CN1066999A - Silver-free copper-based brazing filler metal - Google Patents
Silver-free copper-based brazing filler metal Download PDFInfo
- Publication number
- CN1066999A CN1066999A CN 91107056 CN91107056A CN1066999A CN 1066999 A CN1066999 A CN 1066999A CN 91107056 CN91107056 CN 91107056 CN 91107056 A CN91107056 A CN 91107056A CN 1066999 A CN1066999 A CN 1066999A
- Authority
- CN
- China
- Prior art keywords
- brazing
- stainless steel
- silver
- free copper
- filler metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005219 brazing Methods 0.000 title abstract description 12
- 229910052802 copper Inorganic materials 0.000 title abstract description 12
- 239000010949 copper Substances 0.000 title description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title description 10
- 239000000945 filler Substances 0.000 title description 3
- 239000002184 metal Substances 0.000 title 1
- 229910052751 metal Inorganic materials 0.000 title 1
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims abstract description 3
- 238000005476 soldering Methods 0.000 claims description 10
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 239000011572 manganese Substances 0.000 claims description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910052796 boron Inorganic materials 0.000 claims description 2
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 2
- 150000002910 rare earth metals Chemical class 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 abstract description 10
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 10
- 238000003466 welding Methods 0.000 abstract description 5
- 230000008018 melting Effects 0.000 abstract description 4
- 238000002844 melting Methods 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 3
- 229910001209 Low-carbon steel Inorganic materials 0.000 abstract description 2
- 229910021652 non-ferrous alloy Inorganic materials 0.000 abstract description 2
- 150000003839 salts Chemical class 0.000 abstract description 2
- 238000009736 wetting Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 11
- 229910000831 Steel Inorganic materials 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- 238000003723 Smelting Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 241001062472 Stokellia anisodon Species 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000000505 pernicious effect Effects 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
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Abstract
The present invention belongs to the field of non-ferrous alloy technology, and aims at developing one kind of low melting point silver-free copper-base brazing material with excellent wetting capacity to stainless steel and capacity of brazing stainless steel. The components (weight percent) are as follows: zn 30-40%, Mn 4-11%, Sn 1-4%, one or two of Re 0-1%, B0-0.50%, and Cu for the rest. The melting point of the invention is 777 ℃ of solidus line, 790 ℃ of liquidus line, 550MPa of tensile strength and delta of elongation5020 percent, the shear strength of a low-carbon steel brazing joint is more than 400MPa, and the shear strength of a stainless steel brazing joint is more than 200 MPa. It is suitable for salt bath and furnace brazing flame gas welding and high-frequency brazing.
Description
The invention belongs to non-ferrous alloy technology, is a kind of coper-base solder alloy prescription that does not contain precious metal.
Traditional copper base solder, routine H62, S221 etc., all unsuitable soldering stainless steel part.So far, the solder of argentiferous is all used in the soldering of stainless part.For this reason, all be the brazing filler metal alloy of base both at home and abroad with copper in development, the characteristics that are intended to reduce fusing point and keep silver solder again.
State Patent Office's result for retrieval on February 14 nineteen ninety (entrusting numbering 90009) shows; Up to now, the relevant patented technology that has has in the world all reduced the fusing point of copper base solder to some extent, but is to be used for soldering steel, copper and copper alloy mostly, does not solve stainless soldering problem as yet well.As: Russian Patent (27.12.77(21) 2568518/25-27), its brazing filler metal alloy composition and content are: Z
n(13-25) M
n(13-17), S
n(3-12), C
e(0.1-0.3), about 800 ℃ of fusing point is used for brazed copper and copper alloy, and day disclosure is speciallyyed permit the M that the clear 56-165590 of communique (A) provides
n(12-45), Z
n(1-25), N
i(2-14) be and M
n(15-30) Z
n(15-25), N
i(4-6), F
e(2-5) C of pore-free defective
u-M
nThe fusing point that is solder alloy is 800 ℃-870 ℃, is used for welding steel and carbide alloy, also unsuitable soldering stainless steel.The patent that the People's Republic of China (PRC) announces: the patent No. is Z for " a kind of silverless low melting-point coper-base solder " its component and the content of " 87100098 "
n(33-37), M
n(6-14), S
i(0-2.0), F
e(0-1.0), C
o(0-1.0) R
eA kind of, two kinds or three kinds of copper base solders, fusing point is 778-814 ℃.Be mainly used in the soldering of steel.
The objective of the invention is to develop a kind of copper base solder of new no silver, make it have good wettability stainless steel, but the soldering stainless steel.The soldering fusing point is reduced, realize energy-efficient.
Component of the present invention and content are: zinc (Z
n) 30-40%, manganese (M
n) 4-11%, tin (S
n) 1-4%, rare earth (R
e) in a kind of or two kinds of 0-1%, boron (B) 0-0.5%, surpluses be copper C
u
Its processing sequence is: smelting-ingot casting-Jia is hot extruded into silk or is rolled into paper tinsel.
Smelting is in proper order: during melting, add Cu, Mn earlier in melting kettle or other smelting equipments, to reduce fusing point, add S after the fusing
n,, add Z at last with further reduction fusing point
n, R
eAnd B.
Advantage of the present invention is that fusing point is low, is 777 ℃ of solidus, 790 ℃ of liquidus curves, and brazing temperature is 900-950 ℃, than low 200 ℃ of brass, remarkable energy saving effect (energy-conservation 30-40%) is arranged; Satisfactory mechanical property, tensile strength＞550MP
a, percentage elongation δ
50Be 20%, mild steel soldered fitting shearing strength＞400MP
a, stainless steel braze welding shearing strength＞200MP
a; Argentiferous, nickel, cobalt, bismuth, cadmium etc. are valuable and produce the element of pernicious gas when smelting in this solder, smelt simply, and processing characteristics is good; The solder good manufacturability, need not use special flux, stainless steel, steel, carbide alloy are had good sprawling and filling capacity, the butt joint gap is insensitive, can welding, stainless steel, steel, copper, copper alloy and carbide alloy, be suitable for salt bath and gas welding of furnace brazing flame and high frequency brazing.
Claims (1)
1, a kind of silverless Cu-base soldering material alloy is characterized in that its component and content (weight %) are:
Zinc (Z
n) 30-40%
Manganese (M
n) 4-11%
Tin (S
n) 1-4%
Rare earth (R
e) in a kind of or two kinds of 0-1%
Boron (B) 0-0.5%
Yu Weitong (C
u)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 91107056 CN1066999A (en) | 1991-05-20 | 1991-05-20 | Silver-free copper-based brazing filler metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 91107056 CN1066999A (en) | 1991-05-20 | 1991-05-20 | Silver-free copper-based brazing filler metal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1066999A true CN1066999A (en) | 1992-12-16 |
Family
ID=4908419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 91107056 Pending CN1066999A (en) | 1991-05-20 | 1991-05-20 | Silver-free copper-based brazing filler metal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1066999A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1108896C (en) * | 1998-07-01 | 2003-05-21 | 洪若锋 | Special crystalline soldering flux and its manufacture method |
| CN102862003A (en) * | 2012-10-08 | 2013-01-09 | 佛山市泓实机械制造有限公司 | Silver-free copper based solder and preparation method thereof |
| CN103045900A (en) * | 2013-01-16 | 2013-04-17 | 苏州金仓合金新材料有限公司 | Novel high-stability copper alloy material for welding and preparation method for same |
| CN103042318A (en) * | 2013-01-16 | 2013-04-17 | 苏州金仓合金新材料有限公司 | Environment friendly tin zinc manganese copper alloy new material used for welding and preparation method thereof |
| CN103480987A (en) * | 2013-09-26 | 2014-01-01 | 郑州机械研究所 | Preparation method for high-fragility copper-zinc welding wires/welding lugs |
-
1991
- 1991-05-20 CN CN 91107056 patent/CN1066999A/en active Pending
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1108896C (en) * | 1998-07-01 | 2003-05-21 | 洪若锋 | Special crystalline soldering flux and its manufacture method |
| CN102862003A (en) * | 2012-10-08 | 2013-01-09 | 佛山市泓实机械制造有限公司 | Silver-free copper based solder and preparation method thereof |
| CN104942470A (en) * | 2013-01-16 | 2015-09-30 | 苏州金仓合金新材料有限公司 | Environment-protecting tin zinc manganese copper alloy new material for welding and preparing method thereof |
| CN103042318A (en) * | 2013-01-16 | 2013-04-17 | 苏州金仓合金新材料有限公司 | Environment friendly tin zinc manganese copper alloy new material used for welding and preparation method thereof |
| CN103045900B (en) * | 2013-01-16 | 2015-04-08 | 苏州金仓合金新材料有限公司 | Novel high-stability copper alloy material for welding and preparation method for same |
| CN104942472A (en) * | 2013-01-16 | 2015-09-30 | 苏州金仓合金新材料有限公司 | Environment-protecting tin zinc manganese copper alloy new material for welding and preparing method thereof |
| CN104942471A (en) * | 2013-01-16 | 2015-09-30 | 苏州金仓合金新材料有限公司 | Environment-protecting tin zinc manganese copper alloy new material for welding and preparing method thereof |
| CN103045900A (en) * | 2013-01-16 | 2013-04-17 | 苏州金仓合金新材料有限公司 | Novel high-stability copper alloy material for welding and preparation method for same |
| CN104942470B (en) * | 2013-01-16 | 2017-05-03 | 苏州金仓合金新材料有限公司 | Environment-protecting tin zinc manganese copper alloy new material for welding and preparing method thereof |
| CN104942464B (en) * | 2013-01-16 | 2017-05-03 | 苏州金仓合金新材料有限公司 | Environment-protecting tin zinc manganese copper alloy new material for welding and preparing method thereof |
| CN104942471B (en) * | 2013-01-16 | 2017-05-03 | 苏州金仓合金新材料有限公司 | Environment-protecting tin zinc manganese copper alloy new material for welding and preparing method thereof |
| CN104942472B (en) * | 2013-01-16 | 2017-05-03 | 苏州金仓合金新材料有限公司 | Environment-protecting tin zinc manganese copper alloy new material for welding and preparing method thereof |
| CN103480987A (en) * | 2013-09-26 | 2014-01-01 | 郑州机械研究所 | Preparation method for high-fragility copper-zinc welding wires/welding lugs |
| CN103480987B (en) * | 2013-09-26 | 2015-08-19 | 郑州机械研究所 | A kind of preparation method of high fragility copper zinc welding rod/weld tabs |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C01 | Deemed withdrawal of patent application (patent law 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |