CN106684100A - 一种阵列基板及其制作方法、显示装置 - Google Patents
一种阵列基板及其制作方法、显示装置 Download PDFInfo
- Publication number
- CN106684100A CN106684100A CN201710044594.XA CN201710044594A CN106684100A CN 106684100 A CN106684100 A CN 106684100A CN 201710044594 A CN201710044594 A CN 201710044594A CN 106684100 A CN106684100 A CN 106684100A
- Authority
- CN
- China
- Prior art keywords
- area
- film layer
- metallic diaphragm
- underlay substrate
- active layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 70
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000002184 metal Substances 0.000 claims abstract description 44
- 239000004065 semiconductor Substances 0.000 claims description 28
- 230000004888 barrier function Effects 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 9
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 7
- 238000000059 patterning Methods 0.000 claims description 5
- 230000000903 blocking effect Effects 0.000 claims description 4
- 229910021419 crystalline silicon Inorganic materials 0.000 claims 1
- 239000004973 liquid crystal related substance Substances 0.000 abstract description 21
- 230000000694 effects Effects 0.000 abstract description 5
- 229910052755 nonmetal Inorganic materials 0.000 abstract 1
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 230000009286 beneficial effect Effects 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 4
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1222—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/127—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1296—Multistep manufacturing methods adapted to increase the uniformity of device parameters
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Thin Film Transistor (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710044594.XA CN106684100B (zh) | 2017-01-19 | 2017-01-19 | 一种阵列基板及其制作方法、显示装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710044594.XA CN106684100B (zh) | 2017-01-19 | 2017-01-19 | 一种阵列基板及其制作方法、显示装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106684100A true CN106684100A (zh) | 2017-05-17 |
CN106684100B CN106684100B (zh) | 2019-09-06 |
Family
ID=58859727
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710044594.XA Expired - Fee Related CN106684100B (zh) | 2017-01-19 | 2017-01-19 | 一种阵列基板及其制作方法、显示装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106684100B (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111192910A (zh) * | 2020-01-22 | 2020-05-22 | 京东方科技集团股份有限公司 | 阵列基板及制作方法、显示面板 |
CN113540308A (zh) * | 2020-04-22 | 2021-10-22 | 东莞市中麒光电技术有限公司 | Led显示模组的基板结构及制作方法 |
WO2022052816A1 (zh) * | 2020-09-11 | 2022-03-17 | 京东方科技集团股份有限公司 | 显示装置及显示装置的制造方法 |
WO2022257179A1 (zh) * | 2021-06-07 | 2022-12-15 | 惠州华星光电显示有限公司 | 显示面板、显示模组及显示装置 |
WO2024113147A1 (zh) * | 2022-11-29 | 2024-06-06 | 京东方科技集团股份有限公司 | 阵列基板和显示装置 |
US12035588B2 (en) | 2020-01-22 | 2024-07-09 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Array substrate and method for manufacturing the same, display panel |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112582572B (zh) * | 2020-12-09 | 2022-09-23 | 昆山工研院新型平板显示技术中心有限公司 | 显示面板、触控显示屏及电子设备 |
CN112909203B (zh) * | 2021-01-29 | 2022-09-13 | 昆山国显光电有限公司 | 显示面板及显示装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101030008A (zh) * | 2006-02-28 | 2007-09-05 | 元太科技工业股份有限公司 | 电子墨水显示装置及显示装置 |
JP4884320B2 (ja) * | 2007-06-29 | 2012-02-29 | 京セラ株式会社 | 画像表示装置 |
CN103534638A (zh) * | 2011-02-14 | 2014-01-22 | 奥特司科技株式会社 | 液晶显示装置 |
-
2017
- 2017-01-19 CN CN201710044594.XA patent/CN106684100B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101030008A (zh) * | 2006-02-28 | 2007-09-05 | 元太科技工业股份有限公司 | 电子墨水显示装置及显示装置 |
JP4884320B2 (ja) * | 2007-06-29 | 2012-02-29 | 京セラ株式会社 | 画像表示装置 |
CN103534638A (zh) * | 2011-02-14 | 2014-01-22 | 奥特司科技株式会社 | 液晶显示装置 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111192910A (zh) * | 2020-01-22 | 2020-05-22 | 京东方科技集团股份有限公司 | 阵列基板及制作方法、显示面板 |
US12035588B2 (en) | 2020-01-22 | 2024-07-09 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Array substrate and method for manufacturing the same, display panel |
CN113540308A (zh) * | 2020-04-22 | 2021-10-22 | 东莞市中麒光电技术有限公司 | Led显示模组的基板结构及制作方法 |
WO2022052816A1 (zh) * | 2020-09-11 | 2022-03-17 | 京东方科技集团股份有限公司 | 显示装置及显示装置的制造方法 |
CN114730108A (zh) * | 2020-09-11 | 2022-07-08 | 京东方科技集团股份有限公司 | 显示装置及显示装置的制造方法 |
US20230056588A1 (en) * | 2020-09-11 | 2023-02-23 | Hefei Boe Optoelectronics Technology Co, Ltd. | Display device and manufacturing method of display device |
US11714307B2 (en) | 2020-09-11 | 2023-08-01 | Hefei Boe Optoelectronics Technology Co, Ltd. | Display device and manufacturing method of display device |
CN114730108B (zh) * | 2020-09-11 | 2023-10-20 | 京东方科技集团股份有限公司 | 显示装置及显示装置的制造方法 |
WO2022257179A1 (zh) * | 2021-06-07 | 2022-12-15 | 惠州华星光电显示有限公司 | 显示面板、显示模组及显示装置 |
WO2024113147A1 (zh) * | 2022-11-29 | 2024-06-06 | 京东方科技集团股份有限公司 | 阵列基板和显示装置 |
Also Published As
Publication number | Publication date |
---|---|
CN106684100B (zh) | 2019-09-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20200428 Address after: 350300, No. 36 West North Road, Peach Street, Fuzhou, Fujian, Fuqing Co-patentee after: BOE TECHNOLOGY GROUP Co.,Ltd. Patentee after: FUZHOU BOE OPTOELECTRONICS TECHNOLOGY Co.,Ltd. Address before: 100015 Jiuxianqiao Road, Beijing, No. 10, No. Co-patentee before: FUZHOU BOE OPTOELECTRONICS TECHNOLOGY Co.,Ltd. Patentee before: BOE TECHNOLOGY GROUP Co.,Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190906 Termination date: 20210119 |