CN106601655A - Chip monitoring device and chip monitoring method for chip upside-down mounting process - Google Patents
Chip monitoring device and chip monitoring method for chip upside-down mounting process Download PDFInfo
- Publication number
- CN106601655A CN106601655A CN201611245712.5A CN201611245712A CN106601655A CN 106601655 A CN106601655 A CN 106601655A CN 201611245712 A CN201611245712 A CN 201611245712A CN 106601655 A CN106601655 A CN 106601655A
- Authority
- CN
- China
- Prior art keywords
- chip
- image information
- salient point
- gripper shoe
- control signal
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
Abstract
The invention discloses a chip monitoring device and a chip monitoring method for a chip upside-down mounting process. The method comprises the following steps: the feature point image information of a bumped chip is preloaded to a control computer; the bumped chip is inverted and mounted on a chip surface mounting head by adsorption; the control computer sends a control signal according to the position information of a mobile mechanism and the chip surface mounting head to make the chip within the visual range of a shooting device, wherein the camera of the shooting device focuses on the tested bumped chip; the image information of the bumped surface of the bumped chip is acquired, the feature points in the image information are identified, a motion control signal is sent to the mobile mechanism, and the position of the chip surface mounting head is adjusted to make the feature points fit a preset feature point image; the bumped surface image information shot at the moment is stored; and whether the chip is usable is judged, and the judgment result is output and displayed. It is ensured that chips used in a chip upside-down mounting process are good. The use of bad chips, such as damaged chips and chips with damaged balls, is reduced. The control power for raw materials of devices is improved significantly.
Description
Technical field
The present invention relates to a kind of flip chip mounting process chip monitoring device and method, it is adaptable to upside-down mounting welding core reverse installation process
Process.
Background technology
Face-down bonding technique is one of key factor of impact flip chip bonding product quality, but due to the spy of flip-chip packaging processes
Point, chip needs to be mounted again on ceramic substrate after upset, and the salient point surface of chip cannot be carried out after chip is overturn
Observation, it is impossible to ensure the surface state of chip and salient point before flip chip bonding, and due to flip chip bonding encapsulated circuit salient point surface array row
The characteristics of cloth, after Reflow Soldering cannot butt welding point directly carry out visual examination, at present conventional method is carried out before flip-chip
The inspection of chip and solder joint, checking good carries out subsequent handling.But, if cause during flip-chip chip or
The damage of salient point, the damage that this process occurs cannot find, therefore certain hidden danger.And traditional flip-chip equipment possesses
Attachment and welding function, do not possess the observation in chip processes and writing function, if later stage circuit fails, chip and salient point
Reset condition cannot be reviewed, and cause Problem of Failure location difficulty.
The content of the invention
The present invention technology solve problem be：Overcome the deficiencies in the prior art, there is provided a kind of flip chip mounting process chip prison
Device is surveyed, monitoring and the record of chip status before chip face-down bonding is realized, the problems such as chip is damaged, soldered ball is damaged core is reduced
The use of piece, significantly improves the control dynamics of device raw material.
The present invention another technology solve problem be：Based on a kind of flip chip mounting process chip monitoring device, one is proposed
Flip chip mounting process chip monitoring process is planted, monitoring and the record of chip status before chip face-down bonding is realized, is reduced
The use of the problems such as chip is damaged, soldered ball is damaged chip, significantly improves the control dynamics of device raw material.
The present invention technical solution be：A kind of flip chip mounting process chip monitoring device, the monitoring device includes core
Piece mounting head, travel mechanism, camera arrangement and control computer, wherein：
Chip attachment head, is vertically fixedly mounted in travel mechanism, for absorption band bump chip；
Travel mechanism, under the driving of control computer motion control signal, drives chip attachment head horizontally or vertically
Motion；
Camera arrangement, in the horizontal plane, it takes pictures camera vertically upward to fixed placement, receives what control computer sent
Amplify control signal, the salient point surface of chip is taken pictures according to control signal is amplified, salient point surface image information is obtained, by salient point
Face image information is sent in real time to control computer；
Control computer, first, according to the positional information of default camera arrangement, and reads in real time the position of chip attachment head
Confidence ceases, and to travel mechanism motion control signal is sent, while according to the size with bump chip and its corresponding multiplication factor,
Send to camera arrangement and amplify control signal, until chip attachment head is centrally located at the center of the visual range of camera arrangement
Domain, and camera arrangement camera focuses with tested bump chip；Then, band bump chip salient point surface image information is obtained in real time,
Characteristic point in identification image information, to travel mechanism motion control signal, adjustment chip attachment head center are sent so that
Characteristic point is coincide with default feature dot image, afterwards, preserves the salient point surface image information for now shooting；Salient point surface image is believed
Breath is monitored, and judges whether chip can use, and exports and show judged result.
The characteristic point is located on chip diagonal, and characteristic point is the formation characteristic pattern on chip identification or diagonal top
The salient point array of case.
Further, the monitoring device also includes ring light, and the ring light is arranged on the camera week of camera arrangement
Enclose.
The resolution ratio of camera head of the camera arrangement is 1,500,000 pixel above colour imagery shots.
The travel mechanism include the first servomotor, the second servomotor, the 3rd servomotor, the first gripper shoe, the
Two gripper shoes, the 3rd gripper shoe, moving track, bracing frame, wherein,
First gripper shoe and the equal horizontal positioned of the second gripper shoe, the second gripper shoe overlays the first gripper shoe top, one end
It is fixedly mounted in the second gripper shoe perpendicular to horizontal plane, other end fixed installation shifting sledge, the 3rd gripper shoe is perpendicular to water
Plane, one end is arranged on slide rail, other end fixed installation chip attachment head；First servomotor and the second servomotor are received
The gripper shoe of control computer order-driven first and the second gripper shoe are moved in the horizontal plane along orthogonal moving track, the
Three servomotors receive the gripper shoe of control computer order-driven the 3rd and move along moving track vertical direction, so as to driving chip
Mounting head drives band bump chip movement.
The present invention another technical solution be：A kind of flip chip mounting process chip monitors process, and step is such as
Under：
Step one, prepackage band bump chip characteristic point image information to control computer, described image information includes pixel
Value and positional information；
Step 2, will be inverted with bump chip, absorption is arranged on chip attachment head；
Step 3, according to the positional information of default camera arrangement, and read the position of travel mechanism chip attachment head in real time
Confidence ceases, and to travel mechanism motion control signal is sent, while according to the size with bump chip and its corresponding multiplication factor,
Send to camera arrangement and amplify control signal, until chip attachment head is centrally located at the center of the visual range of camera arrangement
Domain, and camera arrangement shooting and the focusing of tested bump chip；
Step 4, in real time acquisition band bump chip salient point surface image information, recognize the characteristic point in image information, to movement
Mechanism sends motion control signal, adjustment chip attachment head center so that characteristic point is coincide with default feature dot image；
Step 5, automatically save the salient point surface image information for now shooting；
Step 6, salient point surface image information is monitored, judges whether chip can use, export and show judged result.
It is described to judge that the whether available concrete basis for estimation of chip is：Whether salient point lacks or whether salient point is damaged, convex
Point disappearance or damaged area are more than 10%, then it is assumed that unavailable, otherwise it is assumed that available.
The present invention has the advantages that compared with prior art：
(1), the present invention can monitoring chip upside-down mounting process chips and salient point surface state, prevent from using chip damage,
The bad chips such as salient point damage, reduce production disqualification rate；
(2) it is, of the invention when for different chip sizes, by the way that chip size information input computer is automatically determined
Shot region；
(3), the present invention can will move to camera arrangement top by travel mechanism with bump chip, and now camera is just right
Band bump chip, control is accurate；
(4), the picture that the present invention can be shot by display screen Real Time Observation, strengthens the visuality of test；
(5) it is, of the invention the picture taken pictures to be judged and be achieved, so as to later stage check.
(6), attachment process of the present invention suitable for various packagings such as chip attachment, capacitance/resistance attachments.
Description of the drawings
Fig. 1 is the front view of flip chip mounting process chip monitoring device；
Fig. 2 is camera arrangement front view；
Fig. 3 is travel mechanism's device front view.
Specific embodiment
Below in conjunction with the accompanying drawings the present invention is described in further detail：
As shown in figure 1, the invention provides a kind of flip chip mounting process chip monitoring device, the detection means is by chip patch
Dress 1, travel mechanism 2, camera arrangement 3 and control computer 4 are constituted.Wherein：
Chip attachment 1, is vertically fixedly mounted in travel mechanism 2, for absorption band bump chip；
Travel mechanism 2, under the driving of the motion control signal of control computer 4, drives the level of chip attachment 1 or hangs down
Straight motion；
Camera arrangement 3, in the horizontal plane, it takes pictures camera vertically upward to fixed placement, receives control computer 4 and sends
Amplification control signal, according to amplify control signal the salient point surface of chip is taken pictures, obtain salient point surface image information, will be convex
Point face image information is sent in real time to control computer 4；
Control computer 4, first, according to the positional information of default camera arrangement 3, and reads in real time chip attachment 1
Positional information, motion control signal is sent to travel mechanism 2, while according to the size with bump chip and its corresponding amplifying
Multiple, sends to camera arrangement 3 and amplifies control signal, until chip attachment 1 is centrally located at the visual range of camera arrangement 3
Central area, and the camera 6 of camera arrangement 3 and the focusing of tested bump chip；Then, band bump chip salient point surface figure is obtained in real time
As information, the characteristic point in image information is recognized, to travel mechanism 2 motion control signal, adjustment chip attachment 1 center are sent
Position so that characteristic point is coincide with default feature dot image；The characteristic point is located on chip diagonal, and characteristic point is chip
The salient point array of the formation characteristic pattern on mark or diagonal top；Afterwards, the salient point surface image information for now shooting is preserved；
Salient point surface image information is monitored, judges whether chip can use, export and show judged result.
The travel mechanism 2 includes the first servomotor 7, the second servomotor 8, the 3rd servomotor 9, the first gripper shoe
10th, the second gripper shoe 11, the 3rd gripper shoe 12, moving track 13, bracing frame 14.First gripper shoe 10 and the second gripper shoe 11 are equal
Horizontal positioned, the second gripper shoe 11 overlays the top of the first gripper shoe 10, and bracing frame 14 is " Γ " shape structure, and one end is perpendicular to water
Plane is fixedly mounted in the second gripper shoe 11, other end fixed installation shifting sledge 13, and the 3rd gripper shoe 12 is perpendicular to level
Face, one end is arranged on slide rail, other end fixed installation chip attachment 1；First servomotor 7 and the second servomotor 8 connect
Control computer order-driven the first gripper shoe 10 and the second gripper shoe 11 are received in the horizontal plane along orthogonal moving track
13 movements, the 3rd servomotor 12 receives the gripper shoe 12 of 4 order-driven of control computer the 3rd along the vertical direction of moving track 13
It is mobile, so as to driving chip mounting head 1 drives band bump chip movement.
In order that illumination condition is more preferable when camera is taken pictures, the photo for coming of breaking forth becomes apparent from completely.Detection means includes
Ring light 5, the ring light 5 is arranged on around the camera 6 of camera arrangement 3.
The resolution ratio of camera 6 of the camera arrangement 3 is 1,500,000 pixel above colour imagery shots.
The present invention provides a kind of flip chip mounting process chip and monitors process, the method step always according to said apparatus
It is as follows：
Step one, prepackage band bump chip characteristic point image information to control computer 4, described image information includes pixel
Value and positional information；
Step 2, will be inverted with bump chip, absorption is arranged in chip attachment 1；Using inverted mode fixed core
Piece and the surface state of salient point, prevent from using the bad chips such as chip damage, salient point damage, reduce production disqualification rate；
Step 3, according to the positional information of default camera arrangement, and read travel mechanism 2 chip attachment 1 in real time
Positional information, sends motion control signal, while according to the size with bump chip and its corresponding times magnification to travel mechanism 2
Number, sends to camera arrangement 3 and amplifies control signal, until chip attachment 1 is centrally located in the visual range of camera arrangement 3
Heart district domain, and the camera 6 of camera arrangement 3 and the focusing of tested bump chip；
The concrete grammar of focusing is：The height of camera 6 is manually adjusted, the bottom diagram picture of chip attachment 1 is allowed in control
It is clear on computer, the then height of fixing camera 6.Chip thickness, control computer 4 are input in control computer 4
According to the identical of chip thickness lifting chip attachment 1 height, so as to realize camera 6 and the focusing with bump chip.It is being directed to
During different chip size, by the way that chip size information input computer is automatically determined into shot region.
Step 4, in real time acquisition band bump chip salient point surface image information, recognize the characteristic point in image information, to movement
Mechanism 1 sends motion control signal, adjustment chip attachment 1 center so that characteristic point is kissed with default feature dot image
Close；
Step 5, the salient point surface image information for now shooting is automatically saved, so as to later stage check；
Step 6, salient point surface image information is monitored, judges whether chip can use, export and show judged result.
It is described to judge that the whether available concrete basis for estimation of chip is：Whether salient point lacks or whether salient point damaged, salient point disappearance or
Person's breakage area is more than 10%, then it is assumed that unavailable, otherwise it is assumed that available.
3 batches of monitorings for amounting to 100 flip chip mounting process are carried out according to above-mentioned steps, 8 chips damages, soldered balls are rejected altogether
The problems such as damage chip, the qualified yield rate of device improves 8%.
Apparatus and method of the present invention can ensure that the chip that flip chip mounting process is used is good chip, reduce chip damage
The use of the problems such as wound, soldered ball are damaged chip, significantly improves the control dynamics of device raw material.Meanwhile, the present invention is applied to
The attachment process of various packagings such as chip attachment, capacitance/resistance attachment.The flip-chip of different money products is carried out, is only needed
It is identified positioning the typing of image and the change of chip size.
The above, only one specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, and appoints
What those familiar with the art the invention discloses technical scope in, the change or replacement that can be readily occurred in, all
Should be included within the scope of the present invention.
The content not being described in detail in description of the invention belongs to the known technology of professional and technical personnel in the field.
Claims (7)
1. a kind of flip chip mounting process chip monitoring device, it is characterised in that including chip attachment head (1), travel mechanism (2), clap
According to device (3) and control computer (4), wherein：
Chip attachment head (1), is vertically fixedly mounted in travel mechanism (2), for absorption band bump chip；
Travel mechanism (2), under the driving of control computer (4) motion control signal, drive chip attachment head (1) level or
Vertical movement；
Camera arrangement (3), in the horizontal plane, it takes pictures camera vertically upward to fixed placement, receives control computer (4) and sends
Amplification control signal, according to amplify control signal the salient point surface of chip is taken pictures, obtain salient point surface image information, will be convex
Point face image information is sent in real time to control computer (4)；
Control computer (4), first, according to the positional information of default camera arrangement (3), and reads in real time chip attachment head
(1) positional information, to travel mechanism (2) motion control signal is sent, while according to the size with bump chip and its accordingly
Multiplication factor, to camera arrangement (3) send amplify control signal, until chip attachment head (1) is centrally located at camera arrangement (3)
Visual range central area, and camera arrangement (3) camera (6) and tested bump chip focusing；Then, band is obtained in real time
Bump chip salient point surface image information, recognizes the characteristic point in image information, and to travel mechanism (2) motion control signal is sent,
Adjustment chip attachment head (1) center so that characteristic point is coincide with default feature dot image, afterwards, preservation now shoots
Salient point surface image information；Salient point surface image information is monitored, judges whether chip can use, export and show judgement knot
Really.
2. the device that a kind of flip chip mounting process chip according to claim 1 is monitored, it is characterised in that：The characteristic point
On chip diagonal, characteristic point is the salient point array of the formation characteristic pattern on chip identification or diagonal top.
3. the device that a kind of flip chip mounting process chip according to claim 1 is monitored, it is characterised in that also including annular
Light (5), the ring light (5) is around the camera (6) of camera arrangement (3).
4. the device that a kind of flip chip mounting process chip according to claim 1 is monitored, it is characterised in that the dress of taking pictures
Camera (6) resolution ratio for putting (3) is 1,500,000 pixel above colour imagery shots.
5. the device that a kind of flip chip mounting process chip according to claim 1 is monitored, it is characterised in that the moving machine
Structure (2) including the first servomotor (7), the second servomotor (8), the 3rd servomotor (9), the first gripper shoe (10), second
Gripper shoe (11), the 3rd gripper shoe (12), moving track (13), bracing frame (14), wherein,
First gripper shoe (10) and the second gripper shoe (11) horizontal positioned, the second gripper shoe (11) overlays the first gripper shoe
(10) top, one end is fixedly mounted in the second gripper shoe (11) perpendicular to horizontal plane, other end fixed installation shifting sledge
(13), perpendicular to horizontal plane, one end is arranged on slide rail the 3rd gripper shoe (12), other end fixed installation chip attachment head (1)；
First servomotor (7) and the second servomotor (8) receive control computer the first gripper shoe of order-driven (10) and second
Fagging (11) is mobile along orthogonal moving track (13) in the horizontal plane, and the 3rd servomotor (12) receives control computer
(4) gripper shoe (12) of order-driven the 3rd is moved along moving track (13) vertical direction, so as to driving chip mounting head (1) drive
Band bump chip movement.
6. a kind of a kind of flip chip mounting process chip of utilization claim 1 described device monitors process, it is characterised in that
Step is as follows：
Step one, prepackage band bump chip characteristic point image information to control computer (4), described image information includes pixel value
And positional information；
Step 2, will be inverted with bump chip, absorption is arranged on chip attachment head (1)；
Step 3, according to the positional information of default camera arrangement, and read travel mechanism (2) chip attachment head (1) in real time
Positional information, to travel mechanism (2) motion control signal is sent, while according to the size with bump chip and its corresponding amplification
Multiple, sends to camera arrangement (3) and amplifies control signal, until chip attachment head (1) is centrally located at the visual of camera arrangement (3)
The central area of scope, and camera arrangement (3) camera (6) and the focusing of tested bump chip；
Step 4, in real time acquisition band bump chip salient point surface image information, recognize the characteristic point in image information, to travel mechanism
(1) motion control signal is sent, adjusts chip attachment head (1) center so that characteristic point is kissed with default feature dot image
Close；
Step 5, automatically save the salient point surface image information for now shooting；
Step 6, salient point surface image information is monitored, judges whether chip can use, export and show judged result.
7. a kind of a kind of flip chip mounting process chip of utilization claim 1 described device monitors process, it is characterised in that
It is described to judge that the whether available concrete basis for estimation of chip is：Whether salient point lacks or whether salient point damaged, salient point disappearance or
Person's breakage area is more than 10%, then it is assumed that unavailable, otherwise it is assumed that available.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611245712.5A CN106601655B (en) | 2016-12-29 | 2016-12-29 | Chip monitoring device and method for chip flip process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611245712.5A CN106601655B (en) | 2016-12-29 | 2016-12-29 | Chip monitoring device and method for chip flip process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106601655A true CN106601655A (en) | 2017-04-26 |
| CN106601655B CN106601655B (en) | 2020-02-21 |
Family
ID=58605013
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611245712.5A Active CN106601655B (en) | 2016-12-29 | 2016-12-29 | Chip monitoring device and method for chip flip process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106601655B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1988121A (en) * | 2005-12-22 | 2007-06-27 | 优利讯国际贸易有限责任公司 | Method for mounting a flip chip on a substrate |
| US20150015286A1 (en) * | 2013-07-12 | 2015-01-15 | Delta Design, Inc. | Micro-vision alignment system with guiding rings for ic testing |
| CN105006445A (en) * | 2015-06-26 | 2015-10-28 | 北京中电科电子装备有限公司 | Pre-alignment system and method for bonding flip chip |
-
2016
- 2016-12-29 CN CN201611245712.5A patent/CN106601655B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1988121A (en) * | 2005-12-22 | 2007-06-27 | 优利讯国际贸易有限责任公司 | Method for mounting a flip chip on a substrate |
| US20150015286A1 (en) * | 2013-07-12 | 2015-01-15 | Delta Design, Inc. | Micro-vision alignment system with guiding rings for ic testing |
| CN105006445A (en) * | 2015-06-26 | 2015-10-28 | 北京中电科电子装备有限公司 | Pre-alignment system and method for bonding flip chip |
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| Publication number | Publication date |
|---|---|
| CN106601655B (en) | 2020-02-21 |
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