CN106684228B - 一种在同一衬底上实现蓝绿光加红光荧光粉的发光led - Google Patents

一种在同一衬底上实现蓝绿光加红光荧光粉的发光led Download PDF

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CN106684228B
CN106684228B CN201710048199.9A CN201710048199A CN106684228B CN 106684228 B CN106684228 B CN 106684228B CN 201710048199 A CN201710048199 A CN 201710048199A CN 106684228 B CN106684228 B CN 106684228B
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丁磊
彭友
陈龙
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Anhui Connect Photoelectric Technology Co Ltd
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

本发明提供了一种在同一衬底上实现蓝绿光加红光荧光粉的发光LED，其包括以下步骤：将磊晶衬底粗化，涂上一层大于10μm耐高温的光刻胶；将事先做好的蓝光镂空光罩板放置在光刻胶上，将曝光部分去除掉；将光刻后的衬底进行磊晶生长，蓝光磊晶完成后，再二次涂布一层光刻胶，将事先做好的绿色镂空光罩板放置在光刻胶上，将曝光部分去除掉；将光刻后的衬底放到绿光外延炉里磊晶生长，最后通过蒸镀、电极制作、测试工艺将蓝绿晶片作为一体进行裂片，得到统一衬底的蓝绿光晶片。本发明通过在同一衬底通过磊晶生长出超窄波长(50nm以下)的蓝光、绿光晶片，搭配超窄波长的红色荧光粉便可产出色域可以超出100％标准NTSC的广色域LED。

Description

一种在同一衬底上实现蓝绿光加红光荧光粉的发光LED
技术领域
本发明涉及到LED技术领域，特别是一种在同一衬底上实现蓝绿光加红光荧光粉发光LED。
背景技术
在LED行业最为常见的方式是蓝光LED搭配黄色荧光粉产生白光，目前市面上有蓝光LED搭配黄色荧光粉产生白光和蓝光LED搭配绿色荧光粉以及红色荧光粉产生白光，特别是蓝光LED搭配氟化物荧光粉的高色域方案，目前已被日亚以及通用电气申请为专利。
现有的LED白光技术为蓝光LED搭配黄色荧光粉产生白光，但是此种方式所产生的白光色域覆盖率低，导致颜色失真，色彩不饱和，不能满足现代人对色彩的需求。基于该原因，为提升白光的色域，通过蓝光LED搭配红色荧光粉以及绿色荧光粉来实现，但是由于材料以及工艺的原因导致绿色荧光粉的半波宽不像红光那样做的窄(在7.5nm左右)，进而导致色域不能够做到100％甚至更高。而目前LED的技术相对成熟，LED晶片的半波宽可以做的很窄，可以做到25nm左右。这样通过在同一衬底通过磊晶生长出超窄波长(50nm以下)的蓝光、绿光LED，在搭配超窄波长(在7.5nm左右)的红色荧光粉便可制备出色域可以超出100％标准NTSC的广色域LED。
发明内容
为解决上述技术问题，本发明提供了一种在同一衬底上实现蓝绿光加红光荧光粉的发光LED，其包括以下步骤：
S1：将衬底粗化，在衬底上涂上一层大于10μm耐高温的光刻胶；将事先做好的蓝光镂空光罩板放置在光刻胶上，通过曝光、显影、光刻将曝光部分去除掉；
S2:将光刻后的衬底放到蓝光外延炉里磊晶生长，蓝光磊晶完成后，再二次涂布一层光刻胶，将事先做好的绿色镂空光罩板放置在光刻胶上，通过曝光、显影、光刻将曝光部分去除掉；
S3:将光刻后的衬底放到绿光外延炉里磊晶生长，最后通过蒸镀、电极制作、测试工艺将蓝绿LED作为一体进行裂片，得到统一衬底的蓝绿光晶片。
较佳地，将蓝绿光晶片(2)通过固晶胶将其固定在LED支架(4)碗杯内，LED正极通过导线(1)与led支架(4)正极引线架连接，LED负极通过导线(1)与led支架(4)负极引线架连接，蓝绿光晶片(2)之间通过导线(1)相连，将混合有红色荧光粉的封装胶(3)灌注在LED支架(4)碗杯内，经50-150摄氏度2-4小时烘烤固化。
本发明具有以下有益效果：
本发明通过在同一衬底通过磊晶生长出超窄波长(50nm以下)的蓝光、绿光LED，搭配超窄波长的红色荧光粉便可制备出色域可以超出100％标准NTSC的广色域LED。
当然，实施本发明的任一产品并不一定需要同时达到以上所述的所有优点。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对实施例描述所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例提供的发光LED制作流程示意图；
图2为本发明实施例提供的封装结构示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其它实施例，都属于本发明保护的范围。
本发明实施例提供了一种在同一衬底上实现蓝绿光加红光荧光粉的发光LED，其包括以下步骤：
如图1所示：
S1：将衬底粗化，在衬底上涂上一层大于10μm耐高温的光刻胶；将事先做好的蓝光镂空光罩板放置在光刻胶上，通过曝光、显影、光刻将曝光部分去除掉；
S2:将光刻后的衬底放到蓝光外延炉里磊晶生长，蓝光磊晶完成后，再二次涂布一层光刻胶，将事先做好的绿色镂空光罩板放置在光刻胶上，通过曝光、显影、光刻将曝光部分去除掉；
S3:将光刻后的衬底放到绿光外延炉里磊晶生长，最后通过蒸镀、电极制作、测试工艺将蓝绿晶片作为一体进行裂片，得到统一衬底的蓝绿光晶片。
如图2所示：
将蓝绿光晶片(2)通过固晶胶将其固定在LED支架(4)碗杯内，LED正极通过导线(1)与led支架(4)正极引线架连接，LED负极通过导线(1)与led支架(4)负极引线架连接，蓝绿光晶片(2)之间通过导线(1)相连，将混合有红色荧光粉的封装胶(3)灌注在LED支架(4)碗杯内，经50-150摄氏度2-4小时烘烤固化。
本发明通过在同一衬底通过磊晶生长出超窄波长(50nm以下)的蓝光、绿光晶片，搭配超窄波长的红色荧光粉便可制备出色域可以超出100％标准NTSC的广色域LED。
以上公开的本发明优选实施例只是用于帮助阐述本发明。优选实施例并没有详尽叙述所有的细节，也不限制该发明仅为所述的具体实施方式。显然，根据本说明书的内容，可作很多的修改和变化。本说明书选取并具体描述这些实施例，是为了更好地解释本发明的原理和实际应用，从而使所属技术领域技术人员能很好地理解和利用本发明。本发明仅受权利要求书及其全部范围和等效物的限制。

Claims (1)

1.一种在同一衬底上实现蓝绿光加红光荧光粉的发光LED，其特征在于，包括以下步骤：
S1：将衬底粗化，在衬底上涂上一层大于10μm耐高温的光刻胶；将事先做好的蓝光镂空光罩板放置在光刻胶上，通过曝光、显影、光刻将曝光部分去除掉；
S2:将光刻后的衬底放到蓝光外延炉里磊晶生长，蓝光磊晶完成后，再二次涂布一层光刻胶，将事先做好的绿色镂空光罩板放置在光刻胶上，通过曝光、显影、光刻将曝光部分去除掉；
S3:将光刻后的衬底放到绿光外延炉里磊晶生长，最后通过蒸镀、电极制作、测试工艺将蓝绿LED作为一体进行裂片，得到统一衬底的超窄波长蓝光、绿光LED；
将蓝绿光晶片(2)通过固晶胶将其固定在LED支架(4)碗杯内，LED正极通过导线(1)与led支架(4)正极引线架连接，LED负极通过导线(1)与led支架(4)负极引线架连接，蓝绿光晶片(2)之间通过导线(1)相连，将混合有超窄波长的红色荧光粉的封装胶(3)灌注在LED支架(4)碗杯内，经50-150摄氏度2-4小时烘烤固化。
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