CN106684020A - Surface cleaning treatment method for solar silicon wafer - Google Patents
Surface cleaning treatment method for solar silicon wafer Download PDFInfo
- Publication number
- CN106684020A CN106684020A CN201611164504.2A CN201611164504A CN106684020A CN 106684020 A CN106684020 A CN 106684020A CN 201611164504 A CN201611164504 A CN 201611164504A CN 106684020 A CN106684020 A CN 106684020A
- Authority
- CN
- China
- Prior art keywords
- cleaning
- dried
- box body
- cleaning groove
- solar silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 134
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 51
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 51
- 239000010703 silicon Substances 0.000 title claims abstract description 51
- 238000000034 method Methods 0.000 title abstract 3
- 230000007246 mechanism Effects 0.000 claims abstract description 70
- 235000012431 wafers Nutrition 0.000 claims abstract description 46
- 238000001035 drying Methods 0.000 claims abstract description 12
- 238000009434 installation Methods 0.000 claims abstract description 9
- 210000004247 hand Anatomy 0.000 claims description 24
- 238000003672 processing method Methods 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 3
- 239000003513 alkali Substances 0.000 claims description 3
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- 238000010981 drying operation Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 6
- 238000002955 isolation Methods 0.000 abstract description 2
- 230000000712 assembly Effects 0.000 abstract 1
- 238000000429 assembly Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000009991 scouring Methods 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention relates to a surface cleaning treatment method of a solar silicon wafer, and an adopted system comprises an installation support frame; the mounting support frame is provided with a cleaning tank mechanism, a first drying treatment box, a second drying treatment box, four mechanical moving mechanisms and three pairs of cleaning tank mechanism manipulator assemblies; the cleaning tank mechanism also comprises a plurality of solar silicon wafer bearing flower baskets, and a plurality of isolation plates for isolating the solar silicon wafers are arranged on the solar silicon wafer bearing flower baskets; the drying treatment box comprises a drying box body, a circulating fan and a heat energy device; the front side and the rear side of the drying box body are provided with box doors which move up and down, wherein one side of the box doors forms an inlet of the drying box body, and the other side of the box doors forms an outlet of the drying box body; the left side and the right side in the drying box body are respectively provided with a front-back moving mechanism for supporting the flower basket box. The invention is suitable for cleaning operation of the solar cell and has higher automation working performance. According to the cleaning process, the solar cell can obtain a good cleaning effect.
Description
Technical field
The present invention relates to a kind of solar silicon wafers surface cleaning processing method, belongs to solaode processed technology neck
Domain.
Background technology
During solar battery sheet is manufactured, silicon chip surface cleaning is required very high, it is to avoid during cleaning
Impurity is introduced, so as to affect its using effect, therefore, it is necessary to improve at solar silicon wafers surface cleaning using suitable mode
Reason effect, preferably to improve solar silicon wafers surface cleaning treatment effect.General solar silicon wafers surface cleaning is adopted
Cleanout fluid is carried out, and this cleaning way energy consumption is big, and high to environmental requirement, is adapted to batch production, but in actual production, the sun
The surface cleaning of energy silicon chip is also required to be improved using other modes.
The content of the invention
It is an object of the invention to provide a kind of solar silicon wafers surface cleaning processing method, preferably to improve the sun
Can Battery disposal effect.
To achieve these goals, technical scheme is as follows.
A kind of solar silicon wafers surface cleaning processing method, adopts system to include installing bracing frame；Install on bracing frame
It is provided with cleaning groove mechanism, first, second dried case, four mechanical shifting mechanisms and three pairs of cleaning groove mechanism tool handss components；
The cleaning groove mechanism also includes multiple solar silicon wafers and carries the gaily decorated basket, and solar silicon wafers carry the gaily decorated basket and are provided with some being used for
The division board of isolation solar silicon wafers；The dried case is included and is dried box body, circulating fan and heating unit；It is dried
The left and right sidewall of box body is fixed on installation bracing frame；The side in front and back for being dried box body is provided with the chamber door for moving up and down, wherein
Side constitutes the entrance for being dried box body, and opposite side constitutes the outlet for being dried box body；The left and right sides being dried in box body respectively sets
There is a gaily decorated basket case inner support travel mechanism for moving towards in front and back；Circulating fan is installed in the top or bottom for being dried box body, heat
Energy device is then located at circulating fan and is dried between box body；First dried case be dried outside the entrance chamber door of box body and
One is respectively provided with the installation bracing frame of the left and right sides being dried outside the outlet chamber door of box body of the second dried case
The gaily decorated basket interval moved towards in front and back supports travel mechanism；The outlet chamber door for being dried box body of the first dried case and second is dried
It is provided between the entrance chamber door for the treatment of box and the solar silicon wafers carrying gaily decorated basket is dried going out for box body from the first dried case
The inlet tank of the second dried case solar silicon wafers outdoors are transferred to outside mouthful chamber door and carry gaily decorated basket transfer device；Cleaning scouring machine
Structure tool handss component includes cleaning groove mechanism tool handss main body；Three pairs of cleaning groove mechanism tool handss components are sequentially located at cleaning groove mechanism
Top；Cleaning groove mechanism tool handss main body slides up and down cooperation near the one end and installation bracing frame for being dried box body accordingly, clearly
Washing trough mechanism tool handss main body is provided with gaily decorated basket cleaning and supports breach away from the one end for being dried box body accordingly, and the gaily decorated basket cleaning is supported
Breach is located at the top of corresponding cleaning groove body.
The alkali liquor for cleaning solar silicon wafers, the second rinse bath are placed with the cleaning groove body of the first cleaning groove mechanism
The acid solution for cleaning solar silicon wafers is placed with the cleaning groove body of mechanism；In the cleaning groove body of the 3rd cleaning groove mechanism
It is placed with the deionized water of the solar silicon wafers for cleaning.During cleaning operation, solaode is inserted in solar silicon wafers and holds
In carrying the gaily decorated basket.The solaode being inserted in the solar silicon wafers carrying gaily decorated basket supports travel mechanism to send by gaily decorated basket interval first
To in the cleaning groove mechanism tool handss main body of the first cleaning groove mechanism tool handss component, subsequently into the cleaning groove of the first cleaning groove mechanism
First time cleaning is carried out in main body, box body is dried using mechanical shifting mechanism the first dried case of feeding after the completion of cleaning
Inside it is dried, then again from the cleaning groove that the second cleaning groove mechanism is sent in taking-up in box body that is dried of the first dried case
Second cleaning operation is carried out in main body, then retransferring to send in the 3rd cleaning groove body for cleaning groove mechanism carries out third time
Cleaning, then entering back into being dried in box body for the second dried case carries out second drying.Solaode is through three times
Cleaning operation is completed after cleaning and twice drying operation.
The beneficial effect of the invention is：The present invention suitable for solaode cleaning operation use, with it is higher from
Dynamicization service behaviour.Cleaning procedure of the present invention, solaode can obtain good cleaning effect.
Specific embodiment
The specific embodiment of the present invention is described with reference to embodiment, to be better understood from the present invention.
Embodiment
Solar silicon wafers surface cleaning processing method in the embodiment of the present invention, adopts system to include installing bracing frame；
Bracing frame is installed and is provided with cleaning groove mechanism, first, second dried case, four mechanical shifting mechanisms and three pairs of cleaning scouring machines
Structure tool handss component；The cleaning groove mechanism also includes multiple solar silicon wafers and carries the gaily decorated basket, and solar silicon wafers are carried on the gaily decorated basket
It is provided with some division boards for isolating solar silicon wafers；The dried case is included and is dried box body, circulating fan
And heating unit；It is dried the left and right sidewall of box body to be fixed on installation bracing frame；Be dried box body before and after side be provided with and move down
Dynamic chamber door, wherein side constitute the entrance for being dried box body, and opposite side constitutes the outlet for being dried box body；It is dried in box body
Left and right sides be respectively provided with a gaily decorated basket case inner support travel mechanism for moving towards in front and back；Circulating fan is installed in the top for being dried box body
Portion or bottom, heating unit is then located at circulating fan and is dried between box body；The first dried case is dried entering for box body
Outside mouthful chamber door and the second dried case the left and right sides being dried outside the outlet chamber door of box body installation bracing frame on
It is respectively provided with a gaily decorated basket interval moved towards in front and back and supports travel mechanism；The EXPORT CARTON for being dried box body of the first dried case
It is provided between door and the entrance chamber door of the second dried case and solar silicon wafers is carried the gaily decorated basket from the dry of the first dried case
The EXPORT CARTON of dry box body is transferred to outdoors the inlet tank of the second dried case solar silicon wafers outdoors and carries gaily decorated basket transfer
Mechanism；Cleaning groove mechanism tool handss component includes cleaning groove mechanism tool handss main body；Three pairs of cleaning groove mechanism tool handss components sequentially set
In the top of cleaning groove mechanism；Cleaning groove mechanism tool handss main body is close to be dried accordingly one end of box body and installs on bracing frame
Lower slider coordinates, and cleaning groove mechanism tool handss main body is provided with gaily decorated basket cleaning and supports breach away from the one end for being dried box body accordingly,
The gaily decorated basket cleaning supports breach to be located at the top of corresponding cleaning groove body.
The alkali liquor for cleaning solar silicon wafers, the second rinse bath are placed with the cleaning groove body of the first cleaning groove mechanism
The acid solution for cleaning solar silicon wafers is placed with the cleaning groove body of mechanism；In the cleaning groove body of the 3rd cleaning groove mechanism
It is placed with the deionized water of the solar silicon wafers for cleaning.During cleaning operation, solaode is inserted in solar silicon wafers and holds
In carrying the gaily decorated basket.The solaode being inserted in the solar silicon wafers carrying gaily decorated basket supports travel mechanism to send by gaily decorated basket interval first
To in the cleaning groove mechanism tool handss main body of the first cleaning groove mechanism tool handss component, subsequently into the cleaning groove of the first cleaning groove mechanism
First time cleaning is carried out in main body, box body is dried using mechanical shifting mechanism the first dried case of feeding after the completion of cleaning
Inside it is dried, then again from the cleaning groove that the second cleaning groove mechanism is sent in taking-up in box body that is dried of the first dried case
Second cleaning operation is carried out in main body, then retransferring to send in the 3rd cleaning groove body for cleaning groove mechanism carries out third time
Cleaning, then entering back into being dried in box body for the second dried case carries out second drying.Solaode is through three times
Cleaning operation is completed after cleaning and twice drying operation.
The above is the preferred embodiment of the present invention, it is noted that for those skilled in the art
For, under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications are also considered as
Protection scope of the present invention.
Claims (6)
1. a kind of solar silicon wafers surface cleaning processing method, it is characterised in that：Adopted system includes installing bracing frame；Install
Bracing frame is provided with cleaning groove mechanism, first, second dried case, four mechanical shifting mechanisms and three pairs of cleaning groove mechanism tools
Handss component；The cleaning groove mechanism also includes multiple solar silicon wafers and carries the gaily decorated basket, and solar silicon wafers carry the gaily decorated basket and are provided with
Some division boards for isolating solar silicon wafers；The dried case is included and is dried box body, circulating fan and heat
Can device；It is dried the left and right sidewall of box body to be fixed on installation bracing frame；The side in front and back for being dried box body is provided with what is moved up and down
Chamber door, wherein side constitute the entrance for being dried box body, and opposite side constitutes the outlet for being dried box body；The left side being dried in box body
Right side is respectively provided with a gaily decorated basket case inner support travel mechanism for moving towards in front and back；Circulating fan be installed in the top that is dried box body or
Bottom, heating unit is then located at circulating fan and is dried between box body；The inlet tank for being dried box body of the first dried case
It is each with the installation bracing frame of the left and right sides being dried outside the outlet chamber door of box body of the second dried case outside door
It is provided with a gaily decorated basket interval moved towards in front and back and supports travel mechanism.
2. solar silicon wafers surface cleaning processing method according to claim 1, it is characterised in that：At first drying
Being dried between the outlet chamber door of box body and the entrance chamber door of the second dried case for reason case is provided with solar silicon wafers is carried
The inlet tank that the gaily decorated basket is transferred to outdoors the second dried case from the EXPORT CARTON for being dried box body of the first dried case is outdoors
Solar silicon wafers carry gaily decorated basket transfer device.
3. solar silicon wafers surface cleaning processing method according to claim 1, it is characterised in that：The cleaning groove mechanism
Tool handss component includes cleaning groove mechanism tool handss main body；Three pairs of cleaning groove mechanism tool handss components are sequentially located at the upper of cleaning groove mechanism
Side.
4. solar silicon wafers surface cleaning processing method according to claim 1, it is characterised in that：The cleaning groove mechanism
Tool handss main body slides up and down cooperation near the one end and installation bracing frame for being dried box body accordingly.
5. solar silicon wafers surface cleaning processing method according to claim 1, it is characterised in that：The cleaning groove mechanism
Tool handss main body is provided with gaily decorated basket cleaning and supports breach away from the one end for being dried box body accordingly, and the gaily decorated basket cleaning supports breach to be located at
The top of corresponding cleaning groove body.
6. solar silicon wafers surface cleaning processing method according to claim 1, it is characterised in that：First cleaning groove mechanism
Cleaning groove body in be placed with alkali liquor for cleaning solar silicon wafers, place in the cleaning groove body of the second cleaning groove mechanism
There is the acid solution for cleaning solar silicon wafers；It is placed with for the solar energy of cleaning in the cleaning groove body of the 3rd cleaning groove mechanism
The deionized water of silicon chip；During cleaning operation, solaode is inserted in solar silicon wafers and carries in the gaily decorated basket；It is inserted in solar power silicon
The solaode that piece is carried in the gaily decorated basket supports travel mechanism to be sent to the first cleaning groove mechanism tool handss group by gaily decorated basket interval first
In the cleaning groove mechanism tool handss main body of part, first time cleaning is carried out in the cleaning groove body subsequently into the first cleaning groove mechanism,
The first being dried in box body for dried case is sent into after the completion of cleaning using mechanical shifting mechanism to be dried, then again from the
Being dried in box body in the cleaning groove body for taking out the cleaning groove mechanism of feeding second for one dried case carries out second cleaning
Operation, then retransferring to send in the 3rd cleaning groove body for cleaning groove mechanism carries out third time cleaning, then enters back into second
Being dried in box body for dried case carries out second drying；Solaode is after three cleanings with drying operation twice
Complete cleaning operation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611164504.2A CN106684020B (en) | 2016-12-15 | 2016-12-15 | A kind of solar silicon wafers surface cleaning processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611164504.2A CN106684020B (en) | 2016-12-15 | 2016-12-15 | A kind of solar silicon wafers surface cleaning processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106684020A true CN106684020A (en) | 2017-05-17 |
| CN106684020B CN106684020B (en) | 2019-10-22 |
Family
ID=58869061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611164504.2A Active CN106684020B (en) | 2016-12-15 | 2016-12-15 | A kind of solar silicon wafers surface cleaning processing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106684020B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108336004A (en) * | 2018-04-18 | 2018-07-27 | 冠礼控制科技（上海）有限公司 | A kind of full-automatic wet process equipment of four gaily decorated basket of single batch synchronous operation |
| CN111085497A (en) * | 2019-12-18 | 2020-05-01 | 武汉百臻半导体科技有限公司 | Polycrystalline silicon wafer cleaning system and cleaning method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003109931A (en) * | 2001-09-28 | 2003-04-11 | Sumitomo Mitsubishi Silicon Corp | Cleaning drying method of semiconductor wafer |
| CN202180065U (en) * | 2011-07-26 | 2012-04-04 | 韩华新能源（启东）有限公司 | Automatic cleaning equipment for solar silicon wafer before diffusion |
| CN204074616U (en) * | 2014-09-23 | 2015-01-07 | 浙江昊能光电有限公司 | A kind of ultrasonic wave solar silicon wafers cleaning machine |
-
2016
- 2016-12-15 CN CN201611164504.2A patent/CN106684020B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003109931A (en) * | 2001-09-28 | 2003-04-11 | Sumitomo Mitsubishi Silicon Corp | Cleaning drying method of semiconductor wafer |
| CN202180065U (en) * | 2011-07-26 | 2012-04-04 | 韩华新能源（启东）有限公司 | Automatic cleaning equipment for solar silicon wafer before diffusion |
| CN204074616U (en) * | 2014-09-23 | 2015-01-07 | 浙江昊能光电有限公司 | A kind of ultrasonic wave solar silicon wafers cleaning machine |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108336004A (en) * | 2018-04-18 | 2018-07-27 | 冠礼控制科技（上海）有限公司 | A kind of full-automatic wet process equipment of four gaily decorated basket of single batch synchronous operation |
| CN108336004B (en) * | 2018-04-18 | 2023-09-08 | 冠礼控制科技（上海）有限公司 | Full-automatic wet processing equipment with single batch of four-flower basket synchronous operation |
| CN111085497A (en) * | 2019-12-18 | 2020-05-01 | 武汉百臻半导体科技有限公司 | Polycrystalline silicon wafer cleaning system and cleaning method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106684020B (en) | 2019-10-22 |
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Effective date of registration: 20190920 Address after: 318050 No. 111, four district, Tat Tau Village, Tongyu street, Luqiao District, Taizhou, Zhejiang Applicant after: Taizhou Yinzi Intellectual Property Service Co., Ltd. Address before: 528400, A, room 2, building 10, Xinhua Building, No. 118, Xinhua Road, Xiaolan Town, Guangdong, Zhongshan Applicant before: Zhongshan city high intellectual property rights center (limited partnership) |
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