CN106647188A - 一种双面对准的曝光系统 - Google Patents
一种双面对准的曝光系统 Download PDFInfo
- Publication number
- CN106647188A CN106647188A CN201710032482.2A CN201710032482A CN106647188A CN 106647188 A CN106647188 A CN 106647188A CN 201710032482 A CN201710032482 A CN 201710032482A CN 106647188 A CN106647188 A CN 106647188A
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- China
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- exposure
- faces
- alignment
- sample
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70308—Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70541—Tagging, i.e. hardware or software tagging of features or components, e.g. using tagging scripts or tagging identifier codes for identification of chips, shots or wafers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201710032482.2A CN106647188B (zh) | 2017-01-16 | 2017-01-16 | 一种双面对准的曝光系统 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201710032482.2A CN106647188B (zh) | 2017-01-16 | 2017-01-16 | 一种双面对准的曝光系统 |
Publications (2)
Publication Number | Publication Date |
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CN106647188A true CN106647188A (zh) | 2017-05-10 |
CN106647188B CN106647188B (zh) | 2020-09-04 |
Family
ID=58841936
Family Applications (1)
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CN201710032482.2A Active CN106647188B (zh) | 2017-01-16 | 2017-01-16 | 一种双面对准的曝光系统 |
Country Status (1)
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CN (1) | CN106647188B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108931893A (zh) * | 2017-05-27 | 2018-12-04 | 苏州微影激光技术有限公司 | 一种用于pcb生产线的ldi内层对位装置及对位方法 |
CN111965944A (zh) * | 2019-05-20 | 2020-11-20 | 中山新诺科技股份有限公司 | 一种新型双面双载板机构数字化直写曝光机及曝光方法 |
CN112684679A (zh) * | 2020-12-30 | 2021-04-20 | 中山新诺科技股份有限公司 | 一种双面数字化光刻系统上下图形对准的标定方法 |
CN114518695A (zh) * | 2020-11-20 | 2022-05-20 | 苏州源卓光电科技有限公司 | 一种双面曝光系统的校正方法和曝光方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05211112A (ja) * | 1991-07-31 | 1993-08-20 | Saiki Seisakusho:Kk | 露光装置における試料保持装置及び両面同時露光装置 |
US5334487A (en) * | 1992-07-23 | 1994-08-02 | International Business Machines Corporation | Method for forming a patterned layer on a substrate |
CN1094827A (zh) * | 1993-05-05 | 1994-11-09 | 哈尔滨工业大学 | 双面对版曝光机 |
EP1137970B1 (de) * | 1998-11-09 | 2006-06-21 | MANIA Technologie AG | Verfahren und vorrichtung zum ausrichten zweier fotomasken zueinander und eines unbelichteten leiterplatten-rohlings und zum anschliessenden simultanen belichten bei der herstellung von doppelseitigen leiterplatten |
CN102081312A (zh) * | 2009-11-26 | 2011-06-01 | 上海微电子装备有限公司 | 双面对准装置及其对准方法 |
CN202615113U (zh) * | 2011-08-15 | 2012-12-19 | 中山新诺科技有限公司 | 曝光系统、校准系统和光学引擎 |
CN102968000A (zh) * | 2012-11-21 | 2013-03-13 | 京东方科技集团股份有限公司 | 一种双面制程方法及曝光装置 |
CN104407502A (zh) * | 2014-11-19 | 2015-03-11 | 江苏影速光电技术有限公司 | 一种激光直接成像设备生产内层无孔电路板的方法 |
CN105278263A (zh) * | 2015-11-25 | 2016-01-27 | 四川聚能核技术工程有限公司 | 一种曝光机8ccd双面同时对位方式 |
-
2017
- 2017-01-16 CN CN201710032482.2A patent/CN106647188B/zh active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05211112A (ja) * | 1991-07-31 | 1993-08-20 | Saiki Seisakusho:Kk | 露光装置における試料保持装置及び両面同時露光装置 |
US5334487A (en) * | 1992-07-23 | 1994-08-02 | International Business Machines Corporation | Method for forming a patterned layer on a substrate |
CN1094827A (zh) * | 1993-05-05 | 1994-11-09 | 哈尔滨工业大学 | 双面对版曝光机 |
EP1137970B1 (de) * | 1998-11-09 | 2006-06-21 | MANIA Technologie AG | Verfahren und vorrichtung zum ausrichten zweier fotomasken zueinander und eines unbelichteten leiterplatten-rohlings und zum anschliessenden simultanen belichten bei der herstellung von doppelseitigen leiterplatten |
CN102081312A (zh) * | 2009-11-26 | 2011-06-01 | 上海微电子装备有限公司 | 双面对准装置及其对准方法 |
CN202615113U (zh) * | 2011-08-15 | 2012-12-19 | 中山新诺科技有限公司 | 曝光系统、校准系统和光学引擎 |
CN102968000A (zh) * | 2012-11-21 | 2013-03-13 | 京东方科技集团股份有限公司 | 一种双面制程方法及曝光装置 |
CN104407502A (zh) * | 2014-11-19 | 2015-03-11 | 江苏影速光电技术有限公司 | 一种激光直接成像设备生产内层无孔电路板的方法 |
CN105278263A (zh) * | 2015-11-25 | 2016-01-27 | 四川聚能核技术工程有限公司 | 一种曝光机8ccd双面同时对位方式 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108931893A (zh) * | 2017-05-27 | 2018-12-04 | 苏州微影激光技术有限公司 | 一种用于pcb生产线的ldi内层对位装置及对位方法 |
CN108931893B (zh) * | 2017-05-27 | 2024-06-21 | 苏州微影激光技术有限公司 | 一种用于pcb生产线的ldi内层对位装置及对位方法 |
CN111965944A (zh) * | 2019-05-20 | 2020-11-20 | 中山新诺科技股份有限公司 | 一种新型双面双载板机构数字化直写曝光机及曝光方法 |
CN114518695A (zh) * | 2020-11-20 | 2022-05-20 | 苏州源卓光电科技有限公司 | 一种双面曝光系统的校正方法和曝光方法 |
CN112684679A (zh) * | 2020-12-30 | 2021-04-20 | 中山新诺科技股份有限公司 | 一种双面数字化光刻系统上下图形对准的标定方法 |
Also Published As
Publication number | Publication date |
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CN106647188B (zh) | 2020-09-04 |
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TA01 | Transfer of patent application right |
Effective date of registration: 20181010 Address after: 221300 Huashan Road, Pizhou Economic Development Zone, Pizhou, Xuzhou, Jiangsu, China Applicant after: Jiangsu shadow Speed Technology Co., Ltd. Address before: 201612 401, room 9, 1158 Songjiang District Road, Songjiang District, Shanghai. Applicant before: Shanghai reputation Intelligent Equipment Co., Ltd. |
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TA01 | Transfer of patent application right |
Effective date of registration: 20190627 Address after: 221300 Huashan Road, Pizhou Economic Development Zone, Xuzhou, Jiangsu Applicant after: JIANGSU YINGSU PHOTOELECTRIC TECHNOLOGY CO., LTD. Address before: 221300 Huashan Road, Pizhou Economic Development Zone, Pizhou, Xuzhou, Jiangsu, China Applicant before: Jiangsu shadow Speed Technology Co., Ltd. |
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Address after: 221000 west side of Hengshan Road, Pizhou City, Xuzhou City, Jiangsu Province Applicant after: Jiangsu Yingsu integrated circuit equipment Co., Ltd Address before: 221300 Huashan Road, Pizhou Economic Development Zone, Jiangsu, China, Xuzhou Applicant before: JIANGSU YINGSU PHOTOELECTRIC TECHNOLOGY Co.,Ltd. |
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