CN106601655B - Chip monitoring device and method for chip flip process - Google Patents
Chip monitoring device and method for chip flip process Download PDFInfo
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- CN106601655B CN106601655B CN201611245712.5A CN201611245712A CN106601655B CN 106601655 B CN106601655 B CN 106601655B CN 201611245712 A CN201611245712 A CN 201611245712A CN 106601655 B CN106601655 B CN 106601655B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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Abstract
The invention discloses a chip monitoring device and method for a chip flip process. Firstly, pre-loading feature point image information of a chip with salient points to a control computer, then inverting the chip with the salient points, adsorbing and installing the chip on a chip mounting head, sending a control signal to the control computer according to the position information of a moving mechanism and the chip mounting head so that the chip is positioned in a visible range of a photographing device, focusing a camera of the photographing device and the chip with the salient points to be detected, acquiring the image information of the surface of the salient points of the chip with the salient points in real time, identifying the feature points in the image information, sending a motion control signal to the moving mechanism, adjusting the position of the chip mounting head so that the feature points are matched with the pre-set feature point images, storing the image information of the surface of the salient points shot at the moment, judging whether the chip is available, and outputting and displaying. The invention can ensure that the chip used in the chip flip process is a good chip, reduces the use of the chip with the problems of chip damage, solder ball damage and the like, and obviously improves the control strength of raw materials of devices.
Description
Technical Field
The invention relates to a chip monitoring device and method for a chip flip process, which are suitable for a flip chip flip process.
Background
The flip-chip bonding technique is one of the important factors that influence flip-chip bonding product quality, but because the characteristics of flip-chip bonding packaging technology, the chip need paste dress again after the upset on the ceramic substrate, and the chip can't observe the salient point face of chip after overturning, can't guarantee the surface state of chip and bump before the flip-chip bonding, and because the characteristics that flip-chip bonding packaging circuit salient point face array was arranged, can't directly carry out visual inspection to the solder joint after the reflow soldering, the method commonly used at present carries out the inspection of chip and solder joint before the chip flip-chip, the inspection is good carries out subsequent handling. However, if the chip or the bump is damaged in the flip-chip process, the damage in the process cannot be found, so that certain potential hazards exist. And traditional chip flip-chip equipment possesses subsides dress and welding function, does not possess the observation and the record function of chip in-process, if the circuit takes place to become invalid in later stage, chip and bump original state can't be traced back, causes the problem of failure to fix a position the difficulty.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the defects of the prior art are overcome, the chip flip-chip process monitoring device is provided, the monitoring and recording of the state of the chip before the chip flip-chip welding are realized, the use of the chip with the problems of chip damage, solder ball damage and the like is reduced, and the control strength of raw materials of devices is obviously improved.
The other technical solution problem of the invention is: based on a chip monitoring device for a chip flip process, the chip monitoring process method for the chip flip process is provided, the monitoring and recording of the state of the chip before the chip flip welding are realized, the use of the chip with the problems of chip damage, solder ball damage and the like is reduced, and the control strength of raw materials of devices is remarkably improved.
The technical solution of the invention is as follows: the utility model provides a chip flip-chip technology chip monitoring devices, this monitoring devices includes chip mounting head, moving mechanism, the device of shooing and control computer, wherein:
the chip mounting head is vertically and fixedly arranged on the moving mechanism and used for adsorbing the chip with the salient points;
the moving mechanism is driven by a control computer motion control signal to drive the chip mounting head to move horizontally or vertically;
the photographing device is fixedly placed on a horizontal plane, a photographing camera of the photographing device is vertically upward, the photographing device receives an amplification control signal sent by the control computer, photographs the convex point surface of the chip according to the amplification control signal, obtains convex point surface image information and sends the convex point surface image information to the control computer in real time;
the control computer firstly reads the position information of the chip mounting head in real time according to the preset position information of the photographing device, sends a motion control signal to the moving mechanism, and simultaneously sends an amplification control signal to the photographing device according to the size and the corresponding amplification factor of the chip with the salient points until the center of the chip mounting head is positioned in the central area of the visible range of the photographing device, and the camera of the photographing device is focused with the chip with the salient points to be detected; then, acquiring salient point surface image information of the chip with salient points in real time, identifying characteristic points in the image information, sending a motion control signal to a moving mechanism, adjusting the center position of a chip mounting head to enable the characteristic points to be matched with a preset characteristic point image, and then storing the image information of the salient point surface shot at the moment; and monitoring the image information of the convex point surface, judging whether the chip is available, and outputting and displaying a judgment result.
The characteristic points are positioned on the diagonal line of the chip, and the characteristic points are chip marks or salient point arrays forming characteristic patterns at the top end of the diagonal line.
Further, the monitoring device further comprises an annular light, and the annular light is installed around a camera of the photographing device.
The camera resolution of the photographing device is a color camera with more than 150 ten thousand pixels.
The moving mechanism comprises a first servo motor, a second servo motor, a third servo motor, a first supporting plate, a second supporting plate, a third supporting plate, a moving track and a supporting frame, wherein,
the first supporting plate and the second supporting plate are horizontally arranged, the second supporting plate is stacked above the first supporting plate, one end of the second supporting plate is perpendicular to the horizontal plane and fixedly installed on the second supporting plate, the other end of the second supporting plate is fixedly installed with a movable sliding rail, the third supporting plate is perpendicular to the horizontal plane, one end of the third supporting plate is installed on the sliding rail, and the other end of the third supporting plate is fixedly installed with a chip mounting head; the first servo motor and the second servo motor receive and control computer instructions to drive the first supporting plate and the second supporting plate to move on the horizontal plane along the moving tracks which are vertical to each other, and the third servo motor receives and controls computer instructions to drive the third supporting plate to move along the vertical direction of the moving tracks, so that the chip mounting head is driven to move the chip with the salient points.
The other technical solution of the invention is as follows: a chip monitoring process method for a chip flip process comprises the following steps:
step one, pre-installing salient point chip characteristic point image information to a control computer, wherein the image information comprises pixel values and position information;
inverting the chip with the salient points, and adsorbing and mounting the chip on a chip mounting head;
step three, reading the position information of the chip mounting head of the moving mechanism in real time according to the preset position information of the photographing device, sending a motion control signal to the moving mechanism, sending an amplification control signal to the photographing device according to the size of the chip with the salient points and the corresponding amplification times of the chip with the salient points at the same time until the center of the chip mounting head is positioned in the central area of the visible range of the photographing device, and focusing the photographing device with the detected salient point chip;
acquiring salient point surface image information of the chip with the salient points in real time, identifying characteristic points in the image information, sending a motion control signal to the moving mechanism, and adjusting the central position of the chip mounting head to enable the characteristic points to be matched with a preset characteristic point image;
step five, automatically storing the information of the convex point surface image shot at the moment;
and step six, monitoring the image information of the convex point surface, judging whether the chip is available, and outputting and displaying a judgment result.
The specific judgment basis for judging whether the chip is available is as follows: and if the salient points are missing or broken, and if the area of missing or broken salient points exceeds 10%, determining that the salient points are not usable, otherwise, determining that the salient points are usable.
Compared with the prior art, the invention has the following beneficial effects:
(1) the invention can monitor the surface state of the chip and the salient points in the flip chip process, prevent the use of bad chips such as chip damage and salient point damage and reduce the production failure rate;
(2) when aiming at different chip sizes, the invention automatically determines the photographing area by inputting the chip size information into the computer;
(3) the invention can move the chip with the salient point to the upper part of the photographing device through the moving mechanism, and the camera is over against the chip with the salient point, so that the control is accurate;
(4) the invention can observe the shot picture in real time through the display screen, thereby enhancing the visibility of the test;
(5) the invention can judge and file the photographed picture for later review.
(6) The invention is suitable for the mounting process of various packaged devices such as chip mounting, capacitor/resistor mounting and the like.
Drawings
FIG. 1 is a front view of a chip monitoring device for a flip chip process;
FIG. 2 is a front view of the photographing apparatus;
fig. 3 is a front view of the moving mechanism device.
Detailed Description
The invention is described in further detail below with reference to the attached drawing figures:
as shown in fig. 1, the invention provides a chip monitoring device for a chip flip process, which comprises a chip mounting head 1, a moving mechanism 2, a photographing device 3 and a control computer 4. Wherein:
the chip mounting head 1 is vertically and fixedly arranged on the moving mechanism 2 and used for adsorbing a chip with salient points;
the moving mechanism 2 is driven by a motion control signal of the control computer 4 to drive the chip mounting head 1 to move horizontally or vertically;
the photographing device 3 is fixedly placed on a horizontal plane, a photographing camera of the photographing device is vertically upward, receives an amplification control signal sent by the control computer 4, photographs the convex point surface of the chip according to the amplification control signal, obtains convex point surface image information, and sends the convex point surface image information to the control computer 4 in real time;
the control computer 4 firstly reads the position information of the chip mounting head 1 in real time according to the preset position information of the photographing device 3, sends a motion control signal to the moving mechanism 2, and simultaneously sends an amplification control signal to the photographing device 3 according to the size and the corresponding amplification factor of the chip with the salient points until the center of the chip mounting head 1 is positioned in the central area of the visible range of the photographing device 3, and the camera 6 of the photographing device 3 focuses on the chip with the salient points to be detected; then, acquiring salient point surface image information of the chip with the salient points in real time, identifying characteristic points in the image information, sending a motion control signal to the moving mechanism 2, and adjusting the central position of the chip mounting head 1 to enable the characteristic points to be matched with a preset characteristic point image; the characteristic points are positioned on diagonal lines of the chip, and the characteristic points are chip marks or salient point arrays forming characteristic patterns at the top ends of the diagonal lines; then, saving the convex point surface image information shot at the moment; and monitoring the image information of the convex point surface, judging whether the chip is available, and outputting and displaying a judgment result.
The moving mechanism 2 comprises a first servo motor 7, a second servo motor 8, a third servo motor 9, a first supporting plate 10, a second supporting plate 11, a third supporting plate 12, a moving track 13 and a supporting frame 14. The chip mounting structure comprises a first supporting plate 10, a second supporting plate 11, a supporting frame 14, a chip mounting head 1, a chip mounting head and a chip mounting head, wherein the first supporting plate 10 and the second supporting plate 11 are both horizontally arranged, the second supporting plate 11 is stacked above the first supporting plate 10, the supporting frame is of a T-shaped structure, one end of the supporting frame is perpendicular to the horizontal plane and is fixedly mounted on the second supporting plate 11, the other end of the supporting frame is fixedly mounted; the first servo motor 7 and the second servo motor 8 receive the instruction of the control computer to drive the first supporting plate 10 and the second supporting plate 11 to move on the horizontal plane along the moving tracks 13 which are vertical to each other, and the third servo motor 12 receives the instruction of the control computer 4 to drive the third supporting plate 12 to move along the vertical direction of the moving tracks 13, so that the chip mounting head 1 is driven to drive the chip with the salient points to move.
In order to make the camera better in illumination condition when taking a picture, the taken picture is clearer and more complete. The detection means comprise an annular light 5, said annular light 5 being mounted around a camera 6 of the photographing means 3.
The resolution of the camera 6 of the photographing device 3 is a color camera with more than 150 ten thousand pixels.
The invention also provides a chip monitoring process method for the chip flip process according to the device, which comprises the following steps:
step one, pre-installing salient point chip characteristic point image information to a control computer 4, wherein the image information comprises pixel values and position information;
step two, inverting the chip with the salient points, and adsorbing and mounting the chip on the chip mounting head 1; the surface states of the chip and the salient points are fixed in an inverted mode, so that bad chips such as chip damage and salient point damage are prevented from being used, and the production failure rate is reduced;
step three, reading the position information of the chip mounting head 1 of the moving mechanism 2 in real time according to the preset position information of the photographing device, sending a motion control signal to the moving mechanism 2, and sending an amplification control signal to the photographing device 3 according to the size of the chip with the salient points and the corresponding amplification times of the chip with the salient points until the center of the chip mounting head 1 is positioned in the central area of the visible range of the photographing device 3, and focusing a camera 6 of the photographing device 3 on the chip with the salient points to be detected;
the specific focusing method comprises the following steps: the height of the camera 6 is manually adjusted to make the bottom image of the chip mounter 1 clear on the control computer, and then the height of the camera 6 is fixed. The thickness of the chip is input into the control computer 4, and the control computer 4 lifts the same height of the chip mounting head 1 according to the thickness of the chip, so that the focusing of the camera 6 and the chip with the salient points is realized. When aiming at different chip sizes, the photographing area is automatically determined by inputting the chip size information into a computer.
Acquiring salient point surface image information of the chip with the salient points in real time, identifying characteristic points in the image information, sending a motion control signal to the moving mechanism 1, and adjusting the central position of the chip mounting head 1 to enable the characteristic points to be matched with a preset characteristic point image;
step five, automatically storing the convex point surface image information shot at the moment so as to be convenient for later review;
and step six, monitoring the image information of the convex point surface, judging whether the chip is available, and outputting and displaying a judgment result. The specific judgment basis for judging whether the chip is available is as follows: and if the salient points are missing or broken, and if the area of missing or broken salient points exceeds 10%, determining that the salient points are not usable, otherwise, determining that the salient points are usable.
And 3 batches of 100 chips are monitored in the flip process according to the steps, 8 chips with problems of chip damage, solder ball damage and the like are eliminated, and the qualified finished product rate of the device is improved by 8%.
The device and the method can ensure that the chip used in the chip flip process is a good chip, reduce the use of the chip with the problems of chip damage, solder ball damage and the like, and obviously improve the control strength of raw materials of devices. Meanwhile, the invention is suitable for the mounting process of various packaged devices such as chip mounting, capacitor/resistor mounting and the like. And (4) carrying out chip inversion of different products, and only carrying out inputting of the identification and positioning images and changing of the size of the chip.
The above description is only one embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention.
Those skilled in the art will appreciate that the invention may be practiced without these specific details.
Claims (6)
1. The utility model provides a chip flip-chip technology chip monitoring devices which characterized in that includes chip mounting head (1), moving mechanism (2), device (3) and control computer (4) of shooing, wherein:
the chip mounting head (1) is vertically and fixedly arranged on the moving mechanism (2) and is used for adsorbing a chip with salient points;
the moving mechanism (2) is driven by a motion control signal of the control computer (4) to drive the chip mounting head (1) to move horizontally or vertically;
the photographing device (3) is fixedly placed on a horizontal plane, a photographing camera of the photographing device is vertically upward, receives an amplification control signal sent by the control computer (4), photographs the convex point surface of the chip according to the amplification control signal, acquires convex point surface image information, and sends the convex point surface image information to the control computer (4) in real time;
the control computer (4) firstly reads the position information of the chip mounting head (1) in real time according to the preset position information of the photographing device (3), sends a motion control signal to the moving mechanism (2), and simultaneously sends an amplification control signal to the photographing device (3) according to the size of the chip with the salient points and the corresponding amplification factor thereof until the center of the chip mounting head (1) is positioned in the central area of the visible range of the photographing device (3), and the camera (6) of the photographing device (3) is focused with the detected salient point chip; then, acquiring salient point surface image information of the chip with salient points in real time, identifying characteristic points in the image information, sending a motion control signal to the moving mechanism (2), adjusting the central position of the chip mounting head (1) to enable the characteristic points to be matched with a preset characteristic point image, and then storing the shot salient point surface image information; monitoring the image information of the convex point surface, judging whether the chip is available, and outputting and displaying a judgment result; the characteristic points are positioned on diagonal lines of the chip, and the characteristic points are chip marks or salient point arrays forming characteristic patterns at the top ends of the diagonal lines;
the specific focusing method comprises the following steps: the height of the camera is manually adjusted to enable the bottom image of the chip mounting head to be clear on the control computer, then the height of the camera is fixed, the thickness of the chip is input into the control computer, the control computer lifts the same height of the chip mounting head according to the thickness of the chip, accordingly, focusing of the camera and the chip with the salient points is achieved, and when different chip sizes are aimed, the shooting area is automatically determined by inputting chip size information into the computer.
2. The device for monitoring the chip during the flip-chip process according to claim 1, further comprising a ring light (5), wherein the ring light (5) is installed around the camera (6) of the photographing device (3).
3. The chip monitoring device for the chip flip process according to claim 1, wherein the resolution of the camera (6) of the photographing device (3) is more than 150 ten thousand pixels of color camera.
4. The chip flip process chip monitoring device according to claim 1, wherein the moving mechanism (2) comprises a first servo motor (7), a second servo motor (8), a third servo motor (9), a first support plate (10), a second support plate (11), a third support plate (12), a moving track (13), and a support frame (14),
the chip mounter is characterized in that a first supporting plate (10) and a second supporting plate (11) are both horizontally placed, the second supporting plate (11) is stacked above the first supporting plate (10), one end of the second supporting plate is perpendicular to the horizontal plane and fixedly installed on the second supporting plate (11), the other end of the second supporting plate is fixedly installed with a movable sliding rail (13), a third supporting plate (12) is perpendicular to the horizontal plane, one end of the third supporting plate is installed on the sliding rail, and the other end of the third supporting plate is fixedly installed with a chip mounter; the first servo motor (7) and the second servo motor (8) receive instructions of the control computer to drive the first supporting plate (10) and the second supporting plate (11) to move on a horizontal plane along mutually vertical moving tracks (13), and the third servo motor (12) receives instructions of the control computer (4) to drive the third supporting plate (12) to move along the vertical direction of the moving tracks (13), so that the chip mounting head (1) is driven to drive the chip with the salient points to move.
5. A chip flip process chip monitoring process using the apparatus of claim 1, characterized by the steps of:
step one, pre-installing salient point chip characteristic point image information to a control computer (4), wherein the image information comprises pixel values and position information;
inverting the chip with the salient points, and adsorbing and mounting the chip on the chip mounting head (1);
step three, reading the position information of the chip mounting head (1) of the moving mechanism (2) in real time according to the preset position information of the photographing device, sending a motion control signal to the moving mechanism (2), and sending an amplification control signal to the photographing device (3) according to the size of the chip with the salient points and the corresponding amplification factor of the chip with the salient points until the center of the chip mounting head (1) is positioned in the central area of the visible range of the photographing device (3), and focusing a camera (6) of the photographing device (3) with the detected salient point chip;
the specific focusing method comprises the following steps: manually adjusting the height of the camera to enable the bottom image of the chip mounting head to be clear on a control computer, then fixing the height of the camera, inputting the thickness of the chip into the control computer, and lifting the same height of the chip mounting head by the control computer according to the thickness of the chip, so that focusing of the camera and the chip with the salient points is realized, and when aiming at different chip sizes, automatically determining a photographing area by inputting the size information of the chip into the computer;
acquiring salient point surface image information of a chip with salient points in real time, identifying characteristic points in the image information, sending a motion control signal to the moving mechanism (1), and adjusting the central position of the chip mounting head (1) to enable the characteristic points to be matched with a preset characteristic point image;
step five, automatically storing the information of the convex point surface image shot at the moment;
and step six, monitoring the image information of the convex point surface, judging whether the chip is available, and outputting and displaying a judgment result.
6. A chip flip process chip monitoring process method using the apparatus of claim 1, wherein the specific judgment criteria for judging whether the chip is usable are: and if the salient points are missing or broken, and if the area of missing or broken salient points exceeds 10%, determining that the salient points are not usable, otherwise, determining that the salient points are usable.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201611245712.5A CN106601655B (en) | 2016-12-29 | 2016-12-29 | Chip monitoring device and method for chip flip process |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201611245712.5A CN106601655B (en) | 2016-12-29 | 2016-12-29 | Chip monitoring device and method for chip flip process |
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| CN106601655B true CN106601655B (en) | 2020-02-21 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1988121A (en) * | 2005-12-22 | 2007-06-27 | 优利讯国际贸易有限责任公司 | Method for mounting a flip chip on a substrate |
| CN105006445A (en) * | 2015-06-26 | 2015-10-28 | 北京中电科电子装备有限公司 | Pre-alignment system and method for bonding flip chip |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9857419B2 (en) * | 2013-07-12 | 2018-01-02 | Delta Design, Inc. | Micro-vision alignment system with guiding rings for IC testing |
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2016
- 2016-12-29 CN CN201611245712.5A patent/CN106601655B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1988121A (en) * | 2005-12-22 | 2007-06-27 | 优利讯国际贸易有限责任公司 | Method for mounting a flip chip on a substrate |
| CN105006445A (en) * | 2015-06-26 | 2015-10-28 | 北京中电科电子装备有限公司 | Pre-alignment system and method for bonding flip chip |
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