CN106611720A - Accuracy control device and control method of slice box - Google Patents
Accuracy control device and control method of slice box Download PDFInfo
- Publication number
- CN106611720A CN106611720A CN201510681240.7A CN201510681240A CN106611720A CN 106611720 A CN106611720 A CN 106611720A CN 201510681240 A CN201510681240 A CN 201510681240A CN 106611720 A CN106611720 A CN 106611720A
- Authority
- CN
- China
- Prior art keywords
- film magazine
- unit
- precision
- valut
- control device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses an accuracy control device of a slice box. The accuracy control device comprises a motion unit, a guide unit, a power unit and a detection unit, wherein the motion unit is used for compressing the power unit to a trigger range of the detection unit along the guide unit when the slice box is placed on a slice library, and whether the slice box is correctly placed on the slice library or not is judged according to a trigger condition of the detection unit.
Description
Technical field
The present invention relates to a kind of integrated circuit equipment manufacturing field, more particularly to a kind of control device and control method of film magazine precision.
Background technology
The development of microelectric technique promotes the update of computer technology, the communication technology and other electronic information technologies, and important guide and basic role are played in information industry revolution, and litho machine is instrument indispensable in microelectronic component manufacturing industry.Chip transmission subsystem is the important composition subsystem of Advanced Packaging litho machine.In chip transmission subsystem, valut is used as the direct interface between material and equipment, it is necessary to meet efficient, high automation, the requirement of high security.
With the demand in market, litho machine is more and more lower for the tolerance of each subsystem maloperation;In chip transmission subsystem, it is to adopt manually to be operated the film magazine that needs are processed to be positioned over the operation main flow on valut, and minority is operated using machine.Artificial shortcoming is general character shortcoming, and when being affected by each side factor, artificial film magazine of placing is susceptible to error;The shortcoming of machine is complex structure, relatively costly, and due to repeating sex chromosome mosaicism during placement film magazine, deviation may still occur, and causes film magazine to place deviation;If the deviation of film magazine is not timely detected out, and is corrected, in follow-up operation, it will strong influence subsystem running efficiency and security.Therefore, increase what film magazine laying state monitoring function was a need in valut.The mechanism of a film magazine laying state detection function is described in Chinese patent CN201110233567.x, but it is placed function and uses single-point photoelectric sensor detection mode, because film magazine is when being positioned on valut, can there is the deviation of various multi-forms, if film magazine is exactly in the states such as transregional or side, the photoelectric sensor will be unable to detection, places the film magazine of mistake and will be operated into chip transmission subsystem.
The content of the invention
In order to overcome defect present in prior art, the present invention to disclose a kind of whether correct precision control device in energy automatic detection film magazine position.
In order to realize foregoing invention purpose, the present invention discloses a kind of control device of film magazine precision, including moving cell, pilot unit, power unit and detector unit, when film magazine is placed on valut, the moving cell compresses the power unit to the trigger range of the detector unit along the pilot unit, judges whether the film magazine is properly positioned on the valut according to the triggering situation of the detector unit.
Further, the film magazine precision control device is distributed in the plane that the valut is located in triangular form.
Further, the moving cell is a miniature stroke unit, and the power unit is a compression spring, and the pilot unit is a linear bearing.
Further, the linear bearing is installed on a support base.
Further, a butterfly latch closure is set between the support base and the detector unit.
Present invention simultaneously discloses a kind of control method of film magazine precision, including:When the film magazine is placed on valut, the film magazine is judged whether the film magazine is properly positioned on the valut by the trigger range of the moving cell of gravity compressed one a to detector unit according to the triggering situation of three detector units.
Further, the trigger range of the compression springs of moving cell Jing mono- bearing to the detector unit along a straight line.
Further, three detector units are distributed in the plane that the valut is located in triangular form.
Compared with prior art, the precision control device that the present invention is provided is mainly by moving cell, power unit, pilot unit, detector unit composition.Whether film magazine places the whether wrong triggering by detecting unit to be judged, the X/Y of film magazine determines face to be detected to precision is placed by 33 points of mechanical sensors, by the present invention, solution film magazine can be improved and place the unmanageable problem of precision, improve the efficiency of transmission subsystem, reliability and safety.
Description of the drawings
Can be described in detail by invention below with regard to the advantages and spirit of the present invention and institute's accompanying drawings are further understood.
Fig. 1 is the structural representation of valut provided by the present invention;
Fig. 2 is the sectional view of valut provided by the present invention;
Fig. 3 is the structural representation of film magazine precision control device provided by the present invention;
Fig. 4 is one of abnormal conditions schematic diagram for being likely to occur when film magazine provided by the present invention is positioned on valut;
Fig. 5 is the two of the abnormal conditions schematic diagram being likely to occur when film magazine provided by the present invention is positioned on valut;
Fig. 6 is the three of the abnormal conditions schematic diagram being likely to occur when film magazine provided by the present invention is positioned on valut;
Fig. 7 is film magazine and film magazine accuracy control method interface diagram;
Fig. 8 is that film magazine places precision controlling schematic diagram.
Specific embodiment
Describe the specific embodiment of the present invention in detail below in conjunction with the accompanying drawings.
Fig. 1 is the schematic diagram of the mechanical mechanism of the valut involved by the device.As shown in figure 1, film magazine bogey includes that film magazine places steady pin 10, film magazine places precision control device 20, piece cartridge locking apparatus 40, lock into place detection sensor 50, piece cartridge locking apparatus servomotor 60 and film magazine installing plate 30.
Fig. 2 is the profile of the frame for movement of the valut involved by the device.As shown in Fig. 2 film magazine places the both sides that accuracy apparatus 20 are located at piece cartridge locking apparatus 40.Wherein piece cartridge locking apparatus 40 include the dynamic plate 41 of piece cartridge locking apparatus, rail plate 42 and piece cartridge locking apparatus fixed board 43.
Fig. 3 is the frame for movement detailed view of the device, and mainly including moving cell, power unit, pilot unit, 4 parts of detector unit constitute.When film magazine is placed on valut, miniature stroke unit 21 is subject to the pressure for coming from the applying of film magazine bottom surface, move downward and start compression press spring 22, wherein linear bearing 23 is oriented to, when film magazine it is complete after falling on steady pin 10, mechanical pick-up device 26 end one segment distance of the miniature end of stroke unit 21 pressure in fixed seat 27, in the trigger range of mechanical sensor 26, mechanical pick-up device 26 is triggered the distance.After film magazine is lifted, act on the distress resolves on miniature stroke unit 21, the active force that spring 22 is produced drives miniature stroke unit 21 to move upwards, when it moves to butterfly clasp 25 contacts with mounting seat 24, due to defining mechanical position limitation, the stop motion of miniature stroke unit 21, now stage clip 22 is still in impaction state.
The abnormal conditions 1 being likely to occur when Fig. 4 is positioned on valut for film magazine, in situation as shown in Figure 4 when, 3 on valut precision control device, 2 are completely covered by film magazine, and 1 uncovered;Do not consider whether 2 triggered by the device that film magazine is covered, when 1 device is uncovered, because valut precision control device triggering mode is A (triggering) &B(Triggering)&C(Triggering), whole valut system will recognise that film magazine places abnormal, and operating personnel are reminded by significant red led;And valut system can keep safety interlock state, until abnormal releasing.This kind of abnormal conditions can also cover 2 uncovered situations of precision control device.
The abnormal conditions 2 being likely to occur when Fig. 5 is positioned on valut for film magazine, now 3 precision control devices all covered by film magazine bottom, 3 alignment pins are also completely covered, and the abnormal conditions that now film magazine may occur are that film magazine is integrally placed and biased.Due to cannot from top to bottom recognize that film magazine bottom contacts situation by naked eyes, this abnormal conditions are most common abnormal conditions when manually operating film magazine.In the abnormal conditions, film magazine bottom precision control device is possible to following several situations occur, and the first is that film magazine bottom directly contacts with film magazine installing plate shown in Fig. 1;It is for second film magazine by the direct jack-up of 3 steady pins;The third be film magazine part by jack-up, partly contact with film magazine installing plate, it is inclined.For the first situation, because mechanical sensor triggering distance is c1 ~ c2 (as shown in Figure 7), now mechanical sensor is depressed distance for (c1+b1)>C2, now all detection sensors be in non-triggering state, film magazine is placed abnormal.In second situation when, because steady pin is highly d1, now height d1>A1+b1, mechanical sensor will not be depressed, and film magazine is placed abnormal.In the third situation when, as shown in second situation, will not be depressed all the time by the sensor that region of steady pin jack-up is located, film magazine is placed abnormal.
The abnormal conditions 3 being likely to occur when Fig. 6 is positioned on valut for film magazine, now 3 steady pins are placed in the V-groove of film magazine bottom, but are not correctly positioned.Such case is more rare, but artificial placement is likely to result in the problem with machine placement.In this case, film magazine is placed and whether meets demand and hardly result in control, cannot complete to detect substantially using photo-electric detection mode.Here, we detected using the mechanical pressing detection modes of 3 points of arrangements, determine face by 33 points of mechanical sensor heads, one plane of formation.Accuracy detection sensor is placed due to each film magazine relation is found by miniature stroke unit and film magazine bottom, thus three-point shape into plane can regard parallel with the plane residing for film magazine bottom surface as.As shown in Figure 8, it is assumed that now 3 sensors are depressed respectively and trigger, the distance that three sensors are depressed respectively is e1, e2, e3, c1<e1,e2,e3<C2, the spacing between 3 sensors is respectively f1, f2, f3, and now the precision of the plane can be scaled Rx=(e2-e1)/ f1, Ry=[e3-(e2-e1)/ 2]/h, by being controlled to distance and sensor-triggered distance between 3 sensors, can be positioned over the attitude on valut by precise control film magazine according to demand.
Precision control device is mainly by moving cell, power unit, pilot unit, detector unit composition in the present invention;Whether film magazine places the whether wrong triggering by detecting unit to be judged, the X/Y of film magazine determines face to be detected to precision is placed by 33 points of mechanical sensors, by the present invention, solution film magazine can be improved and place the unmanageable problem of precision, improve the efficiency of transmission subsystem, reliability and safety.
The preferred embodiment of the simply present invention described in this specification, above example is only to illustrate technical scheme rather than limitation of the present invention.All those skilled in the art, all should be within the scope of the present invention under this invention's idea by the available technical scheme of logical analysis, reasoning, or a limited experiment.
Claims (8)
1. a kind of control device of film magazine precision, it is characterized in that, including moving cell, pilot unit, power unit and detector unit, when film magazine is placed on valut, the moving cell compresses the power unit to the trigger range of the detector unit along the pilot unit, judges whether the film magazine is properly positioned on the valut according to the triggering situation of the detector unit.
2. the control device of film magazine precision as claimed in claim 1, it is characterised in that the film magazine precision control device is distributed in the plane that the valut is located in triangular form.
3. the control device of film magazine precision as claimed in claim 1, it is characterised in that the moving cell is a miniature stroke unit, the power unit is a compression spring, and the pilot unit is a linear bearing.
4. the control device of film magazine precision as claimed in claim 3, it is characterised in that the linear bearing is installed on a support base.
5. the control device of film magazine precision as claimed in claim 4, it is characterised in that a butterfly latch closure is set between the support base and the detector unit.
6. a kind of control method of film magazine precision, it is characterised in that include:When film magazine is placed on valut, the film magazine is judged whether the film magazine is properly positioned on the valut by the trigger range of gravity compressed moving cell to detector unit according to the triggering situation of three detector units.
7. the control method of film magazine precision as claimed in claim 6, it is characterised in that trigger range of the compressed spring of the moving cell along linear bearing to the detector unit.
8. the control method of film magazine precision as claimed in claim 6, it is characterised in that three detector units are distributed in the plane that the valut is located in triangular form.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510681240.7A CN106611720B (en) | 2015-10-21 | 2015-10-21 | Control device and control method for accuracy of chip box |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510681240.7A CN106611720B (en) | 2015-10-21 | 2015-10-21 | Control device and control method for accuracy of chip box |
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CN106611720A true CN106611720A (en) | 2017-05-03 |
CN106611720B CN106611720B (en) | 2020-08-25 |
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CN201510681240.7A Active CN106611720B (en) | 2015-10-21 | 2015-10-21 | Control device and control method for accuracy of chip box |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108594150A (en) * | 2018-04-27 | 2018-09-28 | 深圳辉烨通讯技术有限公司 | a kind of calibration method, device, terminal and storage medium |
CN111430264A (en) * | 2019-08-16 | 2020-07-17 | 合肥晶合集成电路有限公司 | Semiconductor processing equipment and control method for loading wafer box thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030001116A1 (en) * | 2001-06-27 | 2003-01-02 | Applied Materials, Inc. | Locator pin integrated with sensor for detecting semiconductor substrate carrier |
CN101738177A (en) * | 2008-11-19 | 2010-06-16 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Level measuring device and method for detecting levelness of wafer box in semiconductor transmission system |
CN203721695U (en) * | 2014-01-22 | 2014-07-16 | 北京京东方光电科技有限公司 | Elevator and dry etching system |
-
2015
- 2015-10-21 CN CN201510681240.7A patent/CN106611720B/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030001116A1 (en) * | 2001-06-27 | 2003-01-02 | Applied Materials, Inc. | Locator pin integrated with sensor for detecting semiconductor substrate carrier |
CN101738177A (en) * | 2008-11-19 | 2010-06-16 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Level measuring device and method for detecting levelness of wafer box in semiconductor transmission system |
CN203721695U (en) * | 2014-01-22 | 2014-07-16 | 北京京东方光电科技有限公司 | Elevator and dry etching system |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108594150A (en) * | 2018-04-27 | 2018-09-28 | 深圳辉烨通讯技术有限公司 | a kind of calibration method, device, terminal and storage medium |
CN108594150B (en) * | 2018-04-27 | 2021-03-26 | 深圳辉烨物联科技有限公司 | Calibration method, calibration device, calibration terminal and storage medium |
CN111430264A (en) * | 2019-08-16 | 2020-07-17 | 合肥晶合集成电路有限公司 | Semiconductor processing equipment and control method for loading wafer box thereof |
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CN106611720B (en) | 2020-08-25 |
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Address after: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Zhang Road No. 1525 Applicant after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Address before: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Zhang Road No. 1525 Applicant before: Shanghai Micro Electronics Equipment Co., Ltd. |
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