CN101738177A - Level measuring device and method for detecting levelness of wafer box in semiconductor transmission system - Google Patents
Level measuring device and method for detecting levelness of wafer box in semiconductor transmission system Download PDFInfo
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- CN101738177A CN101738177A CN200810226663A CN200810226663A CN101738177A CN 101738177 A CN101738177 A CN 101738177A CN 200810226663 A CN200810226663 A CN 200810226663A CN 200810226663 A CN200810226663 A CN 200810226663A CN 101738177 A CN101738177 A CN 101738177A
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- measurement device
- level measurement
- pressure
- levelness
- pressure transducer
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Abstract
The invention discloses a level measuring device and a method for detecting the levelness of a wafer box in a semiconductor transmission system. The level measuring device is provided with at least three pressure sensors of which the lower ends are positioned on the same plane. The level measuring device is put into a slot of the wafer box in the semiconductor transmission system, the lower ends of the pressure sensors are supported in the slot of the wafer box, the pressure sensors on the high side and the pressure sensors on the low side sense different pressure signals because of self weight of the level measuring device when the wafer box and the slot thereof incline, and the levelness of the wafer box can be judged according to the different pressure signals sensed by the different pressure sensors. The level measuring device is convenient to use and has high measuring precision.
Description
Technical field
The present invention relates to a kind of collimation technique of semiconductor transmission system, relate in particular to the method for levelness of wafer box in a kind of level measurement device and the detection semiconductor transmission system.
Background technology
Platform is the transmission system in the semiconductor equipment, is made up of vacuum end (rear end) and atmosphere end (front end) two parts.
As shown in Figure 1, the atmospheric front end part is formed by combining by general frame EFEM (Equipment Front End Module, front equipment end module), mechanical arm 1 (Robot) and film magazine 2 (front-opening unified pod, FOUP front opening film magazine).The effect of platform is the substrate in the film magazine 2 (wafer) to be transferred to do technology in the process reaction chamber, passes back in the film magazine 2 along same path after technology is finished again.The effect of atmosphere end is exactly that substrate with 2 li of film magazines passes to the vacuum rear end.
In the said process, film magazine 2 is written into after EFEM goes up, and mechanical arm 1 can stretch in the film magazine 2 substrate is taken out, and at this moment, needs substrate to have consistent levelness with mechanical arm 1, otherwise the motion of getting/put of 1 pair of substrate of mechanical arm will irregularity, influences transmission precision.Therefore, need to judge whether film magazine 2 has consistent levelness with mechanical arm 1.
Because mechanical arm 1 is installed among the EFEM, EFEM and mechanical arm 1 generally all are that level is mounted, therefore, as long as judge whether the levelness of film magazine 2 meets the requirements.
As shown in Figure 2, in the prior art, employing be in film magazine 2, to place a substrate 4, on substrate 4, put level meter 3, rely on the demonstration of level meter 3 to judge the levelness of substrate 4.
There is following shortcoming at least in above-mentioned prior art:
On the one hand, level meter 3 weight own have certain influence to measurement result; On the other hand, because level meter 3 is generally the bubble level device, the positive usually top of its display position, therefore, if will observe the situation of bubble accurately, the sight line that needs the observer is perpendicular to level meter 3, still under normal circumstances, the people can't extend into head in the film magazine 2, and is influential to result of determination.
Summary of the invention
The purpose of this invention is to provide a kind of easy to use, level measurement device that degree of accuracy is high and detect the method for levelness of wafer box in the semiconductor transmission system.
The objective of the invention is to be achieved through the following technical solutions:
Level measurement device of the present invention comprises at least 3 pressure transducers, and the lower end of described at least 3 pressure transducers is in the same plane.
The method of levelness of wafer box in the detection semiconductor transmission system of the present invention comprises step:
At first, film magazine is put into semiconductor transmission system;
Then, above-mentioned level measurement device is put into the slot of described film magazine, in the described level measurement device, have at least the lower end of 3 pressure transducers to be supported in the described slot;
Afterwards, judge the levelness of described film magazine according to the described pressure signal that has at least 3 pressure transducers to feel.
As seen from the above technical solution provided by the invention, the method for levelness of wafer box in level measurement device of the present invention and the detection semiconductor transmission system.Because being provided with on the level measurement device has 3 pressure transducers at least, its lower end is in the same plane.Level measurement device is put into the slot of film magazine, the lower end of pressure transducer is supported in the slot of film magazine, when film magazine and slot inclination thereof, because the weight of level measurement device self, the pressure transducer of high side can be felt different pressure signals with the pressure transducer of downside, the difference of the pressure signal that can feel according to the different pressures sensor is judged the levelness of film magazine.Easy to use, measuring accuracy is high.
Description of drawings
Fig. 1 is the partial structurtes synoptic diagram of semiconductor transmission system in the prior art;
Fig. 2 is the synoptic diagram that detects the method for levelness of wafer box in the semiconductor transmission system in the prior art;
Fig. 3 a is the Facad structure synoptic diagram of level measurement device of the present invention;
Fig. 3 b is the reverse side structural representation of level measurement device of the present invention;
Fig. 4 is the circuit theory diagrams of level measurement device of the present invention;
Fig. 5 is the synoptic diagram of the method for levelness of wafer box in the detection semiconductor transmission system of the present invention.
Embodiment
Level measurement device of the present invention, its preferable embodiment comprise a plurality of pressure transducers 6 shown in Fig. 3 a, 3b, have 3 pressure transducers 6 at least, and concrete quantity can be selected 4,6,8 etc. as required.The lower end of a plurality of pressure transducers 6 is in the same plane.
Specifically a plurality of pressure transducers 6 can be fixed on the lower surface of installation base plate 5.The lower end of a plurality of pressure transducers 6 constitutes the plane, and this plane can be parallel with installation base plate 5, as required also can be not parallel.
The lower end of pressure transducer 6 can be connected with contact switch, and the upper surface of installation base plate 5 can be provided with pilot lamp 7 corresponding to the position of pressure transducer 6, can also be provided with power supply 8 on the installation base plate 5.
As shown in Figure 4, contact switch K is connected on the loop of pilot lamp 7 and power supply 8.Contact switch K can be a normal open switch, it also can be normally closed switch, when the suffered pressure in the lower end of pressure transducer 6 bears the threshold value of pressure greater than contact switch K, contact switch K moves (close or open), pilot lamp 7 indications can judge that the suffered pressure in lower end of pressure transducer 6 reaches preset threshold.
The center of gravity of level measurement device of the present invention can be higher or lower than the residing plane, lower end of a plurality of pressure transducers 6.Like this, when this plane inclination, because the pressure transducer 6 of top can change with the vertical range of the pressure transducer 6 of below apart from plumb line, therefore, the pressure transducer 6 of top just can change with the pressure that the pressure transducer 6 of below is experienced, wherein the pressure experienced of a side pressure transducer 6 can increase, when reaching preset threshold, and pilot lamp 7 indications.Thereby, realize that it measures the function of levelness.
The method of levelness of wafer box in the detection semiconductor transmission system of the present invention, its preferable embodiment comprises step as shown in Figure 5:
At first, film magazine 2 is put into the EFEM of semiconductor transmission system;
Then, above-mentioned level measurement device is put into the slot 9 of described film magazine 2, in the level measurement device, have at least the lower end of 3 pressure transducers to be supported in the slot 9.Like this, when slot 9 tilted, the pressure signal that 3 or a plurality of pressure transducer are felt just can be different, can judge successively that slot 9 is the levelness of film magazine 2.
The flat shape of the installation base plate 5 of level measurement device can make with film magazine 2 in the flat shape of the substrate shape that adapts, by mechanical arm 1 as this level measurement device that picks and places that picks and places substrate.Convenient, practical.
Can set a pressure threshold to the contact switch of pressure transducer, when the pressure that bears when pressure transducer surpassed this threshold value, contact switch disconnected or is closed, and indicated by pilot lamp; Then, judge the levelness of film magazine according to the indication information of the pilot lamp of a plurality of pressure transducer correspondences.
Specific embodiment, again referring to Fig. 3 a, 3b:
The profile of the installation base plate 5 of level measurement device is similar to semiconductor chip, front at installation base plate 5, orthogonal direction is installed a pair of pilot lamp 7 respectively, be integrated with the pressure transducer 6 of a contact-carrying function at corresponding each pilot lamp 7 in the back side of installation base plate 5, an also integrated rechargeable type power supply 8, pressure transducer 6 and pilot lamp 7 all pass through power supply 8 power supplies, on the power supply 8 switch can be arranged, before each the use power supply 8 is full of electricity, and switch opens is got final product.
Each pressure transducer 6 is connected with corresponding pilot lamp 7, constitutes a loop by power supply 8 and contact switch.4 pressure transducers 6 are distributed on the edge of installation base plate 5, can identical stressed higher limit (consider power supply weight, the value of setting has a little difference) be set all pressure transducers 6 in theory.
As to establish higher limit be 2 kilograms, when somewhere pressure transducer 6 is stressed when surpassing 2 kilograms, and contact switch closure then, the loop of pilot lamp 7 is connected, and pilot lamp 7 is bright; When pressure transducer 6 is stressed when being lower than 2 kilograms, contact switch is opened, and pilot lamp loop disconnects, and pilot lamp goes out.
Specifically, when level measurement device kept horizontality, the center of gravity vertical line overlapped with its center in theory, and each pressure transducer 6 is stressed even, and in the value of setting scope, contact switch is often opened, and pilot lamp does not work.If run-off the straight, then the center of gravity vertical line of level measurement device is offset, and the suffered power of pressure transducer 6 is different everywhere, and it is stressed above setting value just to have a sensor in one direction, and makes that corresponding pilot lamp is bright.
Among the present invention, can take all factors into consideration factors such as the weight of installation base plate own, sensor weight, power supply weight, wire weight, in being provided with of the stressed higher limit of pressure transducer, consider according to the accuracy requirement of design.Can directly show to come the determined level degree, and can regulate the horizontal degree measurement precision by the sensitivity of regulating sensor according to the result.
Level measurement device of the present invention is positioned in the slot of film magazine, according to its display result, determined level degree rapidly.The degree measurement result is accurate, rapid, easy;
In the level measurement device of the present invention, employing be pressure sensor apparatus (having the contact function), in the reality, also can adopt infrared sensor device etc.
The above; only for the preferable embodiment of the present invention, but protection scope of the present invention is not limited thereto, and anyly is familiar with those skilled in the art in the technical scope that the present invention discloses; the variation that can expect easily or replacement all should be encompassed within protection scope of the present invention.
Claims (10)
1. a level measurement device is characterized in that, comprises at least 3 pressure transducers, and the lower end of described at least 3 pressure transducers is in the same plane.
2. level measurement device according to claim 1 is characterized in that, comprises installation base plate, and described at least 3 pressure transducers are fixed in the lower surface of described installation base plate.
3. level measurement device according to claim 2 is characterized in that, residing plane, the lower end of described at least 3 pressure transducers is parallel with described installation base plate.
4. level measurement device according to claim 2, it is characterized in that, the lower end of described pressure transducer is connected with contact switch, and the upper surface of described installation base plate is provided with pilot lamp corresponding to the position of described pressure transducer, and the supply line of described pilot lamp is electrically connected with described contact switch.
5. level measurement device according to claim 4 is characterized in that described installation base plate is provided with power supply, and described power supply is electrically connected with described pilot lamp by described contact switch.
6. according to each described level measurement device of claim 1 to 5, it is characterized in that the center of gravity of this level measurement device is higher or lower than the residing plane, lower end of described at least 3 pressure transducers.
7. according to each described level measurement device of claim 1 to 5, it is characterized in that described pressure transducer has 4-8.
8. a method that detects levelness of wafer box in the semiconductor transmission system is characterized in that, comprises step:
At first, film magazine is put into semiconductor transmission system;
Then, each described level measurement device of claim 1 to 7 is put into the slot of described film magazine, in the described level measurement device, have at least the lower end of 3 pressure transducers to be supported in the described slot;
Afterwards, judge the levelness of described film magazine according to the described pressure signal that has at least 3 pressure transducers to feel.
9. the method for levelness of wafer box in the detection semiconductor transmission system according to claim 8, it is characterized in that, contact switch to described pressure transducer is set a pressure threshold, when the pressure that bears when described pressure transducer surpasses this threshold value, described contact switch disconnects or is closed, and indicates by pilot lamp;
Judge the levelness of described film magazine according to the described indication information that has the pilot lamp of 3 pressure transducer correspondences at least.
10. the method for levelness of wafer box according to Claim 8 or in the 9 described detection semiconductor transmission systems is characterized in that the flat shape of the substrate in the flat shape of the installation base plate of described level measurement device and the described film magazine adapts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810226663A CN101738177A (en) | 2008-11-19 | 2008-11-19 | Level measuring device and method for detecting levelness of wafer box in semiconductor transmission system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN200810226663A CN101738177A (en) | 2008-11-19 | 2008-11-19 | Level measuring device and method for detecting levelness of wafer box in semiconductor transmission system |
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| CN101738177A true CN101738177A (en) | 2010-06-16 |
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| CN200810226663A Pending CN101738177A (en) | 2008-11-19 | 2008-11-19 | Level measuring device and method for detecting levelness of wafer box in semiconductor transmission system |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105534177A (en) * | 2016-01-08 | 2016-05-04 | 广东建设职业技术学院 | Intelligent wardrobe |
| CN106611720A (en) * | 2015-10-21 | 2017-05-03 | 上海微电子装备有限公司 | Accuracy control device and control method of slice box |
| CN110957240A (en) * | 2018-09-27 | 2020-04-03 | 台湾积体电路制造股份有限公司 | Inductor, loading end and leveling method |
| CN111380505A (en) * | 2018-12-29 | 2020-07-07 | 宁波骏鑫信息科技有限公司 | Inclination detection device, inclination detection system and inclination detection method suitable for scaffold |
-
2008
- 2008-11-19 CN CN200810226663A patent/CN101738177A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106611720A (en) * | 2015-10-21 | 2017-05-03 | 上海微电子装备有限公司 | Accuracy control device and control method of slice box |
| CN106611720B (en) * | 2015-10-21 | 2020-08-25 | 上海微电子装备（集团）股份有限公司 | Control device and control method for accuracy of chip box |
| CN105534177A (en) * | 2016-01-08 | 2016-05-04 | 广东建设职业技术学院 | Intelligent wardrobe |
| CN105534177B (en) * | 2016-01-08 | 2021-06-25 | 广东建设职业技术学院 | Intelligent wardrobe |
| CN110957240A (en) * | 2018-09-27 | 2020-04-03 | 台湾积体电路制造股份有限公司 | Inductor, loading end and leveling method |
| CN111380505A (en) * | 2018-12-29 | 2020-07-07 | 宁波骏鑫信息科技有限公司 | Inclination detection device, inclination detection system and inclination detection method suitable for scaffold |
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Application publication date: 20100616 |