CN105006445A - Pre-alignment system and method for bonding flip chip - Google Patents
Pre-alignment system and method for bonding flip chip Download PDFInfo
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- CN105006445A CN105006445A CN201510363265.2A CN201510363265A CN105006445A CN 105006445 A CN105006445 A CN 105006445A CN 201510363265 A CN201510363265 A CN 201510363265A CN 105006445 A CN105006445 A CN 105006445A
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- 238000000034 method Methods 0.000 title claims abstract description 31
- 239000003292 glue Substances 0.000 claims abstract description 59
- 238000007598 dipping method Methods 0.000 claims abstract description 47
- 230000002950 deficient Effects 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 abstract 3
- 238000010586 diagram Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
- H01L2224/8012—Aligning
- H01L2224/80121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
- H01L2224/80122—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors by detecting inherent features of, or outside, the semiconductor or solid-state body
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
The invention provides a pre-alignment system and a pre-alignment method for bonding flip chips. The pre-alignment system comprises a flip chip glue dipping structure, an upper vision optical structure and a flip chip placement head, wherein the flip chip glue dipping structure comprises a glue dipping plate, mechanical sliding rails connected with two sides of the glue dipping plate in a slided manner, and a motor driving the mechanical sliding rails to slide; and the upper vision optical structure comprises a deflecting prism which is fixed between the mechanical sliding rails and arranged under the glue dipping plate, and an industrial camera acquiring images of the flip chips. According to the pre-alignment system and the pre-alignment method, the flip chip placement head picks up one flip chip, moves to a position above the glue dipping plate for dipping glue according to a first trajectory and is lifted upwards after the glue dipping of the flip chip is finished, the mechanical sliding rails drives the glue dipping plate to slide according to a second trajectory and avert from the deflecting prism, then the flip chip after glue dipping is pre-aligned via the upper vision optical structure. Through the pre-alignment system provided by the invention, the bonding accuracy and efficiency are greatly increased, and the requirements of high-precision chip loading are satisfied.
Description
Technical field
The present invention relates to flip-chip bonding techniques field, particularly relate to a kind of pre-alignment system and method for flip-chip bonding.
Background technology
Along with the fast development of global electronic information technology, integrated circuit (IC) chip is constantly to high density, high-performance and compact future development, encapsulate requirement for meeting IC (Integrated Circuit, integrated circuit), the salient point quantity on chip will get more and more.Along with increasing of salient point quantity, propose challenge to existing load kind equipment, one of them main difficult problem is high density, the chip of Small Distance salient point how high accuracy load.
Generally directly complete load after pick-up chip dips in glue in current load kind equipment, but there is a subject matter in this mode: without the direct load of prealignment after pick-up chip, so the little deviation that may exist when cannot eliminate pickup, the precision of load is made to be difficult to improve.Therefore, before chip bonding, carrying out prealignment to chip is a very crucial step.
Summary of the invention
In order to overcome above-mentioned technical problem, the invention provides a kind of pre-alignment system and method for flip-chip bonding, eliminating chip and dipping in issuable little deviation in glue process, substantially increasing the precision of equipment, meet the requirement of high accuracy load.
In order to solve the problems of the technologies described above, the present invention adopts following technical scheme:
According to one aspect of the present invention, provide a kind of pre-alignment system of flip-chip bonding, this pre-alignment system comprises:
The flip-chip be installed on workbench dips in plastic structure, and flip-chip dips in plastic structure and comprises: that carries out dipping in glue for flip-chip dips in offset plate; With the mechanical slide rail dipping in offset plate both sides and be slidably connected; The motor being electrically connected with mechanical slide rail, sliding for driving device slide rail;
Be installed on the upper optometry structure on workbench, upper optometry structure comprises: to be fixed between mechanical slide rail and to be positioned at the deflecting prism dipped in below offset plate; For obtaining the industrial camera of flip-chip image; Wherein, deflecting prism is connected with the camera lens of industrial camera by industrial camera, and
Be positioned at and dip in above offset plate, for picking up the flip-chip mounting head of flip-chip;
Wherein, flip-chip mounting head picks up a flip-chip, and move to dip in above offset plate according to the first movement locus and carry out dipping in glue, flip-chip dips in after glue completes, flip-chip mounting head upwards lifts, mechanical slide rail drive is simultaneously dipped in offset plate and is avoided deflecting prism slip according to the second movement locus, then carries out prealignment by upper optometry structure to dipping in the flip-chip after glue.
Alternatively, deflecting prism is right-angle prism.
Alternatively, the mid point of deflecting prism, flip-chip mounting head and before not sliding according to the second movement locus, dip in being centrally located on same straight line of offset plate, and parallel with the direction of motion of the first movement locus.
Alternatively, the mid point of deflecting prism is positioned on the central axis of camera lens, and the central axis of camera lens is parallel with the direction of motion of the second movement locus.
Alternatively, industrial camera is black and white kilomega network industrial camera.
Alternatively, camera lens is zoom camera lens or fixed times camera lens.
According to another aspect of the present invention, provide a kind of pre-alignment method of flip-chip bonding, be applied to the pre-alignment system of above-mentioned flip-chip bonding, this pre-alignment system comprises: the flip-chip be installed on workbench dips in plastic structure, and flip-chip dips in plastic structure and comprises: that carries out dipping in glue for flip-chip dips in offset plate; With the mechanical slide rail dipping in offset plate both sides and be slidably connected; The motor being electrically connected with mechanical slide rail, sliding for driving device slide rail; Be installed on the upper optometry structure on workbench, upper optometry structure comprises: to be fixed between mechanical slide rail and to be positioned at the deflecting prism dipped in below offset plate; For obtaining the industrial camera of flip-chip image; Wherein, deflecting prism is connected with the camera lens of industrial camera by industrial camera, and is positioned at and dips in above offset plate, for picking up the flip-chip mounting head of flip-chip,
Wherein, this pre-alignment method comprises:
Pick up a flip-chip by flip-chip mounting head, and move to dip in above offset plate according to the first movement locus and carry out dipping in glue;
Flip-chip dips in after glue completes, and flip-chip mounting head upwards lifts, and is driven simultaneously dip in offset plate and avoid deflecting prism according to the second movement locus and slide by mechanical slide rail;
Prealignment is carried out to dipping in the flip-chip after glue by upper optometry structure.
Alternatively, carrying out prealignment by upper optometry structure to dipping in the flip-chip after glue, specifically comprising:
The image of the flip-chip formed by the light of deflecting prism refraction flip-chip is obtained by industrial camera;
Image and pre-set image template are carried out prealignment, if prealignment result is in default similarity dimensions, then flip-chip is qualified; If prealignment result exceeds default similarity dimensions, then flip-chip is defective.
Alternatively, default similarity dimensions is 90% ~ 95%.
The invention has the beneficial effects as follows:
At the pre-alignment system of flip-chip bonding provided by the invention, first a flip-chip is picked up by flip-chip mounting head, and move to dip in above offset plate according to the first movement locus and carry out dipping in glue, dip in after glue completes, this flip-chip pastes head and upwards lifts, meanwhile, mechanical slide rail drive is dipped in offset plate and is avoided deflecting prism slip according to the second movement locus, finally carries out prealignment by upper optometry structure to dipping in the flip-chip after glue.Therefore by pre-alignment system provided by the invention, the prealignment to flip-chip is completed in the process upwards can lifted at flip-chip mounting head, the efficiency that equipment runs can not be affected, eliminate chip and dip in issuable little deviation in glue process, substantially increase precision and the efficiency of bonding, reach higher load required precision, achieve high accuracy load, and in creatively prealignment process being produced through actual process, achieve function that is quick in production process, precise calibration deviation.
Accompanying drawing explanation
Fig. 1 represents the structural representation of the pre-alignment system of flip-chip bonding in the embodiment of the present invention;
Fig. 2 represent the pre-alignment system of flip-chip bonding in the embodiment of the present invention dip in glue before schematic diagram;
Fig. 3 represent the pre-alignment system of flip-chip bonding in the embodiment of the present invention dip in glue before vertical view
Fig. 4 represent the pre-alignment system of flip-chip bonding in the embodiment of the present invention dip in glue after schematic diagram;
Fig. 5 represent the pre-alignment system of flip-chip bonding in the embodiment of the present invention dip in glue after vertical view;
Fig. 6 represents the fundamental diagram of the pre-alignment system of flip-chip bonding in the embodiment of the present invention;
Fig. 7 represents the flow chart of the pre-alignment method of flip-chip bonding in the embodiment of the present invention; And
Fig. 8 represents the flow chart in the embodiment of the present invention, flip-chip being carried out to prealignment.
Wherein in figure: 1, flip-chip dips in plastic structure; 101, offset plate is dipped in; 102, mechanical slide rail; 2, upper optometry structure; 201, deflecting prism; 202, industrial camera; 2021, camera lens; 3, flip-chip mounting head.
Embodiment
For making the object, technical solutions and advantages of the present invention clearly, describe the present invention below in conjunction with the accompanying drawings and the specific embodiments.
Embodiment one
According to one aspect of the present invention, provide a kind of pre-alignment system of flip-chip bonding, as shown in Figure 1, this pre-alignment system comprises:
The flip-chip be installed on workbench dips in plastic structure 1, and flip-chip dips in plastic structure 1 and comprises: that carries out dipping in glue for flip-chip dips in offset plate 101; With the mechanical slide rail 102 dipping in offset plate 101 both sides and be slidably connected; The motor being electrically connected with mechanical slide rail 102, sliding for driving device slide rail 102;
Be installed on the upper optometry structure 2 on workbench, upper optometry structure 2 comprises: to be fixed between mechanical slide rail 102 and to be positioned at the deflecting prism 201 dipped in below offset plate 101; For obtaining the industrial camera 202 of flip-chip image; Wherein, deflecting prism 201 is connected with the camera lens 2021 of industrial camera 202 by industrial camera 202, and
As shown in Figure 3, be positioned at and dip in above offset plate 101, for picking up the flip-chip mounting head 3 of flip-chip;
Wherein, flip-chip mounting head 3 picks up a flip-chip, and move to dip in above offset plate 101 according to the first movement locus and carry out dipping in glue, flip-chip dips in after glue completes, flip-chip mounting head 3 upwards lifts, simultaneously mechanical slide rail 102 drives and dips in offset plate 101 and avoid deflecting prism 201 according to the second movement locus and slide, and then carries out prealignment by upper optometry structure 2 to dipping in the flip-chip after glue.
Therefore, by the pre-alignment system that the embodiment of the present invention provides, the prealignment to flip-chip is completed in the process upwards can lifted at flip-chip mounting head 3, the efficiency that equipment runs can not be affected, eliminate chip and dip in issuable little deviation in glue process, substantially increase precision and the efficiency of bonding, reach higher load required precision, achieve high accuracy load, and in creatively prealignment process being produced through actual process, achieve function that is quick in production process, precise calibration deviation.
Further, be installed between mechanical slide rail 102 that flip-chip dips in plastic structure 1 by the deflecting prism 201 in upper optometry structure 2 is embedded, substantially reduce the space of in the vertical direction, reduce the duty space of whole pre-alignment system.Wherein, in embodiments of the present invention, what deflecting prism 201 adopted is right-angle prism, by utilizing the characteristic of this critical angle, can the light that flip-chip reflects all be refracted on camera lens 2021, and the image identical with flip chip is presented on industrial camera 202, therefore, deflecting prism 201 realizes upper optometry structure 2 and flip-chip to dip in the critical component that plastic structure 1 is combined as a whole.
Particularly, in embodiments of the present invention, the mid point of deflecting prism 201, flip-chip mounting head 3 and before not sliding according to the second movement locus, dip in being centrally located on same straight line of offset plate 101, and parallel with the direction of motion of the first movement locus.And the mid point of deflecting prism 201 is positioned on the central axis of camera lens 2021, and the central axis of camera lens 2021 is parallel with the direction of motion of the second movement locus.Wherein, the direction of motion of the first movement locus is vertical direction as shown by the arrows in Figure 2, the direction of motion of the second movement locus is horizontal direction as shown by the arrows in Figure 4, because deflecting prism 201 is right-angle prism, therefore, deflecting prism 201 by the light refraction of flip-chip on camera lens 2021, and can form the image identical with flip-chip on industrial camera 202.
Particularly, in embodiments of the present invention, industrial camera 202 is black and white kilomega network industrial camera, there is higher resolution, and be black and white by the picture that this black and white kilomega network industrial camera is formed, therefore the higher salient point comparatively clearly identified on flip-chip, achieves the identification location to the At High Resolution that the position of flip-chip after dipping in glue is carried out.It is appreciated of course that, in embodiments of the present invention, the particular type of industrial camera 202 and model are not specifically limited.Wherein, in the invention process, the camera lens 2021 that industrial camera 202 adopts is zoom camera lens or fixed times camera lens, therefore, by regulating camera lens 2021, industrial camera 202 can obtain image clearly.
Wherein, pre-alignment system as Fig. 2 flip-chip bonding dips in shown in the schematic diagram before glue, before flip-chip dips in glue, first a flip-chip is picked up with flip-chip mounting head 3, and according to the first orbiting motion to dipping on offset plate 101, wherein, the direction of motion of the first movement locus is the vertical direction in Fig. 2 shown in arrow, and now, dip in the pre-alignment system of the position of offset plate 101 on mechanical slide rail 102 as Fig. 3 flip-chip bonding dip in glue before vertical view shown in.When dipping in after glue completes, pre-alignment system as Fig. 4 flip-chip bonding dips in shown in the schematic diagram after glue, flip-chip mounting head 3 upwards lifts, and meanwhile, dip in offset plate 101 under the drive of mechanical slide rail 102, avoid deflecting prism 201 according to the second movement locus to slide, wherein, the direction of motion of the second movement locus is the horizontal direction in Fig. 4 shown in arrow, and now, dip in the pre-alignment system of the position of offset plate 101 on mechanical slide rail 102 as Fig. 5 flip-chip bonding dip in glue after vertical view shown in.Therefore, it is possible to exposed by deflecting prism 201, and carry out prealignment by upper optometry structure 2 to dipping in the flip chip after glue.
Particularly, the fundamental diagram of prealignment is carried out as shown in Figure 6 to dipping in the flip chip after glue by upper optometry structure 2, the i.e. light refraction of deflecting prism 201 pairs of flip-chip reflections, and by light refraction on camera lens 2021, industrial camera 202 presents the image identical with flip chip, then by image and pre-set image template are carried out prealignment, and judge according to prealignment result.When prealignment result is in default similarity dimensions, then flip-chip is qualified; When prealignment result exceeds default similarity dimensions, then flip-chip is defective, and wherein, default similarity dimensions is 90% ~ 95%.Thus the prealignment completed flip-chip, for the precision of next step flip-chip bonding provides guarantee, substantially increase precision and the efficiency of bonding, reach higher load required precision, achieve high accuracy load.
Embodiment two
In embodiments of the present invention, provide a kind of pre-alignment method of flip-chip bonding, be applied to the pre-alignment system of above-mentioned flip-chip bonding, this pre-alignment system comprises: the flip-chip be installed on workbench dips in plastic structure 1, and flip-chip dips in plastic structure 1 and comprises: that carries out dipping in glue for flip-chip dips in offset plate 101; With the mechanical slide rail 102 dipping in offset plate 101 both sides and be slidably connected; The motor being electrically connected with mechanical slide rail 102, sliding for driving device slide rail 102; Be installed on the upper optometry structure 2 on workbench, upper optometry structure 2 comprises: to be fixed between mechanical slide rail 102 and to be positioned at the deflecting prism 201 dipped in below offset plate 101; For obtaining the industrial camera 202 of flip-chip image; Wherein, deflecting prism 201 is connected with the camera lens 2021 of industrial camera 202 by industrial camera 202, and is positioned at and dips in above offset plate 101, for picking up the flip-chip mounting head 3 of flip-chip,
Wherein, as shown in Figure 7, this pre-alignment method 700 comprises:
Step S701, pick up a flip-chip by flip-chip mounting head 3, and move to dip in above offset plate 101 according to the first movement locus and carry out dipping in glue;
Step S703, flip-chip dip in after glue completes, and flip-chip mounting head 3 upwards lifts, and driven simultaneously dip in offset plate 101 and avoid deflecting prism 201 according to the second movement locus and slide by mechanical slide rail 102;
Step S705, carry out prealignment by upper optometry structure 2 to dipping in the flip-chip after glue.
By the pre-alignment method that the embodiment of the present invention provides, the prealignment to flip-chip is completed in the process upwards can lifted at flip-chip mounting head 3, the efficiency that equipment runs can not be affected, eliminate chip and dip in issuable little deviation in glue process, substantially increase precision and the efficiency of bonding, reach higher load required precision, achieve high accuracy load, and in creatively prealignment process being produced through actual process, achieve function that is quick in production process, precise calibration deviation.
Particularly, as shown in Figure 8, in embodiments of the present invention, carried out prealignment (step S705) by upper optometry structure 2 specifically comprise dipping in the flip-chip after glue:
Step S7051, obtained the image of the flip-chip that the light that reflects flip-chip by deflecting prism 201 is formed by industrial camera 202;
Step S7053, image and pre-set image template are carried out prealignment, if prealignment result is in default similarity dimensions, then flip-chip is qualified; If prealignment result exceeds default similarity dimensions, then flip-chip is defective.
Wherein, in embodiments of the present invention, default similarity dimensions is 90% ~ 95%.In addition, the concrete principle of prealignment is carried out as shown in Figure 6 to dipping in the flip-chip after glue by upper optometry structure 2, the i.e. light refraction of deflecting prism 201 pairs of flip-chip reflections, and by light refraction on camera lens 2021, industrial camera 202 presents the image identical with flip chip, then by image and pre-set image template are carried out prealignment, and judge according to prealignment result.Thus the prealignment completed flip-chip, for the precision of next step flip-chip bonding provides guarantee, substantially increase precision and the efficiency of bonding, reach higher load required precision, achieve high accuracy load.
Above-described is the preferred embodiment of the present invention; should be understood that the ordinary person for the art; can also make some improvements and modifications not departing under principle prerequisite of the present invention, these improvements and modifications are also in protection scope of the present invention.
Claims (9)
1. a pre-alignment system for flip-chip bonding, is characterized in that, comprising:
The flip-chip be installed on workbench dips in plastic structure (1), and described flip-chip dips in plastic structure (1) and comprising: that carries out dipping in glue for flip-chip dips in offset plate (101); With the described mechanical slide rail (102) dipping in offset plate (101) both sides and be slidably connected; Be electrically connected with described mechanical slide rail (102), motor for driving described mechanical slide rail (102) to slide;
Be installed on the upper optometry structure (2) on described workbench, described upper optometry structure (2) comprising: to be fixed between described mechanical slide rail (102) and to dip in the deflecting prism (201) of offset plate (101) below described in being positioned at; For obtaining the industrial camera (202) of described flip-chip image; Wherein, described deflecting prism (201) is connected with the camera lens (2021) of described industrial camera (202) by described industrial camera (202), and
Offset plate (101) top is dipped in, for picking up the flip-chip mounting head (3) of described flip-chip described in being positioned at;
Wherein, described flip-chip mounting head (3) picks up a flip-chip, and dip in described in moving to according to the first movement locus offset plate (101) top carry out dipping in glue, described flip-chip dips in after glue completes, described flip-chip mounting head (3) is upwards lifted, dipping in offset plate (101) described in described mechanical slide rail (102) drive simultaneously and avoid described deflecting prism (201) slip according to the second movement locus, then carrying out prealignment by described upper optometry structure (2) to dipping in the described flip-chip after glue.
2. prealigned structure as claimed in claim 1, it is characterized in that, described deflecting prism (201) is right-angle prism.
3. prealigned structure as claimed in claim 2; it is characterized in that; the mid point of described deflecting prism (201), described flip-chip mounting head (3) and described in before not sliding according to described second movement locus, dip in being centrally located on same straight line of offset plate (101), and parallel with the direction of motion of described first movement locus.
4. prealigned structure as claimed in claim 2, it is characterized in that, the mid point of described deflecting prism (201) is positioned on the central axis of described camera lens (2021), and the central axis of described camera lens (2021) is parallel with the direction of motion of described second movement locus.
5. prealigned structure as claimed in claim 1, it is characterized in that, described industrial camera (202) is black and white kilomega network industrial camera.
6. prealigned structure as claimed in claim 1, is characterized in that, described camera lens (2021) is zoom camera lens or fixed times camera lens.
7. the pre-alignment method of a flip-chip bonding, be applied to the pre-alignment system of flip-chip bonding, described pre-alignment system comprises: the flip-chip be installed on workbench dips in plastic structure (1), and described flip-chip dips in plastic structure (1) and comprising: that carries out dipping in glue for flip-chip dips in offset plate (101); With the described mechanical slide rail (102) dipping in offset plate (101) both sides and be slidably connected; Be electrically connected with described mechanical slide rail (102), motor for driving described mechanical slide rail (102) to slide; Be installed on the upper optometry structure (2) on described workbench, described upper optometry structure (2) comprising: to be fixed between described mechanical slide rail (102) and to dip in the deflecting prism (201) of offset plate (101) below described in being positioned at; For obtaining the industrial camera (202) of described flip-chip image; Wherein, described deflecting prism (201) is connected with the camera lens (2021) of described industrial camera (202) by described industrial camera (202), and dip in offset plate (101) top described in being positioned at, for picking up the flip-chip mounting head (3) of described flip-chip, it is characterized in that
Described pre-alignment method comprises:
Pick up a flip-chip by described flip-chip mounting head (3), and dip in described in moving to according to the first movement locus offset plate (101) top carry out dipping in glue;
Described flip-chip dips in after glue completes, described flip-chip mounting head (3) is upwards lifted, and dips in offset plate (101) simultaneously and avoid described deflecting prism (201) slip according to the second movement locus described in described mechanical slide rail (102) drives;
Prealignment is carried out to dipping in the described flip-chip after glue by described upper optometry structure (2).
8. pre-alignment method as claimed in claim 7, is characterized in that, describedly carries out prealignment by described upper optometry structure (2) to dipping in the described flip-chip after glue, specifically comprises:
The image of the described flip-chip that the light that reflects described flip-chip by deflecting prism (201) is formed is obtained by industrial camera (202);
Described image and pre-set image template are carried out prealignment, if described prealignment result is in default similarity dimensions, then described flip-chip is qualified; If described prealignment result exceeds described default similarity dimensions, then described flip-chip is defective.
9. pre-alignment method as claimed in claim 8, it is characterized in that, described default similarity dimensions is 90% ~ 95%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510363265.2A CN105006445B (en) | 2015-06-26 | 2015-06-26 | The pre-alignment system and method for a kind of flip-chip bonding |
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| CN201510363265.2A CN105006445B (en) | 2015-06-26 | 2015-06-26 | The pre-alignment system and method for a kind of flip-chip bonding |
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| CN105006445B CN105006445B (en) | 2017-11-07 |
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| CN108155125B (en) * | 2017-12-25 | 2020-07-21 | 北京中电科电子装备有限公司 | Semiconductor chip paster device |
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