CN106586951A - Shock wave excitation apparatus capable of realizing excitation of MEMS microstructure in vacuum environment - Google Patents
Shock wave excitation apparatus capable of realizing excitation of MEMS microstructure in vacuum environment Download PDFInfo
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- CN106586951A CN106586951A CN201610867460.3A CN201610867460A CN106586951A CN 106586951 A CN106586951 A CN 106586951A CN 201610867460 A CN201610867460 A CN 201610867460A CN 106586951 A CN106586951 A CN 106586951A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
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Abstract
The invention discloses a shock wave excitation apparatus capable of realizing excitation of a MEMS microstructure in a vacuum environment. The shock wave excitation apparatus comprises a substrate; a hand-operated triaxial displacement bench and a support are arranged on the substrate; a needle electrode unit pointing to a microstructure unit is arranged on a Z-axis slide carriage of the hand-operated triaxial displacement bench; the microstructure unit comprises an installation sleeve; an elastic pedestal is arranged on one end in an installation hole of the installation sleeve via press mounting; the elastic pedestal is in the shape of a circular ring slice and an annular boss is arranged at the central part of the elastic pedestal; a plate electrode is inlaid in the elastic pedestal via an insulation sleeve; the MEMS microstructure is mounted on the inner side of the elastic pedestal; an optical glass plate is arranged in on the other end in the installation hole via press mounting; the outer wall of the installation sleeve is provided with a vacuum joint along a radial direction; the needle electrode and the plate electrode are electrically connected with two poles of a high-voltage capacitor respectively; and the two poles of the high-voltage capacitor are electrically connected with the positive and negative electrodes of a high-voltage supply respectively. The shock wave excitation apparatus is firm in structure installation, simple and safe to operate and convenient for testing of the dynamic behavior parameters of the microstructure in the vacuum environment.
Description
Technical field
The invention belongs to micromachine electronic system technology field, more particularly to one kind can be micro- to MEMS under vacuum conditions
Structure enters the shock wave exciting bank of row energization.
Background technology
Because MEMS micro elements have the advantages that low cost, small volume and lightweight so as in automobile, Aero-Space, letter
Breath communication, biochemistry, medical treatment, automatically control and suffer from being widely applied prospect with the numerous areas such as national defence.For a lot
For MEMS, the micro-displacement of its internal microstructure and micro-strain are the bases that device function is realized, therefore to these
The dynamic characteristic parameters such as amplitude, intrinsic frequency, the damping ratio of micro-structural carry out accurate test and have become exploitation MEMS product
Important content.
In order to test the dynamic characteristic parameter of micro-structural, it is necessary first to make micro-structural produce vibration, that is, need to micro-
Structure enters row energization.Because MEMS micro-structurals have size little, lightweight and the features such as high intrinsic frequency, tradition machinery mode is surveyed
Motivational techniques and exciting bank in examination cannot be used in the middle of the vibrational excitation of MEMS micro-structurals.Recent two decades come, domestic
Outer researcher has carried out substantial amounts of exploration for the vibrational excitation method of MEMS micro-structurals, investigated some and can be used for
The motivational techniques of MEMS micro-structurals and corresponding exciting bank.Wherein, She Dongsheng etc. exists《MEMS micro-structurals bottom based on shock wave
Seat technique study excited by impact》A kind of seat excitation apparatus based on shock wave are described in one text, the device has excitation bandwidth
Greatly, applied widely the advantages of, possesses good application potential.But the device remains its own shortcomings：First, in dress
Cross-spring piece is bonded to ten as the understructure for carrying micro-structural, micro-structural and its mounting structure used in putting
The top center of word spring leaf, when row energization is entered to micro-structural, cross-spring sector-meeting produces larger flexural deformation；One
This can cause the deformation of micro-structural installing plate to aspect, cause the damage of micro-structural；On the other hand this can make the installing plate of micro-structural
Cured glue bears very big pulling force and cross-spring piece between, and after repeatedly being encouraged, glue easily ftractures, micro- knot
Structure installing plate can produce loosening, depart from cross-spring piece；Second, in a device, cross-spring piece, between potsherd and plate electrode
Up and down superposition is arranged, and is fixed using the mode of glue bonding between two adjacent parts, this bonded structure
It is not firm enough, after multiple discharge, it is easily separated between each layer；3rd, in a device, feed mechanism can only be adjusted manually
Section, it is impossible to realize auto-feed, guiding discharge is cumbersome and security is poor；4th, because micro-structural is to be fully exposed to sky
In gas, when needing to test micro-structural dynamic characteristic under vacuum conditions, due to being discharged under vacuum conditions,
The device just cannot meet demand.
The content of the invention
The technical problem to be solved is to provide one kind can enter row energization to MEMS micro-structurals under vacuum conditions
Shock wave exciting bank, the apparatus structure is firmly installed, easy to operate and safe, is easy to test MEMS micro-structurals under vacuum conditions
Dynamic characteristic parameter.
To solve the above problems, the present invention is adopted the following technical scheme that：
A kind of shock wave exciting bank that can enter row energization to MEMS micro-structurals under vacuum conditions, including substrate, in substrate
Manual three-shaft displacement platform and bearing are provided with, on the Z axis slide carriage of manual three-shaft displacement platform pin electrode unit is provided with；The pin electricity
Pole unit includes the right-angle connecting plate for connecting Z axis slide carriage, and two pieces of gripper shoes being parallel to each other are provided with right-angle connecting plate,
The axis of guide and leading screw that are arranged in parallel are provided between two pieces of gripper shoes and driver plate, driver plate and silk are arranged with the axis of guide
Connected by screw between thick stick, wherein one piece of gripper shoe outside is provided with the stepper motor coaxially connected with leading screw, in driver plate
There is pin electrode upper end by earthenware insulating mounting, and pin electrode points to the microstructure unit for being arranged on bearing upper end；
The microstructure unit includes being arranged on the installation set of bearing upper end, and stepped installing hole is provided with installation set,
Correspondence pin electrode one end is pressed with elastic base by the first pressing plate for sealing in installing hole, and elastic base is clamped in the first pressing plate
Between the ring ladder in installing hole, elastic base is annular flake and is provided with annular boss in the middle, in elasticity
Plate electrode is installed with by insulation sleeve in chassis outer side centre bore, elastic base inner side is provided with MEMS by micro-structural installing plate
Micro-structural；The other end is pressed with optical flat by the second pressing plate for sealing in installing hole, and the installing hole passes through optics glass
Glass plate and elastic base form an airtight cavity, and the MEMS micro-structurals are located in the airtight cavity；On installation set outer wall edge
It is radially provided with a vacuum adapter communicated with airtight cavity；
The pin electrode and plate electrode are electrically connected respectively with the two poles of the earth of high-voltage capacitance, are set between pin electrode and high-voltage capacitance
There is the first air switch to control break-make；The two poles of the earth of the high-voltage capacitance are electrically coupled to respectively the both positive and negative polarity of high voltage power supply, and pass through
Second air switch controls break-make.
Used as further preferred, the earthenware passes perpendicularly through driver plate and is consolidated by being located at the jackscrew of driver plate upper end
It is fixed.
Used as further preferred, the bearing is ladder shaft-like, and its lower end is bigger diameter end and is arranged with ring flange, ring flange
It is connected by screw with substrate and bearing is fixed on substrate, bearing upper end is threaded connection with installation set.
Used as further preferred, first pressing plate is fixed on correspondence pin electrode in installing hole by the screw of circumference uniform distribution
In the port of one end, circular locating groove, the bullet are provided with the annular step tread of corresponding first pressing plate one end in installation set
Property base coordinate the jackscrew being located in locating groove and by circumference uniform distribution on the first pressing plate to fix by gap.
As further preferred, in the installing hole annular step tread at two ends and optical flat and elastic base it
Between be folded with sealing ring respectively, to improve the sealing of airtight cavity.
Used as further preferred, the centre bore of the elastic base is tapered blind hole, the insulation sleeve outer rim be taper and
With tapered blind hole taper fit grafting and bonding, between insulation sleeve inwall and plate electrode outer rim by cooperating circular cone
Face grafting and bonding, to strengthen the fastness of plate electrode installation.
Used as further preferred, the micro-structural installing plate is by the mode connects for screw of circumference uniform distribution on the inside of elastic base
Center, MEMS micro-structurals are bonded on micro-structural installing plate.
The invention has the beneficial effects as follows：
(1) because elastic base is annular flake and is provided with annular boss in the middle, when entering to MEMS micro-structurals
During row energization, elastic base central area is not in flexural deformation, thus will not make to be arranged on elastic base medial center
The micro-structural installing plate at place is deformed, and the phenomenon that micro-structural and micro-structural installing plate are separated would not also occurs.
(2) because the centre bore of elastic base is stepped, plate electrode is installed with by insulation sleeve in its outside macropore, because
This plate electrode is more firmly mounted, after multiple discharge, between each part also without departing from.
(3) due to being provided with the Z axis slide carriage of manual three-shaft displacement platform by the pin electrode unit of driving stepper motor displacement,
Therefore there are two kinds of functions of hand feed and auto-feed simultaneously；The preparatory stage of experiment is encouraged in shock wave, it is possible to use manually
The mode of feeding adjusts the relative position of pin electrode and plate electrode, when travelling shock-wave excitation experiment is entered, can control stepper motor
Discharged by way of auto-feed, so both ensure that the relative position that can neatly adjust between two electrodes,
The security when discharge test is carried out is in turn ensure that, it is easy to operate and safe.
(4) because the installing hole in the installation set forms an airtight cavity by optical flat and elastic base,
The MEMS micro-structurals are located in the airtight cavity, and in installation set outer wall vacuum adapter is provided with, therefore can pass through vacuum adapter pair
MEMS micro-structurals load vacuum environment, it is possible to produce shock wave by electric discharge and enter row energization to micro-structural；Elastic base is designed
Into a part for airtight cavity, solving cannot enter under vacuum conditions a difficult problem for row energization using shock wave to MEMS micro-structurals.
Description of the drawings
Fig. 1 is the dimensional structure diagram of the present invention.
Fig. 2 is the front view of the present invention.
Fig. 3 is the right view of Fig. 2.
Fig. 4 is the three-dimensional structure diagram of pin electrode unit of the present invention.
Fig. 5 is the three-dimensional structure diagram of microstructure unit of the present invention.
Fig. 6 is the partial enlarged drawing of microstructure unit in Fig. 3.
Fig. 7 is the A-A sectional views of Fig. 6.
Fig. 8 is the circuit block diagram of the present invention.
In figure：1. substrate, 2. manual three-shaft displacement platform, 3. base plate, 4. screw, 5. microstructure unit, 501. vacuum adapters,
502. installation sets, 503. screws, 504. first pressing plates, 505. jackscrews, 506. elastic bases, 507. plate electrodes, 508. insulation sleeves,
509. screws, 510. second pressing plates, 511. optical flats, 512. sealing rings, 513.MEMS micro-structurals, 514. screws, 515.
Micro-structural installing plate, 6. pin electrode unit, 601. right-angle connecting plates, 602. stepper motors, 603. screws, 604. screws, 605.
Gripper shoe, 606. axis of guides, 607. screws, 608. screws, 609. axle sleeves, 610. driver plates, 611. jackscrews, 612. earthenwares,
613. pin electrodes, 614. leading screws, 7. ring flange, 8. bearing, 9. the first air switch, 10. the second air switch, 11. high-tension electricities
Hold, 12. high voltage power supplies.
Specific embodiment
As shown in Figure 1-Figure 3, it is according to the present invention a kind of under vacuum conditions row energization to be entered to MEMS micro-structurals and swash
Wave excitation device, including substrate 1, are provided with substrate 1 manual three-shaft displacement platform 2 and a bearing 8, the manual three-shaft displacement
Platform 2 is arranged on a base plate 3, and the base plate 3 is fixed on substrate 1 by screw 4.In the Z axis slide carriage of manual three-shaft displacement platform 2
On pin electrode unit 6 is installed.
As shown in figure 4, the pin electrode unit 6 includes the right-angle connecting plate 601 being fixed by screws on Z axis slide carriage,
Two pieces of gripper shoes 605 being parallel to each other are fixed with by screw on right-angle connecting plate 601, are set between two pieces of gripper shoes 605
There is the axis of guide 606 and leading screw 614 being arranged in parallel up and down, and driver plate 610 is arranged with the axis of guide 606, in driver plate 610
The axle sleeve 609 being slidably matched with the axis of guide 606 is installed with the upper correspondence axis of guide 606, the two ends of the axis of guide 606 pass through screw 604
It is fixed in two pieces of gripper shoes 605, leading screw 614 is rotatably installed between two pieces of gripper shoes 605, driver plate 610 and leading screw
The screw 607 being fixed on driver plate 610 by using screw 608 between 614 is connected, wherein one piece of outside of gripper shoe 605
The stepper motor 602 coaxially connected with leading screw 614 is fixed with by screw 603, in the upper end of driver plate 610 earthenware 612 is passed through
Insulating mounting has pin electrode 613, and the earthenware 612 passes perpendicularly through driver plate 610 and the top by being located at the upper end of driver plate 610
Silk 611 is fixed.The rear portion of pin electrode 613 is installed in earthenware 612, and the forward tip of pin electrode 613 is pointed to and is arranged on the upper end of bearing 8
Microstructure unit 5.
As shown in Figure 5-Figure 7, the microstructure unit 5 includes being arranged on the installation set 502 of the upper end of bearing 8, the bearing 8
For ladder shaft-like, its lower end is bigger diameter end and is arranged with ring flange 7, and ring flange 7 is connected by screw and by bearing 8 with substrate 1
Fix on substrate 1, the upper end of bearing 8 is threaded connection with the screw being arranged on the bottom surface of installation set 502.In installation set 502
Stepped installing hole is inside provided with, installing hole middle part internal diameter is much smaller than its two ends port inner diameter, the correspondence pin electrode 613 in installing hole
One end is pressed with elastic base 506 by the sealing of the first pressing plate 504, and elastic base 506 is clamped in the first pressing plate 504 and installing hole
Between interior ring ladder, elastic base 506 is annular flake and is provided with annular boss in the middle, in elastic base
Correspondence one end of pin electrode 613 is installed with plate electrode 507 by insulation sleeve 508 in 506 centre bore, and the inner side of elastic base 506 is logical
Cross micro-structural installing plate 515 and MEMS micro-structurals 513 are installed；The other end is press-fited by the sealing of the second pressing plate 510 in installing hole
There is optical flat 511, the installing hole forms an airtight cavity by optical flat 511 and elastic base 506, described
MEMS micro-structurals 513 are located in the airtight cavity；There is one to communicate with airtight cavity installation set 502 outer wall is radially mounted
Vacuum adapter 501.
First pressing plate 504 is fixed on correspondence pin electrode 613 one end in installing hole by the screw 503 of circumference uniform distribution
In port, circular locating groove, the bullet are provided with the annular step tread of corresponding one end of first pressing plate 504 in installation set 502
Property base 506 coordinated by gap and be located in locating groove and consolidated by jackscrew 505 of the circumference uniform distribution on the first pressing plate 504
It is fixed, can further compress elastic base 506 by screwing jackscrew.Second pressing plate 510 by the screw 509 of circumference uniform distribution with
Installation set 502 connects and optical flat 511 is fixed in the port of the installing hole other end.Two in the installing hole
Sealing ring 512 is folded with respectively between the annular step tread and optical flat 511 and elastic base 506 at end, it is closed to improve
The sealing of cavity.
The centre bore of the elastic base 506 be tapered blind hole, the outer rim of the insulation sleeve 508 be taper and with the taper
The grafting of blind hole taper fit and bonding, the taper seat between the inwall of insulation sleeve 508 and the outer rim of plate electrode 507 by cooperating is inserted
Connect and bonding, to strengthen the fastness of the installation of plate electrode 507.The insulation sleeve 508 is preferably ceramic jacket.The micro-structural is installed
The center of plate 515 is provided with through hole and is connected to the center of the inner side of elastic base 506 by the screw 514 of circumference uniform distribution, and MEMS is micro-
Structure 513 is bonded on micro-structural installing plate 515.
As shown in figure 8, the shock wave exciting bank is additionally provided with high-voltage capacitance 11 and high voltage power supply 12, the He of the pin electrode 613
Plate electrode 507 is electrically connected respectively with the two poles of the earth of high-voltage capacitance 11 by wire, is provided with for connecting wire on plate electrode 507
Screw.The control break-make of the first air switch 9 is provided between pin electrode 613 and high-voltage capacitance 11；The two of the high-voltage capacitance 11
Pole is electrically coupled to respectively the both positive and negative polarity of high voltage power supply 12, and controls break-make by the second air switch 10.
When using, first the first air switch 9 and the second air switch 10 are all turned off into state, adjust manual three
Axle position moving stage 2 makes the center of the tip alignment plate electrode 507 of pin electrode 613, and ensures the distance between them more than height
Maximum air breakdown gap after voltage capacitance 11 is fully charged；Secondly, vacuum adapter 501 is connected using vavuum pump, to described close
Close inside cavity to vacuumize；Again, the second air switch 10 is closed, is charged for high-voltage capacitance 11 using high voltage power supply 12, when filling
Disconnect the second air switch 10 after the completion of electricity again；Finally, the first air switch 9 is closed, controls stepper motor 602, make pin electrode
613 slow close plate electrodes 507, when the distance between the needle point and plate electrode 507 of pin electrode 613 are met under current charging voltage
Air breakdown condition when, the air gap is breakdown, completes the shock wave that discharges and produce, and realizes to MEMS micro-structurals in vacuum environment
Under it is excited by impact.
Although embodiment of the present invention is disclosed as above, it is not restricted to listed in specification and embodiment
With, it can be applied to completely various suitable the field of the invention, for those skilled in the art, can be easily
Other modification is realized, therefore under the universal limited without departing substantially from claim and equivalency range, the present invention is not limited
In specific details and shown here as the legend with description.
Claims (7)
1. a kind of shock wave exciting bank that can enter row energization to MEMS micro-structurals under vacuum conditions, including substrate, is characterized in that：
Manual three-shaft displacement platform and bearing are provided with substrate, on the Z axis slide carriage of manual three-shaft displacement platform pin electrode unit is provided with；Institute
State the right-angle connecting plate that pin electrode unit includes for connecting Z axis slide carriage, two pieces are provided with right-angle connecting plate and are parallel to each other
Gripper shoe, is provided with the axis of guide and leading screw being arranged in parallel between two pieces of gripper shoes, and driver plate is arranged with the axis of guide, passes
Connected by screw between dynamic plate and leading screw, wherein one piece of gripper shoe outside is provided with the stepper motor coaxially connected with leading screw,
There is pin electrode by earthenware insulating mounting in driver plate upper end, pin electrode points to the microstructure unit for being arranged on bearing upper end；
The microstructure unit includes being arranged on the installation set of bearing upper end, stepped installing hole is provided with installation set, in peace
Correspondence pin electrode one end is pressed with elastic base by the first pressing plate for sealing in dress hole, and elastic base is clamped in the first pressing plate with peace
Between ring ladder in dress hole, elastic base is annular flake and is provided with annular boss in the middle, in elastic base
Plate electrode is installed with by insulation sleeve in outer side center hole, elastic base inner side is provided with the micro- knots of MEMS by micro-structural installing plate
Structure；The other end is pressed with optical flat by the second pressing plate for sealing in installing hole, and the installing hole passes through optical flat
An airtight cavity is formed with elastic base, the MEMS micro-structurals are located in the airtight cavity；In installation set outer wall radially
It is provided with a vacuum adapter communicated with airtight cavity；
The pin electrode and plate electrode are electrically connected respectively with the two poles of the earth of high-voltage capacitance, and is provided between pin electrode and high-voltage capacitance
One air switch controls break-make；The two poles of the earth of the high-voltage capacitance are electrically coupled to respectively the both positive and negative polarity of high voltage power supply, and by second
Air switch controls break-make.
2. a kind of shock wave excitation that can enter row energization to MEMS micro-structurals under vacuum conditions according to claim 1 is filled
Put, it is characterized in that：The earthenware passes perpendicularly through driver plate and is fixed by being located at the jackscrew of driver plate upper end.
3. a kind of shock wave excitation that can enter row energization to MEMS micro-structurals under vacuum conditions according to claim 1 is filled
Put, it is characterized in that：The bearing is ladder shaft-like, and its lower end is bigger diameter end and is arranged with ring flange, and ring flange passes through with substrate
Mode connects for screw is simultaneously fixed on bearing on substrate, and bearing upper end is threaded connection with installation set.
4. a kind of shock wave excitation that can enter row energization to MEMS micro-structurals under vacuum conditions according to claim 1 is filled
Put, it is characterized in that：First pressing plate is fixed on the port of correspondence pin electrode one end in installing hole by the screw of circumference uniform distribution
It is interior, circular locating groove is provided with the annular step tread of corresponding first pressing plate one end in installation set, the elastic base passes through
Gap cooperation is located in locating groove and the jackscrew by circumference uniform distribution on the first pressing plate is fixed.
5. a kind of shock wave excitation that can enter row energization to MEMS micro-structurals under vacuum conditions according to claim 4 is filled
Put, it is characterized in that：The sandwiched respectively between the annular step tread and optical flat and elastic base at two ends in the installing hole
There is sealing ring, to improve the sealing of airtight cavity.
6. a kind of shock wave excitation that can enter row energization to MEMS micro-structurals under vacuum conditions according to claim 4 or 5
Device, is characterized in that：The centre bore of the elastic base be tapered blind hole, the insulation sleeve outer rim be taper and with the taper
The grafting of blind hole taper fit and bonding, by the taper seat grafting that cooperates and glue between insulation sleeve inwall and plate electrode outer rim
Connect.
7. a kind of shock wave excitation that can enter row energization to MEMS micro-structurals under vacuum conditions according to claim 1 is filled
Put, it is characterized in that：Center of the micro-structural installing plate by the mode connects for screw of circumference uniform distribution on the inside of elastic base, MEMS
Micro-structural is bonded on micro-structural installing plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610867460.3A CN106586951B (en) | 2016-09-30 | 2016-09-30 | It is a kind of can be under vacuum conditions to MEMS micro-structures into the shock wave exciting bank of row energization |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610867460.3A CN106586951B (en) | 2016-09-30 | 2016-09-30 | It is a kind of can be under vacuum conditions to MEMS micro-structures into the shock wave exciting bank of row energization |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106586951A true CN106586951A (en) | 2017-04-26 |
| CN106586951B CN106586951B (en) | 2018-06-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610867460.3A Expired - Fee Related CN106586951B (en) | 2016-09-30 | 2016-09-30 | It is a kind of can be under vacuum conditions to MEMS micro-structures into the shock wave exciting bank of row energization |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109437097A (en) * | 2018-12-17 | 2019-03-08 | 大连理工大学 | A kind of ultrasonic exciting device and its working method loading hot environment |
| CN109827727A (en) * | 2018-12-17 | 2019-05-31 | 大连理工大学 | A kind of shock wave seat excitation apparatus and its working method loading hot environment |
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| CN1666952A (en) * | 2005-03-29 | 2005-09-14 | 华中科技大学 | Dynamic testing loading unit for MEMS disc or device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109437097A (en) * | 2018-12-17 | 2019-03-08 | 大连理工大学 | A kind of ultrasonic exciting device and its working method loading hot environment |
| CN109827727A (en) * | 2018-12-17 | 2019-05-31 | 大连理工大学 | A kind of shock wave seat excitation apparatus and its working method loading hot environment |
| CN109827727B (en) * | 2018-12-17 | 2020-05-19 | 大连理工大学 | Shock wave base excitation device loaded in high-temperature environment and working method thereof |
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| Publication number | Publication date |
|---|---|
| CN106586951B (en) | 2018-06-08 |
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