CN106611720B - Control device and control method for accuracy of chip box - Google Patents

Control device and control method for accuracy of chip box Download PDF

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Publication number
CN106611720B
CN106611720B CN201510681240.7A CN201510681240A CN106611720B CN 106611720 B CN106611720 B CN 106611720B CN 201510681240 A CN201510681240 A CN 201510681240A CN 106611720 B CN106611720 B CN 106611720B
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China
Prior art keywords
film
unit
cassette
library
box
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CN201510681240.7A
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Chinese (zh)
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CN106611720A (en
Inventor
黄明
王邵玉
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Shanghai Micro Electronics Equipment Co Ltd
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Shanghai Micro Electronics Equipment Co Ltd
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Priority to CN201510681240.7A priority Critical patent/CN106611720B/en
Publication of CN106611720A publication Critical patent/CN106611720A/en
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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67259Position monitoring, e.g. misposition detection or presence detection
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67259Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like

Abstract

The invention discloses a control device of the precision of a film cassette, which comprises a motion unit, a guide unit, a power unit and a detection unit, wherein when the film cassette is placed on a film library, the motion unit compresses the trigger range from the power unit to the detection unit along the guide unit, and judges whether the film cassette is correctly placed on the film library according to the trigger condition of the detection unit.

Description

Control device and control method for accuracy of chip box
Technical Field
The invention relates to the field of integrated circuit equipment manufacturing, in particular to a control device and a control method for accuracy of a chip box.
Background
The development of microelectronics has promoted the updating of computer technology, communication technology and other electronic information technology, and has played an important leading and fundamental role in the information industry revolution, and lithography machines are indispensable tools in the microelectronics manufacturing industry. The silicon chip transmission subsystem is an important component subsystem of an advanced packaging photoetching machine. In a silicon chip transmission subsystem, a chip library is used as a direct interface between materials and equipment, and the requirements of high efficiency, high automation and high safety must be met.
Along with the market demand, the tolerance of the photoetching machine to the misoperation of each subsystem is lower and lower; in a silicon chip transmission subsystem, the operation of placing a film box to be processed on a film library is mainly performed manually, and a few film boxes are operated by machines. The manual defect is a common defect, and when the manual defect is influenced by various factors, the manual sheet box placing is easy to make errors; the machine has the defects of complex structure and higher cost, and the deviation can still occur due to the repeatability problem when the film box is placed, so that the placing deviation of the film box is caused; if the deviation of the film box is not detected in time and corrected, the operation efficiency and safety of the subsystem can be greatly influenced in subsequent operation. Therefore, it is necessary to add a cassette placement state monitoring function in the cassette library. A mechanism for detecting the placement state of a wafer box is introduced in chinese patent No. cn201110233567.x, but the placement function adopts a single-point photoelectric sensor detection mode, and because the wafer box has various deviations in different forms when being placed on a wafer library, if the wafer box is just in a trans-zone or side-placing state, the photoelectric sensor cannot detect the wafer box, and the wafer box with the wrong placement can enter a silicon wafer transmission subsystem for operation.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention discloses a precision control device capable of automatically detecting whether the position of a film box is correct or not.
In order to achieve the purpose, the invention discloses a control device of the precision of a film cassette, which comprises a moving unit, a guide unit, a power unit and a detection unit, wherein when the film cassette is placed on a film library, the moving unit compresses a trigger range from the power unit to the detection unit along the guide unit, and judges whether the film cassette is correctly placed on the film library according to the trigger condition of the detection unit.
Furthermore, the film box precision control device is distributed on the plane of the film library in a triangular shape.
Furthermore, the moving unit is a micro stroke unit, the power unit is a compression spring, and the guiding unit is a linear bearing.
Further, the linear bearing is mounted on a support base.
Furthermore, a butterfly buckle is arranged between the supporting seat and the detection unit.
The invention also discloses a control method of the accuracy of the chip box, which comprises the following steps: when the film box is placed on the film library, the film box is compressed to the triggering range of a motion unit to a detection unit by gravity, and whether the film box is correctly placed on the film library is judged according to the triggering conditions of the three detection units.
Furthermore, the motion unit extends along a linear bearing to the triggering range of the detection unit through a compression spring.
Furthermore, the three detection units are distributed on the plane of the chip library in a triangular shape.
Compared with the prior art, the precision control device provided by the invention mainly comprises a motion unit, a power unit, a guide unit and a detection unit. Whether the film box is placed by mistake is judged by triggering of the detection unit, and the X/Y direction placing precision of the film box is detected by three-point fixing of 3 mechanical sensors.
Drawings
The advantages and spirit of the present invention can be further understood by the following detailed description of the invention and the accompanying drawings.
FIG. 1 is a schematic diagram of a library according to the present invention;
FIG. 2 is a cross-sectional view of a cassette provided by the present invention;
FIG. 3 is a schematic structural diagram of a cassette precision control device provided by the present invention;
FIG. 4 is a schematic diagram of an abnormal situation that may occur when the film cassette provided by the present invention is placed on a film library;
FIG. 5 is a second schematic diagram illustrating an abnormal situation that may occur when the film cassette provided by the present invention is placed in a film library;
FIG. 6 is a third schematic diagram illustrating an abnormal situation that may occur when the film cassette provided by the present invention is placed in a film library;
FIG. 7 is a schematic diagram of a cassette and a cassette precision control method interface;
FIG. 8 is a schematic diagram of cassette placement accuracy control.
Detailed Description
Specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
Figure 1 is a schematic view of the mechanical mechanism of the magazine to which the device relates. As shown in fig. 1, the cassette loading device includes a cassette placing fixing pin 10, a cassette placing accuracy control device 20, a cassette locking device 40, a lock-in-place detecting sensor 50, a cassette locking device servo motor 60, and a cassette mounting plate 30.
FIG. 2 is a cross-sectional view showing the mechanical structure of the magazine according to the present apparatus. As shown in fig. 2, the cassette placing accuracy device 20 is located at both sides of the cassette locking device 40. The cassette locking device 40 includes a cassette locking device moving plate 41, a slide rail 42, and a cassette locking device fixing plate 43.
Fig. 3 is a detailed view of the mechanical structure of the device, which mainly comprises 4 parts of a motion unit, a power unit, a guide unit and a detection unit. When the film cassette is placed on the film warehouse, the micro stroke unit 21 receives the pressure applied from the bottom surface of the film cassette, moves downwards and starts to compress the compression spring 22, wherein the linear bearing 23 guides, and after the film cassette is completely fallen on the fixed pin 10, the tail end of the micro stroke unit 21 presses the tail end of the mechanical sensor 26 on the fixed seat 27 for a distance which is within the triggering range of the mechanical sensor 26, and the mechanical sensor 26 triggers. When the cassette is taken up, the pressure acting on the micro stroke unit 21 disappears, the micro stroke unit 21 is driven to move upwards by the acting force generated by the spring 22, and when the cassette moves to the point that the butterfly-shaped snap ring 25 is contacted with the mounting seat 24, the micro stroke unit 21 stops moving due to the formation of mechanical limit, and at the moment, the pressure spring 22 is still in a compressed state.
FIG. 4 is an abnormal situation 1 that may occur when a cassette is placed on a library, in the situation shown in FIG. 4, 3 precision control devices are located on the library, 2 are completely covered by the cassette, and 1 is not covered; whether 2 devices covered by the film cassette are triggered or not is not considered, when 1 device is not covered, the film cassette placement abnormity can be recognized by the whole film library system due to the triggering modes of the film library precision control device, namely A (triggering) and B (triggering) and C (triggering), and the operator is reminded through a remarkable red indicator light; and the library system will remain in a safety interlock state until the exception is resolved. This abnormal situation may also cover the case where 2 precision control devices are not covered.
Fig. 5 shows an abnormal situation 2 that may occur when the cassette is placed on the magazine, where 3 precision control devices are all covered by the bottom of the cassette and 3 positioning pins are also completely covered, and where the cassette is placed in a biased manner. Since the contact condition of the bottom of the cassette cannot be recognized from top to bottom by naked eyes, the abnormal condition is the most common abnormal condition when the cassette is manually operated. In this abnormal situation, the cassette bottom precision control device may have several situations, the first is that the cassette bottom is directly contacted with the cassette mounting plate shown in fig. 1; the second is that the film box is directly jacked up by 3 fixing pins; the third is that the part of the wafer box is jacked up, and the part is contacted with the mounting plate of the wafer box to be in an inclined state. In the first case, since the mechanical sensor has a triggering distance of c 1-c 2 (as shown in fig. 7), the mechanical sensor is pressed down by a distance of (c1+ b1) > c2, and all the detecting sensors are in an unfired state, and the cassette is abnormally placed. In the second case, since the height of the fixing pin is d1, and the height d1> a1+ b1 is adopted, the mechanical sensor cannot be pressed down, and the cassette is abnormally placed. In the third case, as shown in the second case, the sensor in the region jacked up by the fixing pin is not pressed down all the time, and the cassette is placed abnormally.
Figure 6 shows an abnormal situation 3 that may occur when a cassette is placed in a magazine, where 3 pins are placed in a V-shaped groove in the bottom of the cassette, but not correctly. This is less common, but both manual and machine placement can cause this problem. Under the condition, whether the film box is placed to meet the requirements is difficult to control, and the detection cannot be basically finished by adopting a photoelectric detection mode. Here, we use a 3-point mechanical pressing detection method to detect, and 3 mechanical sensor heads are fixed on the surface by 3 points to form a plane. Because each cassette placement accuracy detection sensor finds a relationship with the cassette bottom through the micro stroke unit, the plane formed by the three points can be regarded as being parallel to the plane where the cassette bottom surface is located. As shown in fig. 8, assuming that 3 sensors are pressed and triggered respectively at this time, the distances between the three sensors are e1, e2, e3, c1< e1, e2, e3< c2, and the distances between the 3 sensors are f1, f2, and f3 respectively, at this time, the accuracy of the plane can be converted into Rx ═ (e2-e1)/f1, Ry ═ e3- (e2-e1)/2]/h, and by controlling the distances between the 3 sensors and the sensor triggering distances, the posture of the cassette placed on the cassette library can be accurately controlled according to the requirements.
The precision control device mainly comprises a motion unit, a power unit, a guide unit and a detection unit; whether the film box is placed by mistake is judged by triggering of the detection unit, and the X/Y direction placing precision of the film box is detected by three-point fixing of 3 mechanical sensors.
The embodiments described in the specification are only preferred embodiments of the present invention, and the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit the present invention. Those skilled in the art can obtain technical solutions through logical analysis, reasoning or limited experiments according to the concepts of the present invention, and all such technical solutions are within the scope of the present invention.

Claims (2)

1. A method for controlling accuracy of a cartridge, comprising: the control device of the cassette precision comprises a moving unit, a guide unit, a power unit and a detection unit, wherein when a cassette is placed on a cassette library, the moving unit compresses a trigger range from the power unit to the detection unit along the guide unit; the film box precision control devices are distributed on a plane where the film library is located in a triangular shape;
when the film box is placed on the film library, the film box is compressed to the triggering range of the movement unit to the detection unit by gravity, and whether the film box is correctly placed on the film library is judged according to the triggering conditions of the three detection units, wherein if any one of the three detection units is not covered, or all the three detection units are covered, and when all the three detection units are not triggered, the film box is judged to be incorrectly placed on the film library; if the three detection units are all covered and all triggered, the precision of the plane where the three detection units are located is judged according to the distance between the three detection units pressed by the film box and the mutual distance between the three detection units, and then the posture of the film box placed on the film library is judged.
2. The method of claim 1, wherein the motion unit is guided along a linear bearing to a trigger range of the detection unit via a compression spring.
CN201510681240.7A 2015-10-21 2015-10-21 Control device and control method for accuracy of chip box Active CN106611720B (en)

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CN108594150B (en) * 2018-04-27 2021-03-26 深圳辉烨物联科技有限公司 Calibration method, calibration device, calibration terminal and storage medium

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101738177A (en) * 2008-11-19 2010-06-16 北京北方微电子基地设备工艺研究中心有限责任公司 Level measuring device and method for detecting levelness of wafer box in semiconductor transmission system
CN203721695U (en) * 2014-01-22 2014-07-16 北京京东方光电科技有限公司 Elevator and dry etching system

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6573522B2 (en) * 2001-06-27 2003-06-03 Applied Matrials, Inc. Locator pin integrated with sensor for detecting semiconductor substrate carrier

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101738177A (en) * 2008-11-19 2010-06-16 北京北方微电子基地设备工艺研究中心有限责任公司 Level measuring device and method for detecting levelness of wafer box in semiconductor transmission system
CN203721695U (en) * 2014-01-22 2014-07-16 北京京东方光电科技有限公司 Elevator and dry etching system

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Address after: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Zhang Road No. 1525

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