CN106683971A - Etching electrode device - Google Patents
Etching electrode device Download PDFInfo
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- CN106683971A CN106683971A CN201710012092.9A CN201710012092A CN106683971A CN 106683971 A CN106683971 A CN 106683971A CN 201710012092 A CN201710012092 A CN 201710012092A CN 106683971 A CN106683971 A CN 106683971A
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- electrode body
- mounting hole
- infusion set
- etched electrodes
- electrodes device
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- 238000005530 etching Methods 0.000 title abstract description 21
- 238000001816 cooling Methods 0.000 claims abstract description 42
- 238000001802 infusion Methods 0.000 claims abstract description 40
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 15
- 230000007246 mechanism Effects 0.000 claims abstract description 8
- 239000002826 coolant Substances 0.000 claims description 32
- 239000007788 liquid Substances 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 2
- 239000000110 cooling liquid Substances 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011897 real-time detection Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000036760 body temperature Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000003411 electrode reaction Methods 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32559—Protection means, e.g. coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32568—Relative arrangement or disposition of electrodes; moving means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
Abstract
The invention discloses an etching electrode device. The etching electrode device comprises at least one electrode body, a supporting frame, an infusion mechanism and a cooling liquid supply device. Each electrode body is internally provided with a cooling passage with a water inlet and a water outlet; the at least one electrode body is arranged in the supporting frame which is provided with at least one first mounting hole and at least one second mounting hole; the infusion mechanism comprises first infusion components and second infusion components, each first infusion component penetrates the corresponding first mounting hole and is communicated with the water inlet, and each second infusion component penetrates the corresponding second mounting hole and is communicated with the water outlet; the cooling liquid supply device is connected with the first infusion components and the second infusion components through pipelines. By circular flow of cooling liquid in the cooling passage in each electrode body, heat generated by impact on electrodes in gas ionization can be effectively reduced, and accordingly high etching uniformity and high etching speed of products are guaranteed, and high product processing quality is guaranteed as well.
Description
Technical field
The present invention relates to plasma etch techniques field, more particularly to a kind of etched electrodes device.
Background technology
Plasma etching, is most common a kind of form in dry etching, and its principle is an exposure to the gas of electronics regions
The gas of plasma, resulting ionized gas and release high energy electron composition is formed, so that plasma or ion are formed,
When ionized gas atom passes through electric field acceleration, enough strength can be discharged with surface expulsion power tightly jointing material or etching table
Face.The plasma etcher worked using the principle is to be gone to bombard or sputter the material that is etched with the free radical in plasma
Surface molecular, forms volatile substances, so as to realize the purpose of etching.Then erosion is participated in current plasma etcher on the market
The electrode for carving reaction is usually plate armature, and electrode surface can be formed because of etching loss after the reaction of a period of time is participated in
Rough structure；In addition in plasma motion process, gas be ionized after between electrode moving electrodes can produce heat,
Heat is higher, and plasma motion is more violent, and further reaction on this basis can be too high because of electrode temperature, reaction distance,
The reasons such as reaction solution concentration homogeneity difference cause the etching speed of product to reduce, and etch uniformity is not good, influence Product processing
Quality.
The content of the invention
Based on this, the invention reside in the defect for overcoming prior art, there is provided a kind of etch uniformity is good, and etching speed is high,
Product processing quality is good and etched electrodes device of simple structure and plasma etcher.
Its technical scheme is as follows：
A kind of etched electrodes device, including：
At least one electrode body, the inside of the electrode body is provided with cooling duct, and the cooling duct is included into water
Mouth and delivery port；
Support frame, in the support frame, the support frame is provided with least one first to the electrode body
Mounting hole and at least one second mounting holes；
Transfusion mechanism, the transfusion mechanism includes the first infusion set and the second infusion set, first infusion set
Be arranged in first mounting hole and connected with the water inlet, second infusion set be arranged in second mounting hole,
And connected with the delivery port；And
Coolant supply apparatus, the coolant supply apparatus and first infusion set, second infusion set
Pipeline is connected.
Above-mentioned etched electrodes device by installing electrode body at least described in a box in the support frame, and described
Electrode body inside sets cooling duct, afterwards that the coolant supply apparatus are logical with cooling by first infusion set
The water inlet in road is connected, connected with the delivery port of cooling duct by second infusion set.Thus by coolant in electricity
The cooling duct internal circulation flow of pole body interior, can effectively reduce the heat that gas ionization clashes into electrode and produces, and then
Ensure that product etch uniformity is good, etching speed is high, it is ensured that product preferably crudy.
Below to technical scheme seat further instruction：
Wherein in one embodiment, the cooling duct is in roundabout type structure, and along the extension side of the electrode body
To arrangement.Thus the laying area of cooling duct can be made to be adapted with the area of electrode, and then ensure that coolant can be flowed through
Whole electrode, it is ensured that electrode cooling is reliable, it is to avoid the process quality issue that local cooling does not cause thoroughly.
Wherein in one embodiment, first infusion set and second infusion set include fixed seat, defeated
Liquid pipe and locking member, the fixed seat are provided with the 3rd installation being adapted with first mounting hole and second mounting hole
Hole, the woven hose is arranged in first mounting hole and the 3rd mounting hole or second mounting hole or the described 3rd
Mounting hole, the end that the woven hose stretches out the fixed seat is connected with the locking member.So not only can firmly by electrode
Body is fixed on support frame, and the connected mode simple structure, is convenient to mount and dismount, and is conducive to improving operating efficiency, together
When coolant can also be reliably guided into cooling duct, it is to avoid coolant is leaked, cause the wasting of resources and processing ring
Pollute in border.
Wherein in one embodiment, also including at least one temperature sensing part and temperature controller, the temperature control
Device is electrically connected with the coolant supply apparatus, the temperature sensing part be arranged on the electrode body and with the temperature
Controller is communicated to connect.Real-time detection is thus carried out to electrode body temperature by temperature sensing part, can be by temperature control
Device flexibly controls the break-make of coolant to supply, it is ensured that electrode body reliable operation, it is ensured that product etch quantity uniformity is good；Additionally,
It is also beneficial to reduce equipment loss and resource consumption, improves enterprise's production economy.
Wherein in one embodiment, the quantity of the temperature sensing part is multiple, and multiple temperature sensing parts are uniform
It is arranged at intervals on the electrode body.Thus can more fully and sensitive detecting electrode body regional temperature,
Avoid the problem of product processing quality uniformity difference caused by local temperature difference, it is ensured that etch uniformity is good.
Wherein in one embodiment, the electrode body is provided with least one hollow-out parts, and the cooling duct is included extremely
Few two channel units, between the hollow-out parts are located at the two neighboring channel unit.Electrode body can so be effectively improved
Surface amplify area so that negative glow in produce all ions almost can bombarding cathode surface, to improve negative glow
Electric power in area and cathode dark space, the occurrence probability for the collision process such as exciting so that etching current density and plasma density are big
It is big to increase, so as to improve the etching speed and uniformity of product.
Wherein in one embodiment, the quantity of the hollow-out parts is multiple, and the quantity of the channel unit is multiple, institute
Hollow-out parts are stated to be alternately arranged with the channel unit.So improving the surface area of electrode body, process velocity and uniform is improved
While property, electrode can also fully be lowered the temperature by the coolant in channel unit, it is to avoid product temperature is too high, it is ensured that
Product processing quality is good.
Wherein in one embodiment, the quantitative range of the hollow-out parts is：2~50.Thus can be according to different size
Processing object the hollow-out parts of varying number are flexibly set on electrode body, so as to be effectively improved processing conditions, improve product
Etching quality, lifts the scope of application of etched electrodes device.
The present invention also provides a kind of plasma etcher, and it includes etched electrodes device as described above.
Above-mentioned plasma etcher is pacified by installing and using above-mentioned etched electrodes device by the support frame
If electrode body at least described in a box, and cooling duct is set inside the electrode body, the coolant is supplied afterwards
Device connected by first infusion set with the water inlet of cooling duct, by second infusion set and cooling duct
Delivery port connection.Thus by cooling duct internal circulation flow of the coolant inside electrode body, gas can be effectively reduced
The heat that volume ionization clashes into electrode and produces, and then ensure that product etch uniformity is good, etching speed is high, it is ensured that product is preferably
Crudy.
Brief description of the drawings
Fig. 1 is the structural representation of the etched electrodes device described in the embodiment of the present invention；
Fig. 2 is partial enlarged drawing at the A of the etched electrodes device described in the embodiment of the present invention；
Fig. 3 is the structural representation of the electrode body described in the embodiment of the present invention.
Description of reference numerals：
100th, electrode body, 120, cooling duct, 122, water inlet, 124, delivery port, 126, channel unit, 140, hollow out
Portion, 200, support frame, the 220, first mounting hole, the 240, second mounting hole, the 300, first infusion set, the 400, second transfusion group
Part, 500, coolant supply apparatus, 600, fixed seat, the 620, the 3rd mounting hole, 700, woven hose, 800, locking member, 900a, temperature
Degree detection part, 900b, temperature controller.
Specific embodiment
To make the objects, technical solutions and advantages of the present invention become more apparent, below in conjunction with accompanying drawing and specific embodiment party
Formula, is described in further detail to the present invention.It should be appreciated that specific embodiment described herein is only used to solve
The present invention is released, protection scope of the present invention is not limited.
As shown in Figure 1 to Figure 3, it is a kind of etched electrodes device for showing of the invention, including at least one electrode body
100, the inside of the electrode body 100 is provided with cooling duct 120, and the cooling duct 120 includes water inlet 122 and delivery port
124；Support frame 200, in the support frame 200, the support frame 200 is provided with least the electrode body 100
One the first mounting hole 220 and at least one second mounting holes 240；Transfusion mechanism, the transfusion mechanism includes the first transfusion group
The infusion set 400 of part 300 and second, first infusion set 300 be arranged in first mounting hole 220 and with it is described enter
The mouth of a river 122 connects, and second infusion set 400 is arranged in second mounting hole 240 and is connected with the delivery port 124；
And coolant supply apparatus 500, the coolant supply apparatus 500 and first infusion set 300, the second transfusion group
The pipeline of part 400 is connected.
Above-mentioned etched electrodes device installs electrode body 100 at least described in a box by the support frame 200, and
Cooling duct 120 is set inside the electrode body 100, the coolant supply apparatus 500 are passed through described first afterwards
Infusion set 300 connects with the water inlet 122 of cooling duct 120, by second infusion set 400 and cooling duct 120
Delivery port 124 connect.Thus by cooling duct 120 internal circulation flow of the coolant inside electrode body 100, Ke Yiyou
Effect reduces the heat that gas ionization clashes into electrode and produces, and then ensures that product etch uniformity is good, and etching speed is high, it is ensured that produce
Product preferably crudy.
Wherein, support frame 200 is semi-closed structure, and according to processing needs, the inside of support frame 200 can also be simultaneously
2 or more the battery lead plates of quantity (electrode body 100) are installed, two neighboring battery lead plate needs interval setting, it is ensured that enough is anti-
Answer liquid and gas to enter and reaction is participated in gap, elimination reaction interference.When the quantity of battery lead plate is for multiple, correspondingly first pacifies
The quantity in dress hole 220, the second mounting hole 240 and the first infusion set 300 and the second infusion set 400 is also multiple.
Fig. 2 is refer to, in an embodiment, first infusion set 300 and second infusion set 400 are included admittedly
Reservation 600, woven hose 700 and locking member 800, the fixed seat 600 are provided with and first mounting hole 220 and second peace
The 3rd mounting hole 620 that dress hole 240 is adapted, the woven hose 700 is arranged in first mounting hole 220 and the 3rd peace
Dress hole 620 or second mounting hole 240 or the 3rd mounting hole 620, the woven hose 700 stretch out the fixed seat 600
End be connected with the locking member 800.So not only electrode body 100 firmly can be fixed on support frame 200
On, and the connected mode simple structure, it is convenient to mount and dismount, be conducive to improving operating efficiency, while can also reliably lead coolant
Introduce in cooling duct 120, it is to avoid coolant is leaked, cause the wasting of resources and processing environment to pollute.Wherein, fixed seat
600 is cylindrical piece, and the quantity of cylindrical piece is two, is respectively separated the top outer for being arranged on support frame 200, is opened on cylindrical piece
Be provided with the 3rd mounting hole 620, now the 3rd mounting hole 620 respectively with the first mounting hole 220 and the second mounting hole 240 is coaxial sets
Put.Woven hose 700 is one section of pipe part, one end of pipe part through two groups of mounting holes respectively with the water inlet 122 of battery lead plate and
The grafting of delivery port 124, and the other end of pipe part stretches out cylindrical piece.The outer rim of the section of stretching out is provided with helicitic texture, locking member 800
It is nut, nut spins with helicitic texture pairing, so realizes the installation and fixation of woven hose 700.
Additionally, the circular channel that the through hole bore process of cooling duct 120 is opened up in the inside of electrode body 100, that is, cool down
The material of passage 120 is identical with the material of electrode body 100, for example, the conductive material such as aluminium alloy, stainless steel；Certainly, other
In implementation method, it would however also be possible to employ buried pipeline part in the space dug in electrode body 100, pipeline member uses non-conductive material
Material is made, and itself will not be damaged, and so after electrode reaction consumption for a long time, pipeline member can also take out and new battery lead plate
Assembling is used, and saves manufacture and use cost.
In one embodiment, the cooling duct 120 is in roundabout type structure, and along the bearing of trend of the electrode body 100
Arrangement.Thus can be adapted the laying area of cooling duct 120 and the extension area of electrode, and then ensure that coolant can be with
Flow through whole electrode, it is ensured that electrode cooling is reliable, it is to avoid the process quality issue that local cooling does not cause thoroughly.
Fig. 1 is refer to, further, above-mentioned etched electrodes device also includes at least one temperature sensing part 900a and temperature
Controller 900b, the temperature controller 900b are electrically connected with the coolant supply apparatus 500, the temperature sensing part
900a is arranged on the electrode body 100 and is communicated to connect with the temperature controller 900b.Thus pass through temperature sensing part
900a carries out real-time detection to the temperature of electrode body 100, and the break-make of coolant can be flexibly controlled by temperature controller 900b
Supply, it is ensured that the reliable operation of electrode body 100, it is ensured that product etch uniformity is good；Additionally, be also beneficial to reduce equipment loss and
Resource consumption, improves enterprise's production economy.Wherein, temperature sensing part 900a can be that contact or contactless temperature are passed
Sensor, it can in real time obtain the Temperature numerical of battery lead plate, and send data to temperature controller 900b, with temperature controller
Preset value (value of setting being thought according to various working conditions, it is ensured that etching reaction is carried out in optimal conditions) inside 900b enters
Row is compared, and output signal to coolant supply apparatus 500 by temperature controller 900b afterwards carries out supply control to coolant.It is cold
But liquid supplying device 500 can be cooling liquid bath, tank for coolant etc..
Additionally, in an embodiment, the quantity of the temperature sensing part 900a is multiple, multiple temperature sensing part 900a
Uniform intervals are arranged on the electrode body 100.Thus can more fully and sensitive each area of detecting electrode body 100
The temperature in domain, it is to avoid the problem of product processing quality uniformity difference caused by local temperature difference, it is ensured that etch uniformity is good.
In one embodiment, the electrode body 100 is provided with least one hollow-out parts 140, and the cooling duct 120 is included extremely
Few two channel units 126, between the hollow-out parts 140 are located at the two neighboring channel unit 126.Can so effectively improve
Area is amplified on the surface of electrode body 100 so that all ions produced in negative glow almost can bombarding cathode surface,
Improving the ionization in negative glow and cathode dark space, the occurrence probability of process such as excite so that etching current density and plasma
Density is greatly increased, so as to improve the etching speed of product.In a preferred embodiment, hollow-out parts 140 can be but not limited to
Rectangle hollow out, can also be the hollow out shape such as circle, triangle in other embodiment.
In one embodiment, the quantity of the hollow-out parts 140 is multiple, and the quantity of the channel unit 126 is multiple, described
Hollow-out parts 140 are alternately arranged with the channel unit 126.The surface area of electrode body 100 so is being improved, process velocity is being improved
While with uniformity, electrode can also fully be lowered the temperature by the coolant in channel unit 126, it is to avoid product temperature
It is too high, it is ensured that product processing quality is good.It is electrode connecting pole between two neighboring rectangle hollow out, channel unit 126 connects located at electrode
Connect inside post, when coolant passes through passage, it is possible to achieve the circumferential cooling that connecting pole is gone up along its length so that cooling
Effect is good.
In one embodiment, the quantitative range of the hollow-out parts 140 is：2~50.Thus can be according to various sizes of processing
Object flexibly sets the hollow-out parts 140 of varying number on electrode body 100, so as to be effectively improved processing conditions, improves product
Etching quality, lifts the scope of application of etched electrodes device.Multiple hollow-out parts 140 can be according to parallel construction, cross structure etc.
Mode is arranged.The quantity of hollow-out parts 140 also can also be other number ranges.
The present invention also provides a kind of plasma etcher, and it includes etched electrodes device as described above.
Above-mentioned plasma etcher by installing and using above-mentioned etched electrodes device, i.e., by the support frame 200
Electrode body 100 at least described in a box is inside installed, and cooling duct 120 is set inside the electrode body 100, afterwards by institute
State coolant supply apparatus 500 connected with the water inlet 122 of cooling duct 120 by first infusion set 300, by institute
The second infusion set 400 is stated to be connected with the delivery port 124 of cooling duct 120.Thus by coolant inside electrode body 100
The internal circulation flow of cooling duct 120, can effectively reduce gas ionization and clash into electrode and the heat that produces, and then ensure product
Etch uniformity is good, and etching speed is high, it is ensured that product preferably crudy.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope of this specification record is all considered to be.
Embodiment described above only expresses several embodiments of the invention, and its description is more specific and detailed, but simultaneously
Can not therefore be construed as limiting the scope of the patent.It should be pointed out that coming for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (9)
1. a kind of etched electrodes device, it is characterised in that including：
At least one electrode body, the inside of the electrode body is provided with cooling duct, the cooling duct include water inlet and
Delivery port；
Support frame, in the support frame, the support frame is provided with least one first installations to the electrode body
Hole and at least one second mounting holes；
Transfusion mechanism, the transfusion mechanism includes the first infusion set and the second infusion set, and first infusion set wears
Connected in first mounting hole and with the water inlet, second infusion set be arranged in second mounting hole and with
The delivery port connection；And
Coolant supply apparatus, the coolant supply apparatus and first infusion set, the second infusion set pipeline
Connection.
2. etched electrodes device according to claim 1, it is characterised in that the cooling duct is in roundabout type structure, and
Arranged along the bearing of trend of the electrode body.
3. etched electrodes device according to claim 1, it is characterised in that first infusion set and described second defeated
Liquid component includes fixed seat, woven hose and locking member, and the fixed seat is provided with and first mounting hole and second peace
The 3rd mounting hole that dress hole is adapted, the woven hose is arranged in first mounting hole and the 3rd mounting hole or described
Second mounting hole or the 3rd mounting hole, the end that the woven hose stretches out the fixed seat is connected with the locking member.
4. the etched electrodes device according to any one of claims 1 to 3, it is characterised in that also including at least one temperature
Detection part and temperature controller, the temperature controller are electrically connected with the coolant supply apparatus, the temperature sensing part
It is arranged on the electrode body and is communicated to connect with the temperature controller.
5. etched electrodes device according to claim 4, it is characterised in that the quantity of the temperature sensing part is multiple,
Multiple temperature sensing part uniform intervals are arranged on the electrode body.
6. etched electrodes device according to claim 1, it is characterised in that the electrode body is provided with least one hollow out
Portion, between the cooling duct includes that at least two channel units, the hollow-out parts are located at the two neighboring channel unit.
7. etched electrodes device according to claim 6, it is characterised in that the quantity of the hollow-out parts is multiple, described
The quantity of channel unit is multiple, and the hollow-out parts are alternately arranged with the channel unit.
8. etched electrodes device according to claim 1, it is characterised in that the quantitative range of the hollow-out parts is：2~
50。
9. a kind of plasma etcher, it includes the etched electrodes device as described in above-mentioned any one of claim 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710012092.9A CN106683971A (en) | 2017-01-06 | 2017-01-06 | Etching electrode device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710012092.9A CN106683971A (en) | 2017-01-06 | 2017-01-06 | Etching electrode device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106683971A true CN106683971A (en) | 2017-05-17 |
Family
ID=58849144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710012092.9A Pending CN106683971A (en) | 2017-01-06 | 2017-01-06 | Etching electrode device |
Country Status (1)
| Country | Link |
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| CN (1) | CN106683971A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108963299A (en) * | 2018-07-20 | 2018-12-07 | 珠海安普特科技有限公司 | A kind of novel electrode structure |
| CN110139458A (en) * | 2019-04-02 | 2019-08-16 | 珠海宝丰堂电子科技有限公司 | A kind of electrode assembly and plasma apparatus of plasma apparatus |
| CN110890267A (en) * | 2019-12-24 | 2020-03-17 | 昆山索坤莱机电科技有限公司 | Plasma photoresist device |
| CN111508812A (en) * | 2020-04-20 | 2020-08-07 | 昆山索坤莱机电科技有限公司 | Plasma electrode plate |
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| CN1466771A (en) * | 2000-10-26 | 2004-01-07 | 陶氏康宁爱尔兰有限公司 | An atmospheric pressure plasma assembly |
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| CN201194213Y (en) * | 2008-01-18 | 2009-02-11 | 东捷科技股份有限公司 | Pore type electrode having uniform electric field distribution |
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Application publication date: 20170517 |