CN1702847A - Ultrasonic wave wire soldering method and wire soldering apparatus - Google Patents
Ultrasonic wave wire soldering method and wire soldering apparatus Download PDFInfo
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- CN1702847A CN1702847A CNA2005100348453A CN200510034845A CN1702847A CN 1702847 A CN1702847 A CN 1702847A CN A2005100348453 A CNA2005100348453 A CN A2005100348453A CN 200510034845 A CN200510034845 A CN 200510034845A CN 1702847 A CN1702847 A CN 1702847A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Abstract
This invention discloses ultrasonic welding wire method and its device, which comprises welding probe system, positioning and testing cameral optics system, movable workbench, rotation bench in level direction and the clamper for welding parts fixed on the rotation bench. The method orderly comprises the following steps: setting initial positions, welding wire points; moving the initial points of welding mouth or moving the end points of welding mouth and wires; welding the wire end terminals.
Description
Technical field
The present invention relates to be applicable to that semiconductor, solid state device or its parts are used for the welding method or the equipment of the lead-in wire of conduction current, especially relate to a kind of supersonic welding line method and bonding wire device thereof.
Background technology
Chip on circuit board PCB or substrate directly encapsulates (Chip on Board with integrated circuit die I C or LED bonding wire, be called for short COB), be widely used in such as consumer electronic information products such as computer, mobile phone, optics digital product, smart card, clock and watch, toys.Bonding wire is the basic technology of COB, needs to adopt supersonic welding line method and relevant device.Existing be specifically designed to the auto-ultrasonic bonding equipment that corresponding bonding pad on IC chip or LED and the pcb board is carried out bridge joint, comprise and be provided with transducer, wire clamp, tip, weldering arm and send the soldering tip that pulls line parts system, be provided with the optical mirror slip group of adjustable focus and the location image optical system of camera, the workbench that can move in the horizontal direction, be arranged on the turntable that can rotate in the horizontal direction on the workbench, and be arranged on the anchor clamps that are used for fixing lineman's part to be welded on the turntable.Described soldering tip system is positioned at the central authorities top of workbench, can move in vertical direction, and described image optical system also is positioned at the central authorities top of workbench.Described bonding wire workpiece is LED or IC chip and pcb board.Absorb the relative position of bonding wire workpiece in advance with image optical system by the location, through identification and Control work platform, turntable moves and rotate, and with compensating error, makes the solder joint of bonding wire workpiece on the anchor clamps confirm the position earlier, promptly accurately be positioned tip lower position, bonding wire then.For present turntable bonding equipment, the soldering tip system only has motion in vertical direction; In the location and after having calculated position of bonding wire, can only be that bonding wire is carried out in the below that workbench is moved horizontally to the soldering tip system usually, bonding wire speed is restricted.In addition, only after finishing bonding wire action, could detect the position of bonding wire and the quality of bonding wire, not only lose time, and can not monitor in real time and improve the bonding wire quality by image optical system.
Summary of the invention
Technical problem to be solved by this invention is to overcome above-mentioned the deficiencies in the prior art, proposes a kind of supersonic welding line method of can side weld line frontier inspection surveying.
Another technical problem to be solved by this invention is to overcome above-mentioned the deficiencies in the prior art, proposes a kind of supersonic welding line method that can improve bonding wire speed.
A technical problem more to be solved by this invention is to overcome above-mentioned the deficiencies in the prior art, proposes a kind of for implementing the custom-designed supersonic welding line apparatus of above-mentioned two kinds of supersonic welding line methods.
For the supersonic welding line method of can side weld line frontier inspection surveying of the present invention, above-mentioned technical problem is solved like this:
This supersonic welding line method of can side weld line frontier inspection surveying, employing comprises and is provided with transducer, wire clamp, tip, weld arm and send the soldering tip that pulls line parts system, be provided with the optical mirror slip group of adjustable focus and the location image optical system of camera, the workbench that can move in the horizontal direction, be arranged on the turntable that can rotate in the horizontal direction on the workbench, and the supersonic welding line apparatus that is arranged on the anchor clamps that are used for fixing lineman's part to be welded on the turntable, described soldering tip system is positioned at the central authorities top of workbench, can move in vertical direction, described image optical system also is positioned at the central authorities top of workbench.
The characteristics of this supersonic welding line method are:
Described soldering tip system can also move in the horizontal direction;
Described image optical system still detects uses image optical system, can move in vertical direction;
Following steps are arranged successively:
Initially put and anticipate the position: lineman's part to be welded is placed in the anchor clamps on the turntable, moves in the horizontal direction the soldering tip system, the tip of soldering tip is removed, treat the bonding wire workpiece by image optical system and position, and calculate position of bonding wire;
The top point of welding bonding wire: move in the horizontal direction the soldering tip system, tip is moved to the image optical system below, simultaneously the top point of a bonding wire of oriented lineman's part to be welded on the turntable is moved to the image optical system below by workbench, move the soldering tip system in vertical direction and fall soldering tip, weld;
Remove tip and detect bonding wire top point: move the soldering tip system in vertical direction and go up soldering tip, move in the horizontal direction the soldering tip system, tip is removed from the below of image optical system, and the distal point direction of tip to lineman's part bar bonding wire to be welded moved, detect by the image of image optical system simultaneously the intact bonding wire top point of firm weldering, revise the bonding wire parameter, improve the bonding wire quality;
The distal point of welding bonding wire: tip moves the soldering tip system in vertical direction and falls soldering tip after moving to directly over the distal point of this bonding wire of lineman's part to be welded, and the distal point of this bonding wire of lineman's part to be welded on the turntable is welded, and finishes the welding of this bonding wire;
Repeat the top point of above-mentioned welding bonding wire, the step of removing tip detection bonding wire top point, welding the distal point of bonding wire successively.
For the supersonic welding line method that can improve bonding wire speed of the present invention, above-mentioned technical problem is solved like this:
This supersonic welding line method that can improve bonding wire speed, employing comprises and is provided with transducer, wire clamp, tip, weld arm and send the soldering tip that pulls line parts system, be provided with the optical mirror slip group of adjustable focus and the location image optical system of camera, the workbench that can move in the horizontal direction, be arranged on the turntable that can rotate in the horizontal direction on the workbench, and the supersonic welding line apparatus that is arranged on the anchor clamps that are used for fixing lineman's part to be welded on the turntable, described soldering tip system is positioned at the central authorities top of workbench, can move in vertical direction, described image optical system also is positioned at the central authorities top of workbench.
The characteristics of this supersonic welding line method are:
Described soldering tip system can also move in the horizontal direction;
Described image optical system still detects uses image optical system, can move in vertical direction;
Following steps are arranged successively:
Initially put and anticipate the position: lineman's part to be welded is placed in the anchor clamps on the turntable, moves in the horizontal direction the soldering tip system, the tip of soldering tip is removed, treat the bonding wire workpiece by image optical system and position, and calculate position of bonding wire;
The top point of welding bonding wire: move in the horizontal direction the soldering tip system, tip is moved to the image optical system below, simultaneously the top point of a bonding wire of oriented lineman's part to be welded on the turntable is moved to the image optical system below by workbench, move the soldering tip system in vertical direction and fall soldering tip, weld;
The distal point of mobile simultaneously tip and bonding wire: move the soldering tip system in vertical direction and go up soldering tip, move in the horizontal direction the soldering tip system, tip is removed from the below of image optical system, and the distal point direction of tip to this bonding wire of lineman's part to be welded moved; The workbench that relatively moves in the horizontal direction simultaneously moves the distal point of this bonding wire of lineman's part to be welded to the tip direction;
The distal point of welding bonding wire: tip moves the soldering tip system in vertical direction and falls soldering tip after moving to directly over the distal point of this bonding wire of lineman's part to be welded, and the distal point of this bonding wire of lineman's part to be welded on the turntable is welded, and finishes the welding of this bonding wire;
Repeat the top point of above-mentioned welding bonding wire, the step of the distal point of distal point, the welding bonding wire of mobile tip and bonding wire simultaneously successively.
For above-mentioned two kinds of supersonic welding line methods, technical problem of the present invention can be solved so according to qualifications:
Described soldering tip system is by the position signalling of independently vertical, horizontal location sensor feedback separately, give the micro-stepping plate drive motor with action command by the microcontroller servoboard, again by the micro-stepping plate drive motor according to this commands for controlling micro-stepping motor driven ball screw, make soldering tip system property along the line guide rail do back and forth vertically, move horizontally, the tip that drives in the soldering tip system moves to accurate welding position.
Described image optical system passes through the independently position signalling of perpendicular positioning sensor feedback, give the micro-stepping plate drive motor with action command by the microcontroller servoboard, again by the micro-stepping plate drive motor according to this commands for controlling micro-stepping motor driven ball screw, make image optical system property along the line guide rail make reciprocal vertical moving, the drive image optical system detects the image of the intact bonding wire top point of firm weldering, revise the bonding wire parameter, improve the bonding wire quality.
Described workbench passes through separately the independently position signalling of horizontal location sensor feedback, give the micro-stepping plate drive motor with action command by the microcontroller servoboard, again by the micro-stepping plate drive motor according to this commands for controlling micro-stepping motor driven ball screw, workbench property along the line guide rail is back and forth moved horizontally, drive workbench and be moved horizontally to accurate welding position.
Described turntable passes through the independently position signalling of corner alignment sensor feedback, give the micro-stepping plate drive motor with action command by the microcontroller servoboard, be provided with the gear of angular contact ball bearing again according to this commands for controlling micro-stepping motor driven by the micro-stepping plate drive motor, make turntable do forward and reversely to horizontally rotate, drive on the turntable lineman's part to be welded in the anchor clamps to accurate welding position.
The described anchor clamps that are used for fixing lineman's part to be welded are standard type bonding wire anchor clamps, compressing tablet formula anchor clamps and vacuum fixture.
For implementing the custom-designed supersonic welding line apparatus of above-mentioned two kinds of supersonic welding line methods, above-mentioned technical problem is solved like this for the present invention:
This supersonic welding line apparatus, comprise and be provided with transducer, wire clamp, tip, weldering arm and send the soldering tip that pulls line parts system, be provided with the optical mirror slip group of adjustable focus and the location image optical system of camera, the workbench that can move in the horizontal direction, be arranged on the turntable that can rotate in the horizontal direction on the workbench, and be arranged on anchor clamps that are used for fixing lineman's part to be welded on the turntable, described soldering tip system is positioned at the central authorities top of workbench, can move in vertical direction, described image optical system also is positioned at the central authorities top of workbench.
The characteristics of this supersonic welding line apparatus are:
Described soldering tip system can also move in the horizontal direction;
Described image optical system still detects uses image optical system, can move in vertical direction.
For implementing the custom-designed supersonic welding line apparatus of above-mentioned two kinds of supersonic welding line methods, above-mentioned technical problem can further be solved like this for the present invention:
Described soldering tip system is by the position signalling of independently vertical, horizontal location sensor feedback separately, give the micro-stepping plate drive motor with action command by the microcontroller servoboard, again by the micro-stepping plate drive motor according to this commands for controlling micro-stepping motor driven ball screw, make soldering tip system property along the line guide rail do back and forth vertically, move horizontally, the tip that drives in the soldering tip system moves to accurate welding position.
Described image optical system passes through the independently position signalling of perpendicular positioning sensor feedback, give the micro-stepping plate drive motor with action command by the microcontroller servoboard, again by the micro-stepping plate drive motor according to this commands for controlling micro-stepping motor driven ball screw, make image optical system property along the line guide rail make reciprocal vertical moving, the drive image optical system detects the image of the intact bonding wire top point of firm weldering, revise the bonding wire parameter, improve the bonding wire quality.
Described workbench passes through separately the independently position signalling of horizontal location sensor feedback, give the micro-stepping plate drive motor with action command by the microcontroller servoboard, again by the micro-stepping plate drive motor according to this commands for controlling micro-stepping motor driven ball screw, workbench property along the line guide rail is back and forth moved horizontally, drive workbench and be moved horizontally to accurate welding position.
Described turntable passes through the independently position signalling of corner alignment sensor feedback, give the micro-stepping plate drive motor with action command by the microcontroller servoboard, be provided with the gear of angular contact ball bearing again according to this commands for controlling micro-stepping motor driven by the micro-stepping plate drive motor, make turntable do forward and reversely to horizontally rotate, drive on the turntable lineman's part to be welded in the anchor clamps to accurate welding position.
The described anchor clamps that are used for fixing lineman's part to be welded are standard type bonding wire anchor clamps, compressing tablet formula anchor clamps and vacuum fixture.
The contrast of method of the present invention and existing supersonic welding line method can be surveyed by side weld line frontier inspection, can monitor in real time and improves the bonding wire quality, can also improve bonding wire speed.Can be widely used in welding for implementing the custom-designed supersonic welding line apparatus of the inventive method such as leads such as charactron, dot matrix plate, the soft encapsulation of integrated circuit, thick film integrated circuit, transistor semiconductor devices in the electronics and IT products such as computer, mobile phone, optics digital product, smart card, clock and watch, toy.
Description of drawings
Below the contrast accompanying drawing and in conjunction with embodiment the invention will be further described.
Fig. 1 is the stereogram of the building block of supersonic welding line apparatus embodiment of the present invention.
Fig. 2 is Fig. 1 embodiment relevant components configuration of components sketch under the bonding wire pattern that side weld line frontier inspection is surveyed.
Fig. 3 is Fig. 1 embodiment relevant components configuration of components sketch under the bonding wire pattern that improves bonding wire speed.
Embodiment
A kind of turntable type auto-ultrasonic bonding equipment as shown in Figure 1, 2, 3, comprise and be provided with transducer, wire clamp, tip, weldering arm and send the soldering tip system 2 of pulling the line parts, be provided with the optical mirror slip group of adjustable focus and the location image optical system 1 of camera, the workbench 6 that can move in the horizontal direction, be arranged on the turntable 5 that can rotate in the horizontal direction on the workbench 6, and be arranged on the anchor clamps that are used for fixing lineman's part 3 to be welded 4 on the turntable 5.Described soldering tip system 2 is positioned at the central authorities top of workbench 6, can move in vertical direction, can also move in the horizontal direction, and described image optical system 1 still detects use image optical system, also is positioned at above the central authorities of workbench 6, can move in vertical direction.
Described soldering tip system 2 is by the position signalling of independently vertical, horizontal location sensor feedback separately, give the micro-stepping plate drive motor with action command by the microcontroller servoboard, again by the micro-stepping plate drive motor according to this commands for controlling micro-stepping motor driven ball screw, make soldering tip system 2 property guide rails along the line do back and forth vertically, move horizontally, the tip that drives in the soldering tip system 2 moves to accurate welding position.
Described image optical system 1 passes through the independently position signalling of perpendicular positioning sensor feedback, give the micro-stepping plate drive motor with action command by the microcontroller servoboard, again by the micro-stepping plate drive motor according to this commands for controlling micro-stepping motor driven ball screw, make image optical system 1 property guide rail along the line make reciprocal vertical moving, the image that drives 1 pair of bonding wire top point that has just welded of image optical system detects, revise the bonding wire parameter, improve the bonding wire quality.
Described workbench 6 passes through separately the independently position signalling of horizontal location sensor feedback, give the micro-stepping plate drive motor with action command by the microcontroller servoboard, again by the micro-stepping plate drive motor according to this commands for controlling micro-stepping motor driven ball screw, workbench 6 property guide rails along the line are back and forth moved horizontally, drive workbench 6 and be moved horizontally to accurate welding position.
Described turntable 5 passes through the independently position signalling of corner alignment sensor feedback, give the micro-stepping plate drive motor with action command by the microcontroller servoboard, be provided with the gear of angular contact ball bearing again according to this commands for controlling micro-stepping motor driven by the micro-stepping plate drive motor, make turntable 5 do forward and reversely to horizontally rotate, drive on the turntable 5 the lineman's part 3 to be welded in the anchor clamps to accurate welding position.
The described anchor clamps 4 that are used for fixing lineman's part 3 to be welded are standard type bonding wire anchor clamps, compressing tablet formula anchor clamps and vacuum fixture.
The bonding wire pattern that is used for can side weld line frontier inspection surveying has following steps successively:
Repeat above-mentioned steps two, three, four successively.
The bonding wire pattern that is used for improving bonding wire speed has following steps successively:
Repeat above-mentioned steps two, three, four successively.
Above-mentioned bonding wire is to be used to produce dither from the ultrasonic wave of supersonic generator through transducer, be delivered to tip by the luffing bar, when chopper formula tip vertical moving be positioned at it under lead-in wire and lineman's part 3 to be welded when contacting, under the effect of pressure, heating power and ultrasonic vibration, cause the lead-in wire and the metal covering of lineman's part 3 to be welded closely contact reach the combination of atomic distance, thereby will go between securely mechanical connection on lineman's part 3 to be welded.The method and apparatus of this embodiment can side weld line frontier inspection be surveyed, and can monitor in real time and improves the bonding wire quality, can also improve bonding wire speed about 20%.
Above content be in conjunction with concrete preferred implementation to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to the scope of patent protection that the present invention is determined by claims of being submitted to.
Claims (10)
1. supersonic welding line method of can side weld line frontier inspection surveying, employing comprises and is provided with transducer, wire clamp, tip, weld arm and send the soldering tip that pulls line parts system, be provided with the optical mirror slip group of adjustable focus and the location image optical system of camera, the workbench that can move in the horizontal direction, be arranged on the turntable that can rotate in the horizontal direction on the workbench, and the supersonic welding line apparatus that is arranged on the anchor clamps that are used for fixing lineman's part to be welded on the turntable, described soldering tip system is positioned at the central authorities top of workbench, can move in vertical direction, described image optical system also is positioned at the central authorities top of workbench, it is characterized in that:
Described soldering tip system can also move in the horizontal direction;
Described image optical system still detects uses image optical system, can move in vertical direction;
Following steps are arranged successively:
Initially put and anticipate the position: lineman's part to be welded is placed in the anchor clamps on the turntable, moves in the horizontal direction the soldering tip system, the tip of soldering tip is removed, treat the bonding wire workpiece by image optical system and position, and calculate position of bonding wire;
The top point of welding bonding wire: move in the horizontal direction the soldering tip system, tip is moved to the image optical system below, simultaneously the top point of a bonding wire of oriented lineman's part to be welded on the turntable is moved to the image optical system below by workbench, move the soldering tip system in vertical direction and fall soldering tip, weld;
Remove tip and detect bonding wire top point: move the soldering tip system in vertical direction and go up soldering tip, move in the horizontal direction the soldering tip system, tip is removed from the below of image optical system, and the distal point direction of tip to lineman's part bar bonding wire to be welded moved, detect by the image of image optical system simultaneously the intact bonding wire top point of firm weldering, revise the bonding wire parameter, improve the bonding wire quality;
The distal point of welding bonding wire: tip moves the soldering tip system in vertical direction and falls soldering tip after moving to directly over the distal point of this bonding wire of lineman's part to be welded, and the distal point of this bonding wire of lineman's part to be welded on the turntable is welded, and finishes the welding of this bonding wire;
Repeat the top point of above-mentioned welding bonding wire, the step of removing tip detection bonding wire top point, welding the distal point of bonding wire successively.
2. supersonic welding line method that can improve bonding wire speed, employing comprises and is provided with transducer, wire clamp, tip, weld arm and send the soldering tip that pulls line parts system, be provided with the optical mirror slip group of adjustable focus and the location image optical system of camera, the workbench that can move in the horizontal direction, be arranged on the turntable that can rotate in the horizontal direction on the workbench, and the supersonic welding line apparatus that is arranged on the anchor clamps that are used for fixing lineman's part to be welded on the turntable, described soldering tip system is positioned at the central authorities top of workbench, can move in vertical direction, described image optical system also is positioned at the central authorities top of workbench, it is characterized in that:
Described soldering tip system can also move in the horizontal direction;
Described image optical system still detects uses image optical system, can move in vertical direction;
Following steps are arranged successively:
Initially put and anticipate the position: lineman's part to be welded is placed in the anchor clamps on the turntable, moves in the horizontal direction the soldering tip system, the tip of soldering tip is removed, treat the bonding wire workpiece by image optical system and position, and calculate position of bonding wire;
The top point of welding bonding wire: move in the horizontal direction the soldering tip system, tip is moved to the image optical system below, simultaneously the top point of a bonding wire of oriented lineman's part to be welded on the turntable is moved to the image optical system below by workbench, move the soldering tip system in vertical direction and fall soldering tip, weld;
The distal point of mobile simultaneously tip and bonding wire: move the soldering tip system in vertical direction and go up soldering tip, move in the horizontal direction the soldering tip system, tip is removed from the below of image optical system, and the distal point direction of tip to this bonding wire of lineman's part to be welded moved; The workbench that relatively moves in the horizontal direction simultaneously moves the distal point of this bonding wire of lineman's part to be welded to the tip direction;
The distal point of welding bonding wire: tip moves the soldering tip system in vertical direction and falls soldering tip after moving to directly over the distal point of this bonding wire of lineman's part to be welded, and the distal point of this bonding wire of lineman's part to be welded on the turntable is welded, and finishes the welding of this bonding wire;
Repeat the top point of above-mentioned welding bonding wire, the step of the distal point of distal point, the welding bonding wire of mobile tip and bonding wire simultaneously successively.
3. according to claim 1 or 2 described supersonic welding line methods, it is characterized in that:
Described soldering tip system is by the position signalling of independently vertical, horizontal location sensor feedback separately, give the micro-stepping plate drive motor with action command by the microcontroller servoboard, again by the micro-stepping plate drive motor according to this commands for controlling micro-stepping motor driven ball screw, make soldering tip system property along the line guide rail do back and forth vertically, move horizontally, the tip that drives in the soldering tip system moves to accurate welding position.
4. according to the described supersonic welding line method of claim 3, it is characterized in that:
Described image optical system passes through the independently position signalling of perpendicular positioning sensor feedback, give the micro-stepping plate drive motor with action command by the microcontroller servoboard, again by the micro-stepping plate drive motor according to this commands for controlling micro-stepping motor driven ball screw, make image optical system property along the line guide rail make reciprocal vertical moving, the drive image optical system detects the image of the intact bonding wire top point of firm weldering.
5. according to the described supersonic welding line method of claim 4, it is characterized in that:
Described workbench passes through separately the independently position signalling of horizontal location sensor feedback, give the micro-stepping plate drive motor with action command by the microcontroller servoboard, again by the micro-stepping plate drive motor according to this commands for controlling micro-stepping motor driven ball screw, workbench property along the line guide rail is back and forth moved horizontally, drive workbench and be moved horizontally to accurate welding position;
Described turntable passes through the independently position signalling of corner alignment sensor feedback, give the micro-stepping plate drive motor with action command by the microcontroller servoboard, be provided with the gear of angular contact ball bearing again according to this commands for controlling micro-stepping motor driven by the micro-stepping plate drive motor, make turntable do forward and reversely to horizontally rotate, drive on the turntable lineman's part to be welded in the anchor clamps to accurate welding position.
6. supersonic welding line apparatus, comprise and be provided with transducer, wire clamp, tip, weldering arm and send the soldering tip that pulls line parts system, be provided with the optical mirror slip group of adjustable focus and the location image optical system of camera, the workbench that can move in the horizontal direction, be arranged on the turntable that can rotate in the horizontal direction on the workbench, and be arranged on anchor clamps that are used for fixing lineman's part to be welded on the turntable, described soldering tip system is positioned at the central authorities top of workbench, can move in vertical direction, described image optical system also is positioned at the central authorities top of workbench, it is characterized in that:
Described soldering tip system can also move in the horizontal direction;
Described image optical system still detects uses image optical system, can move in vertical direction.
7. according to the described supersonic welding line apparatus of claim 6, it is characterized in that:
Described soldering tip system is by the position signalling of independently vertical, horizontal location sensor feedback separately, give the micro-stepping plate drive motor with action command by the microcontroller servoboard, again by the micro-stepping plate drive motor according to this commands for controlling micro-stepping motor driven ball screw, make soldering tip system property along the line guide rail do back and forth vertically, move horizontally, the tip that drives in the soldering tip system moves to accurate welding position.
8. according to the described supersonic welding line apparatus of claim 7, it is characterized in that:
Described image optical system passes through the independently position signalling of perpendicular positioning sensor feedback, give the micro-stepping plate drive motor with action command by the microcontroller servoboard, again by the micro-stepping plate drive motor according to this commands for controlling micro-stepping motor driven ball screw, make image optical system property along the line guide rail make reciprocal vertical moving, the drive image optical system detects the image of the intact bonding wire top point of firm weldering.
9. according to the described supersonic welding line apparatus of claim 8, it is characterized in that:
Described workbench passes through separately the independently position signalling of horizontal location sensor feedback, give the micro-stepping plate drive motor with action command by the microcontroller servoboard, again by the micro-stepping plate drive motor according to this commands for controlling micro-stepping motor driven ball screw, workbench property along the line guide rail is back and forth moved horizontally, drive workbench and be moved horizontally to accurate welding position.
10. according to any described supersonic welding line apparatus in the claim 6～9, it is characterized in that:
Described turntable passes through the independently position signalling of corner alignment sensor feedback, give the micro-stepping plate drive motor with action command by the microcontroller servoboard, be provided with the gear of angular contact ball bearing again according to this commands for controlling micro-stepping motor driven by the micro-stepping plate drive motor, make turntable do forward and reversely to horizontally rotate, drive on the turntable lineman's part to be welded in the anchor clamps to accurate welding position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2005100348453A CN1702847A (en) | 2005-05-31 | 2005-05-31 | Ultrasonic wave wire soldering method and wire soldering apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2005100348453A CN1702847A (en) | 2005-05-31 | 2005-05-31 | Ultrasonic wave wire soldering method and wire soldering apparatus |
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| Publication Number | Publication Date |
|---|---|
| CN1702847A true CN1702847A (en) | 2005-11-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2005100348453A Pending CN1702847A (en) | 2005-05-31 | 2005-05-31 | Ultrasonic wave wire soldering method and wire soldering apparatus |
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| CN (1) | CN1702847A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103302395A (en) * | 2013-04-26 | 2013-09-18 | 邹志峰 | Welding device provided with multiple welding heads |
| CN103302853A (en) * | 2013-05-21 | 2013-09-18 | 苏州凯尔博精密机械有限公司 | Automatic selection workbench for four-shaft ultrasonic welding machine |
| CN106425212A (en) * | 2016-09-19 | 2017-02-22 | 武汉锐泽科技发展有限公司 | Camera welding carrying strip and carrier |
| CN107138846A (en) * | 2017-06-27 | 2017-09-08 | 哈尔滨工业大学深圳研究生院 | Ultrasonic micro-bonding method and its device applied to RFID magnetic card copper lines |
| CN108655623A (en) * | 2018-06-28 | 2018-10-16 | 广东科杰机械自动化有限公司 | It is a kind of to weld not viscous detecting system and method |
| CN110650817A (en) * | 2017-03-21 | 2020-01-03 | 申克索诺系统有限责任公司 | Method and apparatus for manufacturing welder assembly |
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2005
- 2005-05-31 CN CNA2005100348453A patent/CN1702847A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103302395A (en) * | 2013-04-26 | 2013-09-18 | 邹志峰 | Welding device provided with multiple welding heads |
| CN103302395B (en) * | 2013-04-26 | 2016-06-08 | 邹志峰 | A kind of multi-head welding set |
| CN103302853A (en) * | 2013-05-21 | 2013-09-18 | 苏州凯尔博精密机械有限公司 | Automatic selection workbench for four-shaft ultrasonic welding machine |
| CN106425212A (en) * | 2016-09-19 | 2017-02-22 | 武汉锐泽科技发展有限公司 | Camera welding carrying strip and carrier |
| CN106425212B (en) * | 2016-09-19 | 2018-05-08 | 武汉锐泽科技发展有限公司 | Camera welds carrier strip and carrier |
| CN110650817A (en) * | 2017-03-21 | 2020-01-03 | 申克索诺系统有限责任公司 | Method and apparatus for manufacturing welder assembly |
| CN110650817B (en) * | 2017-03-21 | 2021-11-09 | 申克索诺系统有限责任公司 | Method and device for producing a welded assembly |
| US11224936B2 (en) | 2017-03-21 | 2022-01-18 | Schunk Sonosystems Gmbh | Method and device for producing a welded assembly |
| CN107138846A (en) * | 2017-06-27 | 2017-09-08 | 哈尔滨工业大学深圳研究生院 | Ultrasonic micro-bonding method and its device applied to RFID magnetic card copper lines |
| CN107138846B (en) * | 2017-06-27 | 2022-12-06 | 哈尔滨工业大学深圳研究生院 | Ultrasonic micro-welding method and device applied to RFID magnetic card metal copper wire |
| CN108655623A (en) * | 2018-06-28 | 2018-10-16 | 广东科杰机械自动化有限公司 | It is a kind of to weld not viscous detecting system and method |
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