolt 12 and the second movable bolt 13, the data file behind location can be reused the accurate location of realizing same standard substrate to be split.
Above-described embodiment is only a kind of embodiment of the present invention; be illustrative and not restrictive, also have many variations all to belong to technical scheme of the present invention, therefore; not departing under the present invention design that institute makes, be change and revise, all within protection scope of the present invention.
Claims (4)
1. a device is cut apart positioner, comprise microscope carrier, transmitted light source, ccd image acquisition system and bolt positioning device, described transmitted light source is arranged on the below of described microscope carrier, described ccd image acquisition system is arranged on the top of described microscope carrier, described ccd image acquisition system comprises lighting source, it is characterized in that: described bolt positioning device comprises movable bolt and sliding tray, described movable bolt comprises the first movable bolt, the second movable bolt and the 3rd movable bolt.
2. device according to claim 1 is cut apart positioner, it is characterized in that: the described first movable bolt is provided with locking device.
3. device according to claim 1 is cut apart positioner, it is characterized in that: the described second movable bolt is provided with locking device.
4. device according to claim 1 is cut apart positioner, it is characterized in that: described sliding tray is arranged on described microscope carrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210280357.0A CN103568059A (en) | 2012-08-08 | 2012-08-08 | Device segmentation and positioning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210280357.0A CN103568059A (en) | 2012-08-08 | 2012-08-08 | Device segmentation and positioning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103568059A true CN103568059A (en) | 2014-02-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210280357.0A Pending CN103568059A (en) | 2012-08-08 | 2012-08-08 | Device segmentation and positioning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103568059A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107741687A (en) * | 2017-11-24 | 2018-02-27 | 西安立芯光电科技有限公司 | A kind of high-precision alignment methods for wafer photolithography |
| CN108608491A (en) * | 2018-07-06 | 2018-10-02 | 浙江华人数码科技有限公司 | A kind of Full-automatic die cutter punching type waste discharge apparatus and its waste discharge method |
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| US5901270A (en) * | 1996-09-12 | 1999-05-04 | The Plastic Forming Company, Inc. | Apparatus for hot fluid trimming of plastic molded articles |
| CN101364560A (en) * | 2007-08-08 | 2009-02-11 | 京元电子股份有限公司 | Adjustable chip clamp tool |
| CN101923356A (en) * | 2010-03-16 | 2010-12-22 | 江苏和利普激光科技有限公司 | Fast and accurate locating method of laser resistance trimming substrate |
| CN102259346A (en) * | 2011-02-16 | 2011-11-30 | 苏州天风环保科技有限公司 | Adjustable multifunctional edge trimmer |
| CN102280239A (en) * | 2011-05-20 | 2011-12-14 | 珠海市铭语自动化设备有限公司 | Method for positioning and processing chip resistor ceramic substrate |
| CN202805288U (en) * | 2012-08-08 | 2013-03-20 | 成都科兴密封技术有限公司 | Cutting-locating device for component |
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2012
- 2012-08-08 CN CN201210280357.0A patent/CN103568059A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5901270A (en) * | 1996-09-12 | 1999-05-04 | The Plastic Forming Company, Inc. | Apparatus for hot fluid trimming of plastic molded articles |
| CN101364560A (en) * | 2007-08-08 | 2009-02-11 | 京元电子股份有限公司 | Adjustable chip clamp tool |
| CN101923356A (en) * | 2010-03-16 | 2010-12-22 | 江苏和利普激光科技有限公司 | Fast and accurate locating method of laser resistance trimming substrate |
| CN102259346A (en) * | 2011-02-16 | 2011-11-30 | 苏州天风环保科技有限公司 | Adjustable multifunctional edge trimmer |
| CN102280239A (en) * | 2011-05-20 | 2011-12-14 | 珠海市铭语自动化设备有限公司 | Method for positioning and processing chip resistor ceramic substrate |
| CN202805288U (en) * | 2012-08-08 | 2013-03-20 | 成都科兴密封技术有限公司 | Cutting-locating device for component |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107741687A (en) * | 2017-11-24 | 2018-02-27 | 西安立芯光电科技有限公司 | A kind of high-precision alignment methods for wafer photolithography |
| CN107741687B (en) * | 2017-11-24 | 2020-04-03 | 西安立芯光电科技有限公司 | High-precision alignment method for wafer photoetching |
| CN108608491A (en) * | 2018-07-06 | 2018-10-02 | 浙江华人数码科技有限公司 | A kind of Full-automatic die cutter punching type waste discharge apparatus and its waste discharge method |
| CN108608491B (en) * | 2018-07-06 | 2024-07-09 | 浙江华人数码科技有限公司 | Stamping type waste discharge device of full-automatic die cutting machine and waste discharge method thereof |
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Application publication date: 20140212 |