CN101973082B - Single crystal butting machine featuring precise positioning - Google Patents
Single crystal butting machine featuring precise positioning Download PDFInfo
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- CN101973082B CN101973082B CN201010259175.6A CN201010259175A CN101973082B CN 101973082 B CN101973082 B CN 101973082B CN 201010259175 A CN201010259175 A CN 201010259175A CN 101973082 B CN101973082 B CN 101973082B
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- steel wire
- single crystal
- dowel hole
- monocrystalline
- spacing
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Abstract
The invention provides a single crystal butting machine featuring precise positioning, comprising a numerical control machine, a single crystal positioning die plate which can move on the numerical control machine, and four groups of main shafts arranged around the single crystal positioning die plate; steel wires for cutting the single crystal in one direction are respectively arranged on the main shafts; the main shafts are provided with a plurality of steel wire grooves; the steel wires can movably arranged in the steel wire grooves of the corresponding main shafts; the spacing between two adjacent steel wire grooves is fixed; the panel of the numeric control machine is provided with a positioning pin; a group of location pinholes are respectively arranged at the two sides of the single crystal positioning die plate; the centers of the location pinholes of each group of location pinholes are positioned on the same straight line; the straight line and a straight line on which the steel wires are positioned form an included angles of 45 degrees, the quantity of the included angles is the same as the quantity of the steel wire grooves; and the spacing between the centers of two adjacent location pinholes is square root of 2 times as much as the spacing between steel wire grooves. The single crystal butting machine of the invention can accurately complete positioning, and save cost and time, thus achieving the purpose of improving the operating efficiency.
Description
Technical field
The present invention relates to a kind of cutting equipment of silicon single crystal material, be specifically related to a kind of single crystal butting machine of registration.
Background technology
Steel wire butting machine is also called excavation machine, is that profit one mortar (lapping liquid that SiC mixes together with oil) sprays the equipment cut on the steel wire of high-speed cruising thus to silicon single crystal rod or polycrystal silicon ingot.
Wherein, high-speed cruising in the steel wire trough that steel wire is opened on main shaft, cuts the monocrystalline silicon be arranged on monocrystalline locating template.Because spray on steel wire has lapping liquid, therefore, in rotating process starts, or can not accomplish in electrical control the speed of steel wire and main shaft speed completely the same, therefore cut several times, steel wire trough can produce wearing and tearing cutting, at this moment just must change next steel wire trough and cut, otherwise easily cause steel wire to break or cutting accident, assuming that the spacing of steel wire trough is P.When steel wire trough changed by needs, monocrystalline silicon locating template also needs to move a slot pitch P accordingly.But cutting carries out in X, Y both direction simultaneously, therefore locating template needs simultaneously at an X and Y-direction mobile slot pitch P simultaneously.
Current use mainly contains two kinds of methods comparatively widely: the first, be add a pad on main shaft, if adding a thickness in positive direction when namely court+X-direction changes groove is the pad of P, make steel wire trough still in original position, the like.This kind of method, can not move monocrystalline locating template, but the defect of this kind of method is, and the first, easily cause main shaft axial float owing to adding pad to the structure on main shaft, the lower cutting products even sometimes of cut quality is scrapped; The second, adding pad needs to dismantle main shaft, and replacing construction is long, and efficiency is low.
Second method: main shaft changes steel wire trough and do not add pad, mobile monocrystalline locating template, relies on screw to regulate, first adjusts a slot pitch P in X-direction, then adjust a slot pitch P in the Y direction.Its shortcoming be regulate loaded down with trivial details, and to regulate the technical merit of personnel and skill requirement very high, also easily make mistakes.
In sum, the main existence location inaccuracy of prior art, or the technical problem that the mode regulated is loaded down with trivial details.
Summary of the invention
For above-mentioned defect, the object of this invention is to provide a kind of single crystal butting machine of registration, when needing to adjust position after changing steel wire trough with the butting machine monocrystalline locating template solving prior art, location inaccuracy, or change loaded down with trivial details technical problem.
For achieving the above object, present invention employs following technical scheme:
A kind of single crystal butting machine of registration, comprise Digit Control Machine Tool, can the monocrystalline locating template of movement on Digit Control Machine Tool, be arranged on four groups of main shafts of described monocrystalline locating template surrounding, this main shaft is respectively arranged one for cutting the steel wire of monocrystalline in one direction, this main shaft is provided with multiple steel wire trough, described steel wire is arranged in the steel wire trough of corresponding main shaft movably, and between two adjacent steel wire troughs, spacing is fixed;
The panel of described Digit Control Machine Tool is respectively provided with an alignment pin at marginal position, on described monocrystalline locating template, both sides are respectively arranged with one group of dowel hole, often organizing each dowel hole in dowel hole is centrally located on same straight line, this straight line and described steel wire place straight line are in angle of 45 degrees, dowel hole number is identical with the steel wire trough number of each main shaft, and spacing is steel wire trough spacing between two adjacent dowel hole centers
doubly.
According to the single crystal butting machine described in present pre-ferred embodiments, described monocrystalline locating template is fixed by the alignment pin on described dowel hole and Digit Control Machine Tool.
According to the single crystal butting machine described in present pre-ferred embodiments, described dowel hole is measure-alike, and closes with described alignment pin matching size.
According to the single crystal butting machine described in present pre-ferred embodiments, being 45 degree with steel wire, side moves up described monocrystalline locating template.
According to the single crystal butting machine described in present pre-ferred embodiments, described dowel hole side marks corresponding numbering with described steel wire trough is other, and this is numbered numeral or English alphabet.
Owing to have employed above technical scheme, the present invention is made to have following advantage and good effect compared to prior art:
First, single crystal butting machine provided by the invention, monocrystalline locating template arranges two groups of dowel holes, with the detent fit on Digit Control Machine Tool, accurately can complete location, avoid causing when steel wire trough is changed location inaccuracy and problem that the cutting monocrystalline silicon that causes is scrapped;
Secondly, single crystal butting machine provided by the invention, when monocrystalline locating template position changed by needs, the corresponding dowel hole on mobile monocrystalline locating template and alignment pin is only needed to fix, without the need to the adjustment, measurement and positioning etc. of complexity, babe in the wood can be realized equally fast, cost-saving, also save time, thus reach the object of increasing work efficiency.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the single crystal butting machine of a kind of registration of the present invention;
Fig. 2 is the partial enlarged drawing at I position in Fig. 1;
Fig. 3 is the partial enlarged drawing at II position in Fig. 1.
Detailed description of the invention
Below in conjunction with accompanying drawing, several preferred embodiment of the present invention is described in detail, but the present invention is not restricted to these embodiments.The present invention contain any make on marrow of the present invention and scope substitute, amendment, equivalent method and scheme.To have the present invention to make the public and understand thoroughly, in the following preferred embodiment of the present invention, describe concrete details in detail, and do not have the description of these details also can understand the present invention completely for a person skilled in the art.
Please refer to Fig. 1, a kind of single crystal butting machine of registration, comprise Digit Control Machine Tool 1, can the monocrystalline locating template 2 of movement on Digit Control Machine Tool, being arranged on four groups of main shafts 3 of described monocrystalline locating template 2 surrounding, those main shafts respectively being arranged one for cutting the steel wire 5 of monocrystalline 4 in one direction.
Wherein, every root steel wire 5 connects in two groups of relative main shafts a pair all simultaneously, cuts respectively at X and Y-direction to monocrystalline silicon.
Please refer to Fig. 2, it is the partial enlarged drawing at I position in Fig. 1, as seen from Figure 2, main shaft 3 is provided with multiple steel wire trough 31, in the steel wire trough that steel wire 5 is arranged on corresponding main shaft movably 31, namely steel wire 5 can be changed spacing between the adjacent steel wire trough 31 of the steel wire trough 31, two at its place and fixes, and being assumed to spacing is P.
Please referring back to Fig. 1, and simultaneously with reference to figure 3, Fig. 3 is the enlarged drawing at II position in Fig. 1, the panel of described Digit Control Machine Tool 1 is respectively provided with an alignment pin (not illustrating in figure) at marginal position, on monocrystalline locating template 2, both sides are respectively arranged with one group of dowel hole 21, often organizing each dowel hole in dowel hole 21 is centrally located on same straight line, the straight line at dowel hole place and steel wire 5 place straight line are in angle of 45 degrees (owing to being vertical between two groups of steel wires, so no matter be the angle of 45 degree with X or Y-direction), dowel hole 21 number is identical with the steel wire trough number of each main shaft, between two adjacent dowel holes, spacing is steel wire trough 31 spacing
doubly, namely the center distance of dowel hole is
p.
Further, each dowel hole measure-alike, close with the matching size of alignment pin, monocrystalline locating template is fixed by the alignment pin on described dowel hole and Digit Control Machine Tool, thus realizes alignment pin and loosen in dowel hole inside, can realize the effect of locating.
And, due to steel wire on main shaft, change steel wire trough time, sequential, therefore for avoiding confusion, numbering is set at steel wire trough 31 edge, is simultaneously also arranged at numbering corresponding to each steel wire trough on dowel hole side, such as 1,2,3,4 or A, B, C, D etc., when steel wire trough is changed, only need the dowel hole of correspondence and alignment pin to fix.
Being 45 degree with steel wire, side moves up, because the center distance of dowel hole is described monocrystalline locating template 2
p, it is just in time P in the projection of X-direction and Y-direction, and corresponding steel wire at the moving interval P of X and Y-direction, thus realizes and the coordinating of alignment pin, and can not affect the precision of cutting, change also more convenient.
In sum, owing to have employed above technical scheme, the present invention is made to have following advantage and good effect compared to prior art:
First, single crystal butting machine provided by the invention, monocrystalline locating template arranges two groups of dowel holes, with the detent fit on Digit Control Machine Tool, accurately can complete location, avoid causing when steel wire trough is changed location inaccuracy and problem that the cutting monocrystalline silicon that causes is scrapped;
Secondly, single crystal butting machine provided by the invention, when monocrystalline locating template position changed by needs, the corresponding dowel hole on mobile monocrystalline locating template and alignment pin is only needed to fix, without the need to the adjustment, measurement and positioning etc. of complexity, babe in the wood can be realized equally fast, cost-saving, also save time, thus reach the object of increasing work efficiency.
The preferred embodiment of the present invention just sets forth the present invention for helping.Preferred embodiment does not have all details of detailed descriptionthe, does not limit the detailed description of the invention that this invention is only described yet.Obviously, according to the content of this description, can make many modifications and variations.This description is chosen and is specifically described these embodiments, is to explain principle of the present invention and practical application better, thus makes art technical staff can utilize the present invention well.The present invention is only subject to the restriction of claims and four corner and equivalent.
Claims (5)
1. the single crystal butting machine of a registration, comprise Digit Control Machine Tool, can the monocrystalline locating template of movement on Digit Control Machine Tool, be arranged on four groups of main shafts of described monocrystalline locating template surrounding, this main shaft is respectively arranged one for cutting the steel wire of monocrystalline in one direction, this main shaft is provided with multiple steel wire trough, described steel wire is arranged in the steel wire trough of corresponding main shaft movably, and between two adjacent steel wire troughs, spacing is fixed;
It is characterized in that, the panel of described Digit Control Machine Tool is respectively provided with an alignment pin at marginal position, on described monocrystalline locating template, both sides are respectively arranged with one group of dowel hole, often organizing each dowel hole in dowel hole is centrally located on same straight line, this straight line and described steel wire place straight line are in angle of 45 degrees, dowel hole number is identical with the steel wire trough number of each main shaft, and spacing is steel wire trough spacing between two adjacent dowel hole centers
doubly.
2. single crystal butting machine as claimed in claim 1, it is characterized in that, described monocrystalline locating template is fixed by the alignment pin on described dowel hole and Digit Control Machine Tool.
3. single crystal butting machine as claimed in claim 1, it is characterized in that, described dowel hole is measure-alike, and closes with described alignment pin matching size.
4. the single crystal butting machine as described in claim 1-3 any one, is characterized in that, being 45 degree with steel wire, side moves up described monocrystalline locating template.
5. single crystal butting machine as claimed in claim 1, is characterized in that, described dowel hole side marks corresponding numbering with described steel wire trough is other, and this is numbered numeral or English alphabet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010259175.6A CN101973082B (en) | 2010-08-20 | 2010-08-20 | Single crystal butting machine featuring precise positioning |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010259175.6A CN101973082B (en) | 2010-08-20 | 2010-08-20 | Single crystal butting machine featuring precise positioning |
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| Publication Number | Publication Date |
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| CN101973082A CN101973082A (en) | 2011-02-16 |
| CN101973082B true CN101973082B (en) | 2015-01-28 |
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| CN201010259175.6A Active CN101973082B (en) | 2010-08-20 | 2010-08-20 | Single crystal butting machine featuring precise positioning |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102363329A (en) * | 2011-06-30 | 2012-02-29 | 常州天合光能有限公司 | Evolution cutting deviation preventing tool for polycrystalline silicon ingot and using method thereof |
| CN103707424A (en) * | 2013-11-27 | 2014-04-09 | 江苏美科硅能源有限公司 | Cutting coordinate insertion sheet tool |
| CN109176198A (en) * | 2018-10-17 | 2019-01-11 | 江苏英锐半导体有限公司 | A kind of monocrystalline silicon rod milling side processing unit for wafer flow production |
Citations (4)
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|---|---|---|---|---|
| EP0990498A1 (en) * | 1998-09-10 | 2000-04-05 | Wacker Siltronic Gesellschaft für Halbleitermaterialien Aktiengesellschaft | Method and device for cutting wafers from a hard brittle ingot |
| CH692489A5 (en) * | 1998-01-26 | 2002-07-15 | Hct Shaping Systems Sa | Wire sawing device for cutting prisms comprises two parallel wire layers forming mesh network which is displaced against part to be sawn fixed on support table |
| CN1697721A (en) * | 2003-01-24 | 2005-11-16 | 株式会社新王磁材 | Wire saw device and method of manufacturing sintered magnet using the same |
| CN101618519A (en) * | 2008-07-01 | 2010-01-06 | 内蒙古晟纳吉光伏材料有限公司 | Method and device thereof for linearly cutting silicon slice |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002264003A (en) * | 2001-03-13 | 2002-09-18 | Nippei Toyama Corp | Machining roller for wire saw and wire saw |
| JP3704585B2 (en) * | 2001-04-13 | 2005-10-12 | 株式会社ファインテクニカ | Multi-wire wire saw device |
| JP2003071698A (en) * | 2001-08-29 | 2003-03-12 | Toyo Commun Equip Co Ltd | Wire-saw device |
| JP5286864B2 (en) * | 2007-11-28 | 2013-09-11 | 株式会社デンソー | Substrate manufacturing method |
| JP5022967B2 (en) * | 2008-03-28 | 2012-09-12 | 株式会社日本スライスセンター | Cutting mechanism of wire saw machine |
-
2010
- 2010-08-20 CN CN201010259175.6A patent/CN101973082B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH692489A5 (en) * | 1998-01-26 | 2002-07-15 | Hct Shaping Systems Sa | Wire sawing device for cutting prisms comprises two parallel wire layers forming mesh network which is displaced against part to be sawn fixed on support table |
| EP0990498A1 (en) * | 1998-09-10 | 2000-04-05 | Wacker Siltronic Gesellschaft für Halbleitermaterialien Aktiengesellschaft | Method and device for cutting wafers from a hard brittle ingot |
| CN1697721A (en) * | 2003-01-24 | 2005-11-16 | 株式会社新王磁材 | Wire saw device and method of manufacturing sintered magnet using the same |
| CN101618519A (en) * | 2008-07-01 | 2010-01-06 | 内蒙古晟纳吉光伏材料有限公司 | Method and device thereof for linearly cutting silicon slice |
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| CN101973082A (en) | 2011-02-16 |
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