CN2814893Y - Ultrasonic bonding wire device - Google Patents
Ultrasonic bonding wire device Download PDFInfo
- Publication number
- CN2814893Y CN2814893Y CN 200520058895 CN200520058895U CN2814893Y CN 2814893 Y CN2814893 Y CN 2814893Y CN 200520058895 CN200520058895 CN 200520058895 CN 200520058895 U CN200520058895 U CN 200520058895U CN 2814893 Y CN2814893 Y CN 2814893Y
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- optical system
- bonding
- image optical
- soldering tip
- bonding wire
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Abstract
The utility model discloses an ultrasonic bonding wire device, which comprises a bonding head system, an image optical system, a work table, a turn table and a clamping device, wherein the bonding head system is provided with an energy converter, a wire clamp, a bonding arm and a component for sending pulling threads; the image optical system is provided with a focus-adjustable lens group and is used for positioning; the work table can move in horizontal direction; the turn table is arranged on the work table, and can turn in horizontal direction; the clamping device is arranged on the turn table, and is used for fixing workpieces of which wires need bonding. The bonding head system is positioned above the center of the work table, can move in vertical direction and can also move in horizontal direction. The image optical system which is an image optical system used for detection is also arranged above the center of the work table, and can move in vertical direction. The utility model can perform wire bonding while detecting, can perform real-time monitoring, can improve the quality of the bonding wires and can improve the speed of wire bonding. The ultrasonic bonding wire device can be used for soft packaging of numeral tubes, dot matrix plates and integrated circuits in electronic information products, and for the inner lead-wire bonding of thick film integrated circuits, transistor semiconductor devices, etc.
Description
Technical field
The utility model relates to and is applicable to that semiconductor, solid state device or its parts are used for the welding method or the equipment of the lead-in wire of conduction current, especially relate to a kind of supersonic welding line apparatus.
Background technology
Chip on circuit board PCB or substrate directly encapsulates (Chip on Board with integrated circuit die I C or LED bonding wire, be called for short COB), be widely used in such as consumer electronic information products such as computer, mobile phone, optics digital product, smart card, clock and watch, toys.Bonding wire is the basic technology of COB, needs to adopt supersonic welding line method and relevant device.Existing be specifically designed to the auto-ultrasonic bonding equipment that corresponding bonding pad on IC chip or LED and the pcb board is carried out bridge joint, comprise and be provided with transducer, wire clamp, tip, weldering arm and send the soldering tip that pulls line parts system, be provided with the optical mirror slip group of adjustable focus and the location image optical system of camera, the workbench that can move in the horizontal direction, be arranged on the turntable that can rotate in the horizontal direction on the workbench, and be arranged on the anchor clamps that are used for fixing lineman's part to be welded on the turntable.Described soldering tip system is positioned at the central authorities top of workbench, can move in vertical direction, and described image optical system also is positioned at the central authorities top of workbench.Described bonding wire workpiece is LED or IC chip and pcb board.Absorb the relative position of bonding wire workpiece in advance with image optical system by the location, through identification and Control work platform, turntable moves and rotate, and with compensating error, makes the solder joint of bonding wire workpiece on the anchor clamps confirm the position earlier, promptly accurately be positioned tip lower position, bonding wire then.For present turntable bonding equipment, the soldering tip system only has motion in vertical direction; In the location and after having calculated position of bonding wire, can only be that bonding wire is carried out in the below that workbench is moved horizontally to the soldering tip system usually, bonding wire speed is restricted.In addition, only after finishing bonding wire action, could detect the position of bonding wire and the quality of bonding wire, not only lose time, and can not monitor in real time and improve the bonding wire quality by image optical system.
Summary of the invention
Technical problem to be solved in the utility model is to overcome above-mentioned the deficiencies in the prior art, proposes a kind ofly can side weld line frontier inspection to survey, can monitor in real time and improve the bonding wire quality, can also improve the supersonic welding line apparatus of bonding wire speed.
Technical problem of the present utility model is solved like this:
This supersonic welding line apparatus, comprising can be in the soldering tip system that vertical direction moves, the image optical system that independently is provided with the soldering tip system, the horizontal direction travelling table, be arranged on the turntable that the horizontal direction on the workbench is rotated, and be arranged on anchor clamps on the turntable, described soldering tip system is positioned at the central authorities top of horizontal direction travelling table, described image optical system also is positioned at the central authorities top of workbench, described soldering tip system is provided with transducer, wire clamp, tip, the weldering arm pulls the line parts with sending, and described image optical system is provided with the optical mirror slip group and the camera of adjustable focus.This apparatus features is:
Described soldering tip system is the soldering tip system that can move in the horizontal direction;
Described image optical system is the detection image optical system that can move in vertical direction.
Micro-stepping plate drive motor and the micro-stepping motor that links to each other with the micro-stepping plate drive motor that described soldering tip system comprises be connected with microcontroller independently vertical separately, horizontal location transducer, microcontroller servoboard, is electrically connected with the microcontroller servoboard, and the ball screw that links with the micro-stepping motor.Described soldering tip system is by the position signalling of independently vertical, horizontal location sensor feedback separately, give the micro-stepping plate drive motor with action command by the microcontroller servoboard, again by the micro-stepping plate drive motor according to this commands for controlling micro-stepping motor driven ball screw, make soldering tip system property along the line guide rail do back and forth vertically, move horizontally, the tip that drives in the soldering tip system moves to accurate welding position.
Described image optical system passes through the independently position signalling of perpendicular positioning sensor feedback, give the micro-stepping plate drive motor with action command by the microcontroller servoboard, again by the micro-stepping plate drive motor according to this commands for controlling micro-stepping motor driven ball screw, make image optical system property along the line guide rail make reciprocal vertical moving, the drive image optical system detects the image of the intact bonding wire top point of firm weldering, revise the bonding wire parameter, improve the bonding wire quality.
Described workbench passes through separately the independently position signalling of horizontal location sensor feedback, give the micro-stepping plate drive motor with action command by the microcontroller servoboard, again by the micro-stepping plate drive motor according to this commands for controlling micro-stepping motor driven ball screw, workbench property along the line guide rail is back and forth moved horizontally, drive workbench and be moved horizontally to accurate welding position.
Described turntable passes through the independently position signalling of corner alignment sensor feedback, give the micro-stepping plate drive motor with action command by the microcontroller servoboard, be provided with the gear of angular contact ball bearing again according to this commands for controlling micro-stepping motor driven by the micro-stepping plate drive motor, make turntable do forward and reversely to horizontally rotate, drive on the turntable lineman's part to be welded in the anchor clamps to accurate welding position.
The described anchor clamps that are used to load and clamp lineman's part to be welded are standard type bonding wire anchor clamps, compressing tablet formula anchor clamps and vacuum fixture.
The contrast of supersonic welding line apparatus of the present utility model and existing supersonic welding line method can be surveyed by side weld line frontier inspection, can monitor in real time and improves the bonding wire quality, can also improve bonding wire speed.This supersonic welding line apparatus can be widely used in welding such as leads such as charactron, dot matrix plate, the soft encapsulation of integrated circuit, thick film integrated circuit, transistor semiconductor devices in the electronics and IT products such as computer, mobile phone, optics digital product, smart card, clock and watch, toy.
Description of drawings
Below the contrast accompanying drawing and in conjunction with embodiment the utility model is described in further detail.
Fig. 1 is the stereogram of the building block of supersonic welding line apparatus embodiment of the present utility model.
Fig. 2 is Fig. 1 embodiment relevant components configuration of components sketch under the bonding wire pattern that side weld line frontier inspection is surveyed.
Fig. 3 is Fig. 1 embodiment relevant components configuration of components sketch under the bonding wire pattern that improves bonding wire speed.
Embodiment
A kind of turntable type auto-ultrasonic bonding equipment
A kind of turntable type auto-ultrasonic bonding equipment as shown in Figure 1, 2, 3, comprise and be provided with transducer, wire clamp, tip, weldering arm and send the soldering tip system 2 of pulling the line parts, be provided with the optical mirror slip group of adjustable focus and the location image optical system 1 of camera, the workbench 6 that can move in the horizontal direction, be arranged on the turntable 5 that can rotate in the horizontal direction on the workbench 6, and be arranged on the anchor clamps that are used for fixing lineman's part 3 to be welded 4 on the turntable 5.Described soldering tip system 2 is positioned at the central authorities top of workbench 6, can move in vertical direction, can also move in the horizontal direction, and described image optical system 1 still detects use image optical system, also is positioned at above the central authorities of workbench 6, can move in vertical direction.
Described soldering tip system 2 is by the position signalling of independently vertical, horizontal location sensor feedback separately, give the micro-stepping plate drive motor with action command by the microcontroller servoboard, again by the micro-stepping plate drive motor according to this commands for controlling micro-stepping motor driven ball screw, make soldering tip system 2 property guide rails along the line do back and forth vertically, move horizontally, the tip that drives in the soldering tip system 2 moves to accurate welding position.
Described image optical system 1 passes through the independently position signalling of perpendicular positioning sensor feedback, give the micro-stepping plate drive motor with action command by the microcontroller servoboard, again by the micro-stepping plate drive motor according to this commands for controlling micro-stepping motor driven ball screw, make image optical system 1 property guide rail along the line make reciprocal vertical moving, the image that drives 1 pair of bonding wire top point that has just welded of image optical system detects, revise the bonding wire parameter, improve the bonding wire quality.
Described workbench 6 passes through separately the independently position signalling of horizontal location sensor feedback, give the micro-stepping plate drive motor with action command by the microcontroller servoboard, again by the micro-stepping plate drive motor according to this commands for controlling micro-stepping motor driven ball screw, workbench 6 property guide rails along the line are back and forth moved horizontally, drive workbench 6 and be moved horizontally to accurate welding position.
Described turntable 5 passes through the independently position signalling of corner alignment sensor feedback, give the micro-stepping plate drive motor with action command by the microcontroller servoboard, be provided with the gear of angular contact ball bearing again according to this commands for controlling micro-stepping motor driven by the micro-stepping plate drive motor, make turntable 5 do forward and reversely to horizontally rotate, drive on the turntable 5 the lineman's part 3 to be welded in the anchor clamps to accurate welding position.
The described anchor clamps 4 that are used for fixing lineman's part 3 to be welded are standard type bonding wire anchor clamps, compressing tablet formula anchor clamps and vacuum fixture.
The bonding wire pattern that is used for can side weld line frontier inspection surveying has following steps successively:
Repeat above-mentioned steps two, three, four successively.
The bonding wire pattern that is used for improving bonding wire speed has following steps successively:
Repeat above-mentioned steps two, three, four successively.
Above-mentioned bonding wire is to be used to produce dither from the ultrasonic wave of supersonic generator through transducer, be delivered to tip by the luffing bar, when chopper formula tip vertical moving be positioned at it under lead-in wire and lineman's part 3 to be welded when contacting, under the effect of pressure, heating power and ultrasonic vibration, cause the lead-in wire and the metal covering of lineman's part 3 to be welded closely contact reach the combination of atomic distance, thereby will go between securely mechanical connection on lineman's part 3 to be welded.The method and apparatus of this embodiment can side weld line frontier inspection be surveyed, and can monitor in real time and improves the bonding wire quality, can also improve bonding wire speed about 20%.
Above content be in conjunction with concrete preferred implementation to further describing that the utility model is done, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field; under the prerequisite that does not break away from the utility model design; can also make some simple deduction or replace, all should be considered as belonging to the scope of patent protection that the utility model is determined by claims of being submitted to.
Claims (4)
1. supersonic welding line apparatus, comprise image optical system, the horizontal direction travelling table that can independently be provided with, the turntable that is arranged on the horizontal direction rotation on the workbench in soldering tip system that vertical direction moves, with the soldering tip system, and be arranged on anchor clamps on the turntable, described soldering tip system is positioned at the central authorities top of horizontal direction travelling table, described image optical system also is positioned at the central authorities top of workbench, it is characterized in that:
Described soldering tip system is the soldering tip system that can move in the horizontal direction;
Described image optical system is the detection image optical system that can move in vertical direction.
2. according to the described supersonic welding line apparatus of claim 1, it is characterized in that:
Micro-stepping plate drive motor and the micro-stepping motor that links to each other with the micro-stepping plate drive motor that described soldering tip system comprises be connected with microcontroller independently vertical separately, horizontal location transducer, microcontroller servoboard, is electrically connected with the microcontroller servoboard, and the ball screw that links with the micro-stepping motor.
3. according to claim 1 or 2 described supersonic welding line apparatus, it is characterized in that:
Described image optical system is that property guide rail along the line is made the image optical system that reciprocal vertical moving detects the image of the intact bonding wire top point of firm weldering.
4. according to the described supersonic welding line apparatus of claim 3, it is characterized in that:
The described anchor clamps that are used for fixing lineman's part to be welded are standard type bonding wire anchor clamps, compressing tablet formula anchor clamps and vacuum fixture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520058895 CN2814893Y (en) | 2005-05-31 | 2005-05-31 | Ultrasonic bonding wire device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520058895 CN2814893Y (en) | 2005-05-31 | 2005-05-31 | Ultrasonic bonding wire device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2814893Y true CN2814893Y (en) | 2006-09-06 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520058895 Expired - Fee Related CN2814893Y (en) | 2005-05-31 | 2005-05-31 | Ultrasonic bonding wire device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2814893Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103157915A (en) * | 2011-12-14 | 2013-06-19 | 苏州工业园区高登威科技有限公司 | Integrated circuit (IC) line welding machine |
| CN103302395A (en) * | 2013-04-26 | 2013-09-18 | 邹志峰 | Welding device provided with multiple welding heads |
| CN114388418A (en) * | 2021-12-28 | 2022-04-22 | 凌波微步半导体设备(常熟)有限公司 | Closed loop position compensation method and system of semiconductor wire bonding machine |
-
2005
- 2005-05-31 CN CN 200520058895 patent/CN2814893Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103157915A (en) * | 2011-12-14 | 2013-06-19 | 苏州工业园区高登威科技有限公司 | Integrated circuit (IC) line welding machine |
| CN103302395A (en) * | 2013-04-26 | 2013-09-18 | 邹志峰 | Welding device provided with multiple welding heads |
| CN103302395B (en) * | 2013-04-26 | 2016-06-08 | 邹志峰 | A kind of multi-head welding set |
| CN114388418A (en) * | 2021-12-28 | 2022-04-22 | 凌波微步半导体设备(常熟)有限公司 | Closed loop position compensation method and system of semiconductor wire bonding machine |
| CN114388418B (en) * | 2021-12-28 | 2022-12-13 | 凌波微步半导体设备(常熟)有限公司 | Closed loop position compensation method and system of semiconductor wire bonding machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: ZONGKE OPTOELECTRONICS EQUIPMENT (SHENZHEN) CO., L Free format text: FORMER OWNER: ITM MECHANICAL AND ELECTRICAL (SHENZHEN) CO., LTD. Effective date: 20110317 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518000 NO. 1, 1/F, FACTORY BUILDING 2, AVIC SHAHE INDUSTRIAL AREA, QIAOXIANG ROAD, NANSHAN DISTRICT, SHENZHEN CITY, GUANGDONG PROVINCE TO: 518000 203, BUILDING 2, INDUSTRIAL FACTORY BUILDING, AVIC SHAHE INDUSTRIAL AREA, QIAOXIANG ROAD, NANSHAN DISTRICT, SHENZHEN CITY, GUANGDONG PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20110317 Address after: 518000, building 2, industrial building, AVIC Shahe Industrial Zone,, Nanshan District, Shenzhen, Guangdong Province Patentee after: Shenzhen integrated photoelectric equipment Co., Ltd. Address before: 518000, No. 1, first floor, building No. 2, AVIC Shahe Industrial Zone, overseas Chinese incense Road, Nanshan District, Guangdong, Shenzhen Patentee before: ITM (Shenzhen) Limited |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060906 Termination date: 20140531 |